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256-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-256-4)
Dimensions shown in millimeters
a
15.00 BSC SQ
17.00 BSC SQ
A1 BALL
PAD CORNER
1.00 BSC
BALL PITCH
A1 BALL
PAD CORNER
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
TOP VIEW
16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
BOTTOM VIEW
SIDE VIEW
DETAIL A
0.20 MAX
COPLANARITY
*NOTES
1. COMPLIES WITH JEDEC REGISTERED OUTLINE
MO-192-AAF-1, WITH EXCEPTION TO PACKAGE HEIGHT.
2. MINIMUM BALL HEIGHT 0.45
0.45 MIN
0.70
0.60
0.50
BALL
DIAMETER
DETAIL A
SEATING PLANE
060507-A
1.90*
1.76
1.61