30-Ball Wafer Level Chip Scale Package [WLCSP] (CB-30-3) Dimensions shown in millimeters 2.565 2.525 2.485 5 4 3 2 1 A BALL A1 IDENTIFIER B 3.045 3.005 2.965 2.50 REF C D E F 0.50 BALL PITCH TOP VIEW SEATING PLANE 0.390 0.360 0.330 SIDE VIEW 2.00 REF COPLANARITY 0.05 0.360 0.320 0.280 0.270 0.240 0.210 06-29-2010-C 0.660 0.600 0.540 BOTTOM VIEW (BALL SIDE UP) (BALL SIDE DOWN)