Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOIC_W 300 mils 16 100Sn Yes Yes No Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Novolac Antimony Trioxide Brominated Resin Carbon Black CAS# Weight (g) 60676-86-0 Proprietary 9003-35-4 1309-64-4 40039-93-8 1333-86-4 2.58 E-01 2.25 E-02 1.20 E-02 4.49 E-03 1.50 E-03 8.99 E-04 3.00 E-01 CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 1.37 E-01 3.19 E-03 1.77 E-04 3.40 E-05 1.40 E-01 Homogeneous Material Level Percentage (%) PPM 86.20 862000 7.50 75000 4.00 40000 1.50 15000 0.50 5000 0.30 3000 100 1000000 Component Level Percentage (%) PPM 57.27 4.98 2.66 1.00 0.33 0.20 66.44 572719 49831 26576 9966 3322 1993 664408 Homogeneous Material Level Percentage (%) PPM 97.57 975706 2.28 22789 0.13 1263 0.02 242 100.00 1000000 Component Level Percentage (%) PPM 30.33 0.71 0.04 0.01 31.09 303342 7085 393 75 310895 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 0.31 3140 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 1.05 10465 Homogeneous Material Level Percentage (%) PPM 99.99 1000000 Component Level Percentage (%) PPM 0.11 1109 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 0.89 8851 Homogeneous Material Level Percentage (%) PPM 80 800000 15 150000 5 50000 100 1000000 Component Level Percentage (%) PPM 0.09 0 09 0.02 0.01 0.11 905 170 57 1131 Leadframe Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus Internal Leadframe Plating Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 1.42 E-03 External Leadframe Plating Description Tin & its alloys Substance Tin CAS# Weight (g) 7440-31-5 4.72 E-03 Bond Wires Description Precious metals Substance Gold CAS# Weight (g) 7440-57-5 5.00 E-04 Chip Description Other inorganic materials Substance Doped Silicon CAS# Weight (g) 7440-21-3 3.99 E-03 Die Attach Description Precious metals Thermosets Others Subtotal Substance Silver Epoxy Resin Curing agent & hardener CAS# Weight (g) 7440-22-4 7440 22 4 Proprietary Proprietary 4 08 E 04 4.08 E-04 7.65 E-05 2.55 E-05 5.10 E-04 Weight (g) 4.51 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 PPM 1000000 Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOIC_W 300 mils 16 SnPb No No No Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Novolac Antimony Trioxide Brominated Resin Carbon Black CAS# Weight (g) 60676-86-0 Proprietary 9003-35-4 1309-64-4 40039-93-8 1333-86-4 2.58 E-01 2.25 E-02 1.20 E-02 4.49 E-03 1.50 E-03 8.99 E-04 3.00 E-01 Homogeneous Material Level Percentage (%) PPM 86.2 862000 7.5 75000 4 40000 1.5 15000 0.5 5000 0.3 3000 100 1000000 Component Level Percentage (%) PPM 57.25 572491 4.98 49811 2.66 26566 1.00 9962 0.33 3321 0.20 1992 66.41 664143 Homogeneous Material Level Percentage (%) PPM 97.57 975706 2.28 22789 0.13 1263 0.02 242 100.00 1000000 Component Level Percentage (%) PPM 303221 30.32 7082 0.71 392 0.04 75 0.01 31.08 310771 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM Homogeneous Material Level Percentage (%) PPM 85.0 850000 15.0 150000 100.0 1000000 Component Level Percentage (%) PPM 0.89 0.16 1.05 8891 1569 10460 Homogeneous Material Level Percentage (%) PPM 99.99 1000000 Component Level Percentage (%) PPM 0.11 1109 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM Homogeneous Material Level Percentage (%) PPM 80 800000 15 150000 5 50000 100 1000000 Component Level Percentage (%) PPM 0.09 0.02 0.01 0.11 905 170 57 1131 Homogeneous Material Level Percentage (%) PPM 60.4 604000 28.0 280000 10.0 100000 1.0 10000 0.6 6000 100.0 1000000 Component Level Percentage (%) PPM 0.02 0.01 0.00 0.00 0.00 0.04 241 112 40 4 2 399 Leadframe Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 1.37 E-01 3.19 E-03 1.77 E-04 3.40 E-05 1.40 E-01 Internal Leadframe Plating Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 1.42 E-03 3139 0.31 External Leadframe Plating Description Tin & its alloys Tin & its alloys Subtotal Substance Tin Lead CAS# Weight (g) 7440-31-5 7439-92-1 4.01 E-03 7.08 E-04 4.72 E-03 Bond Wires Description Precious metals Substance Gold CAS# Weight (g) 7440-57-5 5.00 E-04 Chip Description Other inorganic materials Substance Doped Silicon CAS# Weight (g) 7440-21-3 3.99 E-03 8848 0.88 Di Attach Att h Die Description Precious metals Thermosets Others Subtotal Substance Silver Epoxy Resin Curing agent & hardener CAS# Weight (g) 7440-22-4 Proprietary Proprietary 4.08 E-04 7.65 E-05 2.55 E-05 5.10 E-04 CAS# Weight (g) 68083-19-2 68988-89-6 68037-59-2 100-41-4 1330-20-7 1.09 E-04 5.04 E-05 1.80 E-05 1.80 E-06 1.08 E-06 1.80 E-04 Die Coat Description Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Subtotal Substance Dimethylsiloxane Dimethylvinylated & Trimethylated silica Dimethyl, Methylhydrogen siloxane Ethylbenzene Xylene Weight (g) 4.51 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 PPM 1000000