100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP] (SV-100-1) Dimensions shown in millimeters a 0.75 0.60 0.45 16.00 BSC SQ 1.20 MAX 14.00 BSC SQ 100 1 SEATING PLANE 76 76 75 100 75 1 PIN 1 BOTTOM VIEW (PINS UP) TOP VIEW (PINS DOWN) CONDUCTIVE HEAT SINK 51 26 51 50 50 1.05 1.00 0.95 7° 3.5° 0° 0.50 BSC 0.27 0.22 0.17 0.15 0.05 26 25 6.50 NOM COPLANARITY 0.08 COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD NOTES 1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED. 2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS. 040506-A 25 0.20 0.09