TEA1720B3T
GreenChip SMPS low power control IC
Rev. 2 — 6 March 2014
Product data sheet
1. General description
The TEA1720B3T is a small and low cost Switched Mode Power Supply (SMPS)
controller IC for low power applications (up to 12.5 W) and operates directly from the
rectified universal mains input. The device includes an emitter switch for driving an
external low-cost bipolar power transistor. It has been optimized for flyback converter
topologies to provide high-efficiency over the entire load range with ultra-low power
consumption in the no-load condition. It provides a circuit for fast start-up directly from the
rectified mains voltage without any external bleeder circuits.
The converter operates as a regulated voltage source from no-load up to the maximum
output current and operates as current source that delivers the maximum current over a
broad output voltage range. Using the TEA1720B3T a low power converter can be built at
minimum cost and with the minimum number of external components.
The controller regulates the output voltage with primary-side sensing which eliminates the
need for an additional secondary feedback circuitry and simplifies the design. At higher
power levels, a frequency and current control mode is used. It operates with Burst mode
control at low power levels and no-load condition. The burst mode minimizes audible
noise and provides an energy save state which reduces the power consumption in
no-load condition. The Burst mode frequency of 400 Hz enables no-load power
consumption < 20 mW at high mains input.
A fast transient response is obtained when the TEA1720B3T is used in combination with
the TEA1705 transient controller at the secondary side. The fast transient response
ensures excellent control of the output voltage at load steps, at minimum no load power
and at small output capacitors.
2. Features and benefits
2.1 Power features
Low power SMPS controller designed for charger applications up to 12.5 W
Primary sensing for control of the output voltage without optocoupler and secondary
feedback circuitry
Minimizes audible noise in all operation modes
USB battery charging and Energy Star 2.0 compliant
Jitter function for reduced EMI
Cable compensation 0.3 V at maximum power
Fast transient response when TEA1720B3T is used with the TEA1705 transient
controller at the secondary side
TEA1720B3T
NXP Semiconductors
GreenChip SMPS low power control IC
Integrated emitter switch to control external low-cost bipolar power transistor
2.2 Green features
Enables no-load power consumption < 20 mW
Very low supply current in no-load condition with energy save mode
Incorporates a high voltage start-up circuit with zero current consumption under
normal switching operation
Available in halogen-free and Restriction of Hazardous Substances (RoHS) SO8
package
2.3 Protection features
OverVoltage Protection (OVP) on feedback control pin (FB) with safe restart
UnderVoltage LockOut (UVLO) on IC supply pin
OverTemperature Protection (OTP)
Soft-start by reduced peak current for zero and low output voltage
Demagnetization protection for guaranteed discontinuous conduction mode operation
Open and short-circuit protection of the Feedback control (FB) pin
Short-circuit protection of the charger output
3. Applications
Battery chargers for smart phones and media tablets up to 12.5 W
Standby supply for TV and desktop PC
4. Quick reference data
Table 1.
Symbol
Quick reference data
Parameter
Conditions
Min
Typ
Max Unit
emitter switch; Ids = 100 mA;
Tj = 25 C
0.75
0.85
1.0
Power switch (pin EMITTER)
Ron
on-state resistance
Oscillator (pins EMITTER and SENSE)
fburst
burst mode
frequency
burst frequency in CVB mode,
without jitter
350
400
450
Hz
fosc(high)
HIGH oscillator
frequency
maximum switching frequency in
CV and CC mode, without jitter
46
52
58
kHz
15
17
19
V
7.5
8.5
9.5
V
Supply (pin VCC)
TEA1720B3T
Product data sheet
VCC(startup)
start-up supply
voltage
VCC(stop)
stop supply voltage
undervoltage lockout of IC
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Rev. 2 — 6 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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TEA1720B3T
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GreenChip SMPS low power control IC
5. Ordering information
Table 2.
Ordering information
Type number
Package
TEA1720B3T/1
Name
Description
Version
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
6. Block diagram
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TEA1720B3T block diagram
7. Pinning information
7.1 Pinning
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Fig 2.
TEA1720B3T
Product data sheet
TEA1720B3T pin configuration
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Rev. 2 — 6 March 2014
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GreenChip SMPS low power control IC
7.2 Pin description
Table 3.
Pin description
Pin
Pin name
I/O type Description
1
HV
I
high-voltage start-up
2
n.c.
-
not connected; high-voltage spacer
3
FB
I
feedback input for voltage sensing
4
GND1
-
ground
5
GND2
-
ground
6
SENSE
I
source emitter switch and sense input
7
VCC
I
supply input
8
EMITTER
I
emitter connection of external NPN power transistor
8. Functional description
8.1 Start-up
The TEA1720B3T starts up by charging the VCC capacitor until the VCC(startup) level. The
charging current flows from the HV pin via an internal start-up current source to the VCC
pin.
Once the start-up level has been reached the start-up current source is switched off.
During the switching operation, the start-up current source remains current-less and has
zero bleeder loss.
8.2 Primary sensing
The FB input senses the reflected secondary voltage on the primary side. The FB input
has a sample and hold function that samples the FB voltage on the secondary stroke to
control the output voltage.
The sampled VFBS voltage is the input for the TEA1720B3T’s control loop and defines the
operating mode.
8.3 Operating modes
The TEA1720B3T operates in three modes, one of which is active at the time. The three
modes in order of decreasing load impedance are:
• CVB: Constant Voltage with Burst mode
• CV: Constant Voltage mode
• CC: Constant Current mode
The converter acts as a voltage source in CVB and CV modes.
The converter acts as a current source in CC mode.
8.3.1 Constant Voltage with Burst mode (CVB)
At low power, the TEA1720B3T operates in Burst mode.
TEA1720B3T
Product data sheet
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Burst mode operates with a Vref-peak = 120 mV, a switching frequency of 23 kHz and burst
duty cycle regulation by sensing the FB voltage.
The TEA1720B3T features an energy save function that puts the main part of the
analogue blocks in a sleep mode with low supply current in burst mode. The burst mode
enables the energy save mode in the non-switching part of the burst. The IC switches to
the nominal supply just before new burst starts.
Transition from burst mode to CV mode happens at 100 % burst duty cycle: a burst
completely filled with 32 pulses. This 100 % pulse train is identical to the lowest power
level of the CV mode. The TEA1720B3T changes directly from burst mode to CV mode if
the FB voltage drops below 2.4 V in burst mode.
8.3.2 Constant Voltage mode (CV)
At higher power levels, the TEA1720B3T operates in CV mode. The output voltage is
sensed by the FB pin and the control keeps the output voltage constant over the power
range.
CV mode starts at 23 kHz switching frequency and peak current regulation at the Vref-peak
minimum level of 120 mV.
With an increasing power output, the Vref-peak level and the switching frequency are also
increased.
CV mode is exited when the maximum power level is reached. Maximum power occurs at
peak current regulation at the Vref-peak maximum level of 575 mV and a maximum
switching frequency of 52 kHz.
8.3.3 Constant Current mode (CC)
The CC mode starts at maximum power delivery and keeps the output current constant for
decreasing output voltage.
CC mode is enabled when the converter is operating at the maximum switching
frequency, with the maximum primary peak current when the FB voltage drops below the
regulated level.
Regulation of the switching frequency from 52 kHz down to 23 kHz controls the CC mode
operation.
8.4 Jitter
The TEA1720B3T features a jitter function for ElectroMagnetic Interference (EMI)
reduction. The switching frequency is 7 % typical for the spread spectrum. The sweep
frequency is a low frequency of approximately 220 Hz. To keep the output power constant,
the VSENSE level is jittered with the opposite polarity. The jitter is active in all operation
modes except burst mode.
8.5 Cable compensation
The TEA1720B3T features a cable compensation function which keeps the output voltage
at the end of a 0.15 cable constant. The reference voltage tracks the load, increasing
from 2.5 V at no-load up to 2.65 V at full load. This results in an increase of the output
voltage by 300 mV at an output current of 2 A.
TEA1720B3T
Product data sheet
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Rev. 2 — 6 March 2014
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GreenChip SMPS low power control IC
8.6 Fast transient response
In combination with the TEA1705 transient controller at the secondary side the
TEA1720B3T can achieve a fast transient response on load steps.
In the Energy save state the TEA1720B3T monitors the FB pin. When the device detects
a load step a signal is submitted through the transformer that pulls the FB pin below the
0.5 V threshold.
The TEA1720B3T wakes up quickly and reacts with the maximum peak current and the
switching frequency to keep the drop of the output voltage to its minimum. The device’s
reaction allows the smallest size output capacitor.
8.7 Short pin SENSE protection
The TEA1720B3T has an integrated protection against faults caused by a shorted SENSE
pin or a shorted sense resistor. During every primary stroke, the voltage on the SENSE
pin is monitored. In normal situations, the voltage on the SENSE pin reaches the sense
protection trigger level after the sense protection time has passed. When the SENSE
voltage does not reach this level, the SENSE pin is shorted and the protection is
activated. The IC stops switching and restarts. The value of the sense protection time is
automatically adapted to the mains input voltage.
8.8 Hiccup mode protection
The hiccup mode protects the power supply from damage in case of current overload
situations. The output voltage is sensed via the FB pin. If the voltage on the FB pin drops
below the Vth(hiccup) level for a time exceeding tblank(hiccup), the TEA1720B3T stops
switching and restarts. As long as the fault condition is present the IC makes repetitive
restart attempts. Once the fault condition is removed, normal operation is resumed.
8.9 OverTemperature Protection (OTP)
The IC incorporates an accurate internal temperature protection. When the junction
temperature exceeds the overtemperature protection threshold temperature, the IC stops
switching. Once the temperature has dropped with the overtemperature protection
temperature hysteresis (T < Tpl(IC) Tpl(IC)hys), the IC restarts.
TEA1720B3T
Product data sheet
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TEA1720B3T
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GreenChip SMPS low power control IC
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
General
Tamb
ambient temperature
40
+85
C
Tj
junction temperature
40
+160
C
Tstg
storage temperature
55
+150
C
VESD
electrostatic discharge
voltage
500
+500
V
2000
+2000
V
CDM; all pins
HBM; all pins
[1]
Voltages
VHV
voltage on pin HV
0.3
+550
V
VSENSE
voltage on pin SENSE
0.3
+5
V
VCC
supply voltage
0.3
+40
V
VEMITTER
voltage on pin EMITTER
0.3
+40
V
VFB
voltage on pin FB
20
+5
V
IEMITTER
current on pin EMITTER
1.1
1.1
A
ISENSE
current on pin SENSE
1.1
1.1
A
Currents
[1]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
10. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction
to ambient
in free air; JEDEC test board
150
K/W
in free air; on open PCB of
2.2 cm 2.6 cm; 2-layer; 35 m
Cu
200
K/W
11. Characteristics
Table 6.
Characteristics
VCC = 20 V; FB = 0 V; Rsource = 0.75 ; Tj = 25 C; all voltages referenced to GND; positive currents flow into the IC, unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply (pin VCC)
ICC(startup)
start-up supply current
VCC = 0 V
1.5
1.2
0.9
mA
ICC(startup)
start-up supply current
VCC = VCC(startup) 1
1.3
1.0
0.7
mA
ICC
supply current
VFB = 2.8 V; non-switching;
in energy save
130
170
210
A
VCC(startup)
start-up supply voltage
CC mode
TEA1720B3T
Product data sheet
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Rev. 2 — 6 March 2014
0.6
0.8
1.0
mA
15
17
19
V
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TEA1720B3T
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GreenChip SMPS low power control IC
Table 6.
Characteristics …continued
VCC = 20 V; FB = 0 V; Rsource = 0.75 ; Tj = 25 C; all voltages referenced to GND; positive currents flow into the IC, unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCC(stop)
stop supply voltage
undervoltage lockout of IC
7.5
8.5
9.5
V
Tpl(IC)
IC protection level
temperature
140
150
160
C
Tpl(IC)hys
hysteresis of IC protection
level temperature
-
50
-
C
3.1
3.2
3.3
V
Feedback (pin FB)
Vth(ovp)FB
overvoltage protection
threshold voltage on pin FB
Vref(FB)
reference voltage on pin
FB
CV mode
2.45
2.5
2.55
V
Vth(FB)
threshold voltage on pin FB transition from burst mode to constant
voltage
2.35
2.4
2.45
V
Vdet(demag)FB
demagnetization detection
voltage on FB pin
25
50
75
mV
Vdet(trt)FB
transient detection voltage
on pin FB
in energy save state
0.6
0.5
0.4
V
td(s)
sample delay time
moment of sampling VFB after start of
secondary stroke; VFB = 2.35 V
4.4
5.4
6.4
s
burst frequency in CVB mode, without
jitter
350
400
450
Hz
Oscillator (pins EMITTER and SENSE)
fburst
burst mode frequency
fjit/fsw
jitter frequency to switching in all operation modes except in CVB
frequency ratio
mode
5
7
9
%
fosc(high)
high oscillator frequency
maximum switching frequency in CV
and CC mode, without jitter
46
52
58
kHz
fosc(low)
low oscillator frequency
minimum switching frequency in CV
and CC mode, without jitter. switching
frequency in CVB mode
20
23
26
kHz
fmod
modulation frequency
in current source operation
170
220
270
Hz
max
maximum duty cycle
72
75
78
%
VHV = 325 V
-
1
-
A
Ids = 100 mA
0.75
0.85
1.0
dV/dt = 0.2 V/s
-
100
-
ns
270
320
370
ns
HV start-up (pin HV)
Ioff(HV)
off-state current on pin HV
Emitter switch (pin EMITTER)
Ron
on-state resistance
Peak current comparator (pin SENSE)
tPD
propagation delay
tleb
leading edge blanking time
Vsense(high)
high sense voltage
maximum peak voltage in CV and CC
modes, without jitter; VFB = 10 V
540
575
610
mV
Vsense(low)
low sense voltage
CVB mode; VFB = 10 V
100
120
140
mV
Vsense(high)2
15.8
17.0
18.2
V2kHz
Vsense2fosc
square sense voltage times
* fosc(high); in CV and CC
oscillator frequency
modes, without jitter; VFB = 10 V
TEA1720B3T
Product data sheet
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Rev. 2 — 6 March 2014
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TEA1720B3T
NXP Semiconductors
GreenChip SMPS low power control IC
Table 6.
Characteristics …continued
VCC = 20 V; FB = 0 V; Rsource = 0.75 ; Tj = 25 C; all voltages referenced to GND; positive currents flow into the IC, unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Sense pin short protection (pin SENSE)
Vscp(high)
high short-circuit protection
voltage
-
125
-
mV
Vscp(low)
low short-circuit protection
voltage on pin SENSE
-
105
-
mV
tblank(scp)SENSE
short-circuit protection
blanking time on pin
SENSE
1
1.35
1.7
s
VFB = 10 V
Hiccup protection (pin FB)
Vth(hiccup)
hiccup release threshold
voltage
1.35
1.45
1.55
V
Vth(rel)(hiccup)
hiccup release voltage
1.6
1.7
1.8
V
tblank(hiccup)
hiccup blanking time
15
21
27
ms
TEA1720B3T
Product data sheet
at minimum switching frequency
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TEA1720B3T
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GreenChip SMPS low power control IC
12. Application information
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TEA1720B3T
Product data sheet
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Rev. 2 — 6 March 2014
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TEA1720B3T
NXP Semiconductors
GreenChip SMPS low power control IC
13. Package outline
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TEA1720B3T
Product data sheet
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Rev. 2 — 6 March 2014
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GreenChip SMPS low power control IC
14. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA1720B3T v.2
20140306
Product data sheet
-
TEA1720B3T v.1
Modifications:
TEA1720B3T v.1
TEA1720B3T
Product data sheet
•
The data sheet status has changed from objective to product.
20131203
Objective data sheet
-
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Rev. 2 — 6 March 2014
-
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15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TEA1720B3T
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
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Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
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NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 6 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
13 of 15
TEA1720B3T
NXP Semiconductors
GreenChip SMPS low power control IC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP Semiconductors N.V.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TEA1720B3T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 6 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
14 of 15
NXP Semiconductors
TEA1720B3T
GreenChip SMPS low power control IC
17. Contents
1
2
2.1
2.2
2.3
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.4
8.5
8.6
8.7
8.8
8.9
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Power features . . . . . . . . . . . . . . . . . . . . . . . . . 1
Green features . . . . . . . . . . . . . . . . . . . . . . . . . 2
Protection features . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 4
Start-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Primary sensing . . . . . . . . . . . . . . . . . . . . . . . . 4
Operating modes . . . . . . . . . . . . . . . . . . . . . . . 4
Constant Voltage with Burst mode (CVB). . . . . 4
Constant Voltage mode (CV) . . . . . . . . . . . . . . 5
Constant Current mode (CC) . . . . . . . . . . . . . . 5
Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Cable compensation . . . . . . . . . . . . . . . . . . . . . 5
Fast transient response . . . . . . . . . . . . . . . . . . 6
Short pin SENSE protection . . . . . . . . . . . . . . . 6
Hiccup mode protection . . . . . . . . . . . . . . . . . . 6
OverTemperature Protection (OTP) . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics . . . . . . . . . . . . . . . . . . 7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application information. . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 6 March 2014
Document identifier: TEA1720B3T