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Analog Devices Welcomes
Hittite Microwave Corporation
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v01.1103
MP86 (E) – 4 LEAD PLASTIC MICRO-P
PLASTIC PACKAGE (A.K.A. MICRO-X)
PACKAGE OUTLINES
MP86 (E) Package Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
5. THE MICRO-P PACKAGE IS DIMENSIONALLY
COMPATIBLE WITH THE “MICRO-X PACKAGE”
Package Information
Part Number Suffix
Package Body Material
Lead Finish
MSL Rating
MP86
RoHS Compliant Mold Compound
Sn/Pb Solder
MSL1
MP86E
RoHS Compliant Mold Compound
100% matte Sn
MSL1
Package Marking [3]
[1]
HNNN
[2]
HNNN
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 3-Digit part number NNN
B - 18
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
v01.1103
MP86 (E) – 4 LEAD PLASTIC MICRO-P
PLASTIC PACKAGE (A.K.A. MICRO-X)
PACKAGE OUTLINES
Suggested MP86 (E) PCB Land Pattern
NOTES:
1. DIMENSIONS ARE IN INCHES [MILLIMETERS].
2. PAD WIDTH SHOWN IS FOR SOLDERING ONLY. BEYOND SOLDERING AREA ALL CONDUCTORS THAT
CARRY RF AND MICROWAVE SIGNALS SHOULD HAVE 50 OHM CHARACTERISTIC IMPEDANCE.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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