MRF24J40MB Data Sheet

MRF24J40MB
Data Sheet
2.4 GHz IEEE Std. 802.15.4™
20 dBm RF Transceiver Module
 2009 Microchip Technology Inc.
Preliminary
DS70599B
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Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
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© 2009, Microchip Technology Incorporated, Printed in the
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Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
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and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS70599B-page ii
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
2.4 GHz IEEE Std. 802.15.4™ 20 dBm RF Transceiver Module
Features:
RF/Analog Features:
• IEEE Std. 802.15.4™ Compliant RF Transceiver
• Supports ZigBee®, MiWi™, MiWi P2P and
Proprietary Wireless Networking Protocols
• Small Size: 0.9" x 1.3" (22.9 mm x 33.0 mm),
Surface Mountable
• Integrated Crystal, Internal Voltage Regulator,
Matching Circuitry, Power Amplifier, Low Noise
Amplifier and PCB Antenna
• Easy Integration into Final Product – Minimize
Product Development, Quicker Time to Market
• Radio Regulation Certified for United States
(FCC), Canada (IC) and Europe (ETSI)
• Compatible with Microchip Microcontroller
Families (PIC16F, PIC18F, PIC24F/H, dsPIC33
and PIC32)
• Up to 4000 ft. Range
• ISM Band 2.405-2.475 GHz Operation
• Data Rate: 250 kbps
• -102 dBm Typical Sensitivity with -23 dBm
Maximum Input Level
• +20 dBm Typical Output Power with 56 dB TX
Power Control Range
• Integrated Low Phase Noise VCO, Frequency
Synthesizer and PLL Loop Filter
• Digital VCO and Filter Calibration
• Integrated RSSI ADC and I/Q DACs
• Integrated LDO
• High Receiver and RSSI Dynamic Range
Operational:
•
•
•
•
Operating Voltage: 2.4-3.6V (3.3V typical)
Temperature Range: -40C to +85C Industrial
Simple, Four-Wire SPI Interface
Low-Current Consumption:
- RX mode: 25 mA (typical)
- TX mode: 130 mA (typical)
- Sleep: 5 A (typical)
FIGURE 1:
MAC/Baseband Features:
• Hardware CSMA-CA Mechanism, Automatic ACK
Response and FCS Check
• Independent Beacon, Transmit and GTS FIFO
• Supports all CCA modes and RSS/LQI
• Automatic Packet Retransmit Capable
• Hardware Security Engine (AES-128) with CTR,
CCM and CBC-MAC modes
• Supports Encryption and Decryption for MAC
Sublayer and Upper Layer
PIN DIAGRAM
GND
RESET
WAKE
INT
SDI
SCK
 2009 Microchip Technology Inc.
1
2
3
4
5
6
12
11
10
9
8
7
Preliminary
GND
GND
VIN
NC
CS
SDO
DS70599B-page 1
MRF24J40MB
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 3
2.0 Circuit Description ........................................................................................................................................................................ 9
3.0 Regulatory Approval................................................................................................................................................................... 19
4.0 Electrical Characteristics ........................................................................................................................................................... 23
Appendix A: Revision History............................................................................................................................................................... 25
Index ................................................................................................................................................................................................... 27
The Microchip Web Site ....................................................................................................................................................................... 29
Customer Change Notification Service ................................................................................................................................................ 29
Customer Support ................................................................................................................................................................................ 29
Reader Response ................................................................................................................................................................................ 30
Product Identification System............................................................................................................................................................... 31
TO OUR VALUED CUSTOMERS
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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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DS70599B-page 2
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
1.0
DEVICE OVERVIEW
1.1
The MRF24J40MB is a 2.4 GHz IEEE Std. 802.15.4™
compliant, surface mount module with integrated
crystal, internal voltage regulator, matching circuitry,
Power Amplifier, Low Noise Amplifier and PCB
antenna. The MRF24J40MB module operates in the
non-licensed 2.4 GHz frequency band. The integrated
module design frees the integrator from extensive RF
and antenna design, and regulatory compliance
testing, allowing quicker time to market.
The MRF24J40MB module is compatible with
Microchip’s ZigBee®, MiWi™ and MiWi P2P software
stacks. Each software stack is available as a free
download, including source code, from the Microchip
web site: http://www.microchip.com/wireless.
Interface Description
Figure 1-1 shows a simplified block diagram of the
MRF24J40MB module. The module is based on the
Microchip Technology MRF24J40 IEEE 802.15.4™
2.4 GHz RF Transceiver IC. The module interfaces to
many popular Microchip PIC® microcontrollers via a
4-wire serial SPI interface, interrupt, wake, Reset,
power and ground, as shown in Figure 1-2. Table 1-1
provides the pin descriptions.
Data communications with the MRF24J40MB module
are documented in the “MRF24J40 IEEE 802.15.4™
2.4 GHz RF Transceiver Data Sheet” (DS39776). Refer
to the MRF24J40 Data Sheet for specific serial
interface protocol and register definitions.
The MRF24J40MB module has received regulatory
approvals for modular devices in the United States
(FCC), Canada (IC) and Europe (ETSI). Modular
approval removes the need for expensive RF and
antenna design, and allows the end user to place the
MRF24J40MB module inside a finished product and
not require regulatory testing for an intentional radiator
(RF transmitter).
Note:
See Section 3.0 “Regulatory Approval”
for specific requirements to be followed by
the integrator.
FIGURE 1-1:
MRF24J40MB BLOCK DIAGRAM
MRF24J40MB IEEE Std. 802.15.4™ Module
MRF24J40
PA
PCB
Antenna
Interface
Physical
SPI
Digital
I/O
MAC
Power
Management
LNA
Power
20 MHz
Crystal
 2009 Microchip Technology Inc.
Preliminary
DS70599B-page 3
MRF24J40MB
TABLE 1-1:
Pin
PIN DESCRIPTION
Symbol
Type
Description
1
GND
Power
2
RESET
DI
Global hardware Reset pin
3
WAKE
DI
External wake-up trigger
4
INT
DO
Interrupt pin to microcontroller
5
SDI
DI
Serial interface data input
6
SCK
DI
Serial interface clock
7
SDO
DO
Serial interface data output from MRF24J40
Ground
8
CS
DI
Serial interface enable
9
NC
—
No connection
10
VIN
Power
Power supply
11
GND
Ground
Ground
12
GND
Ground
Ground
Legend: Pin type abbreviation: D = Digital, I = Input, O = Output
FIGURE 1-2:
MICROCONTROLLER TO MRF24J40MB INTERFACE
PIC® MCU
DS70599B-page 4
MRF24J40MB
I/O
CS
SDO
SDI
SDI
SDO
SCK
SCK
INTx
INT
VIN
GND
I/O
WAKE
I/O
RESET
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
1.2
FIGURE 1-4:
Mounting Details
The MRF24J40MB is a surface mountable module.
Module dimensions are shown in Figure 1-3. The
module Printed Circuit Board (PCB) is 0.032" thick with
castellated mounting points on the edge. Figure 1-4 is
a recommended host PCB footprint for the
MRF24J40MB.
RECOMMENDED PCB
FOOTPRINT
The MRF24J40MB has an integrated PCB antenna.
For the best performance, follow the mounting details
shown in Figure 1-5. It is recommended that the
module be mounted on the edge of the host PCB, and
an area around the antenna, approximately 1.2", be
kept clear of metal objects. A host PCB ground plane
around the MRF24J40MB acts as a counterpoise to the
PCB antenna. It is recommended to extend the ground
plane at least 0.4" around the module.
FIGURE 1-3:
MODULE DETAILS
 2009 Microchip Technology Inc.
Preliminary
DS70599B-page 5
MRF24J40MB
FIGURE 1-5:
MOUNTING DETAILS
1.2”
Keep area around antenna
(approximately 1.2 inches)
clear of metallic structures
for best performance
Edge of PCB
1.2”
0.315”
0.4”
0.4”
PCB Ground Plane (Counterpoise)
Underneath and extend as far as possible
to the sides and below the module
(at least 0.4 inches on each side)
for best performance
DS70599B-page 6
0.4”
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
1.3
Operation
1.3.1
PA/LNA CONTROL
Operation of the Power Amplifier (PA) IC3 and Low Noise
Amplifier (LNA) IC5 is controlled by the MRF24J40
internal RF state machine via RF switches, IC2 and IC4,
and the GPIO1 and GPIO2 pins on the MRF24J40.
Figure 1-6 shows the PA/LNA block diagram. Figure 2-1
is the schematic diagram for the module.
FIGURE 1-6:
The internal RF state machine is configured for the PA/
LNA mode by setting TESTMODE (0x22F<2:0>) = 111.
Pins, GPIO1 and GPIO2, then control the RF switches,
PA and LNA automatically when the MRF24J40
receives and transmits data.
Note:
A complete explanation of the operation of
the PA/LNA control is documented in the
“MRF24J40 Data Sheet” (DS39776),
Section 4.2 “External PA/LNA Control”.
PA/LNA BLOCK DIAGRAM
PCB
Antenna
RF Switch
AS179-92
LNA
uPC8233TK
RF Switch
AS179-92
LNA
RFP
Balun
RFN
PA
V1 V2
V1 V2
PA
PA2423L
MRF24J40
GPIO1
GPIO2
1.3.2
ENERGY DETECTION (ED)
1.3.3
SLEEP
Before performing an energy detection (see
Section 3.6.1 “RSSI Firmware Request (RSSI
Mode 1)” in the “MRF24J40 Data Sheet” (DS39776)),
perform the following steps:
To get the lowest power consumption from the
MRF24J40MB module during Sleep, it is necessary to
disable both the PA and LNA. To do this, perform the
following steps:
1.
1.
2.
3.
4.
Configure the internal RF state machine to normal
operation (TESTMODE (0x22F<2:0>) = 000).
Configure GPIO2 and GPIO1 direction for the
output (TRISGP2 (0x34<2>) = 1 and TRISGP1
(0x34<1>) = 1).
Set GPIO2 (0x33<2>) = 1 and GPIO1
(0x32<1>) = 0. This enables the LNA and
disables the PA.
Perform the energy detection following the steps
in Section 3.6.1 “RSSI Firmware Request
(RSSI Mode 1)” in the “MRF24J40 Data Sheet”
(DS39776).
Note:
2.
3.
4.
Configure the internal RF state machine to normal
operation (TESTMODE (0x22F<2:0>) = 000).
Configure the GPIO2 and GPIO1 direction for
output (TRISGP2 (0x34<2>) = 1 and TRISGP1
(0x34<1>) = 1).
Set GPIO2 (0x33<2>) = 0 and GPIO1
(0x32<1>) = 0. This disables the LNA and the PA.
Put the MRF24J40 to Sleep following the steps
in the “MRF24J40 Data Sheet” (DS39776).
When waking the module, re-enable the PA/LNA mode.
The LNA will amplify the received signal.
The RSSI value will include the receive
signal strength plus the LNA amplification.
 2009 Microchip Technology Inc.
Preliminary
DS70599B-page 7
MRF24J40MB
NOTES:
DS70599B-page 8
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
2.0
CIRCUIT DESCRIPTION
2.1
The MRF24J40MB is a complete 2.4 GHz IEEE
Std. 802.15.4™ compliant surface mount module with
integrated crystal, internal voltage regulator, matching
circuitry, Power Amplifier, Low Noise Amplifier and PCB
antenna. The MRF24J40MB module interfaces to many
popular Microchip PIC microcontrollers via a 4-wire
serial SPI interface, interrupt, wake, Reset, power and
ground. Data communications with the MRF24J40MB
module are documented in the “MRF24J40 IEEE
802.15.4™ 2.4 GHz RF Transceiver Data Sheet”
(DS39776). Refer to the MRF24J40 Data Sheet for
specific serial interface protocol and register definitions.
Schematic
A schematic diagram of the module is shown in
Figure 2-1 and the Bill of Materials (BOM) is shown in
Table 2-1.
The MRF24J40MB module is based on the Microchip
Technology MRF24J40 IEEE 802.15.4™ 2.4 GHz RF
Transceiver IC (U1). The serial I/O (SCK, SDI, SDO
and CS), RESET, WAKE and INT pins are brought out
to the module pins. The SDO signal is tri-state buffered
by IC7 to solve a silicon errata, where the SDO signal
does not release to a high-impedance state, after the
CS pin returns to its inactive state.
Crystal, X1, is a 20 MHz crystal with a frequency
tolerance of ±10 ppm @ 25°C to meet the IEEE Std.
802.15.4 symbol rate tolerance of ±40 ppm.
A balun is formed by components: L1, L2, L3, C2, C3
and C4. L2 is also a pull-up for the RFP and RFN pins
on the MRF24J40. C4 also acts as a DC block
capacitor. RF switches, IC2 and IC4, switch between
the power amplifier, IC3, when transmitting and low
noise amplifier, IC5, when receiving. A low-pass filter is
formed by components: L10, L11, C31, C32 and C36.
The remaining passive components provide bias and
decoupling.
 2009 Microchip Technology Inc.
Preliminary
DS70599B-page 9
MRF24J40MB
MRF24J40MB SCHEMATIC
1 MF
20 MHz
10 MF
2.2 MF
FIGURE 2-1:
DS70599B-page 10
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
TABLE 2-1:
MRF24J40MB BILL OF MATERIALS
Designator
Description
Manufacturer
Part Number
C2
Chip Capacitor 0402 COG 0.5P
Johanson Technology
500R07S0R5AV4T
C3
Chip Capacitor 0402 COG 0.5P
Johanson Technology
500R07S0R5AV4T
C4
Chip Capacitor 0402 COG 1.0P
Johanson Technology
500R07S1R0BV4T
C5
Chip Capacitor 0402 COG 1.5P
Murata
GRM1555C1H1R5CZ01D
C6
Not Used
C7
Chip Capacitor 0402 COG 4.7P
Murata
GRM1555C1H4R7CZ01D
C8
Chip Capacitor 0402 COG 4.7P
Murata
GRM1555C1H4R7CZ01D
C9
Chip Capacitor 0402 COG 10P
Murata
GRM1555C1H100JZ01D
C10
Chip Capacitor 0402 COG 10P
Murata
GRM1555C1H100JZ01D
C11
Chip Capacitor 0402 X5R 100N
Murata
GRM155R61A104KA01D
C12
Chip Capacitor 0402 X5R 100N
Murata
GRM155R61A104KA01D
C13
Chip Capacitor 0402 COG 15P
Murata
GRM1555C1H150JZ01D
C14
Chip Capacitor 0402 COG 15P
Murata
GRM1555C1H150JZ01D
C16
Chip Capacitor 0402 COG 22P
Murata
GRM1555C1H220JZ01D
C17
Chip Capacitor 0402 X5R 100N
Murata
GRM155R61A104KA01D
C18
Chip Capacitor 0402 COG 5.6P
Murata
GRM1555C1H5R6CZ01D
C19
Chip Capacitor 0402 COG 1.8P
Murata
GRM1555C1H1R8CZ01D
C20
Chip Capacitor 0402 X7R 1N
Murata
GRM155R71H102KA01D
C21
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C22
Chip Capacitor 0402 X7R 1N
Murata
GRM155R71H102KA01D
C23
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C24
Not Used
C25
Chip Capacitor 0402 X7R 1N
Murata
GRM155R71H102KA01D
C26
Chip Capacitor 0402 X5R 100N
Murata
GRM155R61A104KA01D
C27
Chip Capacitor 0402 COG 10P
Murata
GRM1555C1H100JZ01D
C28
Chip Capacitor 0402 COG 100P
Murata
GRM1555C1H101JZ01D
C29
Chip Capacitor 0402 X5R 100N
Murata
GRM155R61A104KA01D
C30
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C31
Chip Capacitor 0402 COG 1.5P
Johanson Technology
500R07S1R5BV4T
C32
Chip Capacitor 0402 COG 0.4P
Johanson Technology
500R07S0R4AV4T
C33
Chip Capacitor 0402 COG 18P
Murata
GRM1555C1H180JZ01D
C34
Chip Capacitor 0402 COG 18P
Murata
GRM1555C1H180JZ01D
C35
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C36
Not Used
C37
Chip Capacitor 0805 X5R 10U
Murata
GRM21BR60J106ME19L
C38
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C39
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C40
Chip Capacitor 0402 X5R 1U
Murata
GRM155R60J105ME19D
C41
Chip Capacitor 0402 X7R 10N
Murata
GRM155R71E103KA01D
C42
Chip Capacitor 0402 X7R 10N
Murata
GRM155R71E103KA01D
C43
Chip Capacitor 0402 COG 100P
Murata
GRM1555C1H101JZ01D
C44
Chip Capacitor 0402 X5R 100N
Murata
GRM155R61A104KA01D
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C45
Note:
Capacitors and inductors cannot be substituted.
 2009 Microchip Technology Inc.
Preliminary
DS70599B-page 11
MRF24J40MB
TABLE 2-1:
MRF24J40MB BILL OF MATERIALS (CONTINUED)
Designator
Description
Manufacturer
Part Number
C46
Chip Capacitor 0402 X5R 100N
Murata
GRM155R61A104KA01D
C47
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C48
Chip Capacitor 0603 X5R 2.2U
Murata
GRM188R60J225ME01D
IC1
802.15.4 Radio
Microchip
MRF24J40-I/ML
IC2
Switch SPDT
Skyworks
AS179-92
IC3
Power Amplifier
SiGe
PA2423L-R
IC4
Switch SPDT
Skyworks
AS179-92
IC5
Low Noise Amplifier
NEC
UPC8233TK-E2-A
IC6
Voltage Regulator
Microchip
MCP1700T-3302E/TT
IC7
Buffer-SC70 Package
Fairchild
NC7SZ125P5X
L1
Chip Inductor 0402 8.2N
Panasonic
ELJ-RF8N2JFB
L2
Chip Inductor 0402 2.7N
Panasonic
ELJ-RF2N7DFB
L3
Chip Inductor 0402 4.7N
Panasonic
ELJ-RF4N7DFB
L4
Chip Resistor 0402 0Ohms
Dale
CRCW04020000Z0ED
L5
Chip Inductor 0402 3.3N
Panasonic
ELJ-RF3N3DFB
L6
Chip Inductor 0402 3.9N
Panasonic
ELJ-RF3N9DFB
L7
Chip Inductor 0402 1.5N
Panasonic
ELJ-RF1N5DFB
L8
Chip Inductor 0402 18N
Panasonic
ELJ-RF18NJFB
L9
Chip Inductor 0402 1.5N
Panasonic
ELJ-RF1N5DFB
L10
Chip Inductor 0402 2.2N
Panasonic
ELJ-RF2N2DFB
L11
Chip Inductor 0402 2.7N
Panasonic
ELJ-RF2N7DFB
R1
Chip Resistor 0402 10Ohms 5%
Dale
CRCW040210R0JNED
R2
Not Used
R3
Chip Resistor 0402 2.2Ohms 5%
Dale
CRCW04022R20JNED
R4
Chip Resistor 0402 10K 5%
Dale
CRCW040210K0JNED
R7
Not Used
R8
Not Used
S
X1
Note:
Shield-Custom
TBD
20 MHz Crystal
Abracon
ABM8-156-20.0000MHZ-T
Capacitors and inductors cannot be substituted.
DS70599B-page 12
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
2.2
Printed Circuit Board
The MRF24J40MB module printed circuit board is constructed with FR4 material, four layers and
0.032 inches thick. The layers are shown in Figure 2-2
through Figure 2-6. The stack up of the PCB is shown
in Figure 2-7.
FIGURE 2-2:
TOP SILK SCREEN
FIGURE 2-3:
TOP COPPER
FIGURE 2-4:
Note:
 2009 Microchip Technology Inc.
Preliminary
LAYER 2 – GROUND
PLANE
Top view positive Gerber.
DS70599B-page 13
MRF24J40MB
FIGURE 2-5:
Note:
LAYER 3 – POWER
PLANE
FIGURE 2-6:
Note:
Top view positive Gerber.
FIGURE 2-7:
BOTTOM COPPER
Top view.
PCB LAYER STACK UP
1/2 oz. Copper
Top Copper
8 mil FR4
1/2 oz. Copper
Ground Plane
0.032‚
12 mil FR4
+/- 0.005‚
1/2 oz. Copper
Power Plane
8 mil FR4
1/2 oz. Copper
DS70599B-page 14
Preliminary
Bottom Copper
 2009 Microchip Technology Inc.
MRF24J40MB
2.3
PCB Antenna
(www.ansoft.com) and tested in an anechoic room. The
design goal was to create a compact, low-cost antenna
with the best radiation pattern. Figure 2-9 shows the
simulation drawing and Figure 2-10 and Figure 2-11
show the 2D and 3D radiation patterns, respectively. As
shown by the radiation patterns, the performance of the
antenna is dependant upon the orientation of the
module. Figure 2-12 shows the impedance simulation
and Figure 2-13 shows the SWR simulation. The
discrete matching circuitry matches the impedance of
the antenna with the MRF24J40 transceiver IC.
The PCB antenna is fabricated on the top copper trace.
Figure 2-8 shows the trace dimensions. The layers
below the antenna have no copper traces. The ground
and power planes under the components serve as a
counterpoise to the PCB antenna. Additional ground
plane on the host PCB will substantially enhance the
performance of the module. For best performance,
place the module on the host PCB following the
recommendations in Section 1.2 “Mounting Details”.
The Printed Circuit Board (PCB) antenna was designed
and simulated using Ansoft Designer® and HFSS™ 3D
full-wave solver software by Ansoft Corporation
FIGURE 2-8:
PCB ANTENNA DIMENSIONS
1.3
22.0
1.0
6.0
4.2
8.6
3.8
2.0
5.3
1.0
9.6
0.5
1.2
0.5
3.37
6.6
4.3
1.54
0.85
1.2
3.82
1.0
2.0
1.0
1.0
6.6
0.72
Note 1:
Dimensions are in mm and tolerance is +/– 0.05 mm.
 2009 Microchip Technology Inc.
Preliminary
DS70599B-page 15
MRF24J40MB
FIGURE 2-9:
PCB ANTENNA SIMULATION DRAWING
FIGURE 2-10:
SIMULATED 2D RADIATION PATTERN
DS70599B-page 16
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
FIGURE 2-11:
SIMULATED 3D RADIATION PATTERN
FIGURE 2-12:
SIMULATED PCB ANTENNA IMPEDANCE
 2009 Microchip Technology Inc.
Preliminary
DS70599B-page 17
MRF24J40MB
FIGURE 2-13:
DS70599B-page 18
SIMULATED PCB ANTENNA SWR
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
3.0
REGULATORY APPROVAL
The user’s manual should include the following
statement:
The MRF24J40MB module has received regulatory
approvals for modular devices in the United States,
Canada and European countries. Modular approval
allows the end user to place the MRF24J40MB module
inside a finished product and not require regulatory
testing for an intentional radiator (RF transmitter), provided no changes or modifications are made to the
module circuitry. Changes or modifications could void
the user’s authority to operate the equipment. The end
user must comply with all of the instructions provided
by the Grantee, which indicate installation and/or
operating conditions necessary for compliance.
The integrator may still be responsible for testing the end
product for any additional compliance requirements
required with this module, installed (for example: digital
device emission, PC peripheral requirements, etc.) in
the specific country that the end device will be marketed.
Annex F of the IEEE Std. 802.15.4 document has a good
summary of regulatory requirements in various countries
concerning IEEE Std. 802.15.4 devices. The standard
can be downloaded from the IEEE Standards web page:
http://standards.ieee.org/getieee802/802.15.html.
Refer to the specific country radio regulations for
details on regulatory compliance.
3.1
United States
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment
and receiver.
• Connect the equipment into an outlet on a
circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV
technician for help.
3.1.1
The
MRF24J40MB
has
received
Federal
Communications
Commission
(FCC)
CFR47
Telecommunications, Part 15 Subpart C “Intentional
Radiators” 15.247 and modular approval in accordance
with FCC Public Notice DA 00-1407 Released: June 26,
2000, Part 15 Unlicensed Modular Transmitter Approval.
The MRF24J40MB module can be integrated into a
finished product without obtaining subsequent and
separate FCC approvals.
The MRF24J40MB module has been labeled with its
own FCC ID number, and if the FCC ID is not visible
when the module is installed inside another device,
then the outside of the finished product into which the
module is installed must also display a label referring to
the enclosed module. This exterior label can use
wording such as the following:
Contains Transmitter Module FCC ID:
OA3MRF24J40MB
-orContains FCC ID: OA3MRF24J40MB
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
 2009 Microchip Technology Inc.
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful
interference in a residential installation. This
equipment generates, uses and can radiate radio
frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However, there
is no guarantee that interference will not occur in a
particular installation. If this equipment does cause
harmful interference to radio or television reception,
which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
MRF24J40MB SETTINGS
To meet the FCC requirements, the following settings
must be observed by the integrator:
• The MRF24J40MB transmit power setting
(RFCON3 0x203) cannot exceed -1.9 dB.
• Only channels 11 through 25 may be selected
(RFCON0 0x200).
3.1.2
RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. OET Bulletin 65 “Evaluating
Compliance with FCC Guidelines for Human Exposure
to Radio Frequency Electromagnetic Fields” provides
assistance in determining whether proposed or existing
transmitting facilities, operations or devices comply
with limits for human exposure to Radio Frequency
(RF) fields adopted by the Federal Communications
Commission (FCC). The bulletin offers guidelines and
suggestions for evaluating compliance.
If appropriate, compliance with exposure guidelines for
mobile and unlicensed devices can be accomplished
by the use of warning labels and by providing users
with information concerning minimum separation
distances from transmitting structures and proper
installation of antennas.
Preliminary
DS70599B-page 19
MRF24J40MB
The following statement must be included as a
CAUTION statement in manuals and OEM products to
alert users of FCC RF exposure compliance:
To satisfy FCC RF exposure requirements for mobile
and base station transmission devices, a separation
distance of 20 cm or more should be maintained
between the antenna of this device and persons
during operation. To ensure compliance, operation at
closer than this distance is not recommended.
The antenna(s) used for this transmitter must not be
co-located or operating in conjunction with any other
antenna or transmitter.
If the MRF24J40MB module is used in a portable
application (antenna is less than 20 cm from persons
during operation), the integrator is responsible for
performing Specific Absorption Rate (SAR) testing in
accordance with FCC rules 2.1091.
3.1.3
HELPFUL WEB SITES
Federal
Communications
http://www.fcc.gov
3.2
Commission
(FCC):
Canada
The MRF24J40MB module has been certified for use in
Canada under Industry Canada (IC) Radio Standards
Specification (RSS) RSS-210 and RSS-Gen.
From Section 7.1.1, RSS-Gen, Issue 2, June 2007,
Modular Transmitter Approval:
Host devices which contain separately certified
modules do not need to be recertified, provided that
they meet the following conditions:
a)
b)
c)
Note:
The host device, as a stand-alone unit
without any separately certified modules,
complies with all applicable Radio Standards
Specifications.
The host device and all the separately
certified modules it contains jointly meet the
RF exposure compliance requirements of
RSS-102, if applicable.
The host device complies with the
certification labeling requirements of each of
the modules it contains.
From Section 5.2, RSS-Gen, Issue 2, June 2007,
Equipment Labels:
All Category I radio equipment intended for use in
Canada shall permanently display on each transmitter,
receiver or inseparable combination thereof, the
applicant’s name (i.e., manufacturer’s name, trade
name or brand name), model number and certification
number. This information shall be affixed in such a
manner as to not be removable except by destruction or
defacement. The size of the lettering shall be legible
without the aid of magnification, but is not required to be
larger than an 8-point font size. If the device is too small
to meet this condition, the information can be included in
the user manual upon agreement with Industry Canada.
Label:
Contains IC: 7693A-24J40MB
From Section 7.1.6, RSS-Gen, Issue 2, June 2007,
Digital Circuits:
If the device contains digital circuitry that is not directly
associated with the radio transmitter, the device shall
also have to comply with ICES-003, Class A or B as
appropriate,
except
for
ICES-003
labeling
requirements. The test data obtained (for the ICES-003
tests) shall be kept by the manufacturer or importer
whose name appears on the equipment label, and
made available to Industry Canada on request, for as
long as the model is being marketed in Canada.
3.2.1
MRF24J40MB SETTINGS
To meet Industry Canada (IC) requirements, the following
settings must be observed by the integrator:
• The MRF24J40MB transmit power setting
(RFCON3 0x203) cannot exceed -1.9 dB.
• Only channels 11 through 25 may be selected
(RFCON0 0x200).
3.2.2
HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
Compliance of a module in its final
configuration is the responsibility of the
applicant. A host device will not be
considered certified if the instructions
regarding antenna configuration provided
in the original description, of one or more
separately certified modules it contains,
were not followed
DS70599B-page 20
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
3.3
3.3.1
Europe
The MRF24J40MB module has been certified for use in
European countries. The following testing has been
completed:
Test standard ETSI EN 300 328 V1.7.1 (2006-10):
•
•
•
•
Maximum Transmit Power
Maximum EIRP Spectral Density
Frequency Range
Radiated Emissions
Test standards ETSI EN 301 489-1:2008 and ETSI
EN 301 489-17:2008:
• Radiated Emissions
• Electrostatic Discharge
• Radiated RF Susceptibility
A helpful document that can be used as a starting point
in understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E,
downloadable
from
the
European
Radio
Communications Office (ERO): http://www.ero.dk.
The end user is responsible for ensuring compliance
with
harmonized
frequencies
and
labeling
requirements for each country the end device is
marketed and sold.
 2009 Microchip Technology Inc.
MRF24J40MB SETTINGS
To meet ETSI requirements, the following settings must
be observed by the integrator:
• The MRF24J40MB transmit power setting
(RFCON3 0x203) cannot exceed -14.9 dB. This is
to meet the requirements of ETSI EN 300 328
v1.7.1 (2006-05), Maximum e.i.r.p. spectral
density limit, Section 4.3.2.2, “For wideband
modulations other then FHSS (e.g., DSSS,
OFDM, etc.), the maximum e.i.r.p. spectral
density is limited to 10 mW per MHz”. The output
power of the MRF24J40MB module, at this setting
with the PA enabled, is 9 dBm.
• Only channels 11 through 25 may be selected
(RFCON0 0x200).
3.3.2
HELPFUL WEB SITES:
Radio and Telecommunications Terminal Equipment
(R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
European Conference of Postal and Telecommunications
Administrations (CEPT): http://www.cept.org/
European Telecommunications Standards Institute
(ETSI): http://www.etsi.org/
European Radio Communications Office (ERO):
http://www.ero.dk/
Preliminary
DS70599B-page 21
MRF24J40MB
NOTES:
DS70599B-page 22
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
4.0
ELECTRICAL CHARACTERISTICS
TABLE 4-1:
RECOMMENDED OPERATING CONDITIONS
Parameters
Min
Typ
Max
Units
Ambient Operating Temperature
-40
—
+85
°C
Supply Voltage for RF, Analog and
Digital Circuits
2.4
—
3.6
V
Supply Voltage for Digital I/O
2.4
3.3
3.6
V
Input High Voltage (VIH)
0.5 x VDD
—
VDD + 0.3
V
Input Low Voltage (VIL)
-0.3
—
0.2 x VDD
V
TABLE 4-2:
CURRENT CONSUMPTION
(TA = 25°C, VDD = 3.3V)
Chip Mode
Condition
Min
Typ
Max
Units
Sleep
Sleep Clock Disabled
—
5 A
—
A
TX
At Maximum Output Power
—
130 mA
—
mA
—
25 mA
—
mA
Min
Typ
Max
Units
2.405
—
2.480
GHz
RF Sensitivity
—
-102
—
dBm
Maximum RF Input
-23
—
—
dBm
—
-60
—
dBm
Input Return Loss
-8
-12
—
dB
Noise Figure
(including matching)
—
1.9
—
dB
RX
TABLE 4-3:
RECEIVER AC CHARACTERISTICS
Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz
Parameters
RF Input Frequency
LO Leakage
Condition
Compatible to
IEEE Std. 802.15.4™, 2003
Measured at Balun Matching
Network Input at Frequency,
2.405-2.48 GHz
Adjacent Channel
Rejection
@ +/-5 MHz
30
—
—
dB
Alternate Channel
Rejection
@ +/-10 MHz
40
—
—
dB
RSSI Range
—
50
—
dB
RSSI Error
-5
—
5
dB
 2009 Microchip Technology Inc.
Preliminary
DS70599B-page 23
MRF24J40MB
TABLE 4-4:
TRANSMITTER AC CHARACTERISTICS
Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz
Parameters
Min
Typ
Max
Units
RF Carrier Frequency
2.405
—
2.475
GHz
Maximum RF Output
Power
—
20
—
dBm
RF Output Power
Control Range
—
56
—
dB
—
1.25
—
dB
Carrier Suppression
—
-30
—
dBc
TX Spectrum Mask for Offset Frequency > 3.5 MHz,
O-QPSK Signal
at 0 dBm Output Power
-33
—
—
dBm
TX EVM
—
15
—
%
TX Gain Control
Resolution
DS70599B-page 24
Condition
Programmed by Register
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
APPENDIX A:
REVISION HISTORY
Revision A (June 2009)
Original release of this document.
Revision B (August 2009)
Added Section 3.0 “Regulatory Approval”.
 2009 Microchip Technology Inc.
Preliminary
DS70599B-page 25
MRF24J40MB
NOTES:
DS70599B-page 26
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
INDEX
A
P
AC Characteristics
Receiver ......................................................................23
Transmitter .................................................................. 24
Antenna Impedance
Simulated PCB ............................................................ 17
PCB Antenna ...................................................................... 15
Dimensions ................................................................. 15
Simulation Drawing ..................................................... 16
SWR ........................................................................... 18
PCB Layers
Bottom Copper............................................................ 14
Layer 2 – Ground Plane.............................................. 13
Layer 3 – Power Plane ............................................... 14
Stack Up ..................................................................... 14
Top Copper ................................................................. 13
Top Silk Screen .......................................................... 13
Pin Description...................................................................... 4
Pin Diagram .......................................................................... 1
Printed Circuit Board (PCB) ................................................ 13
B
Bill of Materials (BOM) ........................................................ 11
Block Diagrams
Microcontroller to MRF24J40MB Interface.................... 4
MRF24J40MB ............................................................... 3
PA/LNA ......................................................................... 7
C
Circuit Description ................................................................. 9
Customer Change Notification Service ............................... 28
Customer Notification Service ............................................. 28
Customer Support ............................................................... 28
D
Details
Module ..........................................................................5
Mounting ....................................................................... 6
Recommended PCB Footprint ...................................... 5
E
Electrical Characteristics .....................................................23
Current Consumption .................................................. 23
Recommended Operating Conditions ......................... 23
Errata..................................................................................... 2
European Radio Communications (ERC)............................21
R
Radiation Pattern
2D ............................................................................... 16
3D ............................................................................... 17
Reader Response ............................................................... 29
Regulatory Approval ........................................................... 19
Canada ....................................................................... 20
Settings............................................................... 20
Europe ........................................................................ 21
Settings............................................................... 21
United States .............................................................. 19
Settings............................................................... 19
Revision History .................................................................. 25
RF Exposure ....................................................................... 19
RF/Analog Features.............................................................. 1
S
F
FCC ID Number................................................................... 19
FCC RF Exposure Compliance ........................................... 20
H
Helpful Web Sites.......................................................... 20, 21
I
Interface Description ............................................................. 3
Internet Address .................................................................. 28
M
MAC/Baseband Features ...................................................... 1
Microchip Internet Web Site ................................................ 28
MiWi P2P............................................................................... 3
MiWi Protocol ........................................................................3
More Information ................................................................... 2
Customer Notification System ....................................... 2
Errata ............................................................................2
Mounting Details.................................................................... 5
MRF24J40 Data Sheet...................................................... 3, 9
Schematic
MRF24J40MB ............................................................. 10
Serial I/O
SCK, SDI, SDO, CS...................................................... 9
Short Range Devices (SRD) ............................................... 21
Specific Absorption Rate (SAR).......................................... 20
SPI ........................................................................................ 9
W
WWW Address.................................................................... 28
WWW, On-Line Support ....................................................... 2
Z
ZigBee Protocol .................................................................... 3
O
Operation
Energy Detection (ED) .................................................. 7
PA/LNA Control............................................................. 7
Sleep ............................................................................. 7
Overview ............................................................................... 3
DS70599B-page 27
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
NOTES:
DS70599B-page 28
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
 2009 Microchip Technology Inc.
Preliminary
DS70599B-page 29
MRF24J40MB
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 7924150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Device: MRF24J40MB
Y
N
Literature Number: DS70599B
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS70599B-page 30
Preliminary
 2009 Microchip Technology Inc.
MRF24J40MB
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
M
X
T
-X
Device
Module
Module
Type
Tape and
Reel
Temperature
Range
Device
MRF24J40MB;
VDD range 2.4V to 3.6V
Temperature Range
I
= -40C to
 2009 Microchip Technology Inc.
+85C
Examples:
a)
b)
MRF24J40MB-I = Industrial temp. tray
MRF24J40MBT-I = Industrial temp., tape and
reel.
(Industrial)
Preliminary
DS70599B-page 31
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4080
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
03/26/09
DS70599B-page 32
Preliminary
 2009 Microchip Technology Inc.