Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOIC_IC 300 mils 16 100Sn Yes Yes No Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Novolac Antimony Trioxide Brominated Resin Carbon Black CAS# Weight (g) 60676-86-0 Proprietary 9003-35-4 1309-64-4 40039-93-8 1333-86-4 3.20 E-01 2.78 E-02 1.48 E-02 5.57 E-03 1.86 E-03 1.11 E-03 3.71 E-01 CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 1.45 E-01 3.39 E-03 1.88 E-04 3.60 E-05 1.49 E-01 Homogeneous Material Level Percentage (%) PPM 86.20 862000 7.50 75000 4.00 40000 1.50 15000 0.50 5000 0.30 3000 100 1000000 Component Level Percentage (%) PPM 59.16 5.15 2.75 1.03 0.34 0.21 68.63 591589 51472 27452 10294 3431 2059 686299 Homogeneous Material Level Percentage (%) PPM 97.57 975706 2.28 22789 0.13 1263 0.02 242 100.00 1000000 Component Level Percentage (%) PPM 26.84 0.63 0.03 0.01 27.51 268388 6269 347 67 275071 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 0.28 2778 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 1.02 10232 Homogeneous Material Level Percentage (%) PPM 99.99 1000000 Component Level Percentage (%) PPM 0.22 2220 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 1.91 19053 Homogeneous Material Level g (%) ( ) Percentage PPM 80 800000 15 150000 5 50000 100 1000000 Component Level Percentage g (%) ( ) PPM 0.35 0 35 0.07 0.02 0.43 3478 652 217 4347 Leadframe Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus Internal Leadframe Plating Substance Description Precious metals Silver CAS# Weight (g) 7440-22-4 1.50 E-03 External Leadframe Plating Description Tin & its alloys Substance Tin CAS# Weight (g) 7440-31-5 5.53 E-03 Bond Wires Description Precious metals Substance CAS# Weight (g) 1.20 E-03 Gold Chip Description Other inorganic materials Substance CAS# Doped Silicon Weight (g) 1.03 E-02 Die Attach Description Precious P i metals t l Thermosets Others Subtotal Package Totals Substance Silver Sil Epoxy Resin Curing agent & hardener CAS# Weight (g) 7440-22-4 7440 22 4 Proprietary Proprietary 1.88 1 88 E-03 E 03 3.53 E-04 1.18 E-04 2.35 E-03 Weight (g) 5.41 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 PPM 1000000