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100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-1)
Dimensions shown in millimeters
a
0.75
0.60
0.45
16.00 BSC SQ
1.20
MAX
14.00 BSC SQ
100
1
SEATING
PLANE
76
76
75
100
75
1
PIN 1
BOTTOM VIEW
(PINS UP)
TOP VIEW
(PINS DOWN)
CONDUCTIVE
HEAT SINK
51
26
51
50
50
1.05
1.00
0.95
7°
3.5°
0°
0.50 BSC
0.27
0.22
0.17
0.15
0.05
26
25
6.50
NOM
COPLANARITY
0.08
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
040506-A
25
0.20
0.09