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30-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-30-3)
Dimensions shown in millimeters
2.565
2.525
2.485
5
4
3
2
1
A
BALL A1
IDENTIFIER
B
3.045
3.005
2.965
2.50
REF
C
D
E
F
0.50
BALL PITCH
TOP VIEW
SEATING
PLANE
0.390
0.360
0.330
SIDE VIEW
2.00 REF
COPLANARITY
0.05
0.360
0.320
0.280
0.270
0.240
0.210
06-29-2010-C
0.660
0.600
0.540
BOTTOM VIEW
(BALL SIDE UP)
(BALL SIDE DOWN)