Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Qualification Test Report Report Type: See Attached Date: See Attached QTR: 2013- 00260 Wafer Process: PHEMT-H HMC797 HMC863 HMC864 HMC906 HMC907 HMC928 HMC929 HMC943 HMC968 HMC969 HMC1024 HMC5622 HMC5445 HMC5805 HMC5927 HMC5927C HMC5929 HMC5929C HMC5981 HMC6242 HMC6503 Rev: 04 QTR: 2013- 00260 Wafer Process: PHEMT-H Rev: 04 Introduction The testing performed for this report is designed to accelerate the predominant failure mode, electro-migration (EM), for the devices under test. The devices are stressed at high temperature and DC biased to simulate a lifetime of use at typical operating temperatures. Using the Arrhenius equation, the acceleration factor (AF) is calculated for the stress testing based on the stress temperature and the typical use operating temperature. This report is intended to summarize all of the High Temperature Operating Life Test (HTOL) data for the PHEMT-H process. The FIT/MTTF data contained in this report includes all the stress testing performed on this process to date and will be updated periodically as additional data becomes available. Data sheets for the tested devices can be found at www.hittite.com. Glossary of Terms & Definitions: 1. HTOL: High Temperature Operating Life. This test is used to determine the effects of bias conditions and temperature on semiconductor devices over time. It simulates the devices’ operating condition in an accelerated way, through high temperature and/or bias voltage, and is primarily for device qualification and reliability monitoring. This test was performed in accordance with JEDEC JESD22-A108. 2. Operating Junction Temp (Toj): Temperature of the die active circuitry during typical operation. 3. Stress Junction Temp (Tsj): Temperature of the die active circuitry during stress testing. QTR: 2013- 00260 Wafer Process: PHEMT-H Rev: 04 Qualification Sample Selection: All qualification devices used were manufactured and tested on standard production processes and met pre-stress acceptance test requirements. Summary of Qualification Tests: HMC863 (QTR11012) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 71 71 Complete HTOL, 1000 hours 71 71 Complete Post HTOL Electrical Test 71 71 Pass NOTES HMC1050 & HMC1051 (QTR2012-00166) TEST Initial Electrical HTOL, 2000 hours Post HTOL Electrical Test QTY IN 24 24 24 24 24 24 QTY OUT 24 24 24 24 24 24 PASS/FAIL Complete Complete Pass NOTES HMC1050 HMC1051 QTR: 2013- 00260 Wafer Process: PHEMT-H Rev: 04 HMC1050 & HMC1051 (QTR2012-00166) TEST Initial Electrical HTOL, 3500 hours Post HTOL Electrical Test QTY IN 20 20 20 20 20 20 QTY OUT 20 20 20 20 20 20 PASS/FAIL QTY OUT 73 73 73 73 73 73 PASS/FAIL Complete NOTES HMC1050 HMC1051 Complete Pass HMC1050 & HMC1051 (QTR2012-00371) TEST Initial Electrical HTOL, 3500 hours Post HTOL Electrical Test QTY IN 73 73 73 73 73 73 Complete Complete Pass NOTES HMC1050 HMC1051 QTR: 2013- 00260 Wafer Process: PHEMT-H Rev: 04 PHEMT-H Failure Rate Estimate Based on the HTOL test results, a failure rate estimation was determined using the following parameters: With Device Operating Case Temp = 85°C HMC863 (QTR11012) Operating Junction Temp (Toj) =150°C(423°K) Stress Junction Temp (Tsj) = 242°C(515°K) HMC1050 & HMC1051 (QTR2012-00166) Operating Junction Temp (Toj) =131°C(404°K) Stress Junction Temp (Tsj) = 131°C(404°K) HMC1050 & HMC1051 (QTR2012-00166) Operating Junction Temp (Toj) =131°C(404°K) Stress Junction Temp (Tsj) = 131°C(404°K) HMC1050 & HMC1051 (QTR2012-00371) Operating Junction Temp (Toj) =150°C(423°K) Stress Junction Temp (Tsj) = 150°C(423°K) Device hours: HMC863 (QTR11012) = (71 X 1000hrs) = 71,000 hours HMC1050 & HMC1051 (QTR2012-00166) = (48 X 2000hrs) = 96,000 hours HMC1050 & HMC1051 (QTR2012-00166) = (40 X 3500hrs) = 140,000 hours HMC1050 & HMC1051 (QTR2012-00371) = (146 X 1000hrs) = 146,000 hours For PHEMT-H MMIC, Activation Energy = 1.7 eV Acceleration Factor (AF): QTR: 2013- 00260 Wafer Process: PHEMT-H Rev: 04 HMC863 (QTR11012) Acceleration Factor = exp[1.7/8.6 e-5(1/423-1/515)] = 4222.4 HMC1050 & HMC1051 (QTR2012-00166) Acceleration Factor = exp[1.7/8.6 e-5(1/404-1/404)] = 1.0 HMC1050 & HMC1051 (QTR2012-00166) Acceleration Factor = exp[1.7/8.6 e-5(1/404-1/404)] = 1.0 HMC1050 & HMC1051 (QTR2012-00371) Acceleration Factor = exp[1.7/8.6 e-5(1/423-1/423)] = 1.0 Equivalent hours = Device hours x Acceleration Factor Equivalent hours = (71,000x4222.4)+(96,000x1.0)+(140,000x1.0)+(146,000x1.0) = 3.00x108 hours Since there were no failures and we used a time terminated test, F=0, and R = 2F+2 = 2 The failure rate was calculated using Chi Square Statistic: at 60% and 90% Confidence Level (CL), with 0 units out of spec and a 85°C package backside temp; Failure Rate 8 λ60 = [(χ2)60,2]/(2X 3.00x10 )] = 1.8/ 6.00x108 = 3.05x10-9 failures/hour or 3.0 8 λ90 = [(χ2)90,2]/(2X 3.00x10 )] = 4.6/ 6.00x108 = 7.68x10-9 failures/hour or 7.7 FIT or MTTF = 3.28x107 Hours FIT or MTTF = 1.30x108 Hours