MRF24J40MA Data Sheet

MRF24J40MA
Data Sheet
2.4 GHz IEEE Std. 802.15.4™
RF Transceiver Module
© 2008 Microchip Technology Inc.
DS70329B
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Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS70329B-page ii
© 2008 Microchip Technology Inc.
MRF24J40MA
2.4 GHz IEEE Std. 802.15.4™ RF Transceiver Module
Features:
RF/Analog Features:
• IEEE Std. 802.15.4™ Compliant RF Transceiver
• Supports ZigBee®, MiWi™, MiWi™ P2P and
Proprietary Wireless Networking Protocols
• Small Size: 0.7” x 1.1” (17.8 mm x 27.9 mm),
Surface Mountable
• Integrated Crystal, Internal Voltage Regulator,
Matching Circuitry and PCB Antenna
• Easy Integration into Final Product – Minimize
Product Development, Quicker Time to Market
• Radio Regulation Certification for United States
(FCC), Canada (IC) and Europe (ETSI)
• Compatible with Microchip Microcontroller
Families (PIC16F, PIC18F, PIC24F/H, dsPIC33
and PIC32)
• Up to 400 ft. Range
• ISM Band 2.405-2.48 GHz Operation
• Data Rate: 250 kbps
• -94 dBm Typical Sensitivity with +5 dBm
Maximum Input Level
• +0 dBm Typical Output Power with
36 dB TX Power Control Range
• Integrated Low Phase Noise VCO, Frequency
Synthesizer and PLL Loop Filter
• Digital VCO and Filter Calibration
• Integrated RSSI ADC and I/Q DACs
• Integrated LDO
• High Receiver and RSSI Dynamic Range
Operational:
•
•
•
•
Operating Voltage: 2.4-3.6V (3.3V typical)
Temperature Range: -40°C to +85°C Industrial
Simple, Four-Wire SPI Interface
Low-Current Consumption:
- RX mode: 19 mA (typical)
- TX mode: 23 mA (typical)
- Sleep: 2 μA (typical)
FIGURE 1:
MAC/Baseband Features:
• Hardware CSMA-CA Mechanism, Automatic ACK
Response and FCS Check
• Independent Beacon, Transmit and GTS FIFO
• Supports all CCA modes and RSS/LQI
• Automatic Packet Retransmit Capable
• Hardware Security Engine (AES-128) with CTR,
CCM and CBC-MAC modes
• Supports Encryption and Decryption for MAC
Sublayer and Upper Layer
PIN DIAGRAM
GND
RESET
WAKE
INT
SDI
SCK
© 2008 Microchip Technology Inc.
1
2
3
4
5
6
12
11
10
9
8
7
GND
GND
VIN
NC
CS
SDO
DS70329B-page 1
MRF24J40MA
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 3
2.0 Circuit Description ........................................................................................................................................................................ 7
3.0 Regulatory Approval................................................................................................................................................................... 15
4.0 Electrical Characteristics ............................................................................................................................................................ 19
Appendix A: Revision History............................................................................................................................................................... 21
Index .................................................................................................................................................................................................... 23
The Microchip Web Site ....................................................................................................................................................................... 25
Customer Change Notification Service ................................................................................................................................................ 25
Customer Support ................................................................................................................................................................................ 25
Reader Response ................................................................................................................................................................................ 26
Product Identification System............................................................................................................................................................... 27
TO OUR VALUED CUSTOMERS
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DS70329B-page 2
© 2008 Microchip Technology Inc.
MRF24J40MA
1.0
DEVICE OVERVIEW
The MRF24J40MA is a 2.4 GHz IEEE Std. 802.15.4™
compliant, surface mount module with integrated
crystal, internal voltage regulator, matching circuitry
and PCB antenna. The MRF24J40MA module operates in the non-licensed 2.4 GHz frequency band and
is FCC, IC and ETSI compliant. The integrated module
design frees the integrator from extensive RF and
antenna design, and regulatory compliance testing,
allowing quicker time to market.
MRF24J40MA module inside a finished product and
not require regulatory testing for an intentional radiator
(RF transmitter). See Section 3.0 “Regulatory
Approval” for specific requirements to be followed by
the integrator.
1.1
Interface Description
The MRF24J40MA module is compatible with
Microchip’s ZigBee®, MiWi™ and MiWi P2P software
stacks. Each software stack is available as a free
download, including source code, from the Microchip
web site http://www.microchip.com/wireless.
Figure 1-1 shows a simplified block diagram of the
MRF24J40MA module. The module is based on the
Microchip Technology MRF24J40 IEEE 802.15.4™
2.4 GHz RF Transceiver IC. The module interfaces to
many popular Microchip PIC® microcontrollers via a
4-wire serial SPI interface, interrupt, wake, Reset,
power and ground, as shown in Figure 1-2. Table 1-1
provides the pin descriptions.
The MRF24J40MA module has received regulatory
approvals for modular devices in the United States
(FCC), Canada (IC) and Europe (ETSI). Modular
approval removes the need for expensive RF and
antenna design and allows the end user to place the
Data communications with the MRF24J40MA module
are documented in the “MRF24J40 IEEE 802.15.4™
2.4 GHz RF Transceiver Data Sheet” (DS39776). Refer
to the MRF24J40 Data Sheet for specific serial
interface protocol and register definitions.
FIGURE 1-1:
MRF24J40MA BLOCK DIAGRAM
MRF24J40MA IEEE Std. 802.15.4™ Module
MRF24J40
Interface
PCB
Antenna
Matching
Circuitry
Physical
SPI
Digital
I/O
MAC
Power
Management
Power
20 MHz
Crystal
© 2008 Microchip Technology Inc.
DS70329B-page 3
MRF24J40MA
TABLE 1-1:
PIN DESCRIPTION
Pin
Symbol
Type
Description
1
GND
Power
2
RESET
DI
Global hardware Reset pin
3
WAKE
DI
External wake-up trigger
4
INT
DO
Interrupt pin to microcontroller
Ground
5
SDI
DI
Serial interface data input
6
SCK
DI
Serial interface clock
7
SDO
DO
Serial interface data output from MRF24J40
8
CS
DI
Serial interface enable
9
NC
—
No connection (allow pin to float; do not connect signal)
10
VIN
Power
Power supply
11
GND
Ground
Ground
12
GND
Ground
Ground
Legend: Pin type abbreviation: D = Digital, I = Input, O = Output
FIGURE 1-2:
MICROCONTROLLER TO MRF24J40MA INTERFACE
PIC® MCU
DS70329B-page 4
MRF24J40MA
I/O
CS
SDO
SDI
SDI
SDO
SCK
SCK
INTx
INT
VIN
GND
I/O
WAKE
I/O
RESET
© 2008 Microchip Technology Inc.
MRF24J40MA
1.2
Mounting Details
The MRF24J40MA is a surface mountable module.
Module dimensions are shown in Figure 1-3. The
module Printed Circuit Board (PCB) is 0.032" thick with
castellated mounting points on the edge. Figure 1-4 is
a recommended host PCB footprint for the
MRF24J40MA.
FIGURE 1-4:
RECOMMENDED PCB
FOOTPRINT
The MRF24J40MA has an integrated PCB antenna.
For the best performance, follow the mounting details
shown in Figure 1-5. It is recommended that the
module be mounted on the edge of the host PCB, and
an area around the antenna, approximately 1.2", be
kept clear of metal objects. A host PCB ground plane
around the MRF24J40MA acts as a counterpoise to the
PCB antenna. It is recommended to extend the ground
plane at least 0.4" around the module.
FIGURE 1-3:
MODULE DETAILS
© 2008 Microchip Technology Inc.
DS70329B-page 5
MRF24J40MA
FIGURE 1-5:
MOUNTING DETAILS
Keep area around antenna
(approximately 1.2 inches)
clear of metallic structures
for best performance
1.2”
Edge of PCB
1.2”
0.470”
0.4”
0.4”
0.4”
PCB Ground Plane (Counterpoise)
Extend as far as possible to
the sides and below the module
(at least 0.4 inches on each side)
for best performance
DS70329B-page 6
© 2008 Microchip Technology Inc.
MRF24J40MA
2.0
CIRCUIT DESCRIPTION
2.1
The MRF24J40MA is a complete 2.4 GHz IEEE
Std. 802.15.4™ compliant surface mount module with
integrated crystal, internal voltage regulator, matching
circuitry and PCB antenna. The MRF24J40MA module
interfaces to many popular Microchip PIC microcontrollers via a 4-wire serial SPI interface, interrupt,
wake, Reset, power and ground. Data communications
with the MRF24J40MA module are documented in the
“MRF24J40 IEEE 802.15.4™ 2.4 GHz RF Transceiver
Data Sheet” (DS39776). Refer to the MRF24J40 Data
Sheet for specific serial interface protocol and register
definitions.
© 2008 Microchip Technology Inc.
Schematic
A schematic diagram of the module is shown in
Figure 2-1 and the Bill of Materials (BOM) is shown in
Table 2-1.
The MRF24J40MA module is based on the Microchip
Technology MRF24J40 IEEE 802.15.4™ 2.4 GHz RF
Transceiver IC. The serial I/O (SCK, SDI, SDO and
CS), RESET, WAKE and INT pins are brought out to
the module pins. The SDO signal is tri-state buffered by
IC2 to solve a silicon errata, where the SDO signal
does not release to a high-impedance state, after the
CS pin returns to its inactive state. Crystal, X1, is a
20 MHz crystal with a frequency tolerance of
±10 ppm @ 25°C to meet the IEEE Std. 802.15.4
symbol rate tolerance of ±40 ppm. A balun is formed by
components: L1, L3, C2 and C14. L2 is an RF choke
and pull-up for the RFP and RFN pins on the
MRF24J40. C15 is a DC block capacitor. A low-pass
filter is formed by components: L4, C16 and C17. The
remaining capacitors provide RF and digital bypass.
Advance Information
DS70329B-page 7
Advance Information
C17
1.0 pF
Note:
PCB
Antenna
C16
NP
NP = Not Placed.
L4
6.8 nH
C12
0.1 μF
C15
0.5 pF
C13
47 pF
C6
47 pF
C10
47 pF
C11
0.1 μF
L1
8.2 nH
L2
3.3 nH
VIN
VIN
C2
1.0 pF
L3
5.6 nH
C14
0.5 pF
C7
0.01 μF
VIN
VIN
C8
1 μF
VIN
VIN
1
2
3
4
5
6
7
8
9
10
C9
100 pF
X1
R1
NP
VDD
RFP
RFN
VDD
VDD
GND
GPIO0
GPIO1
GPIO5
GPIO4
40
39
38 NC
37
36
35
34
33
32
31
VIN
3 WAKE
2 RESET
4 INT
5 SDI
6 SCK
30 NC
29 NC
28 NC
27 NC
26
25
24
23 NC
22
21
C18
18 pF
20.00 MHz
C19
18 pF
NC
NC
LPOSC1
LPOSC2
IC1
NC
MRF24J40/ML
GND
GND
NC
GND
VDD
LCAP
VDD
NC
VDD
GND
VDD
OSC1
OCS2
VDD
VDD
DS70329B-page 8
GPIO2
GPIO3
RESET
GND
WAKE
INT
SDO
SDI
SCK
CS
GND
3
5
VCC
VIN
Y 4
8 CS
NC
12 GND
11 GND
1 GND
10 VIN
7 SDO
IC2
NC7SZ125P5X
C3
0.01 μF
C5
47 pF
VIN
1 OE
2 A
C4
47 pF
VIN
C1
1 μF
VIN
FIGURE 2-1:
11
12
13
14
15
16
17
18
19
20
VIN
MRF24J40MA
MRF24J40MA SCHEMATIC
© 2008 Microchip Technology Inc.
MRF24J40MA
TABLE 2-1:
MRJ24J40MA BILL OF MATERIALS
Designator
Description
Manufacturer
Part Number
C1
Chip Capacitor 0402 X5R 1U
Murata
GRM155R60J105ME19D
C2
Chip Capacitor 0402 COG 1.0P
Murata
GRM1555C1H1R0CZ01D
C3
Chip Capacitor 0402 X7R 10N
Murata
GRM155R71E103KA01D
C4
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C5
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C6
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C7
Chip Capacitor 0402 X7R 10N
Murata
GRM155R71E103KA01D
C8
Chip Capacitor 0402 X5R 1U
Murata
GRM155R60J105ME19D
C9
Chip Capacitor 0402 COG 100P
Murata
GRM1555C1H101JZ01D
C10
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C11
Chip Capacitor 0402 X5R 100N
Murata
GRM155R61A104KA01D
C12
Chip Capacitor 0402 X5R 100N
Murata
GRM155R61A104KA01D
C13
Chip Capacitor 0402 COG 47P
Murata
GRM1555C1H470JZ01D
C14
Chip Capacitor 0402 COG 0.5P
Murata
GRM1555C1HR50CZ01D
C15
Chip Capacitor 0402 COG 0.5P
Murata
GRM1555C1HR50CZ01D
C16
Not Placed
C17
Chip Capacitor 0402 COG 1.0P
Murata
GRM1555C1H1R0CZ01D
C18
Chip Capacitor 0402 COG 18P
Murata
GRM1555C1H180JZ01D
C19
Chip Capacitor 0402 COG 18P
Murata
GRM1555C1H180JZ01D
IC1
IEEE 802.15.4™ RF Transceiver
Microchip
MRF24J40-I/ML
IC2
Buffer, SC70 Package
Fairchild
NC7SZ125P5X
L1
Chip Inductor 0402 8.2N
Panasonic
ELJ-RF8N2JFB
L2
Chip Inductor 0402 3.3N
Panasonic
ELJ-RF3N3DFB
L3
Chip Inductor 0402 5.6N
Panasonic
ELJ-RF5N6DFB
Panasonic
ELJ-RF6N8JFB
Abracon
ABM8-156-20.0000MHZ-T
L4
Chip Inductor 0402 6.8N
R1
Not Placed
X1
20 MHz Crystal
© 2008 Microchip Technology Inc.
Advance Information
DS70329B-page 9
MRF24J40MA
2.2
FIGURE 2-5:
Printed Circuit Board
The MRF24J40MA module printed circuit board is constructed with FR4 material, four layers and
0.032 inches thick. The layers are shown in Figure 2-2
through Figure 2-6. The stack up of the PCB is shown
in Figure 2-7.
FIGURE 2-2:
TOP SILK SCREEN
Note:
Top view negative Gerber.
FIGURE 2-6:
FIGURE 2-3:
Note:
BOTTOM COPPER
TOP COPPER
Note:
FIGURE 2-4:
LAYER 3 – POWER
PLANE
Top view.
LAYER 2 – GROUND
PLANE
Top view negative Gerber.
DS70329B-page 10
Advance Information
© 2008 Microchip Technology Inc.
MRF24J40MA
FIGURE 2-7:
PCB LAYER STACK UP
1/2 oz. Copper
Top Copper
8 mil FR4
1/2 oz. Copper
Ground Plane
0.032”
12 mil FR4
+/- 0.005”
1/2 oz. Copper
Power Plane
8 mil FR4
1/2 oz. Copper
© 2008 Microchip Technology Inc.
Advance Information
Bottom Copper
DS70329B-page 11
MRF24J40MA
2.3
FIGURE 2-8:
PCB Antenna
The PCB antenna is fabricated on the top copper trace.
Figure 2-8 shows the trace dimensions. The layers
below the antenna have no copper traces. The ground
and power planes under the components serve as a
counterpoise to the PCB antenna. Additional ground
plane on the host PCB will substantially enhance the
performance of the module. For best performance,
place the module on the host PCB following the
recommendations in Section 1.2 “Mounting Details”.
16.5 mm
4.0 mm
11.0 mm
The Printed Circuit Board (PCB) antenna was designed
and simulated using Ansoft Designer® and HFSS™ 3D
full-wave solver software by Ansoft Corporation
(www.ansoft.com). The design goal was to create a
compact, low-cost antenna with the best radiation
pattern. Figure 2-9 shows the simulation drawing and
Figure 2-10 and Figure 2-11 show the 2D and 3D
radiation patterns, respectively. As shown by the
radiation patterns, the performance of the antenna is
dependant upon the orientation of the module.
Figure 2-12 shows the impedance simulation and
Figure 2-13 shows the actual impedance measurement.
The discrete matching circuitry matches the impedance
of the antenna with the MRF24J40 transceiver IC.
FIGURE 2-9:
PCB ANTENNA
DIMENSIONS
2.0 mm
2.5 mm
5.0 mm
PCB ANTENNA SIMULATION DRAWING
Z
Y
X
DS70329B-page 12
Advance Information
© 2008 Microchip Technology Inc.
MRF24J40MA
FIGURE 2-10:
SIMULATED 2D RADIATION PATTERN
FIGURE 2-11:
SIMULATED 3D RADIATION PATTERN
dB (Gain Total)
2.0921e+000
1.1359e-001
-1.8649e+000
-3.8435e+000
-5.8220e+000
-7.8005e+000
-9.7791e+000
-1.1758e-001
-1.3736e+001
-1.5715e+001
-1.7693e+001
-1.9672e+001
-2.1650e+001
-2.3629e-001
-2.5607e+001
-2.7586e+001
-2.9564e+001
© 2008 Microchip Technology Inc.
Z
Theta
Y
Phi
X
Advance Information
DS70329B-page 13
MRF24J40MA
FIGURE 2-12:
SIMULATED PCB ANTENNA IMPEDANCE
FIGURE 2-13:
MEASURED PCB ANTENNA IMPEDANCE
DS70329B-page 14
Advance Information
© 2008 Microchip Technology Inc.
MRF24J40MA
3.0
REGULATORY APPROVAL
The MRF24J40MA module has received regulatory
approvals for modular devices in the United States,
Canada and European countries. Modular approval
allows the end user to place the MRF24J40MA module
inside a finished product and not require regulatory
testing for an intentional radiator (RF transmitter), provided no changes or modifications are made to the
module circuitry. Changes or modifications could void
the user’s authority to operate the equipment. The end
user must comply with all of the instructions provided
by the Grantee, which indicate installation and/or
operating conditions necessary for compliance.
The integrator may still be responsible for testing the end
product for any additional compliance requirements
required with this module installed (for example: digital
device emission, PC peripheral requirements, etc.) in
the specific country that the end device will be marketed.
Annex F of the IEEE Std. 802.15.4 document has a good
summary of regulatory requirements in various countries
concerning IEEE Std. 802.15.4 devices. The standard
can be downloaded from the IEEE Standards web page:
http://standards.ieee.org/getieee802/802.15.html.
Refer to the specific country radio regulations for
details on regulatory compliance.
3.1
United States
The MRF24J40MA has received Federal Communications Commission (FCC) CFR47 Telecommunications,
Part 15 Subpart C “Intentional Radiators” 15.247 and
modular approval in accordance with FCC Public
Notice DA 00-1407 Released: June 26, 2000, Part 15
Unlicensed Modular Transmitter Approval. The
MRF24J40MA module can be integrated into a finished
product without obtaining subsequent and separate
FCC approvals.
The MRF24J40MA module has been labeled with its
own FCC ID number, and if the FCC ID is not visible
when the module is installed inside another device,
then the outside of the finished product into which the
module is installed must also display a label referring to
the enclosed module. This exterior label can use
wording such as the following:
The user’s manual should include the following
statement:
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful
interference in a residential installation. This
equipment generates, uses and can radiate radio
frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However, there
is no guarantee that interference will not occur in a
particular installation. If this equipment does cause
harmful interference to radio or television reception,
which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment
and receiver.
• Connect the equipment into an outlet on a
circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV
technician for help.
3.1.1
RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. OET Bulletin 65 “Evaluating
Compliance with FCC Guidelines for Human Exposure
to Radio Frequency Electromagnetic Fields” provides
assistance in determining whether proposed or existing
transmitting facilities, operations or devices comply
with limits for human exposure to Radio Frequency
(RF) fields adopted by the Federal Communications
Commission (FCC). The bulletin offers guidelines and
suggestions for evaluating compliance.
If appropriate, compliance with exposure guidelines for
mobile and unlicensed devices can be accomplished
by the use of warning labels and by providing users
with information concerning minimum separation
distances from transmitting structures and proper
installation of antennas.
Contains Transmitter Module FCC ID:
OA3MRF24J40MA
-orContains FCC ID: OA3MRF24J40MA
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
© 2008 Microchip Technology Inc.
DS70329B-page 15
MRF24J40MA
The following statement must be included as a
CAUTION statement in manuals and OEM products to
alert users of FCC RF Exposure compliance:
To satisfy FCC RF Exposure requirements for mobile
and base station transmission devices, a separation
distance of 20 cm or more should be maintained
between the antenna of this device and persons
during operation. To ensure compliance, operation at
closer than this distance is not recommended.
The antenna(s) used for this transmitter must not be
co-located or operating in conjunction with any other
antenna or transmitter.
If the MRF24J40MA module is used in a portable
application (antenna is less than 20 cm from persons
during operation), the integrator is responsible for
performing Specific Absorption Rate (SAR) testing in
accordance with FCC rules 2.1091.
3.1.2
HELPFUL WEB SITES
Federal
Communications
http://www.fcc.gov
3.2
Commission
(FCC):
Canada
The MRF24J40MA module has been certified for use in
Canada under Industry Canada (IC) Radio Standards
Specification (RSS) RSS-210 and RSS-Gen.
From Section 7.1.1, RSS-Gen, Issue 2, June 2007,
Modular Transmitter Approval:
From Section 5.2, RSS-Gen, Issue 2, June 2007,
Equipment Labels:
All Category I radio equipment intended for use in
Canada shall permanently display on each transmitter,
receiver or inseparable combination thereof, the
applicant’s name (i.e., manufacturer’s name, trade
name or brand name), model number and certification
number. This information shall be affixed in such a
manner as to not be removable except by destruction or
defacement. The size of the lettering shall be legible
without the aid of magnification, but is not required to be
larger than 8-point font size. If the device is too small to
meet this condition, the information can be included in
the user manual upon agreement with Industry Canada.
Label:
Contains IC: 7693A-24J40MA
From Section 7.1.6, RSS-Gen, Issue 2, June 2007,
Digital Circuits:
If the device contains digital circuitry that is not directly
associated with the radio transmitter, the device shall
also have to comply with ICES-003, Class A or B as
appropriate,
except
for
ICES-003
labeling
requirements. The test data obtained (for the ICES-003
tests) shall be kept by the manufacturer or importer
whose name appears on the equipment label, and
made available to Industry Canada on request, for as
long as the model is being marketed in Canada.
3.2.1
HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
Host devices which contain separately certified
modules do not need to be recertified, provided that
they meet the following conditions:
a)
b)
c)
Note:
The host device, as a stand-alone unit
without any separately certified modules,
complies with all applicable Radio Standards
Specifications.
The host device and all the separately
certified modules it contains jointly meet the
RF exposure compliance requirements of
RSS-102, if applicable.
The host device complies with the
certification labeling requirements of each of
the modules it contains.
Compliance of a module in its final
configuration is the responsibility of the
applicant. A host device will not be
considered certified if the instructions
regarding antenna configuration provided
in the original description, of one or more
separately certified modules it contains,
were not followed
DS70329B-page 16
© 2008 Microchip Technology Inc.
MRF24J40MA
3.3
Europe
The MRF24J40MA module has been certified for use in
European countries. The following testing has been
completed:
The end user is responsible for ensuring compliance
with
harmonized
frequencies
and
labeling
requirements for each country the end device is
marketed and sold.
Test standard ETSI EN 300 328 V1.7.1 (2006-10):
3.3.1
•
•
•
•
Radio and Telecommunications Terminal Equipment
(R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
Maximum Transmit Power
Maximum EIRP Spectral Density
Frequency Range
Radiated Emissions
Test standards ETSI EN 301 489-1:2008 and ETSI
EN 301 489-17:2008:
• Radiated Emissions
• Electro-Static Discharge
• Radiated RF Susceptibility
HELPFUL WEB SITES:
European Conference of Postal and Telecommunications
Administrations (CEPT): http://www.cept.org/
European Telecommunications Standards Institute
(ETSI): http://www.etsi.org/
European Radio Communications Office (ERO):
http://www.ero.dk/
A helpful document that can be used as a starting point
in understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, downloadable
from the European Radio Communications Office
(ERO): http://www.ero.dk.
© 2008 Microchip Technology Inc.
DS70329B-page 17
MRF24J40MA
NOTES:
DS70329B-page 18
© 2008 Microchip Technology Inc.
MRF24J40MA
4.0
ELECTRICAL CHARACTERISTICS
TABLE 4-1:
RECOMMENDED OPERATING CONDITIONS
Parameters
Min
Typ
Max
Units
Ambient Operating Temperature
-40
—
+85
°C
Supply Voltage for RF, Analog and
Digital Circuits
2.4
—
3.6
V
Supply Voltage for Digital I/O
2.4
3.3
3.6
V
Input High Voltage (VIH)
0.5 x VDD
—
VDD + 0.3
V
Input Low Voltage (VIL)
-0.3
—
0.2 x VDD
V
TABLE 4-2:
CURRENT CONSUMPTION
(TA = 25°C, VDD = 3.3V)
Chip Mode
Condition
Min
Typ
Max
Units
Sleep
Sleep Clock Disabled
—
2
—
μA
TX
At Maximum Output Power
—
23
—
mA
—
19
—
mA
Min
Typ
Max
Units
2.405
—
2.480
GHz
RF Sensitivity
—
-94
—
dBm
Maximum RF Input
+5
—
—
dBm
RX
TABLE 4-3:
RECEIVER AC CHARACTERISTICS
Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz
Parameters
RF Input Frequency
Condition
Compatible to
IEEE Std. 802.15.4™, 2003
LO Leakage
Measured at Balun Matching
Network Input at
Frequency, 2.405-2.48 GHz
—
-60
—
dBm
Input Return Loss
Externally Matched to 50 ohm Source
by a Balun Matching Network
-8
-12
—
dB
—
8
—
dB
Noise Figure
(including matching)
Adjacent Channel
Rejection
@ +/-5 MHz
30
—
—
dB
Alternate Channel
Rejection
@ +/-10 MHz
40
—
—
dB
RSSI Range
—
50
—
dB
RSSI Error
-5
—
5
dB
© 2008 Microchip Technology Inc.
DS70329B-page 19
MRF24J40MA
TABLE 4-4:
TRANSMITTER AC CHARACTERISTICS
Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz
Parameters
Min
Typ
Max
RF Carrier Frequency
2.405
—
2.480
GHz
Maximum RF Output
Power
—
0
—
dBm
RF Output Power
Control Range
—
36
—
dB
—
1.25
—
dB
Carrier Suppression
—
-30
—
dBc
TX Spectrum Mask for Offset Frequency > 3.5 MHz,
O-QPSK Signal
at 0 dBm Output Power
-33
—
—
dBm
TX EVM
—
15
—
%
TX Gain Control
Resolution
DS70329B-page 20
Condition
Programmed by Register
Units
© 2008 Microchip Technology Inc.
MRF24J40MA
APPENDIX A:
REVISION HISTORY
Revision A (June 2008)
Original data sheet for the MRF24J40MA device.
Revision B (November 2008)
Changed C17 to 1.0 pF and removed CLKOUT signal.
© 2008 Microchip Technology Inc.
DS70329B-page 21
MRF24J40MA
NOTES:
DS70329B-page 22
© 2008 Microchip Technology Inc.
MRF24J40MA
INDEX
A
O
AC Characteristics
Receiver ......................................................................19
Transmitter .................................................................. 20
Antenna Impedance
Measured PCB ............................................................ 14
Simulated PCB ............................................................ 14
Overview ............................................................................... 3
B
Block Diagrams
Microcontroller to MRF24J40MA Interface.................... 4
MRF24J40MA ............................................................... 3
C
Circuit Description ................................................................. 7
Customer Change Notification Service ............................... 24
Customer Notification Service ............................................. 24
Customer Notification System ............................................... 2
Customer Support ............................................................... 24
P
PCB Antenna ...................................................................... 12
Dimensions ................................................................. 12
Simulation Drawing ..................................................... 12
PCB Layers
Bottom Copper............................................................ 10
Layer 2 – Ground Plane.............................................. 10
Layer 3 – Power Plane ............................................... 10
Stack Up ..................................................................... 11
Top Copper ................................................................. 10
Top Silk Screen .......................................................... 10
Pin Description...................................................................... 4
Pin Diagram .......................................................................... 1
Printed Circuit Board (PCB) ................................................ 10
R
FCC ID Number................................................................... 15
FCC RF Exposure Compliance ........................................... 16
Radiation Pattern
2D ............................................................................... 13
3D ............................................................................... 13
Reader Response ............................................................... 25
Regulatory Approval ........................................................... 15
Canada ....................................................................... 16
Europe ........................................................................ 17
United States .............................................................. 15
Revision History .................................................................. 21
RF Exposure ....................................................................... 15
RF/Analog Features.............................................................. 1
H
S
Helpful Web Sites.......................................................... 16, 17
Interface Description ............................................................. 3
Internet Address .................................................................. 24
Serial I/O
SCK, SDI, SDO, CS...................................................... 7
Short Range Devices (SRD) ............................................... 17
Specific Absorption Rate (SAR).......................................... 16
SPI ........................................................................................ 7
M
W
MAC/Baseband Features ...................................................... 1
Microchip Internet Web Site ................................................ 24
MiWi P2P............................................................................... 3
MiWi Protocol ........................................................................3
More Information ................................................................... 2
Customer Notification System ....................................... 2
Errata ............................................................................2
Mounting Details.................................................................... 5
MRF24J40 Data Sheet...................................................... 3, 7
MRF24J40MA Bill of Materials (BOM) ..................................9
MRF24J40MA Schematic...................................................... 8
WWW Address.................................................................... 24
WWW, On-Line Support ....................................................... 2
E
Electrical Characteristics .....................................................19
Current Consumption .................................................. 19
Recommended Operating Conditions ......................... 19
Errata..................................................................................... 2
European Radio Communications (ERC)............................17
F
I
DS70329B-page 23
Z
ZigBee Protocol .................................................................... 3
© 2008 Microchip Technology Inc.
MRF24J40MA
NOTES:
DS70329B-page 24
© 2008 Microchip Technology Inc.
MRF24J40MA
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
© 2008 Microchip Technology Inc.
DS70329B-page 25
MRF24J40MA
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Device: MRF24J40MA
Y
N
Literature Number: DS70329B
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS70329B-page 26
© 2008 Microchip Technology Inc.
MRF24J40MA
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
M
X
T
-X
Device
Module
Module
Type
Tape and
Reel
Temperature
Range
Device
MRF24J40MA;
VDD range 2.4V to 3.6V
Temperature Range
I
= -40°C to
© 2008 Microchip Technology Inc.
+85°C
Examples:
a)
b)
MRF24J40MA-I = Industrial temp. tray
MRF24J40MAT-I = Industrial temp., tape and
reel.
(Industrial)
DS70329B-page 27
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/02/08
DS70329B-page 28
© 2008 Microchip Technology Inc.