a 164-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-164-1) Dimensions shown in millimeters 12.00 BSC SQ A1 BALL CORNER 14 12 13 10 11 8 9 6 7 4 5 2 3 1 A B C D E 10.40 BSC SQ F G H J 0.80 BSC K L M N P *1.30 1.22 1.14 0.80 REF BOTTOM VIEW DETAIL A 0.65 REF DETAIL A 0.38 0.33 0.28 0.24 REF SEATING PLANE 0.96 0.89 0.82 0.53 COPLANARITY 0.08 0.48 0.43 BALL DIAMETER *COMPLIANT TO JEDEC STANDARDS MO-219 WITH THE EXCEPTION TO PACKAGE HEIGHT. 111808-A TOP VIEW