Freescale Semiconductor Advance Information Document Number: SC900842 Rev. 2.0, 11/2010 Buck-Boost DC/DC and LDO Power Management IC 900842 The 900842 is comprised of a fully integrated, 4-switch synchronous Buck-Boost DC/DC regulator and a low noise, low dropout linear regulator (LDO). The 900842 is supplied from a single Li-Ion battery cell, and steps up or down an input voltage range of 3.0 to 4.4 V to provide a fixed output voltage of 3.3 V. It provides two pins to monitor the status of the IC: a digital status signal, and an analog voltage proportional to the average output current. The 900842 is housed in a 3x3 mm, Pb-free, wafer level chip scale package (WLCSP) with a 0.4 mm pitch. POWER MANAGEMENT Features • • • • • • • • 3.064 X 3.064 98ASA00004D 36-PIN WLCSP Operates from a single Li-Ion cell 3.0 V ≤ VIN ≤ 4.4 V Fixed 3.3 V output voltage Uses internal MOSFETS 1.625 MHz PWM switching frequency Seamless transition between Buck and Boost modes Peak current limiting and output current reporting Uses internal compensation Low-power operating mode ORDERING INFORMATION Device Temperature Range (TA) Package SCCSP900842/R2 -40 °C to 85 °C 36-PIN WLCSP Applications • Mobile internet devices • Tablet PCs • Netbooks VIN= 3.0 to 4.4 V SC900842 CIN33 PVIN1 AVIN PVIN2 VOUTP To Load 3.3 V VOUTPFB 900841 VSW1P EN CLK26M STTS ISNS VSW1FB L33 VSW2FB VSW2P VIN1P8 VOUTMFB BGBYP VREGOUT PGND AGND CBGBYP CCORE Figure 1. 900842 Simplified Application Diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2010. All rights reserved. CO33 INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM BGBYP AVIN PVIN1 PVIN2 LDO Bandgap and Ref Regulator SM DC/DC Converter VREGOUT VOUTP VOUTPFB VIN1P8 Logic M1 M4 VSW1P VSW1FB Buck or Boost Controller Thermal Shutdown VSW2FB VSW2P EN M2 CLK26M STTS M3 VOUTMFB ISNS AGND PGND Figure 2. 900842 Internal Block Diagram 900842 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS 1 VSW1P 2 PGND 3 4 PGND PGND 5 6 PVIN2 VSW2P 6 5 VSW2P PVIN2 4 PGND 3 PGND 2 PGND 1 VSW1P A A PVIN1 PVIN1 STTS AGND VOUTP VOUTP VOUTP VOUTP AGND STTS PVIN1 PVIN1 B B VSW1P AGND ISNS VOUTP VSW2P VSW2P VSW2P VSW2P VOUTP ISNS AGND VSW1P C C VSW1P AGND CLK26M AGND AGND VREGOUT VREGOUT AGND AGND CLK26M AGND VSW1P D D VSW2FB VSW1FB AGND AGND BGBYP AVIN AVIN BGBYP AGND AGND VSW1FB VSW2FB E E VOUTPFB VOUTMFB VIN1P8 EN VREGOUT AGND AGND VREGOUT EN VIN1P8 VOUTMFB VOUTPFB F F Solder Ball Up View (Bottom View) Solder Ball Down View (Transparent Top View) Figure 3. 900842 Pin Connections Table 1. 900842 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 10. Pin Number Name Type I/O Definition Voltage A1 VSW1P Analog O Switching Node 1 A2 PGND Ground G Power Ground 0V A3 PGND Ground G Power Ground 0V A4 PGND Ground G Power Ground 0V A5 PVIN2 Supply P Power VIN A6 VSW2P Analog O Switching Node 2 B1 PVIN1 Supply P Power VIN 2.8 - 4.7 V B2 PVIN1 Supply P Power VIN 2.8 - 4.7 V B3 STTS Digital O Power Good Signal - Active Low B4 AGND Ground G Analog Ground 0V B5 VOUTP Analog O Output Voltage 3.3 V B6 VOUTP Analog O Output Voltage 3.3 V C1 VSW1P Analog O Switching Node 1 C2 AGND Ground G Analog Ground C3 ISNS Analog O Current Sense Signal C4 VOUTP Analog O Output Voltage C5 VSW2P Analog O Switching Node 2 0 - 4.7 V 2.8 - 4.7 V 0 - 4.7 V 1.8 V 0 - 4.7 V 0V 0 - 4.7 V 3.3 V 0 - 4.7 V 900842 Analog Integrated Circuit Device Data Freescale Semiconductor 3 PIN CONNECTIONS Table 1. 900842 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 10. Pin Number Name Type I/O Definition Voltage C6 VSW2P Analog O Switching Node 2 0 - 4.7 V D1 VSW1P Analog O Switching Node 1 0 - 4.7 V D2 AGND Ground G Analog Ground D3 CLK26M Digital I 26 MHz Clock input D4 AGND Ground G Analog Ground 0V D5 AGND Ground G Analog Ground 0V D6 VREGOUT Analog O LDO Output 2.775 V E1 VSW2FB Analog I Switching Node 2 Feedback 0 - 4.7 V E2 VSW1FB Analog I Switching Node 1 Feedback 0 - 4.7 V E3 AGND Ground G Analog Ground 0V E4 AGND Ground G Analog Ground 0V E5 BGBYP Analog O Reference Bypass Cap E6 AVIN Supply P Analog VIN F1 VOUTPFB Analog I Output Voltage Differential Feedback, Positive F2 VOUTMFB Analog I Output Voltage Differential Feedback, Reference F3 VIN1P8 Supply P 1.8 V Supply 1.8 V F4 EN Digital I Enable Signal 1.2 V / 1.8 V F5 VREGOUT Analog O LDO Output F6 AGND Ground G Analog Ground 0V 1.8 V 1.2 V 2.8 - 4.7 V 3.3 V 0V 2.775 V 0V 900842 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Absolute Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Pin / Parameter Min Max -0.3 -0.3 -0.3 -0.3 -0.3 +7.5 +5.5 +3.1 +2.5 +2.5 -2 -200 -500 +2 +200 +500 kV V V Ambient Operating Temperature -40 +85 °C Operating Junction Temperature -40 +150 °C Storage Temperature -65 Maximum Voltage Unit V PVIN1, PVIN2, VSW1P, VSW2P, VOUTP, VSW1FB, and VSW2FB AVIN, VOUTPFB, STTS, ISNS VREGOUT BGBYP, EN, VIN1P8, and CLK26M All other pins ESD Voltage, All Pins(1) Human Body Model Machine Model Charge Device Model THERMAL RATINGS +150 °C Peak Package Reflow Temperature(2),(3) +260 °C Maximum Power Dissipation (TA = 25 °C), PD(4) 940 mW Symbol Value Unit RΘJA(1) RΘJA(4) RΘJB 144 69 27 °C/W °C/W °C/W THERMAL RESISTANCE Parameter Thermal Resistance Junction to Ambient (Single Layer Board) Junction to Ambient (Four Layer Board) Junction to Board Notes: 1. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), the Machine Model (MM) (CZAP = 200 pF, RZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF). 2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 3. Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C for Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL). 4. For TJ=150 °C, TA =85 °C and RΘJA=69 °C/W, application with a 4-layer board. 900842 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS ELECTRICAL CHARACTERISTICS ELECTRICAL CHARACTERISTICS Table 3. System Electrical Characteristics TA = -40 °C to 85 °C, unless otherwise noted. Typical values are characterized at VPWR = 3.6 V and 25°C Parameter Symbol Min Typ Max Unit VIN 3.0 3.6 4.4 V VIN 2.8 3.6 4.7 V - 10 - VBGBYP - 1.2 - V V33 - 3.3 - V -4.0 - 5.0 % 0 0.7 1.4 A - 1.5 - - - 0.5 - - 700 - - 1.0 - 1.625 - GENERAL Typical Input Voltage Range Extended Input Voltage Range (5) Leakage Current μA ILEAK EN=0 Bandgap Voltage(6) BUCK/BOOST CONVERTER Output Voltage Output Voltage Accuracy Continuous Output Load Current(7) Short Circuit Output Current Limit(8) I33 ILIM33 PVIN1 = 3.6 V Transient Load Change(9) ΔI33 Soft Start Time tSS33 EN=1.8 V to STTS=0 Turn Off Time fSW A μs t33OFF EN=0 to STTS=1 Switching Frequency A ms MHz EN Input Voltage - Normal Mode 1.8 V EN Input Voltage - Low Power Mode 1.2 V LINEAR REGULATOR Output Voltage VREGOUT - 2.775 - V Output Voltage Accuracy VREGOUT -5.0 - 5.0 % IL 0 - 100 mA 100 - 200 -1.0 - 0.5 Load Current Maximum Short-circuit Output Current VIN>VIN-MIN, Short-circuit VREGOUT ILSC mA Load Regulation 1.0 mA < IL < 100 mA mV/mA Line Regulation 3.0 V < VIN< 4.4 V mV -25 - 25 Notes 5. The IC will operate below 3.0 V, but will not meet the specifications. 6. No external DC loading is allowed at the BGBYP pin. 7. The maximum output current of 1.4 A is specified for VIN=3.6 V, with the IC operating in Buck mode. 8. 9. The IC has an input peak current limit in which M1 is the current sense device (Figure 2). This maximum current is different than the output current if the IC is in Boost mode The maximum speed of change of a transient load should be 0.1 A/µs 900842 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS ELECTRICAL CHARACTERISTICS Table 3. System Electrical Characteristics (continued) TA = -40 °C to 85 °C, unless otherwise noted. Typical values are characterized at VPWR = 3.6 V and 25°C Parameter Symbol Min Typ Max Unit EXTERNAL COMPONENTS Output Inductor Output Inductor DCR Output Capacitor - Ceramic Input Capacitor - Ceramic L33 - 1.0 - μH L33DCR - - 55 mΩ CO33 - 22 μF CIN33 - 10 μF Internal Regulator Capacitor - Ceramic CCORE - 1.0 μF Bandgap Bypass Capacitor - Ceramic CBGBYP - 0.1 μF 900842 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS ELECTRICAL PERFORMANCE CURVES ELECTRICAL PERFORMANCE CURVES Figure 4. Switcher Efficiency vs. Output Current 900842 8 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The 900842 consists of an integrated switched-mode synchronous Buck-Boost DC/DC converter and its control circuit, a linear regulator, and a bandgap voltage reference. The 900842 is supplied from a single Lithium-Ion battery cell, and steps down or up an input voltage range of 2.8 - 4.7 V, to a fixed output voltage of 3.3 V. A high switching frequency of 1.625 MHz enables the use of small passive filter components, and improves the dynamic response of the converter. BUCK/BOOST CONVERTER The integrated Buck-Boost converter is used to generate the fixed output voltage of 3.3 V. The IC operates in Buck mode when VIN is greater that 3.3 V and in Boost mode otherwise. When in Buck mode, M1 is used as a high side FET, M2 is used as a low side synchronous rectifier FET, M4 is on, and M3 is open (Figure 2). When in Boost mode, M1 is on, M2 is open, M3 is the switching FET, and M4 is the synchronous rectifier FET. The IC transitions seamlessly between Buck and Boost mode following the variation in the input voltage, VIN. The Buck-Boost converter is compensated internally. There are 2 output pins that can be used to monitor the status of the IC: STTS - Status output pin, active low. STTS = 0 if the output voltage VOUTP is up STTS =1 if the IC is under thermal shutdown, IC is in current limit, or VOUTP is too low. ISNS - Current sense pin The ISNS pin voltage is proportional to the average output current. When PVIN = 3.6 V, a typical ratio is 2.084 V/A. Current Limiting A peak current limit circuit protects the converter during overload conditions. If the current through the PMOS power switch M1 exceeds the ILIM33 value, M1 will turn off and the converter will skip the next cycle. This forces the inductor current to be reduced to a safe value. The PMOS power switch M1 is turned on again and the cycle is repeated until the load current is reduced. Low Power Mode A Low Power Mode is provided in the IC to minimize system power dissipation at low loads. In Low Power Mode, the IC operates as an LDO, with a quiescent current of 1mA. To enter Low Power Mode, a voltage of 1.2 V must be applied to the EN pin. The Low Power Mode can only be entered after the Buck-Boost has started up in Normal Operation (EN = 1.8 V). LOW DROPOUT LINEAR REGULATOR The low dropout (LDO) linear regulator uses the bandgap as a reference and provides a low noise supply. The nominal regulator output voltage, VREGOUT, is 2.775 V and is designed for a steady state maximum current of 100 mA. The VREGOUT voltage will decrease when the load demands currents exceeding the current limit. 900842 Analog Integrated Circuit Device Data Freescale Semiconductor 9 FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION FUNCTIONAL PIN DESCRIPTION POWER SUPPLY INPUT VOLTAGE (PVIN1) ANALOG SUPPLY INPUT VOLTAGE (AVIN) This is the input voltage for the Buck-Boost DC/DC converter. Input decoupling/filtering is required for proper operation. Supply voltage for the Buck-or-Boost Controller and LDO regulator. POWER GROUND (PGND) ANALOG GROUND (AGND) Analog ground of the IC. Power Ground connection. OUTPUT VOLTAGE (VOUTP) BOOST GATE DRIVE SUPPLY (PVIN2) This pin is connected to the output pin, VOUTP. This is the 3.3 V output node. SWITCHING NODE 1 (VSW1P) This output pin is the switching node when the device operates in Buck mode. The inductor is connected between this pin and the VSW2P pin. SWITCHING NODE 2 (VSW2P) This output pin is the switching node when the device operates in Boost mode. The inductor is connected between this pin and the VSW1P pin. SWITCHING NODE 1 FEEDBACK (VSW1FB) Feedback voltage from Switching Node 1. This pin must be directly connected to the inductor terminal. SWITCHING NODE 2 FEEDBACK (VSW2FB) Feedback voltage from Switching Node 2. This pin must be directly connected to the inductor terminal. OUTPUT VOLTAGE POSITIVE FEEDBACK (VOUTPFB) This input must be connected to the positive end of the output capacitor. OUTPUT VOLTAGE NEGATIVE FEEDBACK (VOUTMFB) This input must be connected to the negative end (ground) of the output capacitor. LDO REGULATED OUTPUT (VREGOUT) 2.775 V LDO regulated output voltage. REFERENCE BYPASS CAPACITOR (BGBYP) Connect a 0.1 μF decoupling filter capacitor between this pin and GND. 1.8 V SUPPLY INPUT VOLTAGE (VIN1P8) 1.8 V supply for digital sub-circuits. 26 MHz CLOCK INPUT (CLK26M) A 26 MHz clock input reference signal. ENABLE (EN) Active high enable input signal to turn on the 3.3 V output. • EN = 1.8 V to enter Normal Operation Mode. • EN = 1.2 V to enter Low Power Mode. The Low Power Mode can only be entered after the BuckBoost has started up in Normal Operation. POWER GOOD STATUS SIGNAL (STTS) This is an active low output signal that indicates the status of the output voltage. This signal will be high if the IC is under thermal shutdown, IC is in current limit, or VOUTP is too low. CURRENT SENSE SIGNAL (ISNS) This output pin provides an analog voltage proportional to the average output current. 900842 10 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS FUNCTIONAL PIN DESCRIPTION TYPICAL APPLICATIONS VIN CBGBYP CIN33 BGBYP AVIN PVIN1 PVIN2 LDO Bandgap and Ref Regulator SM DC/DC Converter VREGOUT VOUTP Load CCORE VIN1P8 VOUTPFB Logic M4 M1 Buck or Boost Controller VSW1P VSW1FB Thermal Shutdown VSW2FB EN M3 M2 CLK26M CO33 L33 VSW2P STTS VOUTMFB ISNS AGND PGND Figure 5. 900842 Typical Applications TYPICAL CIRCUIT Figure 5, 900842 Typical Applications, shows the schematic for a typical application. A 1-µH inductor with saturation current rating over 2.5 A is recommended for the SM DC/DC converter. The inductor series DC resistance (DCR) should be less than 55 mohm to achieve good efficiency and a low drop-out voltage. If a smaller inductance is used, the 900842 may become unstable under line and load transients and the transient response time may be affected. The 900842 is designed for ceramic capacitor in its input and output filters. The input filter capacitor, CIN33, reduces the voltage ripple on VIN, by providing the AC current drawn to the M1 switch during the first part of each switching cycle. A 10 µF ceramic capacitor should be used for CIN33 as close as possible to the PVIN1 and PGND pins of the IC. The triangular AC component of the inductor current passes through the output filter capacitor, CO33, which reduces the output voltage ripple and maintains a constant output voltage during load and line transients. A 22 µF ceramic capacitor should be used for CO33 as close as possible to the VOUTP and PGND pins. A 100 nF ceramic capacitor should be used for CBGBYP as close as possible to the BGBYP and AGND pins. A 1.0 µF ceramic capacitor should be used for CCORE as close as possible to the VREGOUT and AGND pins. Ceramic capacitor types such as X5R and X7R are recommended. 900842 Analog Integrated Circuit Device Data Freescale Semiconductor 11 PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below. 36-PIN 98ASA00004D REVISION 0 900842 12 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (CONTINUED) 36-PIN 98ASA00004D REVISION 0 900842 Analog Integrated Circuit Device Data Freescale Semiconductor 13 REVISION HISTORY REVISION HISTORY REVISION DATE DESCRIPTION OF CHANGES 1.0 3/2010 • Initial Release 2.0 11/2010 • • Corrected format and typos Removed Bill of Materials and Board Layout sections 900842 14 Analog Integrated Circuit Device Data Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2010. All rights reserved. SC900842 Rev. 2.0 11/2010