MRF24J40MB DATA SHEET (03/27/2011) DOWNLOAD

MRF24J40MC
Data Sheet
2.4 GHz IEEE Std. 802.15.4™ RF
Transceiver Module with PA/LNA and
External Antenna Connector
© 2011 Microchip Technology Inc.
Preliminary
DS75002A
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
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dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
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© 2011, Microchip Technology Incorporated, Printed in the
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Printed on recycled paper.
ISBN: 978-1-61341-006-6
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS75002A-page ii
Preliminary
© 2011 Microchip Technology Inc.
MRF24J40MC
2.4 GHz IEEE Std. 802.15.4™ RF Transceiver Module with
PA/LNA and External Antenna Connector
Features:
• IEEE Std. 802.15.4™ Compliant RF Transceiver
• Supports ZigBee®, MiWi™ Development
Environment Proprietary Wireless Networking
Protocols
• 4-Wire Serial Peripheral Interface (SPI) with
Interrupt
• Small size: 0.9" x 1.3" (22.9 mm x 33.0 mm),
Surface Mountable : Pin Compatible with
MRF24J40MB
• Integrated Crystal, Internal Voltage Regulator,
Matching Circuitry, Power Amplifier, Low Noise
Amplifier
• External Antenna Connector : Ultra Miniature
Coaxial (U.FL), 50Ω
• Easy Integration into Final Product : Minimize
Product Development, Quicker Time to Market
• Radio Regulation Certified for United States
(FCC), Canada (IC), Europe (ETSI) and
Australia/New Zealand (C-TICK)
• Compatible with Microchip microcontroller
families (PIC16, PIC18, PIC24, dsPIC33 and
PIC32)
• Range up to 4000 ft
Operational:
RF/Analog Features:
• ISM Band 2.405 GHz – 2.475 GHz Operation
• Data Rate: 250 kbps
• -108 dBm Typical Sensitivity with -23 dBm
Maximum Input Level
• +19 dBm Typical Output Power with 45 dB Tx
Power Control Range
• Integrated Low Phase Noise VCO, Frequency
Synthesizer and PLL Loop Filter
• Digital VCO and Filter Calibration
• Integrated RSSI ADC and I/Q DACs
• Integrated LDO
• High Receiver RSSI Dynamic Range
MAC/Baseband Features:
• Hardware CSMA-CA Mechanism, Automatic ACK
Response and FCS Check
• Independent Beacon, Transmit and GTS FIFO
• Supports all CCA modes and RSS/LQI
• Automatic Packet Retransmit Capable
• Hardware Security Engine (AES-128) with CTR,
CCM and CBC-MAC modes
• Supports Encryption and Decryption for MAC Sub
layer and Upper Layer
• Operating Voltage: 2.7V – 3.6V (3.3V typical)
• Temperature Range: -40°C to +85°C Industrial
• Low-Current Consumption:
- Rx Mode: 25 mA (typical)
- Tx Mode: 120 mA (typical)
- Sleep: 12 μA (typical)
Pin Diagram:
GND
RESET
WAKE
INT
SDI
SCK
© 2011 Microchip Technology Inc.
1
2
3
4
5
6
12
11
10
9
8
7
Preliminary
GND
GND
VIN
NC
CS
SDO
DS75002A-page 3
MRF24J40MC
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 5
2.0 Circuit Description ...................................................................................................................................................................... 11
3.0 Regulatory Approval ................................................................................................................................................................... 17
4.0 Electrical Characteristics ........................................................................................................................................................... 23
Appendix A: Revision History............................................................................................................................................................... 25
The Microchip Web Site ....................................................................................................................................................................... 27
Customer Change Notification Service ................................................................................................................................................ 27
Customer Support ................................................................................................................................................................................ 27
Reader Response ................................................................................................................................................................................ 28
Product Identification System............................................................................................................................................................... 29
TO OUR VALUED CUSTOMERS
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DS75002A-page 4
Preliminary
© 2011 Microchip Technology Inc.
MRF24J40MC
1.0
DEVICE OVERVIEW
The MRF24J40MC is a 2.4 GHz IEEE Std. 802.15.4™
compliant, surface mount module with integrated
crystal, internal voltage regulator, matching circuitry,
Power Amplifier (PA), Low Noise Amplifier (LNA) with
50Ω external antenna connector. The MRF24J40MC
module operates in the non-licensed 2.4 GHz
frequency band. The integrated module design frees
the integrator from extensive RF and antenna design,
and regulatory compliance testing allowing quicker
time to market.
The MRF24J40MC
module is compatible with
Microchip’s ZigBee®, and MiWi™ Development
Environment software stacks. The MiWi Development
Environment software stack including the source code
is available as a free download, from the Microchip web
site: http://www.microchip.com/wireless.
The MRF24J40MC module has received regulatory
approvals for modular devices in the United States
(FCC) and Canada (IC). Modular approval removes the
need for expensive RF and antenna design, and allows
the end user to place the MRF24J40MC module inside
a finished product and does not require regulatory
testing for an intentional radiator (RF transmitter). To
maintain conformance, refer to module settings in
Section 3.1.1 “MRF24J40MC Settings” for the
United States and Section 3.2.1 “MRF24J40MC
Settings” for Canada.
FIGURE 1-1:
The MRF24J40MC module has been tested and
conforms to ETS EN 300 328 V1.7.1 (2006-10)
European Standards. The module tests can be applied
toward final product certification and Declaration of
Conformity (DoC). To maintain conformance for
Europe, refer to module settings in Section 3.3.1
“MRF24J40MC Settings”. Additional testing may be
required depending on the end application.
1.1
Interface Description
Figure 1-1 shows a simplified block diagram of the
MRF24J40MC module. The module is based on the
Microchip Technology MRF24J40 IEEE 802.15.4™
2.4 GHz RF Transceiver IC. The module interfaces to
many popular Microchip PIC® microcontrollers
through a 4-wire SPI interface, interrupt, wake, reset,
power and ground, as shown in Figure 1-2. Table 1-1
provides the pin descriptions.
Serial communication and module configuration for the
MRF24J40MC
module are documented in the
“MRF24J40 Data Sheet” (DS39776). Refer to the
datasheet for specific serial interface protocol and
register definitions.
Also, see Section 1.3 “Operation” for specific register
settings that are unique to the MRF24J40MC module.
PIC18FXXXX BLOCK DIAGRAM
PIC18FXXXX IEEE Std. 802.15.4™ Module
MRF24J40
PA
Antenna
U.FL
Connector
Interface
Physical
SPI
Digital
I/O
MAC
Power
Management
LNA
Power
20 MHz
Crystal
© 2011 Microchip Technology Inc.
Preliminary
DS75002A-page 5
MRF24J40MC
TABLE 1-1:
PIN DESCRIPTION
Pin
Symbol
Type
Description
1
GND
Ground
2
RESET
DI
Global hardware Reset pin
3
WAKE
DI
External wake-up trigger
4
INT
DO
Interrupt pin to microcontroller
Ground
5
SDI
DI
Serial interface data input
6
SCK
DI
Serial interface clock
7
SDO
DO
Serial interface data output from MRF24J40
8
CS
DI
Serial interface enable
9
NC
—
No connection
10
VIN
Power
Power supply
11
GND
Ground
Ground
12
GND
Ground
Ground
Legend: Pin type abbreviation: D = Digital, I = Input, O = Output
FIGURE 1-2:
MICROCONTROLLER TO MRF24J40MC INTERFACE
PIC® MCU
DS75002A-page 6
MRF24J40MC
I/O
CS
SDO
SDI
SDI
SDO
SCK
SCK
INTX
INT
VIN
GND
I/O
WAKE
I/O
RESET
Preliminary
© 2011 Microchip Technology Inc.
MRF24J40MC
1.2
Mounting Details
The MRF24J40MC is a surface mountable module.
Module dimensions are shown in Figure 1-3. The
module Printed Circuit Board (PCB) is 0.032" thick
with castellated mounting points on the edge.
Figure 1-4 is a recommended host PCB footprint for
the MRF24J40MC .
The MRF24J40MC has 50Ω ultra miniature coaxial
(U.FL) connector.
FIGURE 1-3:
MODULE DETAILS
FIGURE 1-4:
RECOMMENDED PCB FOOTPRINT
© 2011 Microchip Technology Inc.
Caution: The U.FL connector is fragile and can only
tolerate very limited number of insertions.
Preliminary
DS75002A-page 7
MRF24J40MC
1.3
Operation
The MRF24J40MC module is based on the Microchip
Technology MRF24J40 2.4 GHz IEEE 802.15.4 RF
Transceiver
IC.
Serial
communication
and
configuration are documented in the “MRF24J40 Data
Sheet” (DS39776).
The internal RF state machine is configured for the PA/
LNA Mode by setting TESTMODE (0x22<2:0>) = 111.
Pins GPIO1 and GPIO2 control the RF switches, PA
and LNA automatically when the MRF24J40 receives
and transmits data.
Note:
This section emphasizes operational settings that are
unique to the MRF24J40MC module design that must
be followed for proper operation.
1.3.1
PA/LNA CONTROL
Operation of the PA U3 and LNA U2 is controlled by the
MRF24J40 internal RF state machine through RF
switches, U1 and U4, and the GPIO1 and GPIO2 pins on
the MRF24J40. Figure 1-5 shows the PA/LNA block
diagram. Figure 2-2 is the schematic diagram for the
module.
FIGURE 1-5:
A complete explanation of the operation of
the PA/LNA control is documented in the
“MRF24J40 Data Sheet” (DS39776),
Section 4.2 “External PA/LNA Control”.
Voltage regulator U5 supplies a regulated 2.2V to the
PA. This provides a stable voltage to the PA over the VIN
voltage range of the module. U5 is enabled or shutdown
from GPIO3. Ensure that the GPIO3 direction has been
set to output (TRISGP3 (0x34<3>) = 1). Setting a logic
high (GPIO3(0x33<3>) = 1) enables the voltage
regulator and supplies voltage to the PA. Setting a logic
low (GPIO3 (0x33<3>) = 0) will shutdown the voltage
regulator, disabling the PA, and provides the lowest
shutdown current.
PA/LNA BLOCK DIAGRAM
RF Switch
UPG2179TB
U.FL
Connector
LNA
uPC8233TK
LNA
RF Switch
UPG2179TB
Balun
50 ohm
PA
V2 V1
PA
uPG2250T5N
RFP
RFN
V2 V1
MRF24J40
GPIO1
GPIO2
Voltage Regulator
TC1187VCT713
VOUT
DS75002A-page 8
GPIO3
SHDN
Preliminary
© 2011 Microchip Technology Inc.
MRF24J40MC
1.3.2
ENERGY DETECTION (ED)
1.3.3
SLEEP
Before performing an energy detection (see Section
3.6.1 “RSSI Firmware Request (RSSI Mode 1)” in the
“MRF24J40 Data Sheet” (DS39776)), perform the
following steps:
To get the lowest power consumption from the
MRF24J40MC module during Sleep, it is necessary to
disable the PA, PA voltage regulator and LNA. To do
this, perform the following steps:
1.
1.
2.
3.
4.
Configure the internal RF state machine to normal
operation (TESTMODE (0x22F<2:0>) = 000).
Configure GPIO2 and GPIO1 direction for
output (TRISGP2 (0x34<2>) = 1 and TRISGP1
(0x34<1>) = 1).
Set GPIO2 (0x33<2>) = 1 and GPIO1
(0x32<1>) = 0. This enables the LNA and
disables the PA.
Perform the energy detection following the steps
in Section 3.6.1 “RSSI Firmware Request (RSSI
Mode 1)” in the “MRF24J40 Data Sheet”
(DS39776).
Note:
The LNA will amplify the received signal.
The RSSI value will include the receive
signal strength plus the LNA amplification.
© 2011 Microchip Technology Inc.
2.
3.
4.
5.
Configure the internal RF state machine to normal
operation (TESTMODE (0x22F<2:0>) = 000).
Configure the GPIO3, GPIO2 and GPIO1
direction for output (TRISGP3 (0x34<3>) = 1,
TRISGP2 (0x34<2>) = 1 and TRISGP1
(0x34<1>) = 1).
Set GPIO2 (0x33<2>) = 0 and GPIO1 (0x32<1>)
= 0. This disables the LNA and the PA.
Set GPIO3 (0x33<3>) = 0. This shuts down the
voltage regulator U5 that supplies 2.2 volts to
the PA.
Put the MRF24J40 to Sleep following the steps
in the “MRF24J40 Data Sheet” (DS39776).
When waking the module, re-enable the PA/LNA Mode.
Preliminary
DS75002A-page 9
MRF24J40MC
1.3.4
TRANSMIT POWER SETTINGS
Table 1-2 lists the power settings in register RFCON3
(0x203<7:3>) and the output power at antenna
connector J1.
TABLE 1-2:
TRANSMIT POWER SETTINGS
RFCON3 (0x203<7:3>)
MRF24J40 Power Setting
Output Power(1) (dBm)
11111
–36.3
–26.4
11110
–34.9
–25.2
11101
–33.7
–24.1
11100
–32.8
–23.4
11011
–31.9
–22.7
11010
–31.2
–22.4
11001
–30.5
–21.9
11000
–30.0
–21.6
10111
–26.3
–15.7
10110
–24.9
–14.5
10101
–23.7
–13.7
10100
–22.8
–12.9
10011
–21.9
–12.3
10010
–21.2
–11.8
10001
–20.5
–11.5
10000
–20.0
–11.1
01111
–16.3
–6.6
01110
–14.9
–5.5
01101
–13.7
–4.7
01100
–12.8
–4.0
01011
–11.9
–3.4
01010
–11.2
–2.9
01001
–10.5
–2.5
01000
–10.0
–2.0
00111
–6.3
10.7
00110
–4.9
18.0
Note 1:
Note:
00101
–3.7
Typical output power at antenna connector J1, Channel 11, 50Ω impedance.
18.5
Refer to Section 3.0 “Regulatory
Approval” for the required maximum
power setting necessary to maintain
certification requirements for each country
the module will be used.
DS75002A-page 10
Preliminary
© 2011 Microchip Technology Inc.
MRF24J40MC
2.0
CIRCUIT DESCRIPTION
The MRF24J40MC is a 2.4 GHz IEEE Std. 802.15.4™
compliant surface mount module with integrated crystal,
internal voltage regulator, matching circuitry, power
amplifier, low noise amplifier with 50Ω external antenna
connector.
The MRF24J40MC module interfaces to many popular
Microchip PIC microcontrollers through a 4-wire SPI
Interface, interrupt, wake, reset, power and ground. An
example application schematic is illustrated in
Figure 2-1.
Serial communications and register definitions for the
MRF24J40MC
module are documented in the
“MRF24J40 Data Sheet” (DS39776). Refer to this
datasheet for specific serial interface protocol and
register definitions. Also, see Section 1.3 “Operation”
for specific register settings that are unique to the
MRF24J40MC module.
2.1
External Antenna
The MRF24J40MC module has a 50Ω ultra miniature
coaxial (U.FL) connector to connect to an external 2.4
GHz antenna.
Caution: The U.FL connector is fragile and can only
tolerate very limited number of insertions.
The choice of antenna is limited to the antenna types
the module has been tested with. Refer to the
respective country in Section 3.0 “Regulatory
FIGURE 2-1:
Approval” for a list of tested and approved antenna
types that may be used with the MRF24J40MC
module.
2.2
Module Schematic
A schematic diagram of the module is illustrated in
Figure 2-2 and the Bill of Materials (BOM) is shown in
Table 2-1.
The MRF24J40MC module is based on the Microchip
Technology MRF24J40 IEEE 802.15.4™ 2.4 GHz RF
Transceiver IC (U6). The Serial I/O (SCK, SDI, SDO
and CS), RESET, WAKE and INT pins are brought out
to the module pins. The SDO signal is tri-state buffered
by U7 to solve a silicon errata, where the SDO signal
does not release to a high-impedance state, after the
CS pin returns to its inactive state.
Crystal, X1, is a 20 MHz crystal with a frequency
tolerance of ±10 ppm @ 25°C to meet the IEEE Std.
802.15.4 symbol rate tolerance of ±40 ppm.
A balun is formed by components: L11, L12, L13, C25,
C27 and C31. L12 is also a pull-up for the RFP and
RFN pins on the MRF24J40. C25 also acts as a DC
block capacitor. RF switches, U1 and U2, switch
between the power amplifier, U3, when transmitting
and low noise amplifier, U2, when receiving. A
band-pass filter FL1 is placed after the PA U3 to reduce
harmonics. The remaining passive components
provide bias and decoupling.
MRF24J40MC APPLICATION SCHEMATIC
© 2011 Microchip Technology Inc.
Preliminary
DS75002A-page 11
MRF24J40MC
MRF24J40MC SCHEMATIC
DS75002A-page 12
FIGURE 2-2:
Preliminary
© 2011 Microchip Technology Inc.
MRF24J40MC
TABLE 2-1:
MRF24J40MC BILL OF MATERIALS
Designator
Value
C27, C31
0.5 pF
Capacitor, Ceramic, 50V, Johanson Technology 500R07S0R5BV4T
±0.1 pF, UHI Q NP0,
SMT 0402
do not
substitute
C25
0.7 pF
Capacitor, Ceramic, 50V, Johanson Technology 500R07S0R7BV4T
±0.1 pF, UHI Q NP0,
SMT 0402
do not
substitute
C1, C15
1.0 pF
Capacitor, Ceramic, 50V,
±0.25 pF, HI-Q C0G, SMT
0402
C9
1.2 pF
Capacitor, Ceramic, 50V, Johanson Technology 500R07S1R2BV4T
±0.1 pF, UHI Q NP0,
SMT 0402
C2
1.5 pF
Capacitor, Ceramic, 50V,
±0.25 pF, HI-Q C0G, SMT
0402
Murata Electronics
GJM1555C1H1R5
CB01D
—
C18
2.4 pF
Capacitor, Ceramic, 50V,
±-0.25 pF, HI-Q C0G,
SMT 0402
Murata Electronics
GJM1555C1H2R4
CB01D
—
C7
5.6 pF
Capacitor, Ceramic, 50V,
±0.25 pF, HI-Q C0G, SMT
0402
Murata Electronics
GJM1555C1H5R6
CB01D
—
C8
6.8 pF
Capacitor, Ceramic, 50V,
±0.25 pF, HI-Q C0G, SMT
0402
Murata Electronics
GJM1555C1H6R8
CB01D
—
C3, C6
10 pF
Capacitor, Ceramic, 50V,
±5%, HI-Q C0G, SMT
0402
Murata Electronics
GJM1555C1H100J
B01D
—
C11
12 pF
Capacitor, Ceramic, 50V,
±5%, HI-Q C0G, SMT
0402
Murata Electronics
GJM1555C1H120J
B01D
—
C38, C41
18 pF
Capacitor, Ceramic, 50V,
±5%, C0G, SMT 0402
Murata Electronics
GRM1555C1H180
JZ01D
do not
substitute
C19, C26,
C30, C32,
C37, C40,
C42
47 pF
Capacitor, Ceramic, 50V,
±5%, C0G, SMT 0402
Murata Electronics
GRM1555C1H470
JZ01D
—
C4, C5, C12,
C17, C21,
C22, C36
100 pF
Capacitor, Ceramic, 50V,
±5%, C0G, SMT 0402
Murata Electronics
GRM1555C1H101
JZ01D
—
C10, C13,
C14, C16,
C29
1000 pF
Capacitor, Ceramic, 50V,
±10%, X7R, SMT 0402
Murata Electronics
GRM155R71H102
KA01D
—
C24, C34,
C43
0.01 μF
Capacitor, Ceramic, 25V,
±10%, X7R, SMT 0402
Murata Electronics
GRM155R71E103
KA01D
—
C20, C23,
C33, C44
0.1 μF
Capacitor, Ceramic, 10V,
±10%, X5R, SMT 0402
Murata Electronics
GRM155R61A104
KA01D
—
C28, C35,
C39
1 μF
Capacitor, Ceramic, 6.3V,
±20%, X5R, SMT 0402
Murata Electronics
GRM155R60J105
ME19D
—
FL1
—
2450BP15B100E
—
J1
—
U.FL-R-SMT(10)
—
© 2011 Microchip Technology Inc.
Description
Manufacturer
Murata Electronics
Filter, Bandpass, 2.4 GHz Johanson Technology
Connector, Receptical,
Ultra-mini coax SMD
Hirose Electric Co Ltd
Preliminary
Part Number
GJM1555C1H1R0
CB01D
Comments
—
do not
substitute
DS75002A-page 13
MRF24J40MC
TABLE 2-1:
MRF24J40MC BILL OF MATERIALS (CONTINUED)
Designator
Value
Description
Manufacturer
Part Number
Comments
L1, L2, L3
2.4 nH
Inductor, Ceramic, ±0.3
nH, SMT 0402
Johanson Technology
L-07C2N4SV6T
do not
substitute
L8
2.7 nH
Inductor, Ceramic, ±0.3
nH, SMT 0402
Johanson Technology
L-07C2N7SV6T
do not
substitute
L10
3.3 nH
Inductor, Ceramic, ±0.3
nH, SMT 0402
Johanson Technology
L-07C3N3SV6T
do not
substitute
L6
3.9 nH
Inductor, Ceramic, ±0.3
nH, SMT 0402
Johanson Technology
L-07C3N9SV6T
do not
substitute
L11, L12
4.7 nH
Inductor, Ceramic, ±0.3
nH, SMT 0402
Johanson Technology
L-07C4N7SV6T
do not
substitute
L7, L9
5.6 nH
Inductor, Ceramic, ±0.3
nH, SMT 0402
Johanson Technology
L-07C5N6SV6T
do not
substitute
L13
7.5 nH
Inductor, Ceramic, ±5%,
SMT 0402
Johanson Technology
L-07C7N5JV6T
do not
substitute
L4
18 nH
Inductor, Ceramic, ±5%,
SMT 0402
Johanson Technology
L-07C18NJV6T
do not
substitute
R5
2.2 ohms
Resistor, 1%, ±100
ppm/C, SMT 0402
Vishay/Dale
CRCW04022R00F
KED
—
R2
360 ohms
Resistor, 1%, ±100
ppm/C, SMT 0402
Panasonic – ECG
ERJ-2RKF3600X
—
R1
1.60 kohms
Resistor, 1%, ±100
ppm/C, SMT 0402
Panasonic – ECG
ERJ-2RKF1601X
—
R3
470 kohms
Resistor, 1%, ±100
ppm/C, SMT 0402
Yageo
RC0402FR-07470
KL
—
R4
560 kohms
Resistor, 1%, ±100
ppm/C, SMT 0402
Panasonic – ECG
ERJ-2RKF5603X
—
U6
MRF24J40
Transceiver, 2.4 GHz,
IEEE 802.15.4 QFN
Microchip Technology
Inc.
MRF24J40-I/ML
—
Fairchild
Semiconductor
NC7SZ125P5X
—
U7
NC7SZ125P5X Buffer, Tri-State, SC-70-5
U5
TC1187VCT713
Regulator, LDO
Microchip Technology
Inc.
TC1187VCT713
—
U1, U4
UPG2179TB
Switch, RF, SPDT,
6-SMINI
CEL/NEC
UPG2179TB-E4-A
—
U2
UPC8233TK
Amplifier, Low-noise,
6MINIMOLD
CEL/NEC
UPC8233TK-A
—
U3
UPG2250T5N
Amplifier, RF, 6-TSON
CEL/NEC
UPG2250T5N-E2A
—
X1
20.000 MHz
Crystal, 20.000 MHz, 3.5
x 2.5 mm SMD
Abracon
ABM8-156-20.000
MHz
—
DS75002A-page 14
Preliminary
© 2011 Microchip Technology Inc.
MRF24J40MC
2.3
Printed Circuit Board
FIGURE 2-5:
LAYER 2 – GROUND
PLANE
FIGURE 2-6:
LAYER 3 – POWER
PLANE
The MRF24J40MC module PCB is constructed with
high temperature FR4 material, four layers and 0.032 "
thick. The layers are illustrated in Figure 2-3 through
Figure 2-8. The stack up of the PCB is illustrated in
Figure 2-9.
FIGURE 2-3:
FIGURE 2-4:
TOP SILK SCREEN
TOP COPPER
© 2011 Microchip Technology Inc.
Preliminary
DS75002A-page 15
MRF24J40MC
FIGURE 2-7:
BOTTOM COPPER
FIGURE 2-9:
PCB LAYER STACK UP
FIGURE 2-8:
1/2 oz. Copper
BOTTOM SILK SCREEN
Top Copper
8 mil FR4
1/2 oz. Copper
Ground Plane
0.032"
±0.005"
12 mil FR4
1/2 oz. Copper
Power Plane
8 mil FR4
1/2 oz. Copper
DS75002A-page 16
Preliminary
Bottom Copper
© 2011 Microchip Technology Inc.
MRF24J40MC
3.0
REGULATORY APPROVAL
The MRF24J40MC module has received regulatory
approvals for modular devices in the United States and
Canada. Modular approval allows the end user to place
the MRF24J40MC module inside a finished product
and not require regulatory testing for an intentional
radiator (RF transmitter), provided no changes or
modifications are made to the module circuitry.
Changes or modifications could void the user’s
authority to operate the equipment. The end user must
comply with all of the instructions provided by the
Grantee, which indicate installation and/or operating
conditions necessary for compliance.
The MRF24J40MC module has been tested and
conforms to EN 300 328 V1.7.1 (2006-10), European
Standards. The module tests can be applied toward
final product certification and Declaration of Conformity
(DoC). Additional testing may be required depending
on the end application.
The integrator is still responsible for testing the end
product for any additional compliance requirements
required with this module installed (digital device
emission, PC peripheral requirements, etc.) in the
specific country that the end device will be marketed.
Annex F of the IEEE Std. 802.15.4 document has a good
summary of regulatory requirements in various countries
concerning IEEE Std. 802.15.4 devices. The standard
can be downloaded from the IEEE Standards web page:
http://standards.ieee.org/getieee802/802.15.html.
For more information on details on regulatory
compliance, refer to the specific country radio
regulations in the following sections.
3.1
United States
The MRF24J40MC
has received Federal
Communications
Commission
(FCC)
CFR47
Telecommunications, Part 15 Subpart C “Intentional
Radiators” 15.247 and modular approval in accordance
with FCC Public Notice DA 00-1407 Released: June
26, 2000, Part 15 Unlicensed Modular Transmitter
Approval. The MRF24J40MC
module can be
integrated into a finished product without obtaining
subsequent and separate FCC certification.
© 2011 Microchip Technology Inc.
The MRF24J40MC module has been labeled with its
own FCC ID number, and if the FCC ID is not visible
when the module is installed inside another device,
then the outside of the finished product into which the
module is installed must also display a label referring to
the enclosed module. This exterior label can use
wording as following:
Contains Transmitter Module FCC ID:
OA3MRF24J40MC
-orContains FCC ID: OA3MRF24J40MC
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
The user’s manual should include the following
statement:
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful
interference in a residential installation. This
equipment generates, uses and can radiate radio
frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However, there
is no guarantee that interference will not occur in a
particular installation. If this equipment does cause
harmful interference to radio or television reception,
which can be determined by turning the equipment
OFF and ON, the user is encouraged to try to correct
the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment
and receiver.
• Connect the equipment into an outlet on a
circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV
technician for help.
Preliminary
DS75002A-page 17
MRF24J40MC
3.1.1
MRF24J40MC SETTINGS
To meet the FCC requirements, the following settings
must be observed by the integrator:
• The MRF24J40MC transmit power setting shall
not exceed 18.5 dBm (RFCON3 0x203<7:3> =
00101). Refer to Section 1.3.4 “Transmit Power
Settings”.
• Only channels 11 through 25 may be selected
(RFCON0 0x200).
3.1.2
If appropriate, compliance with exposure guidelines for
mobile and unlicensed devices can be accomplished
by the use of warning labels and by providing users
with information concerning minimum separation
distances from transmitting structures and proper
installation of antennas.
The following statement must be included as a
CAUTION statement in manuals and OEM products to
alert users of FCC RF Exposure compliance:
APPROVED EXTERNAL ANTENNA
TYPES
To satisfy FCC RF Exposure requirements for mobile
and base station transmission devices, a separation
distance of 20 cm or more should be maintained
between the antenna of this device and persons
during operation. To ensure compliance, operation at
closer than this distance is not recommended.
To maintain modular approval in the United States, only
the antenna types that have been tested shall be used.
It is permissible to use different antenna manufacturer
provided the same antenna type, antenna gain (equal
to or less than), and MRF24J40MC power setting is
used for the same antenna type tested.
Testing of the MRF24J40MC module was performed
with the antenna types listed in Table 3-1.
3.1.3
RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. OET Bulletin 65 “Evaluating
Compliance with FCC Guidelines for Human Exposure
to Radio Frequency Electromagnetic Fields” provides
assistance in determining whether proposed or existing
transmitting facilities, operations or devices comply
with limits for human exposure to RF fields adopted by
the Federal Communications Commission (FCC). The
bulletin offers guidelines and suggestions for
evaluating compliance.
TABLE 3-1:
Type
The antenna(s) used for this transmitter must not be
co-located or operating in conjunction with any other
antenna or transmitter.
If the MRF24J40MC module is used in a portable
application (antenna is less than 20 cm from persons
during operation), the integrator is responsible for
performing Specific Absorption Rate (SAR) testing in
accordance with FCC rules 2.1091.
3.1.4
HELPFUL WEB SITES
Federal
Communications
http://www.fcc.gov
(FCC)
APPROVED EXTERNAL ANTENNA TYPES
Manufacture
Part Number
Gain
Whip, Dipole Aristotle Enterprises Inc. RFA-02-5-F7H1-70B-150
5 dBi
Note 1: Typical output power at antenna connector J1, Channel 11, 50Ω impedance.
DS75002A-page 18
Commission
Preliminary
Output Power(1)
18.5 dBm
© 2011 Microchip Technology Inc.
MRF24J40MC
3.2
Canada
3.2.2
The MRF24J40MC module has been certified for use
in Canada under Industry Canada (IC) Radio
Standards Specification (RSS) RSS-210 and
RSS-Gen. Modular approval permits the installation of
a module in a host device without the need to recertify
the device.
Labeling Requirements for the Host Device (from
Section 3.2.1, RSS-Gen, Issue 3, December 2010):
The host device shall be properly labeled to identify the
module within the host device.
The Industry Canada certification label of a module
shall be clearly visible at all times when installed in the
host device, otherwise the host device must be labeled
to display the Industry Canada certification number of
the module, preceded by the words “Contains
transmitter module”, or the word “Contains”, or similar
wording expressing the same meaning, as follows:
Contains transmitter module IC: 7693A-24J40MC
User Manual Notice for License-Exempt Radio
Apparatus (from Section 7.1.3 RSS-Gen, Issue 3,
December 2010):
User manuals for license-exempt radio apparatus shall
contain the following or equivalent notice in a
conspicuous location in the user manual or
alternatively on the device or both.
This device complies with Industry Canada
license-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this
device may not cause interference, and (2) this
device must accept any interference, including
interference that may cause undesired operation of
the device.
Le présent appareil est conforme aux CNR
d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux
deux conditions suivantes: (1) l'appareil ne doit pas
produire de brouillage, et (2) l'utilisateur de l'appareil
doit accepter tout brouillage radioélectrique subi,
même si le brouillage est susceptible d'en
compromettre le fonctionnement.
3.2.1
MRF24J40MC SETTINGS
APPROVED EXTERNAL ANTENNA
TYPES
Transmitter Antenna (from Section 7.1.2 RSS-Gen,
Issue 3, December 2010):
The MRF24J40MC module can only be sold or
operated with antennas with which it was approved.
Transmitter may be approved with multiple antenna
types. An antenna type comprises antennas having
similar in-band and out-of-band radiation patterns.
Testing shall be performed using the highest gain
antenna of each combination of transmitter and
antenna type for which approval is being sought, with
the transmitter output power set at the maximum level.
Any antenna of the same type having equal or lesser
gain as an antenna that had been successfully tested
with the transmitter, will also be considered approved
with the transmitter, and may be used and marketed
with the transmitter.
When a measurement at the antenna connector is
used to determine RF output power, the effective gain
of the device's antenna shall be stated, based on
measurement or on data from the antenna
manufacturer. For transmitters of output power greater
than 10 milliwatts, the total antenna gain shall be added
to the measured RF output power to demonstrate
compliance to the specified radiated power limits. User
manuals for transmitters shall display the following
notice in a conspicuous location:
Under Industry Canada regulations, this radio
transmitter may only operate using an antenna of a
type and maximum (or lesser) gain approved for the
transmitter by Industry Canada. To reduce potential
radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent
isotropically radiated power (e.i.r.p.) is not more than
that necessary for successful communication.
Conformément à la réglementation d'Industrie
Canada, le présent émetteur radio peut fonctionner
avec une antenne d'un type et d'un gain maximal (ou
inférieur) approuvé pour l'émetteur par Industrie
Canada. Dans le but de réduire les risques de
brouillage radioélectrique à l'intention des autres
utilisateurs, il faut choisir le type d'antenne et son
gain de sorte que la puissance isotrope rayonnée
équivalente (p.i.r.e.) ne dépasse pas l'intensité
nécessaire à l'établissement d'une communication
satisfaisante.
To meet Industry Canada (IC) requirements, the
following settings must be observed by the integrator:
The above notice may be affixed to the device instead
of displayed in the user manual.
• The MRF24J40MC transmit power setting shall
not exceed 18.5 dBm (RFCON3 0x203<7:3> =
00101). Refer to Section 1.3.4 “Transmit Power
Settings”.
• Only channels 11 through 25 may be selected
(RFCON0 0x200).
User manuals for transmitters equipped with detachable antennas shall also contain the following notice in
a conspicuous location.
© 2011 Microchip Technology Inc.
Preliminary
DS75002A-page 19
MRF24J40MC
This radio transmitter (identify the device by
certification number, or model number if Category II)
has been approved by Industry Canada to operate
with the antenna types listed below with the
maximum permissible gain and required antenna
impedance for each antenna type indicated.
Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that
type, are strictly prohibited for use with this device.
Immediately following the above notice, the
manufacturer shall provide a list of all antenna types
approved for use with the transmitter, indicating the
maximum permissible antenna gain (in dBi) and
required impedance for each.
Approved
external
antenna
types
for
MRF24J40MC module are listed in Table 3-2.
3.2.3
the
HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
Conformément à la réglementation d'Industrie
Canada, le présent émetteur radio peut fonctionner
avec une antenne d'un type et d'un gain maximal (ou
inférieur) approuvé pour l'émetteur par Industrie
Canada. Dans le but de réduire les risques de
brouillage radioélectrique à l'intention des autres
utilisateurs, il faut choisir le type d'antenne et son
gain de sorte que la puissance isotrope rayonnée
équivalente (p.i.r.e.) ne dépasse pas l'intensité
nécessaire à l'établissement d'une communication
satisfaisante.
TABLE 3-2:
Type
APPROVED EXTERNAL ANTENNA TYPES
Manufacture
Part Number
Gain
Output Power(1)
Whip, Dipole Aristotle Enterprises Inc. RFA-02-5-F7H1-70B-150
5 dBi
18.5 dBm
Note 1: Typical output power at antenna connector J1, Channel 11, 50Ω impedance
DS75002A-page 20
Preliminary
E.I.R.P.
23.5 dBm
© 2011 Microchip Technology Inc.
MRF24J40MC
3.3
Europe
3.3.2
The MRF24J40MC module conforms to the emission
standards summarized in Table 3-3. The module tests
can be applied toward product certification and
Declaration of Conformity (DoC).
Note:
EXTERNAL ANTENNA
REQUIREMENTS
The maximum gain external antenna should not
exceed 3 dBi to satisfy ETSI EN 300 328 v1.7.1
(2006-10), Maximum e.i.r.p. spectral density limit,
Section 4.3.2.2, “For wideband modulations other then
FHSS (DSSS, OFDM, etc.), the maximum e.i.r.p.
spectral density is limited to 10 mW per MHz.”
To maintain conformance tested ETSI
standards, the module shall not be
modified and settings in Section 1.3
“Operation” must be observed.
3.3.3
HELPFUL WEB SITES
The European Standards do not provide a modular
approval similar to the USA (FCC) and Canada (IC).
However, the completed compliance testing can be
used as part of the customer’s application for product
compliance approvals. The module test report data can
be used as part of the customer’s product test plan and
can significantly lower customer’s compliance burden.
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E, which
can be downloaded from the European Radio
Communications Office (ERO):http://www.ero.dk/.
Depending on the end application, additional testing
may be required. The integrator is responsible for testing the end product for any additional compliance
requirements that become necessary with this module
installed (for example, digital device emission, PC
peripheral requirements and so on) in the specific
country where end device is marketed).
Radio and Telecommunications Terminal Equipment
(R&TTE):
3.3.1
European
(ETSI):
The other helpful websites are:
http://ec.europa.eu/enterprise/rtte/index_en.htm
European Conference of Postal and Telecommunications
Administrations (CEPT):
http://www.cept.org
MRF24J40MC SETTINGS
To meet ETSI requirements, the following settings must
be observed by the integrator:
Telecommunications
Standards
Institute
http://www.etsi.org
European Radio Communications Office (ERO):
http://www.ero.dk
• The MRF24J40MC transmit power setting shall
not exceed 18.5 dBm peak (RFCON3 0x203<7:3>
= 00101) which for ETSI 300 328 requirements
equates to 9.8 dBm average (20 percent duty
cycle). When the MRF24J40MC module is
connected to a 2 dBi antenna, the EIRP is less
than 20 dBm. Refer to Section 1.3.4 “Transmit
Power Settings”.
Only channels 11 through 25 may be selected
(RFCON0 0x200).
TABLE 3-3:
EMISSIONS STANDARDS TESTED
Specification
Test Method
Emission Standards
EN 300 328 V1.7.1 (2006-10)
4.3.1
Maximum Transmit Power
5.7.2
EN 300 328 V1.7.1 (2006-10)
4.3.2
Maximum EIRP Spectral Density
5.7.3
EN 300 328 V1.7.1 (2006-10)
4.3.3
Frequency Range
5.7.4
EN 300 328 V1.7.1 (2006-10)
4.3.6
Transmitter Spurious Emissions
5.7.5
EN 300 328 V1.7.1 (2006-10)
4.3.7
Receiver Spurious Emissions
5.7.6
© 2011 Microchip Technology Inc.
Preliminary
DS75002A-page 21
MRF24J40MC
3.4
Australia/New Zealand
3.4.2
The MRF24J40MC module conforms to compliance
levels 1, 2 and 3 in Australia and levels of conformity 1,
2 and 3 in New Zealand as required by notices under:
• Section 182 of the Australian
Radiocommunications Act 1992;
• Section 407 of the Australian Telecommunications
Act 1997; and
• Section 134 of the New Zealand
Radiocommunications Act 1989.
3.4.1
MRF24J40MC SETTINGS
To meet ETSI requirements, the following settings must
be observed by the integrator:
EXTERNAL ANTENNA
REQUIREMENTS
The maximum gain external antenna should not
exceed 3 dBi to satisfy ETSI EN 300 328 v1.7.1
(2006-10), Maximum e.i.r.p. spectral density limit, Section 4.3.2.2, “For wideband modulations other then
FHSS (DSSS, OFDM, etc.), the maximum e.i.r.p. spectral density is limited to 10 mW per MHz.”
3.4.3
HELPFUL WEBSITES
Australian Communications and Media Authority –
Radiocommunications
(Short
Range
Devices)
Standard:
http://www.acma.gov.au/WEB/STANDARD/pc=PC_10
0141
• The MRF24J40MC transmit power setting shall
not exceed 18.5 dBm peak (RFCON3 0x203<7:3>
= 00101) which for ETSI 300 328 requirements
equates to 9.8 dBm average (20 percent duty
cycle). When the MRF24J40MC module is
connected to a 2 dBi antenna, the EIRP is less
than 20 dBm. Refer to Section 1.3.4 “Transmit
Power Settings”.
• Only channels 11 through 25 may be selected
(RFCON0 0x200).
DS75002A-page 22
Preliminary
© 2011 Microchip Technology Inc.
MRF24J40MC
4.0
ELECTRICAL CHARACTERISTICS
TABLE 4-1:
RECOMMENDED OPERATING CONDITIONS
Parameters
Min
Typ
Max
Units
Ambient Operating Temperature
–40
—
+85
°C
Supply Voltage for RF, Analog and
Digital Circuits
2.7
—
3.6
V
Supply Voltage for Digital I/O
2.7
3.3
3.6
V
Input High Voltage (VIH)
0.5 x VDD
—
VDD + 0.3
V
Input Low Voltage (VIL)
–0.3
—
0.2 x VDD
V
TABLE 4-2:
CURRENT CONSUMPTION
(TA = 25°C, VDD = 3.3V)
Chip Mode
Condition
Min
Typ
Max
Units
Sleep
Sleep Clock and PA voltage
regulator Disabled
—
12 μA
—
μA
Tx
At Maximum Output Power
—
120 mA
—
mA
Rx
—
—
25 mA
—
mA
TABLE 4-3:
RECEIVER AC CHARACTERISTICS
Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz
Parameters
Condition
Min
Typ
Max
Units
RF Input Frequency
Compatible to
IEEE Std. 802.15.4™, 2003
2.405
—
2.480
GHz
RF Sensitivity
—
—
–108
—
dBm
50Ω
—
—
–23
dBm
Measured at Balun Matching
Network Input at Frequency,
2.405 GHz – 2.48 GHz
—
–60
—
dBm
50Ω
–8
–12
—
dB
—
—
1.8
—
dB
Adjacent Channel
Rejection
@ ±5 MHz
30
—
—
dB
Alternate Channel
Rejection
@ ±10 MHz
40
—
—
dB
RSSI Range
—
—
50
—
dB
RSSI Error
—
–5
—
5
dB
Maximum RF Input
LO Leakage
Input Return Loss
Noise Figure
(including matching)
© 2011 Microchip Technology Inc.
Preliminary
DS75002A-page 23
MRF24J40MC
TABLE 4-4:
TRANSMITTER AC CHARACTERISTICS
Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz
Parameters
Condition
Min
Typ
Max
Units
RF Carrier Frequency
—
2.405
—
2.475
GHz
—
dBm
Maximum RF Output
Power
RF Output Power
Control Range
Tx Gain Control
Resolution
Carrier Suppression
Tx Spectrum Mask for
O-QPSK Signal
50Ω
—
—
—
45
—
dB
Programmed by Register
—
1.25
—
dB
—
—
–30
—
dBc
Offset Frequency >3.5 MHz,
at 0 dBm Output Power
–33
—
—
dBm
—
15
—
%
Tx EVM
—
Note 1: Output power at antenna connector J1.
DS75002A-page 24
Preliminary
19
(1)
© 2011 Microchip Technology Inc.
MRF24J40MC
APPENDIX A:
REVISION HISTORY
Revision A (March 2011)
This is the initial release of the document.
© 2011 Microchip Technology Inc.
Preliminary
DS75002A-page 25
MRF24J40MC
NOTES:
DS75002A-page 26
Preliminary
© 2011 Microchip Technology Inc.
MRF24J40MC
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
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• General Technical Support – Frequently Asked
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•
•
•
•
•
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Local Sales Office
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Customers
should
contact
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Technical support is available through the web site
at: http://microchip.com/support
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will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
© 2011 Microchip Technology Inc.
Preliminary
DS75002A-page 27
MRF24J40MC
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
Device: MRF24J40MC
Literature Number: DS75002A
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS75002A-page 28
Preliminary
© 2011 Microchip Technology Inc.
MRF24J40MC
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.
PART NO
M
X
T
Example:
-X
a)
b)
Device
Module Module
Type
Tape and Temperature
Reel
Range
Device
MRF24J40MC: 2.4 GHz IEEE Std. 802.15.4 RF Transceiver
Module with PA/LNA and External Antenna Connector
Temperature
Range
I
MRF24J40MC-I/RM:
temperature, tray.
MRF24J40MCT-I/RM:
temperature, tape and reel.
Industrial
Industrial
= -40ºC to +85ºC (Industrial)
© 2011 Microchip Technology Inc.
Preliminary
DS75002A-page 29
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
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Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Fax: 82-2-558-5932 or
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Tel: 60-3-6201-9857
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Tel: 60-4-227-8870
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Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
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Tel: 63-2-634-9065
Fax: 63-2-634-9069
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Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
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Tel: 65-6334-8870
Fax: 65-6334-8850
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Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
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Tel: 886-3-6578-300
Fax: 886-3-6578-370
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Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
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Tel: 886-7-213-7830
Fax: 886-7-330-9305
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Tel: 66-2-694-1351
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Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
02/18/11
DS75002A-page 30
© 2011 Microchip Technology Inc.