Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 8 X 8 X 0.75 (5.8 EP) 56 100 Sn MS010587B Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) 5.69E-02 8.37E-03 2.03E-04 6.55 E-02 Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 33.56 4.94 0.12 38.62 PPM 335632 49354 1197 386183 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 8.81 E-02 2.12 E-03 1.08 E-04 2.71 E-05 9.03 E-02 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 51.93 1.25 0.06 0.02 53.27 PPM 519338 12517 639 160 532654 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) 1.85 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 1.09 PPM 10934 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 3.90 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.23 PPM 2297 Bond Wires Component Level Homogeneous Material Level Description Precious metals Precious metals Subtotal Substance Gold Palladium CAS# Weight (g) 7440-57-5 7440-05-3 1.01 E-03 1.02 E-05 1.02 E-03 CAS# Weight (g) Percentage (%) PPM Percentage (%) 99.0 1.0 100.0 990000 10000 1000000 0.60 0.01 0.60 PPM 5952 60 6013 Chip Component Level Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon 7440-21-3 9.02 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 5.32 PPM 53213 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Component Level Weight (g) 1.16 E-03 4.62 E-05 4.62 E-05 4.62 E-05 4.62 E-05 4.62 E-05 4.62 E-05 4.62 E-05 7.73 E-06 1.49 E-03 Weight (g) 1.70 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 0.68 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.005 0.88 Percentage (%) 100 PPM 6813 273 273 273 273 273 273 273 46 8767 PPM 1000000