Freescale Semiconductor, Inc. Automotive Selector Guide Making embedded systems better with robust reliable performance Quarter 3, 2015 SG187 Rev. 59 Contents PRODUCTS Sub category Analog and Mixed Signal Power Actuation - Low-side Switches Power Actuation - High-side Switches Power Actuation - H-Bridge and Motors Drivers Power Actuation - H-Bridge Stepper Motors Power Actuation - Pre-Drivers (High-side MOSFET Gate Drivers) Power Actuation - Squib Drivers Power Actuation - Powertrain Control and Engine Management Communication Transceivers - CAN Physical Interface Components Communication Transceivers - LIN, ISO-9141, J-1850 Physical Interface Components Communication Transceiver - Distributed Systems Interface (DSI) Components Millimeter Wave and Radar Anti-Lock Braking System Drivers and Switches - Configurable I/O System Basis Chip Battery Management - Battery Cell Controller Embedded MCU plus Power - S12 Mixed-Signal Analog MCUs S12 Mixed-Signal Analog MCUs 8-bit Intelligent Distributed Controllers Page 4 Page 5 Page 7 Page 8 Page 8 Page 8 Page 8 Page 11 Page 11 Page 12 Page 12 Page 13 Page 13 Page 13 Page 15 Page 15 Page 16 Page 16 Power Management Power Management - Linear Regulators Power Management - Switching Regulators Automotive Alternator Voltage Regulators Page 17 Page 17 Page 17 Sensors Pressure Sensors Barometric Absolute Pressure (BAP) and Manifold Absolute Pressure (MAP) Sensors Inertial Sensors Tire Pressure Monitoring Systems Page 18 Page 18 Page 19 Page 21 Access and Remote Control GPS Downconverter Page 22 Local Interconnect Network (LIN) Solutions LIN Software Products LIN Physical Layer Transceivers Page 23 Page 23 SG187 (Selector Guide) (3Q2015) – 2 PRODUCTS MCU Sub category 8-bit S08 MCUs S12 and S12X Families S12 MagniV Mixed-signal MCUs 56F8xxx Family Kinetis MCUs based on ARM® Technology MAC57Dxxx 32-bit ARM®-Based MCUs 64-bit S32V MCUs Based on ARM® Technology 32-bit MPC56xx and MPC57xx MCUs Built on Power Architecture® Technology Image Cognition Processors i.MX Applications Processors 32-bit Vybrid Controller Solutions SG187 (Selector Guide) (3Q2015) – 3 Page 25 Page 27 Page 30 Page 32 Page 32 Page 33 Page 35 Page 35 Page 40 Page 41 Page 42 Freescale Semiconductor Analog and Mixed-Signal Products The product categories range from Power Actuation and Communication Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad range of load control and drivers, including motor control. SMARTMOS—Freescale Semiconductor SMARTMOS technology allows designers to interface high-precision components with the harsh automotive environment. Cost-Effective—Ideally suited for rug automotive applications, SMARTMOS solutions offer a cost-effective blend of analog, digital, and robust power silicon that enables integrated, mixed signal, power control ICs. Functionality—SMARTMOS solutions implement traditional analog functions with smaller die size, and a modular process produces components with the minimum number of process steps for each circuit, minimizing overhead. Benefits—Freescale Semiconductor SMARTMOS technology brings a wide range of benefits to today’s designs, including component reductions, power capability, durability, efficiency, precision, high-performance analog, and robustness. Packaging - Freescale device may be offered in EPP and RoHS compliant packages; view the external web for specifics. For additional information, visit: Documentation, Tool, and Product Libraries www.freescale.com www.freescale.com/analog www.freescale.com/powermanagement www.freescale.com/productlongevity www.freescale.com/files/shared/doc/ prod_num_scheme/ANALOGPN.pdf Power Actuation — Low-side Switches (Solid State Intelligent Switches) Product Description No of Output s High-side or Lowside Continuous Current Each Output (A) RDS(on) (m) of Each Output Current Limitation (A) MC33800 Engine Control IC, with Eight Low-side Switches, Two Constant Current Low-side Switches and Six MOSFET gate pre-drivers 8 L 8 @ 0.35 2 @ 700 6 @ 1000 2 @ 6.0 6 @ 2.0 MC33810 Engine Control Integrated Circuit capable of driving a combination of four Low-side loads and four MOSFETs or IGBT gates Engine control power IC, with 3 Low-side drivers, one pre-driver, +5V pre-regulator, ISO-9141 physical interface and MCU watchdog circuit. (1.0 RDS(on)) Configurable Eight Output SPI Controlled Switch (0.8 RDS(on) Smart Six Output Switch with SPI and Parallel Input Control 4 L 1.0 100 3 L 2 @ 4.0 1 @ 1.5 8 H/L 8 MC33996 16 Output Hardware Low-side Switch with 24-bit Serial Input Control MC33999 16 Output Hardware Low-side Switch with 24-bit Serial Input Control and 8 Parallel Control MC33812 MC33879 MC33882 Current Limitation Standby Max (A) 30 Control1 Status/ Fault Reporting Protection Features Packaging Status SPI, Parallel SPI 54-pin SOICW Exposed Pad Production EVB 6.0 30 SPI, Parallel SPI Status Flags Open Load detect, Overcurrent protect, Overvoltage protect, Shorted Load detect, Undervoltage protect, Thermal protect Shorted Load detect, Thermal protect 32-pin SOICW Exposed Pad Production EVB 2 @ 200 1 @ 1000 2 @ 6.0 1 @ 2.0 2 @ 1000 1 @ 20 Parallel Parallel 32-pin SOICW Exposed Pad 0.35 550 1.2 25 SPI w/ 2 PWM SPI Overcurrent, Outputs Short to Battery, Overtemperature Protect Short-circuit, Current Limit, Temp Sense Production EVB Ref.Design Production EVB L 1.0 375 3.0 10 SPI SPI Short-circuit, Current Limit, Temp Sense 16 L 0.5 450 1.0 to 2.5 50 SPI SPI 16 L 0.5 450 1.0 to 2.5 50 SPI. Parallel SPI Short-circuit, Current Limit, Temp Sense, Open Load Short-circuit, Current Limit, Temp Sense, Open Load 30-pin HSOP, 32-pin SOICW Exposed Pad, 32-pin QFN Exposed Pad 32-pin SOICW 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. SG187 (Selector Guide) (3Q2015) – 4 32-pin SOICW Exposed Pad 54-pin SOICW Production Production EVB Production EVB Power Actuation — High-side Switches (Solid State Intelligent Switches) Product Description No of Outputs High-side or Lowside Maximum Current Each Output (A) RDS(on) (m) of Each Output Current Limitation (A) Current Control 1 Limitation Standby Max (A) 8 H/L 1.2 550 1.2 25 Status/Fault Reporting Protection Features SPI w/ 2 PWM SPI Short-circuit, Current Limit, Temp Sense Packaging Status MC33879 (1.0 RDS(on)) Configurable Eight Output SPI Controlled Switch MC12XS2 12 V Multipurpose Low RDS(on) eXtreme Switches MC33981 Single High-side Switch (4.0 m), with PWM, Protection and Diagnostics 1 H 40 4 100 5.0 Parallel Status Pin, Current Monitor, Temperature Over-current, Overtemperature, Short-circuit, Under-voltage Lock Out 16-pin PQFN Production MC33982 Self Protected 2.0 m Switch with Diagnostic and Protection 1 H 60 2 150 5.0 SPI and Parallel SPI Temp Sense, Over/Undervoltage, Shutdown, Overcurrent, Reverse Polarity, Current Recopy 16-pin PQFN Production EVB MC33984 Self Protected 4.0 m Switch with Diagnostic and Protection 2 H 30 4 100 5.0 SPI and Parallel SPI Temp Sense, Over/Undervoltage, Shutdown, Overcurrent, Reverse Polarity, Current Recopy 16-pin PQFN Production EVB MC33988 Self Protected 8.0 m Switch with Diagnostic and Protection 2 H 30 8 60 5.0 SPI and Parallel SPI Temp Sense, Over/Undervoltage, Shutdown, Overcurrent, Reverse Polarity, Current Recopy 16-pin PQFN Production EVB MC12XS3 12V Automotive Exterior Lighting Multichannel eXtreme Switches 24-pin PQFN Production EVB MC06XS3517 Penta High-side Switch (3 x 6m, 2 x 17 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver. 32-pin SOICW Production Exposed Pad EVB 5+1 H 2.8, 5.5 3 X 6, 2 X 17 48, 96 5.0 SPI and Parallel SPI Overcurrent, Overtemperature, Overvoltage, Undervoltage & Short-circuit protect MC07XS3200 Dual High-side Switch (2 x 7m), with PWM, Protection, Diagnostics and SPI Control 2 H 6.0 2X7 93 5.0 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit MC09XS3400 Quad High-side Switch (4 x 9m), with PWM, Protection, Diagnostics and SPI Control 4 H 6.0 4X9 89 5.0 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 24-pin PQFN Production EVB MC10XS3412 Quad High-side Switch (2 x 10 m, 2 x 12 m), with PWM, Protection, Diagnostics and SPI Control 4 H 6.0 2 x 10, 2 x 12 78 5.0 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 24-pin PQFN Production EVB MC10XS3425 Quad High-side Switch (2 x 10 m, 2 x 25m), with PWM, Protection, Diagnostics and SPI Control 4 H 6.0 2 X 10, 2 X 25 39, 78 5.0 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit MC10XS3435 Quad High-side Switch (2 x 12 m, 2 x 35 m), with PWM, Protection, Diagnostics and SPI Control 4 H 6.0 2 x 10, 2 x 35 78 5.0 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 24-pin PQFN Production EVB MC10XS3535 Penta High-side Switch (3 x 10 m, 2 x 35 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver. 5+1 H 2.8, 5.5 3x10, 2x35 44, 88 2.0 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 24-pin PQFN Production EVB MC15XS3400 Quad High-side Switch (4 x 15 m), with PWM, Protection, Diagnostics and SPI Control 4 H 6.0 15 78 5.0 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 24-pin PQFN Production EVB MC35XS3400 Quad High-side Switch (4 x 35 m), with PWM, Protection, Diagnostics and SPI Control 4 H 6.0 35 39 5.0 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 24-pin PQFN Production EVB MC35XS3500 Penta High-side Switch (5 x 35 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver. 5+1 H 2.8 35 39.5 2.0 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 24-pin PQFN Production EVB MC12XS6 External Automotive Lighting Multichannel Scalable eXtreme Switches SG187 (Selector Guide) (3Q2015) – 5 32-pin SOICW Production Exposed Pad 32-pin SOICW Production Exposed Pad EVB Power Actuation — High-side Switches (Solid State Intelligent Switches) (continued) Product No of Outputs High-side or Lowside Maximum Current Each Output (A) RDS(on) (m) of Each Output Current Limitation (A) Status/Fault Reporting Protection Features MC07XS6517 Penta High-side Switch (3 x 7 m2x 17 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver. 5+1 H 11, 5.5 3 x 17 2x7 100, 50 20 SPI Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 54-pin SOICW Production Exposed Pad EVB MC08XS6421 Quad High-side Switch (2 x 8 m2x 21 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver 4+1 H 11, 5.5 2 x 8.0 2 x 21.0 100, 50 20 SPI Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 32-pin SOICW Production Exposed PAD EVB MC17XS6400 Quad High-side Switch (4 x 17 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver 4+1 H 5.5 4 x 17 50 20 SPI Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 32-pin SOICW Production Exposed PAD EVB MC17XS6500 Penta High-side Switch (5 x 17 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver. 5+1 H 5.5 5 x 17 50 20 SPI Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 32-pin SOICW Production Exposed Pad EVB Dual High-side Switch (2 x 10 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver 2+1 H 9 2 x 10 85 20 SPI Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 32-pin SOICW Production Exposed Pad EVB MC10XS6225 Dual High-side Switch (1 x 10 m1 x 25 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver 2+1 H 9, 4.5 1 x 10 1 x 25 85, 40 20 SPI Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 32-pin SOICW Production Exposed Pad EVB MC10XS6325 Triple High-side Switch (2 x 10 m, 1 x 25 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver 3+1 H 9, 4.5 2 x 10 1 x 25 85, 40 20 SPI Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 32-pin SOICW Production Exposed Pad EVB MC25XS6300 Triple High-side Switch (3 x 25 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver 3+1 H 4.5 3 x 25 40 20 SPI Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 32-pin SOICW Production Exposed Pad EVB MC40XS6500 Penta High-side Switch (5 x 40 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver 5+1 H 3.9 5 x 40 35 20 SPI Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit 32-pin SOICW Production Exposed Pad EVB MC10XS6200 MC24XS4 Description Current Control 1 Limitation Standby Max (A) Packaging Status External Automotive Lighting Multichannel Scalable eXtreme Switches MC06XS4200 Dual High-side Switch (2 x 6 m), with PWM, Protection, Diagnostics and SPI Control (24 V) 2 H 9.0 2X6 30, 90 10 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit, Parallel operation 24-pin PQFN Production EVB MC10XS4200 Dual High-side Switch (2 x 10 m), with PWM, Protection, Diagnostics and SPI Control (24 V) 2 H 6.0 2 X 10 18, 55 10 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit, Parallel operation 24-pin PQFN Production EVB MC20XS4200 Dual High-side Switch (2 x 20 m), with PWM, Protection, Diagnostics and SPI Control (24 V) 2 H 3.0 2 X 20 9.0, 27 10 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit, Parallel operation 24-pin PQFN Production EVB MC22XS4200 Dual High-side Switch (2 x 22 m), with PWM, Protection, Diagnostics, and SPI Control (24 V) 2 H 3.0 2 X 22 9.0, 27 10 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit, Parallel operation 32-pin SOIC Exposed Pad Production EVB MC50XS4200 Dual High-side Switch (2 x 50 m), with PWM, Protection, Diagnostics, and SPI Control (24 V) 2 H 1.2 2 x 50 3.5, 11 10 SPI and Parallel SPI Fail-safe Mode, Overcurrent Shutdown, Overtemperature, Short-circuit, Parallel operation 32-Pin SOIC Exposed Pad Production EVB 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. SG187 (Selector Guide) (3Q2015) – 6 Power Actuation — H-Bridge and Motors Drivers Product MC33186 MC33879 MC33880 MC33886 MC33887 MC33899 MC33926 MC33931 MC33932 HB2000 HB2001 Description H-Bridge Driver (5.0 A) Main Characteristics Monolithic H-Bridge ideal for fractional horsepower DCmotor and bi-directional thrust solenoid control. Load can be PWM'ed up to 10 kHz 8-output hardware (1.0 RDS(on)) Configurable configurable, high-side/ lowEight Output SPI Controlled side switch with 16-bit serial Switch input control using SPI with up to 1.2 A current driving capability Configurable Eight Output SPI 8-output hardware Controlled Switch configurable, high-side/ lowside switch with 16-bit serial input control using SPI with up to 2.0 A current driving capability H-Bridge Driver (5.2 A) Monolithic H-Bridge ideal for fractional horsepower DCmotor and bi-directional thrust solenoid control. Load can be PWM'ed up to 10 kHz H-Bridge Driver with Sleep Mode Monolithic H-Bridge ideal for and current feedback (5.0 A) fractional horsepower DCmotor and bi-directional thrust solenoid control. Load can be PWM'ed up to 10 kHz Programmable H-Bridge Power H-Bridge with SPI based IC diagnostics and configurability designed to drive a DC motor in both forward and reverse shaft rotation under Pulse Width Modulation (PWM) of speed and torque 5.0 A Throttle Control H-Bridge H-Bridge power IC for DC servo motor control like engine throttle control. Load can be PWM’ed up to 20 kHz. 5.0 A Throttle Control H-Bridge H-Bridge power IC for DC servo motor control like engine throttle control. Load can be PWM'ed up to 11 kHz 5.0 A Throttle Control Dual HH-Bridge power IC for DC Bridge servo motor control like engine throttle control. Load can be PWM'ed up to 11 kHz 10 A H-Bridge, Programmable H-Bridge power IC for brushed Brushed DC Motor Driver DC motor control. Load can be controlled via parallel inputs as well as SPI with advanced diagnostic to meet ISO26262 functional safety standards 10 A H-Bridge, Programmable H-Bridge power IC for brushed Brushed DC Motor Driver DC motor control. Load can be controlled via parallel inputs as well as SPI with advanced diagnostic to meet ISO26262 functional safety standards No of RDS(on) (m) of Outputs Each Output Typical at 25 C 2 150 Current Limit Sleep Current Max Threshold Max (A) 7.8 — Control1 Status/Fault Reporting Protection Features Packaging Status Parallel Status Flag Short-circuit, Current Limit, Overtemperature, Undervoltage 20-pin HSOP Production 8 750 1.2 5 µA SPI w/2 PWM SPI Short-circuit, Current Limit, Overtemperature, Open load detection, Overvoltage 32-pin SOICW Production Exposed Pad EVB 8 550 2.0 5 µA SPI w/2 PWM SPI Short-circuit, Current Limit, Overtemperature, Open load detection, Overvoltage 32-pin SOICW Production EVB 2 120 7.8 — Parallel Status Flag Short-circuit, Current Limit, Overtemperature, Undervoltage 20-pin HSOP 2 120 7.8 50 A Parallel Status Flag Short-circuit, Current Limit, Overtemperature, Undervoltage 20-pin HSOP, Production 36-pin PQFN, EVB 54-pin SOICW Exposed Pad 2 — 10.6 145 A SPI and Parallel SPI Open Circuit detect, Undervoltage, Overtemperature Shutdown, Output Short-circuit Current Limit 30-pin HSOP Production 2 120 8.0 50 A Parallel Status Flag Output Short-circuit Protect, Overcurrent Limit, Overtemperature 32-pin PQFN Production EVB 2 120 8.0 50 A Parallel Status Flag 4 120 8.0 50 A Parallel Status Flag 2 — SPI selectable 5.1/6.7/8.4/ 10.3 50 A SPI, Parallel SPI, Status Flag Output Short-circuit Protect, 44-pin HSOP, Production Overcurrent Limit, Overtemperature 32-pin SOICW EVB with Exposed Pad Output Short-circuit Protect, 44-pin HSOP, Production Overcurrent Limit, Overtemperature 54-pin SOICW EVB with Exposed Pad Charge pump undervoltage, 32-pin PQFN 4Q 2015 overvoltage, and undervoltage on FRDM VPWR, short to ground and short to EVB VPWR for each output, open load, Planned temperature warning, and overtemperature shutdown 2 — SPI selectable 5.1/6.7/8.4/ 10.3 50 A SPI, Parallel SPI, Status Flag 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. SG187 (Selector Guide) (3Q2015) – 7 Charge pump undervoltage, overvoltage, and undervoltage on VPWR, short to ground and short to VPWR for each output, open load, temperature warning, and overtemperature shutdown 32-pin PQFN Production EVB 4Q 2015 FRDM EVB Planned Power Actuation — H-Bridge Stepper Motors Product Description MM908E626 Stepper Motor Control, Quad Half-Bridge with Embedded MCU and LIN for High Temperature TJ = 135 C Main Characteristics Voltage Regulator 5.0 V/60 mA, LIN Physical Layer with Selectable Slewrates Operating Voltage (V) 5.0 to 28 Packaging 54-pin SOICW Exposed Pad Status Production EVB (‘625) Power Actuation — Pre-Drivers (High-side MOSFET Gate Drivers) Product Description Main Characteristics Operating Voltage (V) Control1 5.0 to 36 Status Reporting Protection Features Packaging Status Parallel, SPI Output Drives High/Low-side, Drive Current 6 H, 2 mA (typ.) SPI 54-pin SOICW Exposed Pad Production EVB Parallel, SPI 4 L, 780 A (typ.) Parallel 2L, 4.0 A (typ.) 1L, 1.5 A (typ.) SPI, Status Flags Parallel 32-pin SOICW Exposed Pad 32-pin SOICW Exposed Pad n/a None Production EVB Production EVB Ref.Design Production EVB 8.0 to 58 4 non-invert CMOS, LSTTL logic Parallel, SPI Open Load detect, Overcurrent, Overvoltage, Shorted Load detect, Undervoltage, Thermal Shorted Load detect, Thermal Overcurrent, Outputs Short to Battery, Overtemperature Protect Overvoltage, Undervoltage 3 H, 3 L, 1.0 A (typ.) SPI Programmable Deadtime, Reverse Charge Injection 54-pin SOICW Exposed Pad Production EVB 8.0 to 58 Parallel, SPI 3 H, 3 L, 1.0 A (typ.) SPI Programmable Deadtime, Reverse Charge Injection 56-pin QFN Production EVB Regulation Voltage Operating Voltage (V) 7.0 to 35 4.75 to 5.25 Packaging Status 32-pin SOICW Production Ref. Design MC33800 Engine Control Integrated Circuit Engine control IC, with six MOSFET gate pre-drivers, eight low-side Switches, and two constant current low-side switches MC33810 Automotive Engine Control IC MC33812 Single cylinder Engine control IC. MC33883 Quad TMOS driver, for fuel injector Engine control IC with four MOSFET/IGBT gate drivers 4.5 to 36 and four low-side switches Engine control power IC, with 3 Low-side drivers, one pre4.5 to 36 driver, +5.0 V pre-regulator, ISO-9141 physical interface and MCU watchdog circuit. Quad TMOS driver, in H-Bridge configuration 5.5 to 28/55 MC33937 Three-Phase Field Effect Transistor Predriver GD3000 Three Phase Field Effect Transistor Predriver Triple High-side and Low-side FET pre-drivers, with parallel & SPI control and programmable deadtime (shootthrough protect). Triple High-side and Low-side FET pre-drivers, with parallel & SPI control and programmable deadtime (shootthrough protect) 20-pin SOICW 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Board. Power Actuation — Squib Drivers Product MC33797 Description Four Channel Squib Driver IC Main Characteristics Four-Channel High-side and Low-side 2.0 A FET Switches, Externally Adjustable FET Current Limiting, Adjustable Current Limit Range: 0.8 A to 2.0 A, 8-bit SPI for Diagnostics and FET Switch Activation, Diagnostics for High-side Safing Sensor Status Power Actuation — Powertrain Control and Engine Management Product Description Main Characteristics MC33800 Engine Control Integrated Circuit Engine control IC, with six MOSFET gate pre-drivers, eight Low-side Switches, and two constant current Lowside Switches. MC33810 Automotive Engine Control IC Engine control IC with four MOSFET/IGBT gate drivers and four Low-side Switches. MC33811 MC33812 Solenoid Monitor Integrated Circuit See Signal Conditioning Single cylinder Engine control IC MC33813 One Cylinder Small Engine Control IC 5 input solenoid monitoring to verify proper electrical and mechanical solenoid operation. Engine control power IC, with 3 Low-side drivers, one pre-driver, +5V pre-regulator, ISO-9141 physical interface and MCU watchdog circuit. Engine control analog power IC intended for one cylinder motorcycle and other small engine control applications. Includes ISO9141 communication interface. Peak Current Limit (A) 2 @ 6.0 6 @ 2.0 1 @ 2.8 1 @ 1.0 6.0 RDS(on) (m) 2 @ 700 6 @ 1000 1 @ 250 1 @ 1000 100 Control1 Operating Voltage (V) Packaging Status SPI, Parallel 5.0 to 36 54-pin SOICW Exposed Pad Production EVB SPI, Parallel 4.5 to 36 Production EVB — — SPI 10.5 to 15.5 32-pin SOICW Exposed Pad 16-pin SOICW 2 @ 6.0 1 @ 2.0 2@200 1@1000 Parallel 4.5 to 36 1 @ 3.0 1 @ 6.0 2 @ 2.4 1 @ .110 1 @ 400 1 @ 300 2 @ 1500 1 @ 20000 SPI, Parallel 6.0 to 18 SG187 (Selector Guide) (3Q2015) – 8 32-pin SOICW Exposed Pad 48-pin LFQP, Exposed Pad Production EVB Production EVB Ref.Design Production EVB Product Description MC33814 Two Cylinder Small Engine Control IC MC33816 Engine Control IC with Smart Gate Control PT2000 Programmable Solenoid Controller for Automotive/Truck Engine (Direct Injection) Control MC33899 Programmable H-Bridge Power IC MC33926 5.0 A Throttle Control H-Bridge MC33937 Three-Phase Field Effect Transistor PreDriver MC33975 22 input Multiple Switch Detect Interface with 32 mA Wetting Current and Wake-up See Signal Conditioning Main Characteristics Engine control analog power IC intended for two cylinder motorcycle and other small engine control applications. Includes ISO9141 communication interface. A 12-channel gate driver IC for automotive engine control applications. The IC consist of five external MOSFET high-side pre-drivers and seven external MOSFET low side pre-drivers. Also contains four independent and concurrent digital microcores The PT2000 is a programmable gate driver IC for precision solenoid control applications. The chip integrates six microcores used to control, seven external MOSFET high-side pre-drivers, eight external MOSFET low-side pre-drivers (two of them with higher switching frequency can be used for DC/DC converters), integrated end of injection detection, current measurement, and diagnostics and protection for both high-side and low-side. Designed to drive a DC motor in both forward and reverse shaft rotation under pulse-width modulation (PWM) of speed and torque. Can be controlled by SPI or parallel control lines. H-Bridge power IC for DC servo motor control like engine throttle control. Load can be PWM’ed up to 20 KHz Triple High-side and Low-side FET pre-drivers, with parallel & SPI control and programmable deadtime (shoot-through protect). 22 inputs contact monitoring (14 GND, 8 configurable), 4.0 mA or 32 mA pulse wetting current, low-power mode interrupt capability, wake-up. Can supply current to external sensors. Peak Current Limit (A) 2 @ 3.0 1 @ 6.0 2 @ 2.4 1 @ .110 RDS(on) (m) 2 @ 400 1 @ 300 2 @ 1500 1 @ 20000 Control1 Operating Voltage (V) Packaging Status SPI, Parallel 6.0 to 18 48-pin LFQP, Exposed Pad Production EVB SPI Parallel 9.0 to 16 64-pin LQFP Exposed Pad Production EVB - - - - SPI Parallel 5.0 to 36 80-pin LQFP 4Q 2015 EVB 15.0 90 SPI, Parallel 6.0 to 26.5 30-pin HSOP Production 8.0 120 Parallel 8.0 to 28 32-pin PQFN Production EVB — — SPI, Parallel 8.0 to 58 Production EVB — — SPI 5.5 to 26.5 54-pin SOICW Exposed Pad 32-pin SOICW Exposed Pad 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. SG187 (Selector Guide) (3Q2015) – 9 Production EVB Communication Transceivers — CAN Physical Interface Components Product Description CM0902 Dual High-Speed CAN Transceiver MC33897 Single-wire CAN MC33901 High-Speed CAN Transceiver Main Characteristics Bus Type and Standard Operating Voltage (V) Current Other Features Limitation Standby (A) Typ. Max. 15 CAN bus wake-up, 3.3 or 5.0 V MCU I/O, TXD dominant timeout The CM0902 is a dual high-speed CAN Dual CAN HS dual transceiver device, providing the physical wire interface between the CAN protocol controller of an MCU and the physical dual wire CAN bus. Both channels are completely independent, featuring CAN bus wake-up on each CAN interface, and TXD dominant timeout functionality Low or high (33.3 kbps or 83.3) kbps Single-wire CAN data rates, wake-up capability (GMW3089 v2.3 compatible) 4.5 to 5.5 6.0 to 27 45 60 Single CAN high-speed physical layer provides operation up to 2 Mbps and the physical interface between an MCU and the physical dual wires of the CAN bus. 4.5 to 5.5 - 5.0 CAN HS dual wire 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. SG187 (Selector Guide) (3Q2015) – 10 Regulator Control Output Waveshaping, Undervoltage lockout detect and loss of GND CAN bus wake-up. TXD dominant timeout, 3.3 or 5.0 V MCU I/O Control and Status Reporting1 Protection Features Packaging Status Parallel High system ESD spec. 14-pin SOICN Production EVB 2 Mode Control Pins Thermal shutdown, current limit 14-pin SOICN Production Parallel High system ESD spec. 8-pin SOICN Production EVB Communication Transceivers — LIN, ISO-9141, J-1850 Physical Interface Components Product Description MC33399 Local Interconnect Network (LIN) Physical Layer MC33660 ISO K Line Serial Link Interface MC33661 Main Characteristics Offers speed communication from 1.0 kbps to 20 kbps, and up to 60 kbps for Programming Mode. It supports LIN Protocol Specification 1.3. ISO9141 physical interface device Bus Type and Standard LIN Single-wire Operating Current Other Voltage Limitation Standby Features (V) (A) Typ. Max. 7.0 to 18 20 50 Wake-up input pin, control of external voltage regulator Control and Status Reporting1 Protection Features Packaging Status Parallel Current limitation, Thermal protection Output shortcircuit Thermal protection Current limitation, Thermal protection Current limitation, Thermal protection Overtemperature protection, Output shortcircuit Current limitation on RDTX+ and RDTXTermination and Termination verification of CSB_TX, SCLK_TX, DATA_TX, and CSB_RX, SCLK_RX, DATA_RX Overcurrent Outputs Short to Battery, Overtemperat ure Protect 8-pin SOICN Production EVB 8-pin SOICN Production EVB 8-pin SOICN Production EVB 8-pin SOICN Production EVB 14-pin SOICN Production 16-pin SOICN 1Q 2016 EVB 32-pin SOICW Production EVB Ref.Design ISO9141 8.0 to 18 — 50 Data rates up to 50 Kbps eLIN – Enhanced LIN Physical Layer Selectable slew rate for operations at (Local Interconnect Network) 10, 20, 100 kbps; bus short to ground fail-safe; excellent EMC behavior. LIN Single-wire 7.0 to 18 8.0 12 MC33662 LIN 2.1/SAE J2602-2 LIN Physical Layer Transceiver Single wire LIN supports normal baud rates of 10 kbps (J) or 20 kbps (L) and fast rate of 100 kbps LIN single wire, SAE J2602- 7.0 to 18 6.0 11 Compatibility with 5.0 V and 3.3 V micros, wake-up input control of external regulator Active bus waveshaping, EMI immunity, Local & Remote wakeup MC33663 LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer Transceivers Integrates two physical layer LIN bus transceivers. The devices offer baud rates of 10 and 20 kbps as well as 100 kbps for test/programming modes. LIN Single-wire, SAE J2602-2 7.0 to 18 12 36 Active bus waveshaping, EMI immunity, 2 wake-up input pins, Compatibility with 5.0 V and 3.3 V micros Parallel MC33664 Isolated Network High Speed Transceiver 2.0 Mbps isolated network communication rate, Dual SPI architecture for message confirmation, Robust conducted and radiated immunity with wake-up, 3.3 V and 5.0 V compatible logic thresholds, Engineered for 5.0 meter, 15 node system, Low sleep mode current with automatic bus wake-up, Ultra-low radiated emissions Dual wires 4.75 to 5.5 (VCC5) 3.1 to 5.5 (VIO) 30 50 3.0 V and 5.0 V compatible, low sleep mode current with automatic bus wake up, current limit protection SPI MC33812 Single cylinder Engine control IC Engine control power IC, with 3 Lowside drivers, one pre-driver, +5V preregulator, ISO-9141 physical interface and MCU watchdog circuit. ISO-9141 4.5 to 36 — — MCU watchdog timer, +5V pre-regulator for MCU, MCU power on RESET Parallel 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. SG187 (Selector Guide) (3Q2015) – 11 Serial Parallel Parallel Communication Transceiver — Distributed Systems Interface (DSI) Components Product MC33780 MC33781 Description Dual DSI Master with Differential Drive Quad DSI Master with Differential Drive MC33784 DSI Sensor Interface MC33789 Airbag System Basis Chip (IC) (SBC) MC33790 Distributed System Interface (DSI) Physical Interface (DSIP) DSI Sensor Interface MC33793 Main Characteristics Max Data Rate Bus Sw. Resistance, typ/max () Packaging Status 150 kbps Operating Temp Range (°C) -40 to +85 Bus controller for two differential DSI channels. SPI port for uC interface. Variable CRC generation and detection, thermal protection, frequency spreading. Bus controller for four differential DSI channels. Dual SPI ports for uC and safing interfaces. Variable CRC generation and detection, comprehensive fault detection, thermal protection, frequency spreading DSI slave device optimized as a sensor interface. Differential bus capability & dual bus switches for improved EMC performance, 2-channel 10-bit ADC, 5.0V regulated output, 3 configurable logic pins, CRC generation and checking. Air bag control module which monitors battery voltage, sensor status and supplies various voltages to the air bag system. Uses SPI for MCU communication. Uses PSI5 for satellite sensors communication. n/a Production 200 kbps -40 to +90 n/an/a n/a -40 to +150 3.0/6.0 16-pin SOICW 32-pin SOICW Exposed Pad 16-pin SOICN 125 kbps -40 to +125 n/a 64-pin LQFP Exposed Pad Dual current-limited waveshaped outputs, current sensing inputs, 3.3 V and 5.0 V 5 - 150 kbps -40 to +85 6.0 DSI slave device. 5.0 V regulated output, 4 configurable I/O pins (logic I/O or 8-bit ADC), fault tolerant, logic output high current buffer. n/a -40 to +125 4.0/8.0 16-pin SOICW 16-pin SOICN Production Packaging Status 6x6 mm BGA Production KITRADAR 2001EVM Production Production Production EVB (contact sales) Production Millimeter Wave and Radar Product MR2001 Description Multi-channel 77 GHz Radar Transceiver Chipset Main Characteristics Operating Temp Range (°C) TA= Ambient Temp TB= Backside of Die Temp TB TA -40 to +125 -— Scalable number of transmitter and receiver channels Anti-Lock Braking System Product Description Main Characteristics SB0400 Two Channels Motorcycle and Scooter ABS in the smallest ABS Package Integrates Safe switch, Valve Drivers, Wheel Speed Sensor Interface, Motor Pump predriver, and a warning lamp driver inside a small package 7x7 size, Low RDS(on) (160 mOhms) allowing heatsink removal SB0401 One Channel Motorcycle and Scooter ABS in the smallest ABS Package Integrates Safe switch, Valve Drivers, Wheel Speed Sensor Interface, Motor Pump predriver, and a warning lamp driver inside a small package 7x7 size, Low RDS(on) (160 mOhms) allowing heatsink removal Load Supply Voltage (V) Min. Max. 5.3 30 5.3 30 Other Features Low RDS(on) (160 mOhms), PWM up to 5 KHz, Low-side Drivers up to 5.0 A, Vehicle Speed Output, Diagnostic line, Supervision Low RDS(on) (160 mOhms), PWM up to 5 KHz, Low-side Drivers up to 5.0 A, Vehicle Speed Output, Diagnostic line, Supervision SG187 (Selector Guide) (3Q2015) – 12 Interface and Input Protection Features Packaging Control SPI Overcurrent, Open 48-pin Load, QFN-EP Overtemperature, VDS monitoring, Overvoltage, Undervoltage, Clock Failure, Watchdog SPI Overcurrent, Open 48-pin Load, QFN-EP Overtemperature, VDS monitoring, Overvoltage, Undervoltage, Clock Failure, Watchdog Status 4Q 2015 4Q 2015 Drivers and Switches — Configurable I/O Product Description Main Characteristics Switch Monitor Voltage (V) 0 to 64 Operating Voltage (V) Packaging Status 10.5 to 15.5 16-pin SOICW Production EVB -14 to 38 5.5 to 26 -14 to 40 -14 to 38/40 Production EVB 5.5 to 26.5 32-pin SOICW, 32-pin SOICW Exposed Pad 32-pin SOICW Exposed Pad Multiple switch detection interface designed to detect closing and opening of up to 22 switch contacts (14 GND, 8 configurable), programmable wetting current from 2.0 to 20 mA. 24 to 1 Analog Multiplexer. -14 to 38 V 4.5 to 36 32-pin SOICW Exposed Pad Production EVB Multiple switch detection interface designed to detect closing and opening of up to 33 switch contacts (21 GND, 11 configurable), programmable wetting current from 2.0 to 20 mA, 35 to 1 Analog Multiplexer -14 to 38 V 4.5 to 36 48-PIN LQFP-EP 1Q 2016 EVB Planned MC33811 Solenoid Monitor Integrated Circuit 5 input solenoid monitoring to verify proper electrical and mechanical solenoid operation. MC33972 22 input Multiple Switch Detect Interface with 16 mA Wetting Current and Suppressed Wake-up 22 input Multiple Switch Detect Interface with 32 mA Wetting Current and Wake-up 22 input Multiple Switch Detect Interface with programmable Wetting Current 33 Channel Multiple Switch Detection Interface with Programmable Wetting Current Multiple switch detection interface with suppressed wake-up designed to detect closing and opening of up to 22 switch contacts (14 GND, 8 configurable), wetting current of 2.0 mA or 16 mA. MC33975 MC33978 CD1030 22 inputs contact monitoring (14 GND, 8 configurable), 4.0 mA or 32 mA pulse wetting current, low-power mode interrupt capability, wake-up. Can supply current to external sensors. Production EVB System Basis Chip Product Description Main Characteristics MC33742 System Basis Chip with Enhanced High-Speed CAN (250K to 1Mbps) MC33789 Airbag System Basis Chip (SBC) with Air bag control module which monitors Power Supply and PSI5 Sensor battery voltage, sensor status and Interface supplies various voltages to the air bag system. Uses SPI for MCU communication. Uses PSI5 for satellite sensors communication. MC33889 System Basis Chip with Low-Speed Fault Tolerant CAN MC33903 Bus Type and Standard SBC, Dual VREG, Enhance HS CAN with CAN High-Speed dual wires Bus failure diagnostic capability, 4 wakeup inputs. Operating Voltage (V) 5.5 to 27 PSI5 5.2 to 20 CAN LowSpeed, dual wires 5.5 to 27 System Basis Chip (SBC)-Gen 2-with High speed CAN and 1 or 2 LIN physical High Speed CAN & LIN Interfaces interface. 5.0 or 3.3 V VDD regulator. CAN highspeed, dual wires, LIN single wire 5.5 to 27 MC33904 System Basis Chip (SBC)-Gen 2-with High speed CAN physical interface. 5.0 High Speed CAN Interface or 3.3 VDD and VAux regulators, w/current sharing CAN highspeed, dual wires 5.5 to 27 MC33905 System Basis Chip (SBC)-Gen 2-with High speed CAN & 1 or 2 LIN physical High Speed CAN & LIN Interfaces interfaces. 5.0 or 3.3 VDD and VAux regulators, w/current sharing. CAN highspeed, dual wires. LIN single wire 5.5 to 27 MC33907 Safe System Basis Chip with Buck and Boost DC/DC up to 800 mA CAN highspeed, dual wires. 5.6 to 40 Dual 5.0 V regulators LS CAN, 2 wake-up inputs Multiple switching and linear voltage regulators, built-in enhanced high speed CAN interface fulfills the ISO11898-2 and -5 standards. Control Current Other Features Protection Features Packaging Limitation and Standby Status (A) Reporting1 Typ Max 60 150 Low power SPI Current and thermal protection for 28-pin SOICW, modes, remote CAN and regulator 48-pin QFN and local wakeup capabilities Safing state SPI Safing state machine, Scrap 64-pin LQFP machine, 9 mode Exposed Pad switch input monitors, 2 config. high/low side drivers, Power-on-reset, watchdog timer, Squib energy reserve 60 100 Dual voltage SPI Fault tolerant 28-pin SOICW regulator, Watchdog, wakeup input, sleep and stop modes 15 35 Fail-safe state “Secured” Overcurrent, Overtemperature, 32-pin SOICW machine, SPI Short-circuit, protect Exposed Pad Configurable I/O, MUX - out, pin compatible with MC33905 15 35 Fail-safe state “Secured” Overcurrent, Overtemperature, 32-pin SOICW Exposed Pad machine, Short -circuit and undervoltage SPI Configurable I/O, detect MUX - out, pin compatible with MC33905 15 35 Fail-safe state “Secured” Overcurrent, Overtemperature, 32-pin SOICW machine, SPI Short -circuit and undervoltage Exposed Pad, Configurable I/O, detect 54-pin SOICW MUX - out, SAFE Exposed Pad output, Low power modes w/ INT and RST capability. 32 60 Safe Assure “Secured” Overcurrent, Overtemperature, 48-pin LQFP product SPI Over & Undervoltage detect Exposed Pad SG187 (Selector Guide) (3Q2015) – 13 Status Production EVB Production EVB (contact sales) Production EVB Production EVB Production EVB(‘905) Production EVB Production EVB Product Description Main Characteristics Bus Type and Standard Operating Voltage (V) Multiple switching and linear voltage regulators, built-in enhanced high speed CAN interface fulfills the ISO11898-2 and -5 standards. Two high speed CAN interfaces plus four LINs, compatible with specification 2.1 and SAEJ2602-2. Also contains 17 switch to ground inputs for switch detection. CAN highspeed, dual wires. 5.6 to 40 CAN highspeed, dual wires. LIN single wire 3.5 to 27 125 - LIN Single-wire 5.5 to 18 48 80 LIN Single-wire 5.5 to 18 48 80 LIN Single-wire 5.5 to 18 48 80 CAN High-Speed, dual wires 5.5 to 27 80 150 MC33908 Safe System Basis Chip with Buck and Boost DC/DC up to 1.5 A MC33909 System Basis Chip with CAN, LIN Multiple Switch-to-Ground Interface MC33910 System Basis Chip with High-side Drivers and LIN Physical Interface MC33911 System Basis Chip with DC Motor LIN 2.0 compatible, 5.0 V/60 mA LDO, Pre-driver and LIN Physical Interface 1 High-side driver & 2 Low-side drivers w/PWM, 2 analog/digital inputs System Basis Chip with DC Motor LIN 2.0 compatible, 5.0 V/60 mA LDO, Pre-driver and Current Sense and LIN 2 High-side drives & 2 Low-side drivers w/PWM, 4 analog/digital inputs Physical Interface. MC33912 MC33989 System Basis Chip with High-Speed CAN LIN 2.0 compatible, 5.0 V/60 mA LDO, 2 High-side drivers w/PWM, 1 analog/ digital input Dual 5.0 V regulators HS CAN, 4 wake-up inputs Current Other Features Limitation Standby (A) Typ Max 32 60 Safe Assure product 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. SG187 (Selector Guide) (3Q2015) – 14 Control and Status Reporting1 Protection Features Packaging Status “Secured” SPI Overcurrent, Overtemperature, Over & Undervoltage detect 48-pin LQFP Exposed Pad Production EVB Watchdog timer, Switched inputs wake-up, Failsafe mode SPI Overvoltage 64-pin LQFP Exposed Pad Production EVB Hall Sensor supply, Configurable Window Watchdog Configurable Window Watchdog Hall Sensor supply, Configurable Window Watchdog, Current Sense Dual voltage regulator, Watchdog, wakeup input, sleep and stop modes SPI Multiple wake-up sources, LDO Fault Detect, Low Voltage Reset 32-pin LQFP Production EVB (‘912) SPI Multiple wake-up sources, LDO Fault Detect, Low Voltage Reset Multiple wake-up sources, LDO Fault Detect, Low Voltage Reset 32-pin LQFP Production EVB (‘912) 32-pin LQFP Production EVB SPI SPI Current limitation, thermal 28-pin SOICW Production EVB Battery Management — Battery Cell Controller Product Description MC33771 Battery Cell Controller IC MC33772 Battery Cell Controller IC Main Characteristics 4.0 Mbps SPI or 2.0 Mbps Isolated Differential Communication, 14 cell voltage input channels, One current channel with Auto PGA and Coulomb Counter, 7 GPIO configurable as Temperature Sensor Inputs,14 onboard 300 mA balancing switches, 5.0 V @ 5.0 mA Output Reference Supply, Low power mode with monitoring and cell balance capability, I2C interface for external EEPROM, Automatic cell over/under voltage and over/under temperature detection routable to Fault Output pin, Hot plug capable, Fully compatible with the MC33772 for 6 cells 4.0 Mbps SPI or 2.0 Mbps Isolated Differential Communication, 6 cell voltage input channels, one current channel with Auto PGA and Coulomb Counter, 7 GPIO configurable as Temperature Sensor Inputs, 6 onboard 300 mA balancing switches, 5.0 V @ 5.0 mA Output Reference Supply, Low power mode with monitoring and cell balance capability, I2C interface for external EEPROM, Automatic cell over/under voltage and over/undertemperature detection routable to Fault Output pin, Hot plug capable, Fully compatible with the MC33771 for 14 cells Operating Voltage (V) 9.6 to 61.6 5.0 to 30 (SPI type) 7.0 to 30 (TPL type) Output Voltages Packaging Status 64-pin LQFPEP 1Q 2016 EVB Single chip ASIL C capable, Diagnostics of internal and external faults as open lines, shorted lines, and leakage currents, Diagnostic state routable to the Fault Output pin, Die overtemperature detection and protection 48-PIN LQFPEP 2Q 2016 EVB MCU Details Additional Information S12 16-bit core, 128 K/96 KBytes Flash, 6 KBytes RAM, Selectable Internal or external temp 4 K Bytes data Flash, ESCI, 16-bit 4 Channel Timer, sense, GPIO, including SPI functionality, Internal Clock Generator, BDM internal or external oscillator. Window Watchdog with Selectable Timing, Normal/Stop/Sleep/Crank Mode Ctrl. High Voltage Wake-up Inputs, S12Z MCU with 128 KB Flash, 8 KB RAM, 4 KB Four battery voltage measurements with EEPROM internal resistor dividers, and up to five direct voltage measurements for use with an external resistor divider. Measurement synchronization between voltage channels and current channels. Packaging 48-pin QFN, Exposed Pad Status Production EVB 48-pin QFN Exposed Pad Production EVB Ref. Design Cell balancing: 10 V Fault pin: 5.0 V GPIO: 5.0 V Cell balancing: 10 V Fault pin: 5.0 V GPIO: 5.0 V Protection Features Single chip ASIL C capable, Diagnostics of internal and external faults as open lines, shorted lines, and leakage currents, Diagnostic state routable to the Fault Output pin, Die overtemperature detection and protection Embedded MCU plus Power — S12 Mixed-Signal Analog MCUs Product MM912_637 Description Battery Sensor with LIN for 12 V Lead-acid Batteries MM9Z1_638 Battery Sensor with CAN and LIN MM912_P812 S12P MCU and Multifunctional Ignition and Injector Driver System In Package (SiP) Main Characteristics MCU References Simultaneous Battery voltage & current 16-bit MCU measurement with 16-bit sigma-delta CPU12_V1 ADC & IIR filter. Voltage Regulators: 2.5 V/10mA & 60mA, 5.0 V/80 mA. LIN 2.1 Physical Layer w/Selectable Slew rates and triggered wake-up, This is a fully integrated battery 16-bit MCU monitoring device. The device supports S12Z precise current measurement via an external shunt resistor. The MM9Z1_638 includes LIN 2.2 protocol and physical interface, and an MSCAN protocol controller, An engine control IC combining an MCU 16-bit MCU (S12P) and analog control die S12P (MC33812) intended for motorcycle and other single/dual cylinder small engine control applications. MM912_S812 S12XS MCU and Multifunctional An engine control IC combining an MCU Ignition and Injector Driver System In (S12XS) and analog control die Package (SiP) (MC33812) intended for motorcycle and other single/dual cylinder small engine control applications. 16-bit MCU S12XS The MCU S12P has 6 KB RAM, and flash memory size of 96 KB or 128 KB. The S12P family uses many of the same features found on the S12XS family, including error correction code (ECC) on flash memory, a separate data-flash module for diagnostic or data storage, a fast analog-to-digital converter (ATD), and a frequency modulated phase locked loop (IPLL) that improves electromagnetic compatibility (EMC). Analog functions consists of three 100 lead LQFP, integrated low side drivers, one preExposed Pad driver, a +5.0 V, voltage pre-regulator, an MCU watchdog circuit, an ISO 9141 KLine interface, and a parallel interface for MCU communication. The three low side drivers are provided for driving a fuel injector, a lamp or LED, and a relay, another injector or fuel pump. 100 lead LQFP, Analog functions consists of three The MCU S12XS has 8 KB or 12 KB RAM, and flash Exposed Pad integrated low side drivers, one prememory size of 128 KB or 256 KB. The S12XS family driver, a +5.0 V, voltage pre-regulator, an uses many of the same features found on the S12P MCU watchdog circuit, an ISO 9141 Kfamily, including error correction code (ECC) on flash memory, a separate data-flash module for diagnostic or Line interface, and a parallel interface for MCU communication. The three low side data storage, a fast analog-to-digital converter (ATD), drivers are provided for driving a fuel and a frequency modulated phase locked loop (IPLL) that improves the electromagnetic compatibility (EMC) injector, a lamp or LED, and a relay, another injector or fuel pump. performance. SG187 (Selector Guide) (3Q2015) – 15 Production Ref.Design Production Ref. Design S12 Mixed-Signal Analog MCUs Product MM912_634 Description Main Characteristics Integrated S12 MagniV Based Relay Cascaded dual Voltage Regulator 2.5 V/ Drivers with LIN 50 mA and 5.0 V/80 mA, LIN Physical Layer with Selectable Slew rates, Window Watchdog with Selectable Dual High-side and Dual Low Side Switches with Embedded S12 MCU + Power + LIN Power Features 7 High-side Switches, 2.5 Low-side Switches for relay drivel MCU Reference 16-bit MCU MCU Detail S12 16-bit Core, 32KB Flash, 2KB RAM, ESCI, Multi channel 10-bit ADC, 16-bit 4 Channel Timer, Internal Clock Generator Additional Information High Voltage Wake-up Inputs, Selectable Gain I-Sense, Battery Voltage Sense. Timing, Normal/Stop/Sleep Mode Control, Hall Supply of 18 V/30 mA Packaging 48-pin LQFP Exposed Pad Status Production EVB Additional Information 2/3 Pin Hall Sensor Input, Analog Input with Current Source, 40 V Rated Wake-up Input, Vsup, Chip Temp. and Current Sensing 2/3 Pin Hall Sensor Input, Analog Input with Current Source, 40 V Rated Wake-up Input, Vsup, Chip Temp. and Current Sensing Packaging 54-pin SOICW Exposed Pad Status Production 54-pin SOICW Exposed Pad Production Operational Amplifier, 2 x 40 V Rated Wake-up Inputs 54-pin SOICW Production EVB 3 x 2 Pin Hall Sensor Inputs with 54-pin SOICW Cyclic Wake-up Feature, Analog Exposed Pad Input with Current Source, Vsup, Chip Temp. and Current Sensing Vsup, Chip Temperature and 54-pin SOICW Exposed Pad Current Sensing Production EVB 8-bit Intelligent Distributed Controllers Product MM908E621 Description DC Motor/Mirror Control and LIN Mirror Control, Integrated Quad HalfBridge and Triple High-side with Embedded MCU and LIN Main Characteristics Voltage Regulator 5.0 V/60 mA, LIN Physical Layer with Selectable Slew rates, Window Watchdog, “Normal/Stop/ Sleep Mode “Control Power Features 2 x 275 m Half-Bridges; 2 x 750 m Half-Bridges; 1 x 185 m High-side; 2 x 440 m High-side; Switched 5.0 V Output (25 mA) MM908E622 DC Motor/Mirror Control and LIN Mirror Control, Integrated Quad HalfBridge, Triple High-side and EC Glass Driver with Embedded MCU and LIN Voltage Regulator 5.0 V/60 mA, LIN Physical Layer with Selectable Slew rates, Window Watchdog, “Normal/Stop/ Sleep Mode “Control 2 x 275 m Half-Bridges; 2 x 750 m Half-Bridges; 1 x 185 m High-side; 2 x 440 m High-side; Switched 5.0 V Output (25 mA) EC Glass Driver 1 x 7 High-side, 2 x 2.5 High-side Switches for Relay Control MM908E624 MM908E625 MM908E626 DC Motor Control Using Relays (for example, Window Lift, Sun Roof, and Power Seats), Triple High-side Switch with Embedded MCU + Power + LIN Mirror Control, Stepper Motor Control, Door Lock Quad Half-Bridge and Single High-side with Embedded MCU and LIN Voltage Regulator 5.0 V/50 mA, LIN Physical Layer with Selectable Slew rates, Window Watchdog with Selectable Timing, Normal/Stop/Sleep Mode Control Voltage Regulator 5.0 V/60 mA, LIN Physical Layer with Selectable Slew rates, Timeout Watchdog with Periodic Wake-up Feature, Normal/Stop Modes Stepper Motor Control, Quad HalfVoltage Regulator 5.0 V/60 mA, LIN Bridge with Embedded MCU and LIN Physical Layer with Selectable Slew rates. High Temperature use, TJ = 135×C MCU Reference 8-bit MCU HC908EY16 4 x 400 m Half-Bridges with Current Control; 1 x 600 m High-side; Switched 5.0 V Output (25 mA) 4 x 400 m Half-Bridges with Current Control; Switched 5.0 V Output (24 mA) SG187 (Selector Guide) (3Q2015) – 16 MCU Detail HC08 Core, 16K Flash, 512 Bytes RAM, ESCI, 8-Channel 10-bit ADC, Two 16-bit 2 Channel Timers, Internal Clock Generator Production EVB (‘625) FREESCALE SEMICONDUCTOR POWER MANAGEMENT PRODUCTS The Power Management products portfolio provides solutions for Linear and Switching voltage regulators. Hot Swap control and Power over Ethernet devices for use in applications ranging from Consumer and Industrial to Automotive. SMARTMOS — Freescale Semiconductor SMARTMOS technology allows designers to interface high-precision components with the harsh automotive environment. For additional information, visit: Documentation, Tool, and Product Libraries www.freescale.com www.freescale.com/analog www.freescale.com/powermanagement www.freescale.com/productlongevity Power Management — Linear Regulators Product MC33730 Description Switch Mode Power Supply with Multiple Linear Regulators and Power Sequencing Main Characteristics Bus Type and Standard Operating Voltage (V) n/a 4.5 to 28 Step-down Switching regulator (2.0 A), with 3 Programmable Linear Regulators (15 mA, 15 mA, 15 mA) and two 5.0 V Sensor supplies (100 mA, 100 mA). Current Limitation Standby (A) Typ Max 150 — Other Features Diagnostics1 Protection Features Programmable voltage regulator, power sequencing, adjustable OSC - Switcher None Reverse Battery Protect, Undervoltage and Overvoltage Lockout, Reset monitor signals for regulators (4) Packaging Status 32-pin SOICW Production EVB Packaging 32-pin SOICW Status Production EVB Packaging Status Die Production 1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards. Power Management — Switching Regulators Product MC33730 Description Switch Mode Power Supply with Multiple Linear Regulators and Power Sequencing Main Characteristics Step-down Switching regulator (2.0 A), with 3 Programmable Linear Regulators (15 mA, 15 mA, 15 mA) and 2 x 5.0 V sensor supply (100 mA, 100 mA) Operating Voltage (V) 4.5 to 28 Output Voltages 4.9 to 5.1 V, 2.0 to 3.3 V, 1.5 to 3.3 V, 1.0 to 5.0 V, 5.0 V Protection Features Reverse Battery Protect, Undervoltage and Overvoltage Lockout, Reset monitor signals for regulators (4) Automotive Alternator Voltage Regulators Product TC80310 Description An integrated circuit intended to regulate the output voltage of an automotive alternator. It supplies a current via a high-side MOSFET to the excitation coil of the alternator and provides an internal freewheeling diode. Main Characteristics Bus Type Operating Voltage Regulation Voltage High-side field driver, Internal freewheeling diode, Up to 8.0 A rotor current (excitation coil), Load response control (LRC), LIN interface, Set point voltage selectable LIN 1.3 8 to 27 150 Other Features Factory Selectable Features: LRC Rate, LRC disable RPM, Self start, Self start threshold, Alternator Pole pairs, Thermal Fault Threshold, Thermal Compensation Threshold, Phase Sensitivity, Phase Start Regulating RPM, Phase Stop Regulating RPM Note: Choice of 16 parametric fields may be specified by the customer. Contact sales for specific parameter combinations and part numbering. SG187 (Selector Guide) (3Q2015) – 17 Diagnostics Protection Features LIN communication Load Dump Protection, used for Electrical, Thermal protection, Mechanical and Thermal compensation Thermal fault reporting FREESCALE SEMICONDUCTOR AUTOMOTIVE SENSORS Freescale is a leading sensor supplier for automotive safety for airbags, Tire Pressure Monitoring Systems (TPMS), Electronic Stability Control (ESC) and for engine management with barometric absolute pressure (BAP) and manifold absolute pressure (MAP) applications.. Our Zero Defects process, Automotive Electronics Council (AEC) membership and functional safety with Safe Assure are critical in providing world-class quality solutions from entry-level to the high end. Applications — Freescale Semiconductor automotive sensors are designed for a variety of applications ranging from safety and performance to comfort and control. Our sensors are used in under-hood and in-cabin applications, and are compatible with Freescale analog product, power management and microcontroller families. For additional information, visit www.freescale.com/automotive Pressure Sensors Maximum Pressure Rating (kPa) Full Scale Span Voltage (Typical) (Vdc) Sensitivity (mV/kPa) Accuracy 0 C to 85 C (% of VFSS) Packaging Status MPX4115A 115 115 4.6 4.4 46 38 ±1.5 ±1.5 Super-Small Outline Package (SSOP) SSOP Available Available MPX4250A 250 250 4.7 4.7 20 19 ±1.5 ±1.4 SSOP SSOP Available Available Product MPXV5004 4 3.9 1000 ±2.5 SOP Available MPXV5010 10 4.5 450 ±5.0 SOP Available MPX5100 100 4.5 45 ±2.5 6-pin unibody package Available MPX5700 700 4.5 6.4 ±2.5 6-pin unibody package Available MPX5999 1000 4.5 4.5 ±2.5 6-pin unibody package Available MPXH6101 102 4.6 54 ±1.8 SSOP Available MPXV7007 7 4.0 286 ±5.0 SOP Available MPXV7025 25 4.5 90 ±5.0 SOP Available Barometric Absolute Pressure (BAP) and Manifold Absolute Pressure (MAP) Sensors Product Maximum Pressure Rating (kPa) Full Scale Span Voltage (Typical) (Vdc) Sensitivity (mV/kPa) Accuracy 0 C to 85 C (% of VFSS) Packaging Status Available MPXH6101 102 4.6 54 ±1.8 Super-Small Outline Package (SSOP) MPXA6115 115 4.6 45.9 ±1.5 SOP Available MPXAZ6115A 115 4.5 45.9 ±1.5 SOP Available Available MPXHZ6115A 115 4.5 45.9 ±1.5 SSOP MPXH6250A 250 4.7 20 ±1.5 SSOP Available MPXHZ6250 250 4.7 20 ±1.5 SSOP Available MPXH6300 300 4.7 16 ±1.8 SSOP Available MPXH6400 400 4.7 12 ±1.5 SSOP Available MPXHZ6400 400 4.7 12 ±1.5 SSOP Available SG187 (Selector Guide) (3Q2015) – 18 Inertial Sensors1 Product Sensing Direction Acceleration (±g) Sensitivity (mV/V/g) Sensitivity (count/g) Temperature Range Roll-Off Frequency Analog Digital Communication Packaging Status MMA1270KEG Z 2.5 g 150 — -40 C to +105 C 50 Hz Yes — — 16-pin SOIC Available MMA1250KEG Z 5g 80 — -40 C to +105 C 50 Hz Yes — — 16-pin SOIC Available Analog Sensors: MMA1220KEG Z 8g 50 — -40 C to +85 C 250 Hz Yes — — 16-pin SOIC Available MMA2240KEG X 7g 300 — -40 C to +125 C 50 Hz Yes — — 16-pin SOIC Available MMA2244KEG X 20 g 100 — -40 C to +125 C 400 Hz Yes — — 16-pin SOIC Available MMA2201KEG X 40 g 10 — -40C to +125 C 400 Hz Yes — — 16-pin SOIC Available MMA2202KEG X 50 g 8 — -40 C to +125 C 400 Hz Yes — — 16-pin SOIC Available MMA2204KEG X 100 g 4 — -40 C to +125 C 400 Hz Yes — — 16-pin SOIC Available MMA2300KEG X 250 g 1.6 — -40 C to +125 C 400 Hz Yes — — 16-pin SOIC Available MMA2301KEG X 200 g 2 — -40 C to +125 C 400 Hz Yes — — 16-pin SOIC Available MMA3201KEG XY 40 g 10 — -40 C to +125 C 400 Hz Yes — — 20-pin SOIC Available MMA3221KEG XY 50/20 g 40/100 — -40 C to +125 C 400 Hz Yes — — 20-pin SOIC Available MMA3204KEG XY 100/30 g 4/13 — -40 C to +125 C 400 Hz Yes — — 20-pin SOIC Available MMA3202KEG XY 100/50 g 4/8 — -40 C to +125 C 400 Hz Yes — — 20-pin SOIC Available Digital Sensors: MMA5106KW Z 60 g — 8 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available MMA5112KW Z 120 g — 4 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available MMA5124KW Z 240 g — 2 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available MMA5148KW Z 480 g — 1 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available MMA5206KW X 60 g — 8 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available MMA5212KW X 120 g — 4 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available MMA5224KW X 240 g — 2 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available MMA5248KW X 480 g — 1 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available MMA2612KW X 125 g — 4.096 -40 C to +125 C 400 Hz — Yes DSI 16-pin QFN Available MMA1618KW Z 187 g — 2.731 -40 C to +125 C 400 Hz — Yes DSI 16-pin QFN Available MMA2725W X 250 g — 2 -40 C to +125 C 400 Hz — Yes DSI3 QFN 6x6 mm 16-pin Available MMA2712W X 125 g — 4 -40 C to +125 C 400 Hz — Yes DSI3 Self Test Available MMA2737W X 375 g — 1.3 -40 C to +125 C 400 Hz — Yes DSI3 Self Test Available MMA2718W X 187 g — 2.7 -40 C to +125 C 400 Hz — Yes DSI3 Self Test Available MMA2702W X 25 g — 20.4 -40 C to +125 C 400 Hz — Yes DSI3 Self Test Available MMA1725W Z 250 g — 2 -40 C to +125 C 400 Hz — Yes DSI3 Self Test Available 1. Freescale Semiconductor reserves the right to modify product specifications and/or introduction dates without any further notice. The product parameters are typical values at VDD = 5.0 V and T = 25 C, unless otherwise specified. Additional sensitivity and expanded temperature ranges are available upon request. Consult your Freescale Semiconductor sales representative SG187 (Selector Guide) (3Q2015) – 19 Inertial Sensors1 (continued) Product Sensing Direction Acceleration (±g) MMA6255KEG XY 50/50 g MMA6852KW X 35 g Sensitivity (mV/V/g) Sensitivity (count/g) Temperature Range Roll-Off Frequency Analog Digital Communication Packaging Status — 9.76 -40C to +125 C 400 Hz — Yes SPI 16-pin QFN Available — 13.947 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available MMA6854KW X 75 g — 6.51 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available MMA6811KW XY 60/25 g — 8.192/20.479 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available MMA6813KW XY 50/50 g — 9.766/9.766 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available MMA6821KW XY 120/25 g — 4.096/20.479 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available MMA6823KW XY 120/60 g — 4.096/8.192 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available MMA6826KW XY 60/60 g — 8.192/8.192 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available MMA6852KW XY 120/120 g — 4.096/4.096 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available MMA6900KQ XY 3.5 g — 291.5 -40C to +105 C 50 Hz — Yes SPI 16-pin QFN Available MMA6901KQ XY 5g — 203.6 -40C to +105 C 50 Hz — Yes SPI 16-pin QFN Available 1. Freescale Semiconductor reserves the right to modify product specifications and/or introduction dates without any further notice. The product parameters are typical values at VDD = 5.0 V and T = 25 C, unless otherwise specified. Additional sensitivity and expanded temperature ranges are available upon request. Consult your Freescale Semiconductor sales representative. SG187 (Selector Guide) (3Q2015) – 20 Tire Pressure Monitoring Systems Product Product RF Transmitter Flash Frequency Protocols Supported Clock Type Timer Pressure Range Pressure Sensor FXTH870502DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 450 kPA FXTH870511DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 450 kPA FXTH8705116T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 450 kPA FXTH870902DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 900 kPA FXTH8709026T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 900 kPA FXTH870911DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 900 kPA FXTH8709126T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 900 kPA FXTH870912DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 900 kPA FXTH8709226T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 900 kPA FXTH871502DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA FXTH8715026T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM FXTH8715027T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA FXTH871511DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM FXTH8715116T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA FXTH8715117T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA 100 - 1500 kPA 100 - 1500 kPA X-axis Offset Package Temperature Status Description Pressure Z-axis Offset Accuracy Range Offset Accuracy Accuracy (0 °C <=TA<=70 (0 °C <=TA<=70 (0 °C <=TA<=70 °C) °C) °C) +/-7 kPa ±6g NA 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with ZAxis Accelerometer) +/-7 kPa ±6g ±4g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with XZ-Axis Accelerometer) +/-7 kPa ±3g ±3g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with XZ-Axis Accelerometer) +/-10 kPa ±6g NA 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with ZAxis Accelerometer) +/-10 kPa ±3g NA 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with ZAxis Accelerometer) +/-10 kPa ±5g ±4g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with XZ-Axis Accelerometer) +/-10 kPa ±3g ±3g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with XZ-Axis Accelerometer) +/-10 kPa ±6g ±4g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with XZ-Axis Accelerometer) +/-10 kPa ±3g ±3g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with XZ-Axis Accelerometer) +/-20 kPa ±6g NA 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with ZAxis Accelerometer) +/-20 kPa ±3g ±3g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with ZAxis Accelerometer) +/-17 kPa ±3g NA 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with ZAxis Accelerometer) +/-20 kPa ±5g ±4g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with XZ-Axis Accelerometer) +/-20 kPa ±3g ±3g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with XZ-Axis Accelerometer) +/-17 kPa ±3g ±3g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure Monitoring Sensor (with XZ-Axis Accelerometer) SG187 (Selector Guide) (3Q2015) – 21 FREESCALE SEMICONDUCTOR ACCESS AND REMOTE CONTROL PRODUCTS For additional information, visit: Documentation, Tool, and Product Libraries www.freescale.com Automotive Home Page www.freescale.com/automotive GPS Downconverter Product MRFIC1505A RF Freq (MHz) 1575.42 Supply Voltage Range (Vdc) 2.7 to 3.3 Supply Current (Typ) (mA) 28 Standby Current (mA) 3 Conversion Gain (typ) (dB) 105 SG187 (Selector Guide) (3Q2015) – 22 Packaging 48-pin LQFP (Case No 932) System Applicability GPS Documentation MRFIC1505 FREESCALE SEMICONDUCTOR LOCAL INTERCONNECT NETWORK (LIN) SOLUTIONS Freescale Semiconductor and LIN—As the only semiconductor member of the LIN consortium, Freescale Semiconductor has the industry’s most advanced range of components, software, tools, and support available. Cost Benefits from LIN—A LIN sub-bus system uses a single-wire implementation and self-synchronization, without a crystal or ceramic resonator, in the slave node. With these cost benefits, high-end comfort and convenience features no longer need to be limited only to top-of-the-line cars. Embedded Controllers—Since the LIN sub-bus is based on common UART/SCI interface hardware, the 8-bit 68HC08, and 16-bit S12 and S12X Families provide the industry’s broadest range of performance and features, affording designers the freedom to choose parts ideally suited to their needs. Advanced Integration with LIN—Microcontrollers will evolve in the LIN environment to integrate the voltage regulator, physical interface, and high-voltage I/O to provide space, cost, and reliability benefits. Freescale Semiconductor solutions provide this capability today. Software for LIN—Freescale Semiconductor is working closely with the leading LIN tool supplier to ensure a first class, seamless development and debug environment for Freescale Semiconductor LIN products. For additional information, visit: Local Interconnect Network (LIN) Home Page www.lin-subbus.org Automotive Home Page LIN Software Products Product LIN master LIN slave Operating system 68HC05 n/a Available n/a 68HC08 Available Available Available S08 Available Available Available S12 Available Available Available S12X Available Available Available LIN Physical Layer Transceivers Product MC33399 MC33661 MC33662 Description Main Characteristics Bus Type and Standard Protection Features Operating Voltage (V) See Network Transceivers — LIN, ISO-9141, J-1850 Physical Interface Components See Network Transceivers — LIN, ISO-9141, J-1850 Physical Interface Components See Network Transceivers — LIN, ISO-9141, J-1850 Physical Interface Components SG187 (Selector Guide) (3Q2015) – 23 Current Limitation Standby (A) Typ Max Other Features Control and Status Reporting Packaging Status MCU CHOICES BY APPLICATION Application Microcontroller Transmission, Engine Control and Management Interfaces MPC5674F, MPC5673F, MPC563xM, MPC5644A, MPC5643A, MPC5642A, MPC5746M, MPC5777M, S12XE, S12P, S12G Hybrid and Electric Auxiliaries MPC5674F, MPC5673F, MPC563xM, MPC5644A, MPC5643A, MPC5642A, MPC5744P, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC55748G, MPC5746M, S12G Watchdog S12G, S12P, S08QD4, S08SG, S08AW, S08SC4, S08RN High Temperature MPC5744P, S12G, S08SG Body Control Module and Gateway MPC5668x, MPC560xB, MPC560xD, MPC564xB/C, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, S12G, S12XE, KEA HVAC, Lighting, Seats, Window Lift, Doors, Sun Roof MPC560xB, MPC560xD, S12XS, S12P, S12G, S12VR, S12ZVFP, S08D, S08AW, S08EL, S08SG, S08SL, S08MP16, S08SC4, S08RN, KEA Body Motor Control S12G, S12VR, S08MP16, S08RN, KEA Infotainment all i.MX, SVFxxxR, MAC57D5xx, KEA Telematics i.MX251, i.MX281, i.MX53, i.MX351, i.MX 6S1, i.MX 6U1, MAC57D5xx Instrument Cluster MPC560xS, i.MX534, i.MX 6S1, i.MX 6U1, SVFxxxR, S12H, S12XH, S12XHY, S12ZVFP, S12ZVH, S12ZVY S08LG, MAC57D5xx Head-Up-Display MAC57D5xx Multi-function Display MAC57D5xx Braking Systems MPC564xL, MPC560xP, MPC5744P, S12XE, S12XS, KEA Electronic Power Steering MPC564xL, MPC560xP, MPC5744P, S12G Tire Pressure Monitoring System MPC560xB, MPC5668G, S12XE, S12XS, S08D, S08RN Semi-Active Suspension MPC564xL, MPC5744P Airbag MPC560xP, MPC5744P, S12XF, S12XE, S12XS, S08SG, KEA Electronic Stability Control MPC564xL, MPC560xP, MPC5744P Lane Departure i.MX534, MPC567xK, i.MX 6S4, i.MX 6U4, i.MX 6D4, i.MX 6Q4, MPC577xK Advanced Cruise Control MPC564xL, MPC567xK, MPC5744P, MPC577xK, SCP2201, SCP2207 Precrash, Blindspot Detection, Backup Warning MPC564xL, MPC567xK, MPC5744P, MPC5604E, MPC577xK, S12ZVFP, S08RN Ethernet MPC560xS, MPC5668x, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, MPC5746M, MPC577xK, all i.MX FlexRay (tm) MPC5668x, MPC564xL, MPC560xP, MPC5674F, MPC5673F, MPC5644A, MPC5643A, MPC5642A, MPC5744P, MPC5748G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, MPC5746M MPC5642A, MPC577xK, S12XF CAN MPC5644A, MPC5643A, MPC5642A, MPC5744P, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, MPC5746M, MPC577xK all S12(X), S08D, KEA LIN MPC5644P, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, MPC577xK, S12P, S12XS, S12XE, S12G, S12X, S12VR64, S08SG, S08EL, S08AW, S08D, S08SL,S08SC4, S08RN, KEA NOTE: 32-bit in plain, 16-bit in bold, 8-bit in italics SG187 (Selector Guide) (3Q2015) – 24 S08 8 - BIT MICROCONTROLLERS S08 Core Technology — Optimized for extreme operating economy with a number of lowpower options, Freescale’s S08 core is particularly attractive for automotive applications. Multiple stop modes, along with wait and standby modes, will help achieve new thresholds in low-power performance under a variety of operating conditions. The S08 core allows efficient, compact, modular coding with full 16-bit stack-pointer and stack-relative addressing, which permit various instruction sizes and enable memory interface in multiple mechanisms and addressing modes. The object code is also compatible with Freescale’s legacy HC05 and HC08 cores. S08 Family Benefits — Freescale’s S08 families help save cost, reduce board space, increase performance and improve quality through extensive on-chip integration. No longer are external components required, such as an external crystal, LVI circuit, voltage regulator, I/O mux, watchdog circuit or EEPROM. With on-chip emulation and debug, changes can be made in application and in real-time, reducing development time. Also, with the S08 CPU running at 40 MHz, MCUs are able to quickly accomplish a task and go back to sleep. Quick execution translates into power savings, which allows customers to add more embedded content while staying within their power budgets. 8-bit S08 MCUs Device Bus Frequency Flash RAM EEPRO M CAN UART SPI I2C SLIC Analog (ADC) Timer Clock Additional Features Operating Voltage Temp. Range1 Package Options In Production S08DZ 200 MHz Up to Up to 8 128 KB KB Up to 2 KB 1 2xSCI Up to 2 Up to 2 — Up to 24-CH, 12-bit, 2 com Up to 12-CH MCG Watchdog OSC/Timer, COP, BDM, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP, 64 LQFP, 100 LQFP S08DV 200 MHz Up to Up to 6 128 KB KB — 1 2xSCI Up to 2 Up to 2 — Up to 24-CH, 12-bit, 2 com Up to 12-CH MCG Watchdog OSC/Timer, COP, BDM, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP, 64 LQFP, 100 LQFP S08DN 200 MHz Up to 60 KB Up to 2 KB Up to 2 KB 1xSCI 1 1 — Up to 16-CH, 12-bit, 2 com Up to 6-CH + 2CH MCG Watchdog OSC/Timer, COP, BDM, Temp Sensor 2.7 to 5.5 C, V, M 32 LQFP, 48 LQFP, 64 LQFP S08AW 200 MHz Up to 60 KB Up to 2 KB — 2xSCI 1 1 — Up to 16-CH, 10-bit Up to 8-CH ICG KBI, ICE, BDM, Temp Sensor 2.7 to 5.5 C, V, M 48 QFN, 44 QFP, 32 LQFP, 64 QFP, 64 LQFP, 44 LQFP S08EL 200 MHz Up to 32 KB 1 KB Up to 512 B 1xSCI 1 1 1 Up to 16-CH, 10-bit, 2 com 4-CH + 2-CH ICS LIN Auto-Baud/Synch, Watchdog OSC/Timer, BDM, Temp Sensor 2.7 to 5.5 C, V, M 28 TSSOP, 20 TSSOP S08SL 200 MHz Up to 16 KB 512 B Up to 256 B 1xSCI 1 1 1 Up to 16-CH, 10-bit, 1 com 2-CH + 2-CH ICS LIN Auto-Baud/Synch, Watchdog OSC/Timer, BDM, Temp Sensor 2.7 to 5.5 C, V, M 28 TSSOP, 20 TSSOP S08SG 200 MHz Up to 32 KB Up to 1 KB — 1xSCI 1 1 — Up to 16-CH, 10-bit, 1 com Up to 2-CH + 2CH ICS Watchdog OSC/Timer, COP, BDM, POR, KBI, Temp Sensor 2.7 to 5.5 C, V, M, W 28 TSSOP, 20 TSSOP, 16 TSSOP, 8 SOIC S08SC4 200 MHz 4 KB 256 B — 1xSCI 1 1 — Up to 8-CH, 10-bit Up to 2-CH + 2CH ICS Watchdog OSC/Timer, COP, BDM, Temp Sensor 4.5 to 5.5 C, V, M 16 TSSOP S08LG 200 MHz Up to 32 KB 2 KB — 1xSCI 1 1 — Up to 16-CH, 12-bit Up to 2-CH + 6CH ICS Up to 37x8/41x4 LCD Driver, Watchdog OSC/Timer, RTC, BDM, Temp Sensor 2.7 to 5.5 C, V 80 LQFP, 64 LQFP, 48 LQFP S08MP 200 MHz 16 KB 1 KB — 2xSCI 1 1 — 13-CH, 12-bit, 3 com 6-CH + 2-CH, 16-bit Flex Timer w/PWM Functions ICS MTIM, RTC, COP, CRC, BDM, 5-bit DAC (3x), Temp Sensor 2.7 to 5.5 C, V, M 48 LQFP SG187 (Selector Guide) (3Q2015) – 25 8-bit S08 MCUs (continued) Device UART SPI I2C SLIC Analog (ADC) Timer Clock Additional Features Operating Voltage Temp. Range1 Package Options In Production Up to 256 B 1xSCI 1 1 — Up to 16-CH, 12-bit Up to 6-CH + 2CH + 2-CH ICS TSI, Watchdog, BDM, RTC Analog Comparator 2.7 to 5.5 C, V, M 64, 48, 32 LQFP 20, 16 TSSOP — Up to 3 Up to 2 Up to 1 — 4-CH, 10-bit 2-CH + 1-CH ICS Watchdog OSC/Timer, BDM, Temp Sensor 2.7 to 5.5 C, V, M 8 SOIC Bus Frequency Flash RAM EEPRO M S08RN 200 MHz Up to 60 KB Up to 4 KB S08QD 8 MHz Up to 4 KB Up to 256 B CAN 1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40°C to +140 °C, W = -40 °C to +150 °C SG187 (Selector Guide) (3Q2015) – 26 S12 AND S12X 16-BIT MICROCONTROLLERS Freescale has a wide range of 16-bit products to offer automotive designers. S12 and S12X MCUs provide high-performance 16-bit control functionality. The S12X MCUs feature the innovative XGATE module, designed specifically to handle interrupt events without CPU intervention. As a result, the S12X controller has the high-performance capabilities you would normally expect of a 32-bit controller. S12 MagniV mixed-signal MCUs extend the S12 portfolio and offer the right blend of digital programmability and high precision analog in highly-integrated packages. For additional information, visit: Freescale Semiconductor Documentation, Tool, and Product Libraries www.freescale.com Automotive Home Page www.freescale.com/automotive 16-bit Microcontrollers Home Page www.freescale.com/16BIT S12 and S12X Families Device Bus Frequency Flash RAM Data EEPROM XGATE Flash MPU S12XEP100 50 MHz 1 MB 64 KB — 4 KB S12XEP768 50 MHz 768 KB 48 KB — 4 KB S12XEQ512 50 MHz 512 KB 32 KB — 4 KB S12XEQ384 50 MHz 384 KB 24 KB — S12XET512 50 MHz 512 KB 32 KB S12XET384 50 MHz 384 KB S12XET256 50 MHz S12XEG384 ECC FlexRa y CAN SCI SPI I2C Analog (ADC) PWM Motor SSD ECT Timer PIT Package Options In Production 5 8 3 2 2x16-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit 8-CH, 16-bit 8-CH — 25 3.13 to 5.5 C, V, M 112 LQFP, 144 LQFP, 208 MAPBGA 5 8 3 2 2x16-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit 8-CH, 16 -bit 8-CH — 25 3.13 to 5.5 C, V, M 112 LQFP, 144 LQFP, 208 MAPBGA 4 6 3 2 2x12-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit 8-CH, 16-bit 8-CH — 25 3.13 to 5.5 C, V, M 80 LQFP, 112 LQFP, 144 LQFP 4 KB 4 4 3 1 2x12-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit — 4-CH — 25 3.13 to 5.5 C, V, M 80 LQFP, 112 LQFP, 144 LQFP — 4 KB 3 6 3 2 24-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit — Up to 4-CH — 25 3.13 to 5.5 C, V, M 80 QFP, 112 LQFP, 144 LQFP 24 KB — 4 KB 3 6 3 2 24-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit — Up to 4-CH — 25 3.13 to 5.5 C, V, M 80 QFP, 112 LQFP, 144 LQFP 256 KB 16 KB — 4 KB 3 4 3 1 2x12-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit — 4-CH — 25 3.13 to 5.5 C, V, M 80 LQFP, 112 LQFP, 144 LQFP 50 MHz 384 KB 24 KB — 4 KB 2 6 3 2 24-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit — Up to 4-CH — 25 3.13 to 5.5 C, V, M 80 QFP, 112 LQFP, 144 LQFP S12XEG256 50 MHz 256 KB 16 KB — 4 KB 2 4 3 1 16-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit — Up to 4-CH — 25 3.13 to 5.5 C, V, M 112 LQFP S12XEG128 50 MHz 128 KB 12 KB — 2 KB 2 2 2 1 16-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit — Up to 2-CH — 25 3.13 to 5.5 C, V, M 80 QFP, 112 LQFP S12XEA256 54 MHz 256 KB 16 KB — 4 KB 3 2 3 1 8-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit — Up to 8-CH — 25 3.13 to 5.5 C, V, M 80 QFP S12XEA128 50 MHz 128 KB 12 KB — 2 KB 2 2 2 1 12-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit — Up to 8-CH — 25 3.13 to 5.5 C, V, M 80 QFP S12XES384 55 MHz 384 KB 24 KB — 4 KB 1 2 1 1 16-CH, 12-bit 8-CH, 8-bit — — 8-CH, 16-bit — Up to 8-CH — 25 3.13 to 5.5 C, V, M 80 QFP, 112 LQFP, 144 LQFP S12GA128 25 mhZ 128 KB 8 KB — 4 KB — — — 1 3 3 — 12-CH, 12-bit 8-CH, 8bit — — — 8-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M 48 LQFP, 64 LQFP, 100 LQFP, S12GA96 25 mhZ 96 KB 8 KB — 4 KB — — — 1 3 3 — 12-CH, 12-bit 8-CH, 8bit — — — 8-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M 48 LQFP, 64 LQFP, 100 LQFP, S12GA64 25 mhZ 64 KB 4 KB — 2 KB — — — 1 2 2 — 12-CH, 12-bit 6-CH, 8bit — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M, W 48 LQFP, 64 LQFP S12G64 25 mhZ 64 KB 4 KB — 2 KB — — — 1 2 2 — 12-CH, 10-bit 6-CH, 8bit — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M, W 32 LQFP, 48 LQFP, 64 LQFP SG187 (Selector Guide) (3Q2015) – 27 LCD KWU EBI Operating Voltage Temp. Range1 S12 and S12X Families (continued) Device Bus Frequency Flash RAM Data EEPROM XGATE Flash MPU ECC FlexRa y CAN SCI SPI I2C Analog (ADC) PWM Motor SSD ECT Timer PIT Operating Voltage Temp. Range1 Package Options In Production S12GA48 25 mhZ 48 KB 4 KB — 1.5 KB — — — 1 2 2 — 12-CH, 12-bit 6-CH, 8bit — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M, W 48 LQFP, 64 LQFP S12G48 25 mhZ 48 KB 4 KB — 1.5 KB — — — 1 2 2 — 12-CH, 10-bit 6-CH, 8bit — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M, W 32 LQFP, 48 LQFP, 64 LQFP S12GNA48 25 mhZ 48 KB 4 KB — 1.5 KB — — — — 2 2 — 12-CH, 12-bit 6-CH, 8bit — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M, W 48 LQFP, 64 LQFP S12GN48 25 mhZ 48 KB 4 KB — 1.5 KB — — — — 2 2 — 12-CH, 10-bit 6-CH, 8bit — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M, W 32 LQFP, 48 LQFP, 64 LQFP S12GNA32 25 mhZ 32 KB 2 KB — 1 KB — — — — 1 1 — 8-CH, 12-bit 6-CH, 8bit — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M, W 48 LQFP S12GN32 25 mhZ 32 KB 2 KB — 1 KB — — — — 1 1 — 8-CH, 12-bit 6-CH, 8bit — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M, W 20 TSSOP, 32 LQFP, 48 LQFP, 48 QFN S12GNA16 25 mhZ 16 KB 1 KB — 512 B — — — — — 1 1 — 8-CH, 12-bit 6-CH, 8bit — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M, W 48 LQFP S12GN16 25 mhZ 16 KB 1 KB — 512 B — — — — 1 1 — 8-CH, 10-bit 6-CH, 8bit — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M, W 20 TSSOP, 32 LQFP, 48 LQFP, 48 QFP S12G192 25 MHz 192 KB 11 KB — 4 KB — — — 1 3 3 — 16-CH, 10-bit 8-CH, 8-bit — — — 8-CH, 16-bit — — — — 3.13 to 5.5 M 20 TSSOP, 32 LQFP, 48 LQFP, 48 QFN, 64 LQFP, 100 LQFP S12G240 25 MHz 240 KB 11 KB — 4 KB — — — 1 3 3 — 16-CH, 10-bit 8-CH, 8-bit — — — 8-CH, 16 -bit — — — — 3.13 to 5.5 M 20 TSSOP, 32 LQFP, 48 LQFP, 48 QFN, 64 LQFP, 100 LQFP S12GN32 25 MHz 32 KB 2 KB — 1 KB — — — — 1 1 — 8-CH, 10-bit 6-CH, 8-bit — — — 6-CH, 16-bit — — — — 3.13 to 5.5 M 20 TSSOP, 32 LQFP, 48 LQFP, 48 QFN, 64 LQFP, 100 LQFP S12G128 25 MHz 128 KB 8 KB — 4 KB — — — — 1 3 3 — 12-CH, 10-bit 8-CH, 8-bit — — — 8-CH, 16-bit — — — — 3.13 to 5.5 M 48 LQFP, 64 LQFP, 100 LQFP S12G96 25 MHz 96 KB 8 KB — 3 KB — — — — 1 3 3 — 12-CH, 10-bit 8-CH, 8-bit — — — 8-CH, 16-bit — — — — 3.13 to 5.5 M 48 LQFP, 64 LQFP, 100 LQFP S12XS256 40 MHz 256 KB 12 KB 8 KB — 1 2 1 — 16-CH, 12-bit 8-CH, 8-bit — — — 8-CH, 16-bit 4-CH — 18 3.13 to 5.5 C, V, M, J 64 LQFP, 80 QFP, 112 LQFP, KGD S12XS128 40 MHz 128 KB 8 KB 8 KB — 1 2 1 — 16-CH, 12-bit 8-CH, 8-bit — — — 8-CH, 16-bit 4-CH — 18 3.13 to 5.5 C, V, M, J 64 LQFP, 80 QFP, 112 LQFP, KGD S12XS64 40 MHz 64 KB 4 KB 4 KB — 1 2 1 — 16-CH, 12-bit 8-CH, 8-bit — — — 8-CH, 16-bit 4-CH — 18 3.13 to 5.5 C, V, M, J 64 LQP, 80 QFP, 112 LQFP, KGD S12XF512 50 MHz 512 KB 32 KB — 4KB 1 2 2 — 16-CH, 12-bit 6-CH, 15-bit — — — 8-CH, 16-bit 4-CH — 11 3.13 to 5.5 C, V, M 112 LQFP, 64 LQFP S12XF384 50 MHz 384 KB 24 KB — 4KB 1 2 2 — 16-CH, 12-bit 6-CH, 15-bit — — — 8-CH, 16-bit 4-CH — 11 3.13 to 5.5 C, V, M 112 LQFP, 64 LQFP S12XF256 50 MHz 256 KB 20 KB — 2 KB 1 2 2 — 16-CH, 12-bit 6-CH, 15-bit — — — 8-CH, 16-bit 4-CH — 11 3.13 to 5.5 C, V, M 112 LQFP, 64 LQFP SG187 (Selector Guide) (3Q2015) – 28 LCD KWU EBI S12 and S12X Families (continued) Device Bus Frequency Flash RAM Data EEPROM XGATE Flash S12XF128 50 MHz 128 KB 16 KB — 2 KB S12XHZ512 40 MHz 512 KB 32 KB — 4 KB S12XHZ384 40 MHz 384 KB 28 KB — S12XHZ256 40 MHz 256 KB 16 KB S12XHY256 40 MHz 256 KB S12XHY128 40 MHz S12P128 MPU ECC FlexRa y CAN SCI SPI I2C Analog (ADC) PWM Motor SSD ECT Timer PIT 1 2 2 — 16-CH, 12-bit 6-CH, 15-bit — — — 8-CH, 16 -bit 4-CH 2 2 1 2 16-CH, 10-bit 8-CH, 8-bit 24/6 6 8-CH, 16-bit 4-CH 32x4 8 4 KB 2 2 1 2 16-CH, 10-bit 8-CH, 8-bit 24/6 6 8-CH, 16-bit 4-CH 32x4 — 4 KB 2 2 1 2 16-CH, 10-bit 8-CH, 8-bit 24/6 6 8-CH, 16-bit — 12 KB 8 KB - - 2 2 1 - 12-ch., 10-bit 8-CH, 8-bit/ 4-CH, 16-bit 16/4 4 - 128 KB 8KB 8 KB - - 2 2 1 - 12-ch., 10-bit 8-CH, 8-bit/ 4-CH, 16-bit 16/4 4 32 MHz 128 KB 6 KB 4 KB — 1 1 1 — 10-CH, 12-bit 6-CH, 8-bit — S12P96 32 MHz 96 KB 6 KB 4 KB — 1 1 1 — 10-CH, 12-bit 6-CH, 8-bit S12P64 32 MHz 64 KB 4 KB 4 KB — 1 1 1 — 10-CH, 12-bit S12P32 32 MHz 32 KB 2 KB 4 KB — 1 1 1 — S12HZ128 25 MHz 128 KB 6 KB — 2 KB 2 2 1 S12HZ64 25 MHz 64 KB 4 KB — 1 KB 1 1 S12HN64 25 MHz 64 KB 4 KB — 1 KB S12HY64 32 MHz 64 KB 4 KB 4 KB — S12HA64 32 MHz 64 KB 4 KB 4 KB — S12HY48 32 MHz 48 KB 4 KB 4 KB — S12HA48 32 MHz 48 KB 4 KB 4 KB — S12HY32 32 MHz 32 KB 2 KB 4 KB — S12HA32 32 MHz 32 KB 2 KB 4 KB — 1 1 1 Temp. Range1 Package Options In Production 3.13 to 5.5 C, V, M 112 LQFP, 64 LQFP 4.5 to 5.5 C, V, M 112 LQFP, 144 LQFP 8 4.5 to 5.5 C, V, M 112 LQFP, 144 LQFP 4-CH 32x4 8 4.5 to 5.5 C, V, M 112 LQFP, 144 LQFP - 16CH., 16-bit 40 x 4 25 - 4.5 to 5.5 C, V, M 100 LQFP, 112 LQFP - - 16CH., 16-bit 40 x 4 25 - 4.5 to 5.5 C, V, M 100 LQFP, 112 LQFP — — 8-CH, 16 -bit — — 12 3.13 to 5.5 C, V, M 80 QFP, 64 LQFP, 48 QFN — — — 8-CH, 16 -bit — — 12 3.13 to 5.5 C, V, M 80 QFP, 64 LQFP, 48 QFN 6-CH, 8-bit — — — 8-CH, 16-bit — — 12 3.13 to 5.5 C, V, M 80 QFP, 64 LQFP, 48 QFN 10-CH, 12-bit 6-CH, 8-bit — — — 8-CH, 16-bit — — 12 3.13 to 5.5 C, V, M 80 QFP, 64 LQFP, 48 QFN 1 16-CH, 10-bit 6-CH, 8-bit 16/4 4 — 8-CH, 8-bit — 32x4 8 4.5 to 5.5 C, V, M 112 LQFP 1 — 8-CH, 10-bit 4-CH, 8-bit 16/4 4 — 8-CH, 8-bit — 24x4 8 4.5 to 5.5 C, V, M 80 QFP, 112 LQFP 1 1 — 8-CH, 10-bit 4-CH, 8-bit 16/4 4 — 8-CH, 8-bit — 24x4 8 4.5 to 5.5 C, V, M 80 QFP, 112 LQFP 1 1 1 8-CH, 10-bit 8-CH, 8-bit 16/4 Support — 8-CH+8-CH 16-bit — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 100 LQFP 1 1 1 8-CH, 10-bit 8-CH, 8-bit 16/4 Support — 8-CH+8-CH 16-bit — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 100 LQFP 1 1 1 8-CH, 10-bit 8-CH, 8-bit 16/4 Support — 8-CH+8-CH 16-bit — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 100 LQFP 1 1 1 8-CH, 10-bit 8-CH, 8-bit 16/4 Support — 8-CH+8-CH 16-bit — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 100 LQFP 1 1 1 8-CH, 10-bit 8-CH, 8-bit 16/4 Support — 8-CH+8-CH 16-bit — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 100 LQFP 1 1 1 8-CH, 10-bit 8-CH, 8-bit 16/4 Support — 8-CH+8-CH 16-bit — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 100 LQFP 1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40 °C to +140 °C, W = -40 °C to +150 °C SG187 (Selector Guide) (3Q2015) – 29 LCD KWU EBI — 11 Operating Voltage S12 MagniV Mixed-signal MCUs Device S12ZVCA192 Bus Frequency 32 MHz Flash RAM EEPROM ECC CAN CANPHY SCI LINPHY SPI I2C Ext. Analog (ADC) 192 KB 12 KB 2 KB 1 1 2 — 2 1 S12ZVCA128 32 MHz 128 KB 12 KB 2 KB 1 1 2 — 2 S12ZVCA96 32 MHz 96 KB 12 KB 2 KB 1 1 2 — S12ZVCA64 32 MHz 64 KB 4 KB 1 KB 1 1 2 S12ZVC192 32 MHz 192 KB 12 KB 2 KB 1 1 S12ZVC128 32 MHz 128 KB 12 KB 2 KB 1 S12ZVC96 32 MHz 96 KB 12 KB 2 KB S12ZVC64 32 MHz 64 KB 4 KB 1 KB S12ZVL32 32 MHz 32 KB 1 KB S12ZVL16 32 MHz 16 KB S12ZVL8 32 MHz S12ZVLS32 Int. Analog (ADC) PWM Timer LCD KWU Motor High Voltage Input Other Analog Vreg Ext. Supply Operating Temp. Voltage Range1 Package Options 16-CH, 12bit 4+4-CH, 16-bit 8+4-CH, 16-bit — 1 16-CH, 12bit 4+4-CH, 16-bit 8+4-CH, 16-bit 2 1 16-CH, 12bit 4+4-CH, 16-bit — 2 1 16-CH, 12bit 2 — 2 1 1 2 — 2 1 1 2 — 1 1 2 128 B — — 1 KB 128 B — 8 KB 1 KB 128 B 32 MHz 32 KB 1 KB 128 B S12ZVLS16 32 MHz 16 KB 1 KB S12VR64 25 MHz 64 KB S12VR48 25 MHz S12ZVH128 34 — 2-CH HVI, Vsup Sense 2 5.0 V/20 mA C, M, V, W — 34 — 2-CH HVI, Vsup Sense 2 5.0 V/20 mA C, M, V, W 8+4-CH, 16-bit — 34 — 2-CH HVI, Vsup Sense 2 5.0 V/20 mA C, M, V, W 4+4-CH, 16-bit 8+4-CH, 16-bit — 34 — 2-CH HVI, Vsup Sense 2 5.0 V/20 mA C, M, V, W 16-CH, 10bit 4+4-CH, 16-bit 8+4-CH, 16-bit — 34 — 2-CH HVI, Vsup Sense 2-CH ACMP, DAC 2-CH ACMP, DAC 2-CH ACMP, DAC 2-CH ACMP, DAC — 2 5.0 V/20 mA C, M, V, W 1 16-CH, 10bit 4+4-CH, 16-bit 8+4-CH, 16-bit — 34 — 2-CH HVI, Vsup Sense — 2 5.0 V/20 mA C, M, V, W 2 1 16-CH, 10bit 4+4-CH, 16-bit 8+4-CH, 16-bit — 34 — 2-CH HVI, Vsup Sense — 2 5.0 V/20 mA C, M, V, W — 2 1 16-CH, 10bit 4+4-CH, 16-bit 8+4-CH, 16-bit — 34 — 2-CH HVI, Vsup Sense — 2 5.0 V/20 mA C, M, V, W 2 1 1 1 10-CH, 10bit 6+2-CH, 16-bit — 23 — 1-CH HVI, Vsup Sense 5.0 V/20 mA C, V, M 2 1 1 1 10-CH, 10bit 6+2-CH, 16-bit — 23 — 1-CH HVI, Vsup Sense 1 5.0 V/20 mA C, V, M 48 LQFP, 32-LQFP — — 2 1 1 1 10-CH, 10bit 6+2-CH, 16-bit — 23 — 1-CH HVI, Vsup Sense 1 5.0 V/20 mA C, V, M 48 LQFP, 32-LQFP — — 2 1 1 1 10-CH, 10bit 6+2-CH, 16-bit — 23 — 1-CH HVI, Vsup Sense 1 5.0 V/20 mA C, V, M 32 QFN 128 B — — 2 1 1 1 10-CH, 10bit 6+2-CH, 16-bit — 23 — 1-CH HVI, Vsup Sense 1 5.0 V/20 mA C, V, M 32 QFN 2 KB 512 B — — 2 1 1 — 6-CH, 10-bit 4-CH, 10bit 4-CH, 16 -bit — 6 5.0 V, 20 mA 6.0 to 18 C, V 32 LQFP, 48 LQFP 2 KB 512 B — — 2 1 1 — 6-CH, 10-bit 4-CH, 10bit 4-CH, 8bit 4-CH, 16 -bit — 6 2 5.0 V, 20 mA 6.0 to 18 C, V 32 LQFP, 48 LQFP 32 MHz 128KB 8 KB 4 KB 1 1 2 — 1 1 8-CH, 10-bit 8-CH, 10bit Two 8CH x16bit 4x40 24 2 5.5 V to 18 V C, V 100 LQFP, 144 LQFP S12ZVH64 32 MHz 64 KB 4 KB 4 KB 1 1 2 — 1 1 8-CH, 10-bit 8-CH, 10bit Two 8CH x16bit 4x40 24 4 Stepper Vbat-Sense, Vsup-Sense — 2 5.5 V to 18 V C, V 144 LQFP S12ZVHY64 32 MHz 64 KB 4 KB 2 KB 1 — 2 — 1 1 8-CH, 10-bit 8-CH, 10bit 8-CH(8bit), 4CH(16bit) 8-CH(8bit), 4CH(16bit) 8-CH(8bit), 4CH(16bit) 4-CH HVI, Vbat-Sense, Vsup Sense 4-CH HVI, Vbat-Sense, Vsup Sense Vbat-Sense, Vsup-Sense 2 48 KB 2-CH Relay, LS Driver 2-CH Relay, LS Driver 4 Stepper 3-CH NGPIO (5.0 V/25 mA) 3-CH NGPIO (5.0 V/25 mA) 3-CH NGPIO (5.0 V/25 mA) 3-CH NGPIO (5.0 V/25 mA) 3-CH NGPIO (5.0 V/25 mA) 2-CH, HS Driver 2-CH, HS Driver — 1 — 8-CH, 8bit or 4CH, 16bit 8-CH, 8bit or 4CH, 16bit 8-CH, 8bit or 4CH, 16bit 8-CH, 8bit or 4CH, 16bit 8-CH, 8bit or 4CH, 16bit 4-CH, 8bit 64 LQFPEP, 48 LQFP 64 LQFPEP, 48 LQFP 64 LQFPEP, 48 LQFP 64 LQFPEP, 48 LQFP 64 LQFPEP, 48 LQFP 64 LQFPEP, 48 LQFP 64 LQFPEP, 48 LQFP 64 LQFPEP, 48 LQFP 48 LQFP, 32-LQFP Two 8CH x16bit 4x40 24 2 Stepper Vbat-Sense, Vsup-Sense — 1 5.5 V to 18 V C, V 100 LQFP, 144 LQFP SG187 (Selector Guide) (3Q2015) – 30 In Production S12 MagniV Mixed-signal MCUs (continued) CANPHY SCI LINPHY SPI I2C Ext. Analog (ADC) Int. Analog (ADC) 1 — 2 — 1 1 8-CH, 10-bit 8-CH, 10bit 1 — 2 1 1 1 8-CH, 10-bit 8-CH, 10bit 2 KB 1 — 2 1 1 1 8-CH, 10-bit 8-CH, 10bit 8 KB 512 B 1 — 2 1 1 — 4+5-CH, 12bit 8-CH, 12bit 128 KB 8 KB 512 B 1 — 2 — 1 — 4+5-CH, 12bit 8-CH, 12bit 6-CH, 15-bit 4-CH, 16bit 51 MHz 64 KB 4 KB 512 B 1 — 2 1 1 — 4+5-CH, 12bit 8-CH, 12bit 6-CH, 15-bit S12ZVMC64 52 MHz 64 KB 4 KB 512 B 1 — 2 — 1 — 4+5-CH, 12bit 8-CH, 12bit S12ZVML32 50 MHz 32 KB 4 KB 512 B 1 — 2 1 1 S12ZVM32 50 MHz 32 KB 4 KB 128 B — 2 4+5-CH, 12bit 4+5-CH, 12bit S12ZVM31 50 MHz 32 KB 2 KB 1 S12ZVM16 50 MHz 16 KB 2 KB 1 Device Flash RAM S12ZVHY32 Bus Frequency 32 MHz EEPROM ECC CAN 32 MHz 2 KB 2 KB S12ZVHL64 32 MHz 64 KB 4 KB 2 KB S12ZVFP64 32 MHz 64 KB 4 KB S12ZVML128 50 MHz 128 KB S12ZVMC128 50 MHz S12ZVML64 128 B 1 2 1 1 PWM Timer LCD KWU Motor High Voltage Input Other Analog Vreg 24 2 Stepper Vbat-Sense, Vsup-Sense — 1 5.5 V to 18 V C, V 100 LQFP, 144 LQFP 24 2 Stepper Vbat-Sense, Vsup-Sense — 1 5.5 V to 18 V C, V 100 LQFP, 144 LQFP 24 — Vbat-Sense, Vsup-Sense — 1 5.5 V to 18 V C, V 100 LQFP, 144 LQFP 6 BLDC/ PMSM Vsup-Sense 2 — 3.5 V to 20 V, M, W V 64 LQFPEP — 6 BLDC/ PMSM Vsup-Sense 2 — 3.5 V to 20 V, M, W V 64 LQFPEP 4-CH, 16bit — 6 BLDC/ PMSM Vsup-Sense 1 — 3.5 V to 20 V, M, W V 64 LQFPEP 6-CH, 15-bit 4-CH, 16bit — 6 BLDC/ PMSM Vsup-Sense 6-CH Gate Drive Unit 6-CH Gate Drive Unit 6-CH Gate Drive Unit 6-CH Gate Drive Unit 2 — 3.5 V to 20 V, M, W V 64 LQFPEP 8-CH, 12bit 8-CH, 12bit 6-CH, 15-bit 6-CH, 15-bit 4-CH, 16bit 4-CH, 16bit 6 BLDC/ PMSM BLDC/ PMSM Vsup-Sense 1 1 3.5 V to 20 V, M, W V 3.5 V to 20 V, M, W V 64 LQFPEP 64 LQFPEP, 48 LQFP-EP 4+5-CH, 12bit 8-CH, 12bit 6-CH, 15-bit 4-CH, 16bit 6 BLDC/ PMSM 3.5 V to 20 V, M, W V 64 LQFPEP 4+5-CH, 12bit 8-CH, 12bit 6-CH, 15-bit 4-CH, 16bit 6 BLDC/ PMSM Vsup-Sense HV-PHY, 6-CH Gate Drive Unit Vsup-Sense 6-CH Gate Drive Unit Vsup-Sense HV-PHY, 6-CH Gate Drive Unit 5.0 V, 20 mA 5.0 V, 20 mA 3.5 V to 20 V, M, W V 64 LQFPEP, 48 LQFP-EP 8-CH (8Two 8- 4x40 bit), 4CH x 16CH (16bit bit) 8-CH (8Two 8- 4x40 bit), 4CH x 16CH (16bit bit) 8-CH (8Two 8- 4x40 bit), 4CH x 16CH (16bit bit) 6-CH, 4-CH, 16- — 15-bit bit 1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40 °C to +140 °C, W = -40 to +150 °C SG187 (Selector Guide) (3Q2015) – 31 6 Ext. Supply 1 1 5.0 V, 20 mA Operating Temp. Voltage Range1 Package Options In Production DIGITAL SIGNAL CONTROLLERS 56800E Core—The 56800E MCU+DSP core was architected specifically to provide users the ease of use of an MCU together with the performance of a DSP in a single core. 56F8300 High-Performance Flash Series—The MC56F8300 series of controllers combines the 56800E core with flash memory, motor control peripherals, and built-in safety features targeted specifically for automotive applications to provide 60 MIPS of performance over the full -40°C to 125°C temperature range. Memory—On-board memory includes program flash and RAM, data flash and RAM, and BootFlash with EEPROM emulation capability. The modified Harvard architecture enables users to perform up to three simultaneous memory accesses. Service—A full-range of services is offered for the controller devices including software, support, training, and internal and third-party development tools. For additional information, visit: Documentation, Tool, and Product Libraries: www.freescale.com 56F8xxx Family Product ROM (KB) RAM Flash Timer 56F8013 0 4K 16K 4 x 16-bit 56F8355 n/a 20K 280K 16 x 16-bit Serial GPIO (pins) A/D PWM Operating Voltage (V) Operating Frequency (MHZ) Temperature 26 1 x 4-CH 12-bit 4 x 4-CH 12-bit 1 x 6-CH 3.3 32 C, M 32-pin LQFP 2 x 6-CH 3.3 60 C, M 128-pin LQFP 1 SCI/LIN + 1 SPI + 1 I2C 2 SCI/LIN + 2 SPI + 1 CAN + 1 49 I2C Packaging Additional Information mcPWM with center alignment, 1 x 4 channel Quad Decoder mcPWM with center alignment, 2 x 4 channel Quad Decoder KINETIS MCUS BASED ON ARM® TECHNOLOGY Kinetis MCU families for automotive are based on ARM® Cortex Technology and provide high scalability, cost-effective automotive-grade 32-bit portfolio for a wide range of automotive applications. Designers will be benefited from the granted third party support for ARM technology and they will maximize hardware and software reuse. For additional information, visit: Documentation, Tool, and Product Libraries www.freescale.com Automotive Home Page www.freescale.com/automotive Kinetis MCUs based on ARM® Technology Core Platform Program Flash RAM EEPROM SCI SPI CAN I2C Other Communications Timer Analog (ADC) KBI Additional Features Operating Voltage Temp Range Debug Package Options In Production KEAZN8 48 MHz 8 KB 1 KB Emulate 1 1 0 1 - FTM, PIT, PWT, RTC 12-CH, 12-bit 2x 8-bit 2.7 to 5.5 C, V, M SWD 16 TSSOP, 24 QFN KEAZN16 40 MHz 16 KB 2 KB 256 B 3 2 0 2 - FTM, PIT, RTC 16-CH, 12-bit 2x 8-bit 2.7 to 5.5 C, V, M SWD 32 LQFP, 64 LQFP KEAZN32 40 MHz 32 KB 4 KB 256 B 3 1 0 2 - FTM, PIT, RTC 16-CH, 12-bit 2x 8-bit 2.7 to 5.5 C, V, M SWD 32 LQFP, 64 LQFP KEAZN64 40 MHz 64 KB 4 KB 256 B 3 1 0 2 - FTM, PIT, RTC 16-CH, 12-bit 2x 8-bit 2.7 to 5.5 C, V, M SWD 32 LQFP, 64 LQFP KEAZ64 48 MHz 64 KB 8 KB Emulate 3 1 1 2 - FTM, PIT, PWT, RTC 16-CH, 12-bit 2x 32-bit 2.7 to 5.5 C, V, M SWD 64 LQFP, 80 LQFP KEAZ128 48 MHz 128 KB 16 KB Emulate 3 2 1 2 - FTM, PIT, PWT, RTC 16-CH, 12-bit 2x 32-bit LVD, BME, ACMP, PMC, CRC LVD, BME, ACMP, PMC, CRC LVD, BME, ACMP, PMC, CRC LVD, BME, ACMP, PMC, CRC LVD, BME, ACMP, PMC, CRC LVD, BME, ACMP, PMC, CRC 2.7 to 5.5 C, V, M SWD 64 LQFP, 80 LQFP Device SG187 (Selector Guide) (3Q2015) – 32 MAC57DXXX 32-BIT ARM®-BASED MCUS The MAC57Dxxx family is the next-generation platform of devices specifically targeted at driver information systems (DIS) market using single and dual high resolution displays. For additional information, visit: Documentation, Tool, and Product Libraries www.freescale.com Automotive Home Page www.freescale.com/automotive Leveraging the highly successful MPC56xxS product families, our next generation product families powered by ARM® processors, coupled with 2D graphics accelerators, Head Up Display (HUD) warping engines, high resolution displays, integrated stepper motor drivers with patented stepper stall detect offering leading-edge performance and scalability for cost-effective applications. MAC57Dxxx 32-bit ARM®-Based MCUs Ether- Sound DRAM Flash net Genera- SupSuptor port port Oper- Temp Debug Secuating Range rity voltage 2 10/100 +AVB Yes 16-bit SDR, 16/32bit DDR2 2x Dual DDR Quad SPI 3.3, 5 V JTAG, Trace CSE2 3 2 10/100 +AVB Yes 16-bit SDR, 16/32bit DDR2 2x Dual DDR Quad SPI 3.3, 5 V JTAG, Trace CSE2 3 2 10/100 +AVB Yes 16-bit SDR, 16/32bit DDR2 2x Dual DDR Quad SPI 3.3, 5 V JTAG, Trace CSE2 Device Multi Core Platform Core Frequency Program Flash SRA M Graph- eDMA EEPROM Display ics ResoluRAM tion Display Interfaces Segment LCD Graphics Accelerator Digital Video Input Stepper Motor Driver I/O Processor MLB UART SPI /LIN MAC57D54H ARM Cortex -A5, ARM Cortex -M4, ARM Cortex -M0+ ARM Cortex -A5, ARM Cortex -M4, ARM Cortex -M0+ ARM Cortex -A5, ARM Cortex -M4, ARM Cortex -M0+ (A5)320 MHz, (M4)160 MHz, (M0+)80 MHz 4 MB 2x 512 KB 1.3 MB (1 MB Flex ECC option) 2 x 16 Emulated Up to 2 x Ch : 2 x (4 x WVGA 16 kB + 64 kB) 2x dRGB, 1x RSDS, 1x LVDS 4x40 OpenVG 1.1 Yes 6 Yes MLB 50 3 5 3 (A5)320 MHz, (M4)160 MHz, (M0+)80 MHz 3 MB 2x 512 KB 1.3 MB (1 MB Flex ECC option) 2 x 16 Emulated Up to 2 x Ch : 2 x (4 x WVGA 16 kB + 64 kB) 2x dRGB, 1x RSDS, 1x LVDS 4x40 OpenVG 1.1 Yes 6 Yes MLB 50 3 5 (A5)320 MHz, (M4)160 MHz, (M0+)80 MHz 2 MB 2x 512 KB 1.3 MB (1 MB Flex ECC option) 2 x 16 Emulated Up to 2 x Ch : 2 x (4 x WVGA 16 kB + 64 kB) 2x dRGB, 1x RSDS, 1x LVDS 4x40 OpenVG 1.1 Yes 6 Yes MLB 50 3 5 MAC57D53M MAC57D52L SG187 (Selector Guide) (3Q2015) – 33 CA I2C N (FD) Functional Safety Package Optio ns In Production 64-BIT S32V MCUS BASED ON ARM® TECHNOLOGY The S32V200 family of processors are robust, efficient, flexible solutions for Automotive Advanced Driver Assistance Systems (ADAS) including applications like pedestrian detection, object detection, lane departure warning, smart head beam control and traffic sign recognition, amongst others. For additional information, visit: Documentation, Tool, and Product Libraries www.freescale.com Automotive Home Page www.freescale.com/automotive 64-bit S32V MCUs Based on ARM® Technology Device S32V234 Core Platform Quad ARM Cortex™ -A53 Core Cache Frequency 1 GHz L1: 32 KB/ 32 KB I/D per core L2: 256 KB Unified per cluster SRAM DMA 4 MB 32 CH Video GraphImage CamDisplay Accelerics Procesera Interface ator Accelersor Input ator H.264 OpenGL Image MIPI- TFT, up to and ES3.0 3D Signal CSI, 150 MJPEG Processor VIU-Lite MPixels/ encode (ISP) + sec (e.g. and Dual 1920 decode APEX2x1080 60 CL Image Hz) Cognition Processor DRAM Support Flash Support x64 Quad LPDDR Serial 2, Flash DDR3 Controll and er DDR3L (QuadS PI) USB CAN (2.0) x 2x CANFD MLB x SD/ I2C MMC SDIO 1 SG187 (Selector Guide) (3Q2015) – 34 3 SPI 4 UART Ethernet 2 1 GB with IEEE® 1588 HDD Interface SSI/ I2S Sample Rate SPDIF I/O PIT 3.3 V GPIO x x x x 2 Oper- Temp. Packating Range age VoltOption age s 1.0 V ± V 621 5% for Flip digital Chip core BGA, input 17x17 supply mm voltage In Production x 32-BIT MCUS BASED ON POWER ARCHITECTURE® TECHNOLOGY Power Architecture is the world's leading architecture for automotive powertrain control, body electronics, safety and chassis, and instrument cluster applications. Our automotive qualified 32-bit processors built on Power Architecture technology deliver highly integrated single and multicore solutions for many automotive design needs. With 32-bit MCUs microcontrollers based on Power Architecture® Technology, you get a full range of performance and memory options so you can design scalable applications for more fuel-efficient, safer and secure automobiles.The 32-bit MCUs MPC56xx portfolio will continue to grow with devices that offer expanded sets of memory, connectivity and performance options. For additional information, visit: Documentation, Tool, and Product Libraries www.freescale.com Automotive Home Page www.freescale.com/automotive 32-Bit MCUS Based On Power Architecture® Technology Home Page www.freescale.com/32bitMCUS 32-bit MPC56xx and MPC57xx MCUs Built on Power Architecture® Technology Device Core Platform Bus Frequency Program Flash SRAM DMA EEPROM MPU/ MMU CTU MPC5775K Dual Z7 Z7 Process cores at or, 266 lockstep Mhz, Z4 Z4 cores at 133 MHz 4 MB with ECC 1.5 MB with ECC Safe DMA MPC5774K Dual Z7 Z7 Process cores at or, 266 lockstep Mhz, Z4 Z4 cores at 133 MHz 3 MB with ECC 1.0 MB with ECC Safe DMA MPC5744P 2x e200z4 180 MHz No No No 4 4 4 of which 1 is FD 3 No No No 4 4 4 of which 1 is FD 3 2 4 3 MPC5746G Dual e200z7 2x180 MHz 6 MB 384 KB 96CH 64 KB Data Flash 32 entry 3 10 8 4 MPC5747C e200x4, e200x2 180 MHz, 80 MHz 4 MB 512 KB 32CH Emulated 24-CH MPU Up to 16 10 8 4 MPC5746R 3x e200z4 3 x 200 MHz 4 MB 320 KB 64CH 256 KB 24 Entry 6 7 4 \ Zipwire, SENT MPC5745R e200z4x 3 x 200 3 MHz 3 MB 256 KB 64CH 256 KB 24 entry 6 7 4 MPC5743R e200z4x 2 x 200 2 MHz 2 MB 160 KB 64CH 256 KB 24 entry 5 5 4 MPC5777C e200z7x 3 x 264 3 MHz 8 MB 512 KB 2x 64CH 5 5 6 2.5 MB 384 KB 32CH Emulated 32 Entry in Program Flash Emulated 32 entry in Program Flash CSE/ HSM CSE SCI DSPI (LINFlex) CAN I2C FlexRay™ Ethernet (100BaseT) MLB Other Peripherals eTPU eMIOS Motor Control Timers PIT Analog Operat- Temp. (ADC, ing Range 1 DAC) Voltage 128 msg 1 No SPT (Signal Processing Unit) for Radar Algorithms, 2xCross Trig Unit, 3xeTimers, 2xSENT, Temp Sensor No No 2xPWM No 128 msg 1 No SPT (Signal Processing Unit) for Radar Algorithms, 2xCross Trig Unit, 3xeTimers, 2xSENT, Temp Sensor No No 2xPWM No (3 x 6ch., ETimer), (2 x 12ch, PWM) 4CH 8xDelta 3.3 V I/ -40 to Nexus 3+ Sigma O, 1.2 V 150 Tj @ 10 Core MHz; 4x12bit SAR @ 1Mz; 2M/s 8bit DAC 8xDelta 3.3 V I/ -40 to Nexus 3+ Sigma O, 1.2 V 150 Tj @ 10 Core MHz; 4x12bit SAR @ 1Mz; 2M/s 8bit DAC Quad, 3.3 C, V, M Nexus 3+, 25-ch. MDO and External Aurora , 12-bit interface Debug Up to 96-CH, 16-bit 16 Up to 32-CH, 12-bit, 48-CH, 10-bit 3.3 V, 5.0 V C, V, M Nexus 3+ Up to 96-CH, 16-bit 16 Up to 32-CH, 12-bit, 48-CH, 10-bi 3.3 V, 5.0 V C, V, M Nexus 3+ 64-CH 32-CH 8 4x SAR, 3 x SD 3.3, 5 M Nexus 3+, JTAG Zipwire, SENT 64-CH 32-CH 8 4x SAR, 3 x SD 3.3 V, 5.0 V M Zipwire, SENT 64-CH 32-CH 8 3.3 V, 5.0 V M Zipwire, SENT 96-CH 32-CH 4 4x SAR, 3 x SD 2x eQADC, 3 x SD 3.3 V, 5.0 V M SG187 (Selector Guide) (3Q2015) – 35 Package Options 17x17 356 PBGA 17x17 356 PBGA 144 LQFP, 257 MAPBGA 176 LQFP, 256 MAPBGA , 324 MAPBGA 176 LQFP, 256 MAPBGA , 324 MAPBGA 176 LQFP-EP 252 MAPBGA Nexus 3+, 176 JTAG LQFP, 252 MAPBGA Nexus 3+, 144 JTAG LQFP, 176 LQFP Nexus 3+, 416 JTAG PBGA, 516 PBGA In Production 32-bit MPC56xx and MPC57xx MCUs Built on Power Architecture® Technology (continued) Device Core Platform Bus Frequency Program Flash SRAM MPC5747G Dual e200x4, e200x2 180 MHz, 80 MH 4 MB 768 KB 32CH MPC5748C e200x4, e200x2 180 MHz, 80 MH 6 MB 768 KB MPC5748G Dual e200x4, e200x2 180 MHz, 80 MH 6 MB MPC5777M 3x e200z7 +1x e200z4 MPC5676R Dual e200z7 3 x 300 MHz + 1x 200MH z 2x180 MHz MPC5674F e200z7 MPC5673F e200z7 MPC5673K Dual e200z7 MPC5675K Dual 45 MHz e200z7 d MPC5674K Dual e200z7 d 180 MHz MPC5668G e200z6 + e200z0 e200z0 + e200z0 116 MHz 2 MB 116 MHz 2 MB MPC5668E MPC5604E DMA EEPROM MLB Other Peripherals USB 4 8 4 8 4/1 2 3 5 4 96-CH Up to 32-CH, 16-bit 3 4 (MS B) 4 2x32CH 32-CH 3 4 (MS B) 4 2x32CH 32-CH 3 2 4 2 4 3 4 3 opt. 2 4 3 4 3 6 4 6 4 12 4 5 4 2 3 1 3 CTU Emulated 32-CH MPU Up to 18 10 8 4 32CH Emulated 24-CH MPU Up to 16 10 8 768 KB 32CH Emulated 32-CH MPU Up to 18 10 8 MB 596 KB 128CH 8 x 64 KB Yes, No 6 6 MB 384 KB 96CH 4 MB 256 KB 64 KB Data Flash 32 entry 64CH + 32CH 192 KB 64CH + 32CH 256 KB 2x 32CH Emulated in Program Flash Emulated in Program Flash 64 KB MPU+ 64 Entry MMU MPU+ 64 Entry MMU 512 KB 32CH Emulated 64 entry in Program Flash 1.5 MB 384 KB 2x 32CH 64KB 592KB 16CH 64 KB 128 KB 32CH e200z0 64 MHz 512 KB 96 KB h 16CH 150, 200, 264 MHz 150, 200, 264 MHz 2x180 MHz Ethernet (100BaseT) 3 MB 1 MB 2 MB Emulated 16 entry in Program Flash 64 KB yes CSE/ HSM SCI DSPI (LINFlex) CAN I2C FlexRay™ MPU/ MMU eTPU USB eMIOS Motor Control Timers PIT Analog Operat- Temp. (ADC, ing Range 1 DAC) Voltage Up to 96-CH, 16-bit 16 Up to 32-CH, 12-bit, 48-CH, 10-bi 3.3 V, 5.0 V Up to 96-CH, 16-bit 16 Up to 32-CH, 12-bit, 48-CH, 10-bi 3.3 V, 5 V Up to 96-CH, 16-bit 16 Debug Package Options C, V, M Nexus 3+ 176 LQFP, 256 MAPBGA , 324 MAPBGA C, V, M Nexus 3+ 176 LQFP, 256 MAPBGA , 324 MAPBGA Up to 3.3V, 5V C, V, M 32-CH, 12-bit, 48-CH, 10-bi Nexus 3+ 176 LQFP, 256 MAPBGA , 324 MAPBGA 12 x SAR, 10 x SD M Nexus 3+, Zipwire Aurora, JTAG 416 PBGA, 512 PBGA Up to 3.3V, 5V 64-CH, 12-bit 12 xDEC Filters Quad 3.3 V, 64-CH 5.0 V M Nexus 3+ 416 BGA, 516 BGA M Nexus 3+ 324 BGA, 416 BGA, 516 BGA Quad 64-CH 3.3 V, 5 V M Nexus 3+ 324 BGA, 416 BGA, 516 BGA 1 4 x 12bit,,34CH 3.3 V, 1.2 V C, V, M Nexus 3+ 4CH 4-CH, 12-bit 3.3 V, 5 V 4CH 4 x 12bit, 34CH 3.3 V, 5.0 V 16-CH, 24-bit 8CH 36-CH, 10-bit 3.3 V, 5.0 V 32-CH, 16-bit 8CH 64-CH, 10-bit 3.3 V, 5.0 V 1 8-CH, 10-bit 3.0 V, 1.2 V 257 MAPBGA , 473 MAPBGA M, V Nexus 3+ 473 MAPBGA , 275 MAPBGA C, V, M Nexus 3+ 257 MAPBGA , 473 MAPBGA V Nexus3 on 208 z6 and MAPBGA Nexus 2+ V, M JTAG, 208 Nexus3 MAPBG, onz6 and 256 Nexus2+ MAPBGA only for devt. C, V, M Nexus 2+ 64 LQFP 248-CH 3x PWM; 3x ETIME R 3x PWM; 3x ETIME R SG187 (Selector Guide) (3Q2015) – 36 1 x ETimer 3.3, 5 In Production 32-bit MPC56xx and MPC57xx MCUs Built on Power Architecture® Technology (continued) eTPU eMIOS 0 32-CH 2 0 2 2 0 2 3 2 0 10 8 6 1 16 Entry 10 8 6 1 64 KB Data Flash 16 Entry 10 8 6 1 16CH 64 KB Data Flash 16 Entry 10 8 6 1 e200z4 120 1.5 MB 192 KB + MHz, e200z0 60 MHz 16CH 64 KB Data Flash 16 Entry 10 8 6 1 MPC5644B e200z4 16CH 64 KB Data Flash 16 Entry 10 8 6 1 MPC5607B e200z0 64 MHz 1.5 MB 96 KB 16CH 64 KB Data Flash 8 Entry Up to 10 6 6 1 64-CH, 16-bit MPC5606B e200z0 64 MHz 80KB 16CH 64 KB Data Flash 8 Entry Up to Up to 8 6 6 1 64-CH, 16-bit Device Core Platform Bus Frequency Program Flash SRAM MPC5634M e200z3 60, 80 MHz 1.5M 94 KB 32CH Emulated in Program Flash 8 Entry 2 2 2 MPC5633M e200z3 40, 60, 80 MHz 1M 64 KB 32CH Emulated in Program Flash 8 Entry 2 2 MPC5632M e200z3 40, 60 MHz 768 KB 48 KB 32CH Emulated in Program Flash 8 Entry 2 MPC5643L e200z4x 80/120 2 MHz 1 MB 128 KB 16CH 64 KB Data Flash 16 Entry MPC5646C e200z4 120 + MHz, e200z0 60 MHz 3 MB 256 KB 16CH 64 KB Data Flash 16 Entry MPC5646B e200z4 3 MB 192 KB 16CH 64 KB Data Flash MPC5645C e200z4 120 + MHz, e200z0 60 MHz 2 MB 256 KB 16CH MPC5645B e200z4 2 MB 160 KB MPC5644C 120 MHz 120 MHz 120 MHz 1.5 MB 128 KB 1 MB DMA EEPROM MPU/ MMU CTU CSE/ HSM SCI DSPI (LINFlex) CAN I2C FlexRay™ Ethernet (100BaseT) MLB Other Peripherals Motor Control Timers PIT Analog Operat- Temp. (ADC, ing Range 1 DAC) Voltage 16-CH, 24-bit 5CH Dual 34-CH, 12-bit 5.0 V 32-CH 16-CH, 24-bit 5CH Dual 34-CH, 12-bit 5.0 V 32-CH 8-CH, 24-bit 5CH Dual 32-CH, 12-bit 5.0 V 4Ch. Dual 16Ch., 12bit 3.3 V 64-CH, 16-bit Up to 8CH 3.3 V, 5.0 V 64-CH, 16-bit Up to 8CH 64-CH, 16-bit Up to 8CH 64-CH, 16-bit Up to 8CH 64-CH, 16-bit Up to 8CH 64-CH, 16-bit Up to 8CH Up to 29-CH, 12-bit, Up to 33-CH, 10-bit Up to 29-CH, 12-bit, Up to 33-CH, 10-bit Up to 29-CH, 12-bit, Up to 33-CH, 10-bit Up to 29-CH, 12-bit, Up to 33-CH, 10-bit Up to 29-CH, 12-bit, Up to 33-CH, 10-bit Up to 29-CH, 12-bit, Up to 33-CH, 10-bit 16-CH, 10/12bit & up to 32Ch., 10bit 16-CH, 10/12bit & up to 32Ch., 10bit 46-Ch. eTimer/ PWM/ STM SG187 (Selector Guide) (3Q2015) – 37 Debug Package Options In Production Nexus 2+ 144 Wide trace LQFP, port in 176 Vertical LQFP, Calibratio 208 n System MAPBGA M Nexus 2+ 100 Wide trace LQFP, port in 144 Vertical LQFP, Calibratio 176 n System LQFP, 208 MAPBGA M Nexus 2+ 100 Wide trace LQFP, port in 144 LQFP Vertical Calibratio n System M Nexus 3+ 144 LQFP, 257 MAPBGA C, V, M Nexus 3+ 256 BGA, 208 LQFP, 176 LQFP 3.3 V, 5.0 V C, V, M Nexus 3+ 256 BGA, 208 LQFP, 176 LQFP 3.3 V, 5.0 V C, V, M Nexus 3+ 256 BGA, 208 LQFP, 176 LQFP 3.3 V, 5.0 V C, V, M Nexus 3+ 256 BGA, 208 LQFP, 176 LQFP 3.3 V, 5.0 V C, V, M Nexus 3+ 256 BGA, 208 LQFP, 176 LQFP 3.3 V, 5.0 V C, V, M Nexus 3+ 256 BGA, 208 LQFP, 176 LQFP 3.3 V, 5.0 V C, V, M 3.3 V, 5.0 V C, V, M Nexus 2+ 100 (208MAP LQFP, BGA 144 Emul. LQFP, Only 176 LQFP Package) JTAG Nexus 2+ 100 (208MAP LQFP, BGA 144 Emul. LQFP, Only 176 LQFP Package) JTAG M 32-bit MPC56xx and MPC57xx MCUs Built on Power Architecture® Technology (continued) Device Core Platform Bus Frequency Program Flash SRAM DMA EEPROM 16CH MPU/ MMU CTU 64 KB Data Flash 8 Entry CSE/ HSM I2C FlexRay™ Ethernet (100BaseT) MLB Other Peripherals eTPU eMIOS SCI DSPI (LINFlex) CAN Up to Up to 8 6 6 1 64-CH, 16-bit MPC5605B e200z0 64 MHz 768 KB 64KB MPC5604B e200z0 64 MHz 512 KB 32KB 64 KB Data Flash 8 Entry 4 3 3 1 56-CH, 16-bit MPC5603B e200z0 64 MHz 384 KB 28KB 64 KB Data Flash 8 Entry 4 3 3 1 MPC5602B e200z0 64 MHz 256 KB 24KB 64 KB Data Flash 8 Entry 3 3 2 MPC5604C e200z0 64 MHz 512 KB 48 KB 64 KB Data Flash 8 Entry 4 3 MPC5603C e200z0 64 MHz 384 KB 40 KB 64 KB Data Flash 8 Entry 4 MPC5602C e200z0 64 MHz 256 KB 32 KB 64 KB Data Flash 8 Entry MPC5601D e200z0 48 MHz 128 KB 12 KB 16CH MPC5602D e200z0 48 MHz 256 KB 16 KB 16CH MPC5604P e200z0 40/64 MHz 512 KB 40 KB 16CH MPC5603P e200z0 40/64 MHz 384 KB 36 KB 16CH MPC5602P e200z0 40/64 MHz 256 KB 20 KB 16CH MPC5601P e200z0 40/64 MHz 192 KB 12 KB 16CH 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash 64 KB Data Flash Motor Control Timers PIT Analog Operat- Temp. (ADC, ing Range 1 DAC) Voltage Debug Package Options In Production Nexus 2+ (208MAP BGA Emul. Only Package) JTAG Nexus 2+ (208MAP BGA Emul. Only Package) JTAG Nexus 2+ (208 MAP BGA Emul. Only Package) JTAG Nexus 2+ (208 MAP BGA Emul. Only Package) JTAG Nexus 2+ (208 MAP BGA Emul. Only Package) JTAG Nexus 2+ (208 MAP BGA Emul. Only Package) JTAG Nexus 2+ (208 MAP BGA Emul. Only Package) JTAG JTAG 100 LQFP, 144 LQFP, 176 LQFP 100 LQFP, 144 LQFP, 100 LQFP, 144 LQFP 100 LQFP, 144 LQFP 100 LQFP 100 LQFP 100 LQFP 100 LQFP, 64 LQFP C, V, M JTAG 100 LQFP, 64 LQFP M Nexus 2+ 100 LQFP, 144 LQFP M Nexus 2+ 100 LQFP, 144 LQFP M Nexus 1 64 LQFP, (Emulatio 100 LQFP n with MPC5604 P) M Nexus 1 64 LQFP, (Emulatio 100 LQFP n with MPC5604 P) 16-CH, 10/12bit & up to 32Ch., 10bit 3.3 V, 5.0 V C, V, M up to 6CH up to 36-CH, 10-bit 3.3V, 5.0 V C, V, M 56-CH, 16-bit up to 6CH up to 36-CH, 10-bit 3.3 V, 5.0 V C, V, M 1 56-CH, 16-bit up to 6CH up to 36-CH, 10-bit 3.3 V, 5.0 V C, V, M 6 1 28-CH, 16-bit 3CH 28-CH, 10-bit 3.3 V, 5.0 V C, V, M 3 6 1 28-CH, 16-bit 3CH 28-CH, 10-bit 3.3 V, 5.0 V C, V, M 4 3 6 1 28-CH, 16-bit 3CH 28-CH, 10-bit 3.3 V, 5.0 V C, V, M 3 2 1 2 1 2 4 2 0 2 4 2 0 2 3 2 0 4CH Up to 33-CH, 12-bit Up to 33-CH, 12-bit Dual 13-CH, 10-bit Dual 13-CH, 10-bit 16-CH, 10-bit C, V, M 3 Up to 4CH Up to 4CH 4CH 3.3 V, 5.0 V Up to 28-CH, 16-bit Up to 28-CH, 16-bit 1 1 1 0 4CH 11-CH, 10-bit 3.3 V, 5V SG187 (Selector Guide) (3Q2015) – 38 20-CH eTimer/ PWM 20-CH eTimer/ PWM 14-CH eTimer/ PWM 6-CH eTimer 4CH 3.3 V, 5.0 V 3.3 V, 5.0 V 3.3 V, 5.0 V 3.3 V, 5V 32-bit MPC56xx and MPC57xx MCUs Built on Power Architecture® Technology (continued) DMA EEPROM MPU/ MMU CSE/ HSM SCI DSPI (LINFlex) eMIOS 32-CH 3 3 Core Platform Bus Frequency Program Flash SRAM MPC5644A e200z4 120, 132, 150 MHz 4 MB 192 KB 64CH Emulated 24 entry in MMU Program Flash 3 3(MS B) 3 MPC5643A e200z4 120, 132, 150 MHz 3 MB 192 KB 64CH Emulated 24 entry in MMU Program Flash 3 3(MS B) MPC5642A e200z4 120, 132, 150 MHz 2 MB 192 KB 64CH Emulated 24 entry in MMU Program Flash 3 3(MS B) MPC5645S e200z4 d 125 MHz 2 MB 64 KB 16CH 4 x 16 KB Up to 2 Display Control Unit (DCU) with Parallel Data Interface (PDI) CTU eTPU Device CAN Up to Up to Up to 3 6 6 3 gaug es w/ Step per Stall Dete ct (SSD ) MPC5606S e200z0 64 MHz 1 MB 48 KB 164x16 KB Display 6 2 3 2 h + 160 CH Control gaug KB Unit es w/ Graphi (DCU) Step cs with per RAM Parallel Stall Data Dete Interface ct (PDI) (SSD ) MPC5604S e200z0 64 MHz 512 KB 48 KB 164x16 KB No 6 2 2 2 h CH gaug es w/ Step per Stall Dete ct (SSD ) MPC5602S e200z0 64 MHz 256 KB 24 KB 164x16 KB No 6 2 3 1 h CH gaug es w/ Step per Stall Dete ct (SSD ) 1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40 °C to +140°C, W = -40 °C to +150 °C I2C FlexRay™ 4 Ethernet (100BaseT) MLB Other Peripherals PIT Analog Operat- Temp. (ADC, ing Range 1 DAC) Voltage 24-bit 5CH Dual 40CH, + 2 DECFIL 3.3 V, 5V 32-CH 24-bit 5CH Dual 40CH, + 2 DECFIL 32-CH 24-bit 5CH Quad SPI 16 Entry QuadS PI 12 entry 2-CH 4 40x4 Yes (using eMIOS) 2 64x6 12 entry 2-CH 2 64x6 12 entry 2-CH SG187 (Selector Guide) (3Q2015) – 39 Motor Control Timers Debug Package Options In Production M Nexus3+ Vertical Calibratio n system 3.3 V, 5.0 V M Nexus3+ Vertical Calibratio n system Dual 40CH, + 2 DECFIL 3.3 V, 5.0 V M Nexus3+ Vertical Calibratio n system RTC, API, 8ch, 32-bit PIT and S/W Watchdog Timer Up to 20-CH, 10-bit 3.3 V and 5.0 V C, V Nexus 3+ 176 QFP, 208 MAPBGA , 324 MAPBGA 176 QFP, 208 MAPBGA , 324 MAPBGA 176 QFP, 208 MAPBGA , 324 MAPBGA 176 LQFP, 208 LQFP, 416 TEPBGA Real Time Counter (RTC), Autonomous Periodic Interrupt (API), 4-CH 32-bit PIT and S/W watchdog timer. Real Time Counter (RTC), Autonomous Periodic Interrupt (API), 4-CH 32-bit PIT and S/W watchdog timer. Real Time Counter (RTC), Autonomous Periodic Interrupt (API), 4-CH 32-bit PIT and S/W watchdog timer. 16-CH, 10-bit 3.3 V and 5.0 V C, V, M Nexus 2+ 144 LQFP, 176 LQFP 16-CH, 10-bit 3.3 V and 5.0 V C, V, M Nexus 1 100 LQFP, 144 LQFP 16-CH, 10-bit 3.3 V and 5.0 V C, V, M Nexus 1 100 LQFP, 144 LQFP Image Cognition Processors Device SCP2201 SCP2207 Primary Core Core Plat- Freform quenc y ARM926 350 MHz ARM926 350 MHz Secondary Core Platform SRAM APEX - SMD Array, Slave ARM926 APEX - SMD Array, Slave ARM926 DM A Video Accelerator Graphics Accelerator Image Processor Camera Input Display Interface 16 MB DRAM PDI LCD/ WVGA 64 MB DRAM PDI LCD/ WVGA DRAM Support Flash Support USB 2.0 NAND, Serial NOR flash NAND, Serial NOR flash HS OTG + HS Phy HS OTG + HS Phy 1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40 °C to +140 °C, W = -40 °C to +150 ° SG187 (Selector Guide) (3Q2015) – 40 PCi Express I2S I2 C SPI 1 2 1 1 2 1 UART Timers ADC PIT 3.3 V GPIO Voltage Temp. Range1 Package Options In Production 4 1 C 236 BGA 4 1 C 236 BGA I.MX 32-BIT APPLICATIONS PROCESSORS The AEC-Q100 automotive-qualified i.MX applications processors are based on ARM9 and ARM11 CPU cores coupled with a wide rage of connectivity peripherals and hardware accelerators. Target automotive applications include infotainment, navigation, hands-free calling, telematics and fully configurable Instrumentation clusters. For additional information, visit: Freescale Semiconductor Documentation, Tool, and Product Libraries www.freescale.com Automotive Home Page www.freescale.com/automotive i.MX Applications Processors Device Core Platform CPU Frequency Cache SRAM DMA Video Accelerator Graphics Accelerator Image Processor Camera Input Display Interface DRAM Flash Support Support USB (2.0) CAN MLB SD/ MMC SDIO I2C SPI UART Ethernet (100BaseT ) HDD Interface SSI/ I2S Sample Rate Converter SP DIF I/O PIT 3.3V Voltage GPIO Temp. Range Package Options In Production 1 i.MX 6Q Quad ARM Cortex®-A9 852 MHz 1 GHz L1: 32 KB/ 32 KB I/D L2: 512 KB Unified 256 KB 32-Ch. MultiFormat 1080p Encode and Decode (only on i.MX6Q6) OpenVG 1.1 (3D Core) OpenGLES 2.0, 3.0 Display Composition MIPI, CCIR656 Up to 4x WXGA x64 DDR3, LVDDR3 LPDDR2 x16 NOR x8 SLC/ MLC NAND HS OTG+HS PHY HS Host+HS PHY x2 HSIC 2 25/ 50/ 150 4 4 5 5 1 GB with IEEE® 1588 SATA 3+ ESAI Yes, Asynchr onous Yes 3 1.275 to 1.50 C 625 Flip Chip BGA i.MX 6D Dual ARM Cortex-A9 852 MHz 1 GHz L1: 32 KB/ 32 KB I/D L2: 512 KB Unified 256 KB 32-Ch. MultiFormat 1080p Encode and Decode (only on i.MX6D6) OpenVG 1.1 (3D Core) OpenGLES 2.0, 3.0 Display Composition MIPI, CCIR656 Up to 4x WXGA x64 DDR3, LVDDR3 LPDDR2 x16 NOR x8 SLC/ MLC NAND HS OTG+HS PHY HS Host+HS PHY x2 HSIC 2 25/ 50/ 150 4 4 5 5 1 GB with IEEE 1588 SATA 3+ ESAI Yes, Asynchr onous Yes 3 1.275 to 1.50 C 625 Flip Chip BGA i.MX 6U Dual ARM Cortex-A9 800 MHz L1: 32 KB/ 32 KB I/D L2: 512 KB Unified 128 KB 32-Ch. MultiFormat 1080p Encode and Decode (only on i.MX6U6) OpenVG 1.1 (3D Core) OpenGLES 2.0, 3.0 Display Composition on i.MX6U6 only MIPI, CCIR656 (not in i.MX 6U1) Up to 2x WXGA x64 DDR3, LVDDR3 LPDDR2 x16 NOR x8 SLC/ MLC NAND HS OTG+HS PHY HS Host+HS PHY x2 HSIC 2 25/ 50/ 150 4 4 4 5 1 GB with IEEE 1588 3+ ESAI Yes, Asynchr onous Yes 3 1.275 to 1.50 C 625 Flip Chip BGA i.MX 6S ARM CortexA9 800 MHz L1: 32 KB/ 32 KB I/D L2: 512 KB Unified 128 KB 32-Ch. MultiFormat 1080p Encode and Decode MIPI, Up to 2x CCIR656 WXGA (not in (not in i.MX i.MX 6S1) 6S1) x32 DDR3, LVDDR3 LPDDR2 x16 NOR x8 SLC/ MLC NAND HS OTG+HS PHY HS Host+HS PHY x2 HSIC 2 25/ 50/ 150 4 4 4 5 1 GB with IEEE 1588 3+ ESAI Yes, Asynchr onous Yes 3 1.275 to 1.50 C 625 Flip Chip BGA i.MX53 ARM Cortex®A8 with VPU and NEON 800 MHz L1: 32 KB/ 32 KB I/D, L2: 256 KB Unified 128 KB 32-Ch. HD720 Encode, HD1080 Decode (not in i.MX534) i.MX35 ARM1136™ with Vector Floating Point 532MHz L1: 16 KB/ 16 KB I/D, L2: 128 KB Unified 128 KB 32-Ch. i.MX28 ARM926™ 454 MHz L1: 16 KB/ 32 KB I/D 128 KB 32-Ch. I.MX25 ARM926 400 MHz L1: 16 KB/ 16 KB I/D 128 KB 32 Ch OpenVG 1.1 (3D Core) (not in OpenGLES i.MX 6S1) 2.0, 3.0 Display Composition (not in i.MX 6S1) OpenVG 1.1, OpenGL ES2.0 MIPI, CCIR656 UXGA, Dual TFT DDR2 DDR3 LPDDR2 NOR, SLC NAND MLC NAND HS OTG+HS PHY HS Host+FS PHY and 2x HS Host 2 25/ 50/ 4 3 3 5 10/100 with IEEE 1588 SATA, PATA 3+ ESAI I Yes, Asynchr onous Yes 3 0.95 to 1.1 C 529 MAPBGA OpenVG 1.1 (only in i.MX356) (not in i.MX351) MIPI, CCIR656 (not in i.MX351) TFT up to SVGA (not in i.MX351) SDRAM, mDDR, DDR2 NOR, SLC NAND MLC NAND HS OTG+HS PHY HS Host+FS PHY or Ext. HS PHY 2 25/ 50/ 3 3 2 3 10/100 ATA-6 2+ ESAI Yes, Asynchr onous Yes 3 1.22 to 1.47 C 400 MAPBGA TFT up to WVGA (not in i.MX281) mDDR, DDR2 SLC NAND, MLC NAND, QSPI Flash HS OTG+HS PHY HS Host+HS PHY or Ext. HS PHY 2 x3 x2 x3 x6 10/100 x1 GMII or x2 RMII with IEEE 1588 Tx 8 Internall y Generat ed C 289 MAPBGA HS OTG+HS PHY HS Host+HS PHY or Ext. HS PHY 2 2 3 3 5 10/100 4 1.38 to 1.52 C 400 MAPBGA MIPI, CCIR656 (not in i.MX251) Up to VGA (640 x 480) (not in i.MX251) SDRAM, NOR, SLC mDDR, DDR2 NAND MLC NAND 1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40 °C to +140 °C, W = -40 °C to +150 °C SG187 (Selector Guide) (3Q2015) – 41 x3 ATA-6 2+ ESAI 32-bit Vybrid Controller Solutions Device Vybrid SVFxxxR Core Platform ARM® Cortex®A5/M4 CPU Frequency Cache 400 MHz L1: 32 KB/ 32 KB I/D L2: 512 KB Up to 1.5 MB SRAM Up to 1.5 MB DMA . Video Accelerator Graphics Accelerator OpenVG 1.1 Image Processor Camera Input 18-bit Composi te (4 to 1) + VADC Display Interface 2 (Up to WVGA) + Segment Display (40 x 4) DRAM Support Flash Support DDR3 LPDDR2 Dual Quad SPI, NAND, FlexBus USB (2.0) 2x USB OTG HS + Phy CAN 50 MLB 1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40 °C to +140 °C, W = -40 °C to +150 °C SG187 (Selector Guide) (3Q2015) – 42 SD/ MMC SDIO I2C 2 4 SPI 4 UART 6 Ethernet (100BaseT ) 2x HDD Interface I2S 4x SAI 1x ESAI Sample Rate Converter SP DIF I/O yes yes PIT 3.3V Voltage GPIO Temp. Range Package Options In Production 176 LQFP 364 BGA 1 3.0 V to 3.6 V C — Definitions — ADC — Analog-to-Digital Converter ASK — Amplitude Shift Keying Modulation BDM — Background Debug Mode CAN — Controller Area Network CDIP — Ceramic Dual In-Line Package CLCC — Ceramic Leaded Chip Carrier COP — Computer Operating Properly (Watchdog Timer) CPU16 — 16-bit Central Processor Unit (HC11 Compatible) CPU32 — 32-bit Central Processor Unit (68000 Compatible) CTM — Configurable Timer Module (Various Hardware Options) DAB — Digital Audio Broadcasting DIP — Dual In-line Package DSPI — Deserial Peripheral Interface EBI — External Bus Interface ECT — Enhanced Capture Timer eDMA — Enhanced Direct Memory Access Controller eTPU — Enhanced Timing Processor Unit eMIOS — Enhanced Modular Input Output System eQADC — Enhanced Queued Analog-to-Digital Converter eSCI — Enhanced Serial Communications Interface FSK — Frequency Shift Keying Modulation GPT — General-Purpose Timer Module (4 IC, 5 OC, 2 PWM) HQFP — Heatsink Quad Flat Package HSOP — Heatsink Small Outline Package i — Input-Only Port Pins i/o — Bidirectional Input and Output Port Pins I2C — Inter-Integrated Circuit IC — Input Capture ISPI — Interval Serial Peripheral Interface LQFP — Low-Profile Quad Flat Package (1.4mm thick) LVI — Low-Voltage Interrupt LVR — Low-Voltage Reset MCCI — Multi-Channel Communication Interface (2 SCI, SPI) MFT — Multi-Function Timer MUX — Multiplexed OC — Output Compare OOK — On-Off Keying PBGA — Plastic Ball Grid Array PDIP — Plastic Dual In-Line Package PEEP — Personality EEPROM PEP — Personality EPROM PLCC — Plastic Leaded Chip Carrier PLL — Phase-Locked Loop PQFP — Plastic Quad Flat Pack PWM — Pulse-Width Modulation QADC — Queued Analog-to-Digital Converter (10-bit) PQFN — Quad Flat No-Lead Package QFN — Quad Flat No-Lead Package QFP — Quad Flat Package QSM — Queued Serial Module (SCI + QSPI) QSPI — Queued SPI RTI — Real-Time Interrupt SCI — Serial Communication Interface SCIE — Enhanced SCI SCIM — Single-Chip Integration Module SDIP — Shrink Dual In-line Package SIM — System Integration Module SIML — Low-Power System Integration Module SIOP — Simple Serial I/O Port SOICN — Small Outline Package Narrow Body SOICW — Small Outline Package Wide Body SPI — Serial Peripheral Interface ESPI — Enhanced SPI SRAM — Standby RAM Module SSOP — Shrink Small Outline Package TPU — Time Processor Unit (16 Programmable Channels) TPURAM — Standby RAM Module with TPU Emulation Capability TQFP — Thin Quad Flat Package (1.0mm thick) TSSOP — Thin Shrink Small Outline Package UART — Universal AsynchroNous Receiver/Transmitter UDFN— Ultra-thin dual flat no-lead package USB — Universal Serial Bus — Package Designators — B — Shrink DIP (70 mil spacing) DW — Small Outline (Wide-Body SOIC) DWB — Small Outline (Wide body SDIB) 0.65 pitch FA — 7 x 7 mm Quad Flat Pack (QFP) FB — 10 x 10 mm Quad Flat Pack (QFP) FC — QFN Quad Flat Pack FE — CQFP (windowed) — Samples Only FN — Plastic Quad (PLCC) FS — CLCC (windowed) — Samples Only FT — 28 x 28 mm Quad Flat Pack (QFP) FU — 14 x 14 mm Quad Flat Pack (QFP) FZ — CQFP (windowed) — Samples Only K — Cerdip (windowed) — Samples Only L — Ceramic Sidebraze P — Dual in-Line Plastic PNA — PQFN Power QFN PNB — PQFN Power QFN PNC — PQFN Power QFN PU — 14 x 14 mm Low-Profile Quad Flat Pack (LQFP) PV — 20 x 20 mm Low-Profile Quad Flat Pack (LQFP) S — Cerdip (windowed) — Samples Only TM — Mechatronics Connector VR — Plastic Ball Grid Array (PBGA) with PB-free solder balls ZP — 27 x 27 mm Plastic Ball Grid Array (PBGA) SG187 (Selector Guide) (3Q2015) – 43 — Pb-free — AA — Pb-free 44 to 100 pin QFP AB — Pb-free 112 to 288 pin QFP AC — Pb-free 16 to 44 pin LQFP AE — Pb-free 48 to 64 pin LQFP AF — Pb-free 68 to 100 pin LQFP AG — Pb-free 108 to 144 pin LQFb AH — Pb-free 80 to 100 pin TQFP AI — Pb-free FQFP AJ — Pb-free CQFP AE — Pb-free 22 to 64 pin PDIP ED — Pb-free 6 yo 20 pin PDIP EE — Pb-free PSDIP EF — Pb-free 8 to 16 in SOIC EG — Pb-free 16 to 28 pin SOIC WIDE EH — Pb-free 132 pin PQFP EI — Pb-free PLCC EJ — Pb-free 8 to 24 pin TSSOP EK — Pb-free 32 to 54 pin SOIC WIDE EL — Pb-free 26 to 56 pin TSSOP EN — Pb-free 8 to 24 pin SSOP EO — Pb-free 26 to 56 pin SSOP EP — Pb-free QFN & MLF (Exposed Pad) ER — Pb-free CATV ES — Pb-free SENSOR ET — Pb-free RF (POWER CHIPS) EU — Pb-free MAC PAAC EV — Pb-free MFP (SOEIAJ) FC — Pb-free QFN & MLF (Regular) FE — Pb-free CerQuads VK — Pb-free MAPBGA <=1.3mm (THINMAP) <.7mm Pitch VL — Pb-free MAPBGA <=1.3mm (THINMAP) >.7mm Pitch VM — Pb-free MAPBGA 1.6mm > .7mm Pitch VN — Pb-free MAPBGA 1.6mm < .7mm Pitch VO — Pb-free MAPBGA 1.35mm < .7mm Pitch VP — Pb-free MAPBGA 1.36mm > .7mm Pitch VR — Pb-free PBGA VS — Pb-free FC-HiTCE LGA (without C5 sphere) VT — Pb-free FC PBGA VU — Pb-free FC-HiTCE VV — Pb-free TBGA VW — Pb-free HSOP VX — Pb-free SMT VY — Pb-free UNIBODY SG187 (Selector Guide) (3Q2015) – 44 Product Numbering System for MC56F8300 Digital Signal Controllers MC 56F83 XX M 60 BUS SPEED QUALIFICATION STATUS PC PRE-QUALIFICATION, ENGINEERING SAMPLES MC FULLY QUALIFIED PACKAGE TYPE PRODUCT DESIGNATOR AUTOMOTIVE CONTROLLER SERIES WITH FLASH XX TEMPERATURE RANGE V -40C TO 105C M -40C TO 125C SG187 (Selector Guide) (3Q2015) – 45 Product Numbering System for Pressure Sensors M PX A 2 XXX A P X T1 M S P, X PRODUCT CATEGORY QUALIFIED STANDARD CUSTOM PRODUCT PROTOTYPE PRODUCT PRESSURE SENSORS NONE A/V AZ/VZ H HZ M Y 0 1–2 3–5 6–7 PACKAGING TYPE UNIBODY SMALL OUTLINE PACKAGE SMALL OUTLINE MEDIA RESISTANT PACKAGE SUPER SMALL OUTLINE PACKAGE SUPER SMALL OUTLINE MEDIA RESISTANT PACKAGE M-PAK SUPER SMALL OUTLINE PACKAGE (TPM) PORTING STYLE A G D V PRODUCT FEATURES NONE 2 3 4 UNCOMPENSATED TEMPERATURE COMPENSATED/CALIBRATED OPEN TEMPERATURE COMPENSATED/CALIBRATED/ SIGNAL CONDITIONED AUTOMOTIVE ACCURACY 5 TEMPERATURE COMPENSATED/CALIBRATED/ SIGNAL CONDITIONED HIGH TEMPERATURE POSITIVE/NEGATIVE PRESSURE CMOS 6 7 8 LEADFORM OPTION OPEN CONSULT FACTORY OPEN SOP* ONLY PRODUCT TYPE ABSOLUTE GAUGE DIFFERENTIAL VACUUM/GAUGE C P S SX W AXIAL PORT (SMALL OUTLINE PACKAGE) PORTED (UNIBODY) P SINGLE PORT Dp DIFFERENTIAL PORT STOVEPIPE PORT (UNIBODY) AXIAL PORT (UNIBODY) ROBUST AXIAL PORT MAXIMUM PRESSURE IN kPa EXCEPT FOR MPX2300 EXPRESSED IN mmHg Product Numbering System for ARM Devices SHIPPING METHOD NONE TRAYS T1 TAPE AND REEL U RAIL MAC 7 1 x x C FV 50 xx STATUS OF PRODUCT: MAC FULLY QUALIFIED SAC FULLY QUALIFIED AVAIL FOR AUTO CUSTOMERS PAC PRODUCT ENGINEERING CORE GENERATION (FAMILY) PINOUT/PACKAGE OPTION DESIGNATOR SEQUENTIAL DEVICE NUMBER SG187 (Selector Guide) (3Q2015) – 46 EXTRA PACKAGE EIGNATORS BUS SPEED AKAGE TYPE U 100 LQFP V 112/144 LQFP F 208 MAP BGA TEMPERATURE RANGE C -40 C TO 85 C V -40C TO 105 C M -40 C TO 125 C Product Numbering — Analog Auto and Power Management Devices MC mm FF r xxxx v PP RR FAMILY/ROADMAP PRODUCT CATEGORY MC - Qualified Standard SC - Custom Device PC - Prototype Device MARKET 32 - Consumer 33 - Automotive 34 - Industrial 35 - Medical/Military AR - Alternator Regulators BC - Battery Chargers BM - Battery Management CD - Configurable Detection CM - Communication FS - System Basis Chips GD - Gate Drivers HB - H-Bridge MM - Millimeter wave MR - MMIC Radar PF - Power Fusion SA - Safety Airbag SB - Safety Braking SD - Smoke Detection VR - Voltage Regulator XS - eXtreme switch PACKAGING DESIGNATOR SILICON REVISION (default blank) CORE 0000 (Defined by BU) Legacy product numbering is available in ANALOGPN on www.freescale.com SG187 (Selector Guide) (3Q2015) – 47 VARIATION (default blank) TAPE AND REEL INDICATOR 8-Bit Automotive Microcontroller Part Numbering System* EXAMPLES: S S 9 9 S08 S08 SL DZ 16 128 F F 1 M 2 M TJ LF S SHIPPING METHOD BLANK = TRAY R = TAPE AND REEL QUALIFICATION STATUS PC = ENGINEERING SAMPLES S = AUTOMOTIVE QUALIFIED MC = GENERAL MARKET QUALIFIED SC = CUSTOM BUILD PACKAGE OPTION TEMPERATURE OPTIONS C = -40C TO +85C V = -40C TO +105C M = -40C TO +125C J = -40C TO +140C W = -40C TO +150C MEMORY TYPE 9 = FLASH 3 = ROM (IF AVAILABLE) CORE DEVICE FAMILY PRODUCT REVISION FLASH SIZE MANUFACTURING SITE *NOTE: Freescale’s automotive part numbering system has evolved over time, so the decoder scheme shown above may not be relevant for the prior generations. 16-Bit Automotive Microcontroller Part Numbering System* EXAMPLES: S S 9 9 S12 HZ S12 EG 256 128 J J 3 C AL 2 C AA R SHIPPING METHOD BLANK = TRAY R = TAPE AND REEL QUALIFICATION STATUS PC = ENGINEERING SAMPLES S = AUTOMOTIVE QUALIFIED MC = GENERAL MARKET QUALIFIED SC = CUSTOM BUILD PACKAGE OPTION TEMPERATURE OPTIONS C = -40C TO +85C V = -40C TO +105C M = -40C TO +125C J = -40C TO +140C MEMORY TYPE 9 = FLASH 3 = ROM (IF AVAILABLE) CORE PRODUCT REVISION DEVICE FAMILY MANUFACTURING SITE FLASH SIZE *NOTE: Freescale’s automotive part numbering system has evolved over time, so the decoder scheme shown above may not be relevant for the prior generations. SG187 (Selector Guide) (3Q2015) – 48 32-Bit Automotive Microcontroller Part Numbering System for MPC55xx Devices* EXAMPLES: M PC 5554 M VR 132 S PC 5514E A C LQ 48 R SHIPPING METHOD BLANK = TRAY R = TAPE AND REEL QUALIFICATION STATUS PC = ENGINEERING SAMPLES S = AUTOMOTIVE MC = GENERAL MARKET QUALIFIED BUS SPEED PACKAGE OPTION POWER ARCHITECTURE CORE TEMPERATURE OPTIONS A = -55C TO +125C C = -40C TO +85C V = -40C TO +105C M = -40C TO +125C PRODUCT NAME RESERVED/OPTIONAL FIELD *NOTE: Freescale’s automotive part numbering system has evolved over time, so the decoder scheme shown above may not be relevant for the prior generations. 32-Bit Automotive Microcontroller Part Numbering System for MPC56xx Devices* EXAMPLES: P PC 5604B E M VR S PC 5604S E M LQ R SHIPPING METHOD BLANK = TRAY R = TAPE AND REEL QUALIFICATION STATUS PC = ENGINEERING SAMPLES S = AUTOMOTIVE MC = GENERAL MARKET QUALIFIED PACKAGE OPTION POWER ARCHITECTURE CORE TEMPERATURE OPTIONS C = -40C TO +85C V = -40C TO +105C M = -40C TO +125C PRODUCT NAME RESERVED/OPTIONAL FIELD *NOTE: Freescale’s automotive part numbering system has evolved over time, so the decoder scheme shown above may not be relevant for the prior generations. SG187 (Selector Guide) (3Q2015) – 49 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support For current information, please visit freescale.com/analog Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. SMARTMOS is a trademark of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2015 Freescale Semiconductor, Inc. SG187 Q3 2015, Rev 59 8/2015