Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched 5 X 5 X 0.85 (3.1 EP) 16 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) 2.18E-02 3.21E-03 7.79E-05 2.51 E-02 Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 33.68 4.95 0.12 38.75 PPM 336763 49521 1201 387485 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 3.23 E-02 8.37 E-04 2.01 E-04 1.67 E-04 3.35 E-02 Percentage (%) PPM Percentage (%) 96.40 2.50 0.60 0.50 100.00 963989 25006 6004 5001 1000000 49.74 1.29 0.31 0.26 51.60 PPM 497447 12904 3098 2581 516030 Internal Leadframe Plating Homogeneous Material Level Substance Description Precious metals Silver CAS# 7440-22-4 Component Level Weight (g) 7.40 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 1.14 PPM 11406 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 1.09 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 1.68 PPM 16800 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 5.40 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.83 PPM 8323 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) 3.18 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 4.90 PPM 49014 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Component Level Weight (g) 5.52 E-04 2.21 E-05 2.21 E-05 2.21 E-05 2.21 E-05 2.21 E-05 2.21 E-05 2.21 E-05 3.69 E-06 7.10 E-04 Weight (g) 6.49 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 0.85 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.01 1.09 Percentage (%) 100 PPM 8504 340 340 340 340 340 340 340 57 10943 PPM 1000000 Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched 5 X 5 X 0.85 (3.1 EP) 16 85Sn/15Pb No No Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) 2.18E-02 3.21E-03 7.79E-05 2.51 E-02 Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 33.68 4.95 0.12 38.75 PPM 336763 49521 1201 387485 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 3.23 E-02 8.37 E-04 2.01 E-04 1.67 E-04 3.35 E-02 Percentage (%) PPM Percentage (%) 96.40 2.50 0.60 0.50 100.00 963989 25006 6004 5001 1000000 49.74 1.29 0.31 0.26 51.60 PPM 497447 12904 3098 2581 516030 Internal Leadframe Plating Homogeneous Material Level Substance Description Precious metals Silver CAS# 7440-22-4 Component Level Weight (g) 7.40 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 1.14 PPM 11406 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Tin & its alloys Subtotal Substance Tin Lead CAS# 7440-31-5 7439-92-1 Component Level Weight (g) 9.27 E-04 1.64 E-04 1.09 E-03 Percentage (%) PPM Percentage (%) 85.0 15.0 100.0 850000 150000 1000000 1.43 0.25 1.68 PPM 14280 2520 16800 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 5.40 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.83 PPM 8323 Chip Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 3.18 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 4.90 PPM 49014 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Component Level Weight (g) 5.52 E-04 2.21 E-05 2.21 E-05 2.21 E-05 2.21 E-05 2.21 E-05 2.21 E-05 2.21 E-05 3.69 E-06 7.10 E-04 Weight (g) 6.49 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 0.85 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.01 1.09 Percentage (%) 100 PPM 8504 340 340 340 340 340 340 340 57 10943 PPM 1000000