16-Ball Wafer Level Chip Scale Package [WLCSP] (CB-16-3) Dimensions shown in millimeters 2.000 1.960 SQ 1.920 4 3 2 1 A BALL A1 IDENTIFIER B 1.50 REF C TOP VIEW 0.50 BSC (BALL SIDE DOWN) SEATING PLANE BOTTOM VIEW (BALL SIDE UP) SIDE VIEW COPLANARITY 0.05 0.340 0.320 0.300 0.270 0.240 0.210 10-17-2012-B 0.640 0.595 0.540 D