80-Ball Wafer Level Chip Scale Package [WLCSP] Die is shifted right by 0.07 mm with respect to ball array (CB-80-5) Dimensions shown in millimeters 4.33 4.29 4.25 0.27 8 7 6 5 4 3 2 1 A B BALL A1 IDENTIFIER C 5.08 5.04 5.00 D 4.50 REF E F G H J 0.50 BALL PITCH TOP VIEW (BALL SIDE DOWN) SEATING PLANE SIDE VIEW 0.36 (BALL SIDE UP) 0.43 3.50 REF COPLANARITY 0.05 0.360 0.320 0.280 0.270 0.240 0.210 03-14-2013-A 0.660 0.600 0.540 0.390 0.360 0.330 K BOTTOM VIEW