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16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16-2)
Dimensions shown in millimeters
a
0.659
0.606
0.553
2.185
BSC SQ
SEATING
PLANE
4
3
2
1
A
BALL 1
IDENTIFIER
0.363
0.313
0.263
B
0.50
REF
C
D
0.369
0.356
0.343
0.03 MAX
COPLANARITY
0.290
0.250
0.210
0.3425
REF
BOTTOM VIEW
(BALL SIDE UP)
022908-A
TOP VIEW
(BALL SIDE DOWN)