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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
MS Number
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
3 X 3 X 0.75 (1.5 EP)
12
100 Sn
MS010587B
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
60676-86-0
Proprietary
1333-86-4
Component Level
Weight (g)
7.22E-03
1.06E-03
2.57E-05
8.30E-03
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100.00
869100
127800
3100
1000000
35.55
5.23
0.13
40.91
PPM
355543
52282
1268
409094
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
9.61 E-03
2.49 E-04
5.98 E-05
4.98 E-05
9.97 E-03
Percentage (%)
PPM
Percentage (%)
96.40
2.50
0.60
0.50
100.00
963989
25006
6004
5001
1000000
47.32
1.23
0.29
0.25
49.09
PPM
473234
12276
2947
2455
490912
Internal Leadframe Plating
Homogeneous Material Level
Substance
Description
Precious metals
Silver
CAS#
7440-22-4
Component Level
Weight (g)
2.49 E-05
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.12
PPM
1227
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Component Level
Weight (g)
4.75 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.34
PPM
23377
Bond Wires
Homogeneous Material Level
Description
Precious metals
Precious metals
Subtotal
Substance
Gold
Palladium
CAS#
7440-57-5
7440-05-3
Component Level
Weight (g)
4.70E-05
4.75E-07
4.75 E-05
Percentage (%)
PPM
Percentage (%)
99.0
1.0
100.0
990000
10000
1000000
0.23
0.002
0.23
PPM
2314
23
2338
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
1.42 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
7.01
PPM
70130
Die Attach
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epichlorohydrin-formaldehyde-phenol copolymer
Epoxy resin, epichlorohydrin-dimer fatty acid
Butyrolactone, gammaPoly(oxypropylene)diamine
2,6-Diglycidyl phenyl allyl ether oligomer
Organosilane
Copper(II) oxide
Epoxy resin modifier
CAS#
7440-22-4
9003-36-5
68475-94-5
96-48-0
9046-10-0
Unassigned
TS ref# 10001
1317-38-0
TS ref# 10038
Component Level
Weight (g)
4.61 E-05
1.84 E-06
1.84 E-06
1.84 E-06
1.84 E-06
1.84 E-06
1.84 E-06
1.84 E-06
3.08 E-07
5.93 E-05
Weight (g)
2.03 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
77.71
3.11
3.11
3.11
3.11
3.11
3.11
3.11
0.52
100.0
777100
31100
31100
31100
31100
31100
31100
31100
5200
1000000
0.23
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.00
0.29
Percentage (%)
100
PPM
2271
91
91
91
91
91
91
91
15
2922
PPM
1000000