36-Ball Wafer Level Chip Scale Package [WLCSP] (CB-36-3) Dimensions shown in millimeters 3.445 3.405 SQ 3.365 6 5 4 3 2 1 A BALL A1 IDENTIFIER B 2.50 BSC SQ C D E F 0.50 TOP VIEW (BALL SIDE DOWN) SEATING PLANE SIDE VIEW 0.380 0.360 0.340 BOTTOM VIEW (BALL SIDE UP) COPLANARITY 0.05 0.360 0.320 0.280 0.270 0.240 0.210 08-01-2012-A 0.650 0.600 0.550 BALL PITCH