Plastic Packages for Integrated Circuits Package Outline Drawing V416.27x27 416 PLASTIC BALL GRID ARRAY PACKAGE (CAVITY DOWN) Rev 0, 9/11 Ø0.100 M C Ø0.250 M C A B 3 PIN A1 CORNER EPOXY ENCAPSULANT Ø1.00(3X). REF Ø0.5-0.7(416 X) 1.00 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF 25.00 27.00 24.00 4.00*45·REF 1.00 24.00 25.00 27.00 27.00 0.20(4X) 0.250C 0.56 BOTTOM VIEW 30° R0.25 TYP. 0.20 C TOP VIEW 0.35 C 27.00 A1 BALL PAD CORNER 2625242322 21201918171615141312 1110 9 8 7 6 5 4 3 2 1 2.23 1.17 -C- SEATING PLANE (25.00) (1.00 TYP) 0.50 25.00 (1.00)TYP SIDE VIEW TYPICAL RECOMMENDED LAND PATTERN 1 NON SOLDER MASK DEFINED PAD 0.38 NOM/0.40MM DIAMETER MAX. NOTES: 1. All dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Terminal positions designation per JESD 95-1, SPP-010. 3. Pin #1 identifier can be chamfer, ink mark or metallized mark but located within the zone indicated. 4. Reflow ball diameter. 5. Compliant to JEDEC registered outline MS-034, variation AAF-1.