Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v01.1103 MP86 (E) – 4 LEAD PLASTIC MICRO-P PLASTIC PACKAGE (A.K.A. MICRO-X) PACKAGE OUTLINES MP86 (E) Package Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 4. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. 5. THE MICRO-P PACKAGE IS DIMENSIONALLY COMPATIBLE WITH THE “MICRO-X PACKAGE” Package Information Part Number Suffix Package Body Material Lead Finish MSL Rating MP86 RoHS Compliant Mold Compound Sn/Pb Solder MSL1 MP86E RoHS Compliant Mold Compound 100% matte Sn MSL1 Package Marking [3] [1] HNNN [2] HNNN [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 3-Digit part number NNN B - 18 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com v01.1103 MP86 (E) – 4 LEAD PLASTIC MICRO-P PLASTIC PACKAGE (A.K.A. MICRO-X) PACKAGE OUTLINES Suggested MP86 (E) PCB Land Pattern NOTES: 1. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 2. PAD WIDTH SHOWN IS FOR SOLDERING ONLY. BEYOND SOLDERING AREA ALL CONDUCTORS THAT CARRY RF AND MICROWAVE SIGNALS SHOULD HAVE 50 OHM CHARACTERISTIC IMPEDANCE. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com B - 11