Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant QSOP 150 mil 16 NiPdAu Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Thermosets Other inorganic materials Subtotal Substance Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black CAS# 60676-86-0 Proprietary Proprietary 29690-82-2 1333-86-3 Component Level Weight (g) 3.87 E-02 2.21 E-03 2.21 E-03 8.83 E-04 1.32 E-04 4.42 E-02 Percentage (%) PPM Percentage (%) 87.7 5.0 5.0 2.0 0.3 100.0 877000 50000 50000 20000 3000 1000000 48.38 2.76 2.76 1.10 0.17 55 PPM 483799 27583 27583 11033 1655 551653 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 2.96 E-02 7.14 E-04 3.65 E-05 9.12 E-06 3.04 E-02 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 37.03 0.89 0.05 0.01 38 PPM 370265 8924 456 114 379759 Internal/External Leadframe Plating Homogeneous Material Level Substance Description Nickel & its alloys Precious metals Precious metals Subtotal Nickel Palladium Gold CAS# 7440-02-0 7440-05-3 7440-57-5 Component Level Weight (g) 2.34 E-03 5.45 E-05 1.13 E-05 2.41 E-03 Percentage (%) PPM Percentage (%) 97.27 2.26 0.47 100.00 972697 22621 4683 1000000 2.93 0.07 0.01 3.01 PPM 29282 681 141 30104 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Weight (g) 4.20 E-04 Percentage (%) PPM Percentage (%) 99.99 1000000 0.52 PPM 5248 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 2.34 E-03 Percentage (%) PPM Percentage (%) 100 1000000 2.92 PPM 29238 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Component Level Weight (g) 2.49 E-04 9.95 E-06 9.95 E-06 9.95 E-06 9.95 E-06 9.95 E-06 9.95 E-06 9.95 E-06 1.66 E-06 3.20 E-04 Weight (g) 8.00 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.00 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 0.31 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.002 0.40 Percentage (%) 100 PPM 3107 124 124 124 124 124 124 124 21 3998 PPM 1000000 Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant QSOP 150 mils 16 100Sn Yes Yes No Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Novolac Antimony Trioxide Brominated Resin Carbon Black CAS# Weight (g) 60676-86-0 Proprietary 9003-35-4 1309-64-4 40039-93-8 1333-86-4 3.71 E-02 3.23 E-03 1.72 E-03 6.46 E-04 2.15 E-04 1.29 E-04 4.30 E-02 CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 3.00 E-02 7.00 E-04 3.88 E-05 7.44 E-06 3.07 E-02 Homogeneous Material Level Percentage (%) PPM 86.20 862000 7.50 75000 4.00 40000 1.50 15000 0.50 5000 0.30 3000 100 1000000 Component Level Percentage (%) PPM 48.14 4.19 2.23 0.84 0.28 0.17 55.84 481360 41882 22337 8376 2792 1675 558422 Homogeneous Material Level Percentage (%) PPM 97.57 975706 2.28 22789 0.13 1263 0.02 242 100.00 1000000 Component Level Percentage (%) PPM 38.86 0.91 0.05 0.01 39.83 388586 9076 503 97 398261 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 0.58 5773 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 1.12 11204 Homogeneous Material Level Percentage (%) PPM 99.99 1000000 Component Level Percentage (%) PPM 0.54 5448 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 1.68 16823 Homogeneous Material Level Percentage (%) PPM 80 800000 15 150000 5 50000 100 1000000 Component Level Percentage (%) PPM 0.33 0.06 0.02 0.41 3255 610 203 4068 Leadframe Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus Internal Leadframe Plating Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 4.45 E-04 External Leadframe Plating Description Tin & its alloys Substance Tin CAS# Weight (g) 7440-31-5 8.64 E-04 Bond Wires Description Precious metals Substance CAS# Weight (g) Gold 4.20 E-04 Chip Description Other inorganic materials Substance Weight (g) CAS# Doped Silicon 1.30 E-03 Die Attach Description Precious metals Thermosets Others Subtotal Substance Silver Epoxy Resin Curing agent & hardener CAS# Weight (g) 7440-22-4 Proprietary Proprietary 2.51 E-04 4.70 E-05 1.57 E-05 3.14 E-04 Weight (g) 7.71 E-02 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 PPM 1000000 Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant QSOP 150 mils 16 SnPb No No No Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Novolac Antimony Trioxide Brominated Resin Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary 9003-35-4 1309-64-4 40039-93-8 1333-86-4 3.71 E-02 3.23 E-03 1.72 E-03 6.46 E-04 2.15 E-04 1.29 E-04 4.30 E-02 CAS# Weight (g) Percentage (%) PPM Percentage (%) 86.20 7.50 4.00 1.50 0.50 0.30 100 862000 75000 40000 15000 5000 3000 1000000 48.14 4.19 2.23 0.84 0.28 0.17 55.84 PPM 481360 41882 22337 8376 2792 1675 558422 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 2.99 E-02 7.21 E-04 3.68 E-05 9.21 E-06 3.07 E-02 Component Level Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 38.83 0.94 0.05 0.01 39.83 PPM 388305 9359 478 119 398261 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 4.45 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.58 PPM 5773 External Leadframe Plating Homogeneous Material Level Description Substance CAS# Component Level Weight (g) Percentage (%) PPM Percentage (%) PPM Tin & its alloys Tin 7440-31-5 7.34 E-04 85.0 850000 0.95 9523 Tin & its alloys Subtotal Lead 7439-92-1 1.30 E-04 8.64 E-04 15.0 100.0 150000 1000000 0.17 1.12 1681 11204 CAS# Weight (g) Bond Wires Homogeneous Material Level Description Precious metals Substance Gold 7440-57-5 4.20 E-04 Component Level Percentage (%) PPM Percentage (%) 99.99 1000000 0.54 PPM 5448 Chip Component Level Homogeneous Material Level Description O h iinorganic Other i materials i l Substance Doped D d Silicon Sili CAS# Weight (g) 7440-21-3 7440 21 3 1.30 1 30 E-03 E 03 Percentage (%) PPM Percentage (%) 100.0 100 0 1000000 1.68 1 68 PPM 16823 Die Attach Homogeneous Material Level Description Precious metals Thermosets Others Subtotal Substance Silver Epoxy Resin Curing agent & hardener CAS# Component Level Weight (g) 2.51 E-04 4.70 E-05 1.57 E-05 3.14 E-04 7440-22-4 Proprietary Proprietary Weight (g) 7.71 E-02 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 80 15 5 100 800000 150000 50000 1000000 0.33 0.06 0.02 0.41 Percentage (%) 100.00 PPM 3255 610 203 4068 PPM 1000000