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Product / Package Information
Environmental Information
Package
Body Size
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
QSOP
150 mil
16
NiPdAu
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy Resin
Phenol Resin
Epoxy Cresol Novolac
Carbon Black
CAS#
60676-86-0
Proprietary
Proprietary
29690-82-2
1333-86-3
Component Level
Weight (g)
3.87 E-02
2.21 E-03
2.21 E-03
8.83 E-04
1.32 E-04
4.42 E-02
Percentage (%)
PPM
Percentage (%)
87.7
5.0
5.0
2.0
0.3
100.0
877000
50000
50000
20000
3000
1000000
48.38
2.76
2.76
1.10
0.17
55
PPM
483799
27583
27583
11033
1655
551653
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
2.96 E-02
7.14 E-04
3.65 E-05
9.12 E-06
3.04 E-02
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
37.03
0.89
0.05
0.01
38
PPM
370265
8924
456
114
379759
Internal/External Leadframe Plating
Homogeneous Material Level
Substance
Description
Nickel & its alloys
Precious metals
Precious metals
Subtotal
Nickel
Palladium
Gold
CAS#
7440-02-0
7440-05-3
7440-57-5
Component Level
Weight (g)
2.34 E-03
5.45 E-05
1.13 E-05
2.41 E-03
Percentage (%)
PPM
Percentage (%)
97.27
2.26
0.47
100.00
972697
22621
4683
1000000
2.93
0.07
0.01
3.01
PPM
29282
681
141
30104
Bond Wires
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Weight (g)
4.20 E-04
Percentage (%)
PPM
Percentage (%)
99.99
1000000
0.52
PPM
5248
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
2.34 E-03
Percentage (%)
PPM
Percentage (%)
100
1000000
2.92
PPM
29238
Die Attach
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epichlorohydrin-formaldehyde-phenol copolymer
Epoxy resin, epichlorohydrin-dimer fatty acid
Butyrolactone, gammaPoly(oxypropylene)diamine
2,6-Diglycidyl phenyl allyl ether oligomer
Organosilane
Copper(II) oxide
Epoxy resin modifier
CAS#
7440-22-4
9003-36-5
68475-94-5
96-48-0
9046-10-0
Unassigned
TS ref# 10001
1317-38-0
TS ref# 10038
Component Level
Weight (g)
2.49 E-04
9.95 E-06
9.95 E-06
9.95 E-06
9.95 E-06
9.95 E-06
9.95 E-06
9.95 E-06
1.66 E-06
3.20 E-04
Weight (g)
8.00 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
77.71
3.11
3.11
3.11
3.11
3.11
3.11
3.11
0.52
100.00
777100
31100
31100
31100
31100
31100
31100
31100
5200
1000000
0.31
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.002
0.40
Percentage (%)
100
PPM
3107
124
124
124
124
124
124
124
21
3998
PPM
1000000
Product / Package Information
Environmental Information
Package
Body Size
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
QSOP
150 mils
16
100Sn
Yes
Yes
No
Yes
Materials Declaration
Molding Compound
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Novolac
Antimony Trioxide
Brominated Resin
Carbon Black
CAS#
Weight (g)
60676-86-0
Proprietary
9003-35-4
1309-64-4
40039-93-8
1333-86-4
3.71 E-02
3.23 E-03
1.72 E-03
6.46 E-04
2.15 E-04
1.29 E-04
4.30 E-02
CAS#
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
3.00 E-02
7.00 E-04
3.88 E-05
7.44 E-06
3.07 E-02
Homogeneous Material Level
Percentage (%)
PPM
86.20
862000
7.50
75000
4.00
40000
1.50
15000
0.50
5000
0.30
3000
100
1000000
Component Level
Percentage (%)
PPM
48.14
4.19
2.23
0.84
0.28
0.17
55.84
481360
41882
22337
8376
2792
1675
558422
Homogeneous Material Level
Percentage (%)
PPM
97.57
975706
2.28
22789
0.13
1263
0.02
242
100.00
1000000
Component Level
Percentage (%)
PPM
38.86
0.91
0.05
0.01
39.83
388586
9076
503
97
398261
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Component Level
Percentage (%)
PPM
0.58
5773
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Component Level
Percentage (%)
PPM
1.12
11204
Homogeneous Material Level
Percentage (%)
PPM
99.99
1000000
Component Level
Percentage (%)
PPM
0.54
5448
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Component Level
Percentage (%)
PPM
1.68
16823
Homogeneous Material Level
Percentage (%)
PPM
80
800000
15
150000
5
50000
100
1000000
Component Level
Percentage (%)
PPM
0.33
0.06
0.02
0.41
3255
610
203
4068
Leadframe
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
Internal Leadframe Plating
Description
Precious metals
Substance
Silver
CAS#
Weight (g)
7440-22-4
4.45 E-04
External Leadframe Plating
Description
Tin & its alloys
Substance
Tin
CAS#
Weight (g)
7440-31-5
8.64 E-04
Bond Wires
Description
Precious metals
Substance
CAS#
Weight (g)
Gold
4.20 E-04
Chip
Description
Other inorganic materials
Substance
Weight (g)
CAS#
Doped Silicon
1.30 E-03
Die Attach
Description
Precious metals
Thermosets
Others
Subtotal
Substance
Silver
Epoxy Resin
Curing agent & hardener
CAS#
Weight (g)
7440-22-4
Proprietary
Proprietary
2.51 E-04
4.70 E-05
1.57 E-05
3.14 E-04
Weight (g)
7.71 E-02
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
100.00
PPM
1000000
Product / Package Information
Environmental Information
Package
Body Size
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
QSOP
150 mils
16
SnPb
No
No
No
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Novolac
Antimony Trioxide
Brominated Resin
Carbon Black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
9003-35-4
1309-64-4
40039-93-8
1333-86-4
3.71 E-02
3.23 E-03
1.72 E-03
6.46 E-04
2.15 E-04
1.29 E-04
4.30 E-02
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.20
7.50
4.00
1.50
0.50
0.30
100
862000
75000
40000
15000
5000
3000
1000000
48.14
4.19
2.23
0.84
0.28
0.17
55.84
PPM
481360
41882
22337
8376
2792
1675
558422
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
2.99 E-02
7.21 E-04
3.68 E-05
9.21 E-06
3.07 E-02
Component Level
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
38.83
0.94
0.05
0.01
39.83
PPM
388305
9359
478
119
398261
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
Weight (g)
7440-22-4
4.45 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.58
PPM
5773
External Leadframe Plating
Homogeneous Material Level
Description
Substance
CAS#
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
PPM
Tin & its alloys
Tin
7440-31-5
7.34 E-04
85.0
850000
0.95
9523
Tin & its alloys
Subtotal
Lead
7439-92-1
1.30 E-04
8.64 E-04
15.0
100.0
150000
1000000
0.17
1.12
1681
11204
CAS#
Weight (g)
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
7440-57-5
4.20 E-04
Component Level
Percentage (%)
PPM
Percentage (%)
99.99
1000000
0.54
PPM
5448
Chip
Component Level
Homogeneous Material Level
Description
O h iinorganic
Other
i materials
i l
Substance
Doped
D
d Silicon
Sili
CAS#
Weight (g)
7440-21-3
7440 21 3
1.30
1 30 E-03
E 03
Percentage (%)
PPM
Percentage (%)
100.0
100 0
1000000
1.68
1 68
PPM
16823
Die Attach
Homogeneous Material Level
Description
Precious metals
Thermosets
Others
Subtotal
Substance
Silver
Epoxy Resin
Curing agent & hardener
CAS#
Component Level
Weight (g)
2.51 E-04
4.70 E-05
1.57 E-05
3.14 E-04
7440-22-4
Proprietary
Proprietary
Weight (g)
7.71 E-02
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
80
15
5
100
800000
150000
50000
1000000
0.33
0.06
0.02
0.41
Percentage (%)
100.00
PPM
3255
610
203
4068
PPM
1000000