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36-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-36-3)
Dimensions shown in millimeters
3.445
3.405 SQ
3.365
6
5
4
3
2
1
A
BALL A1
IDENTIFIER
B
2.50
BSC SQ
C
D
E
F
0.50
TOP VIEW
(BALL SIDE DOWN)
SEATING
PLANE
SIDE VIEW
0.380
0.360
0.340
BOTTOM VIEW
(BALL SIDE UP)
COPLANARITY
0.05
0.360
0.320
0.280
0.270
0.240
0.210
08-01-2012-A
0.650
0.600
0.550
BALL PITCH