Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 23 December 2015, 12:59 GMT Diotec Semiconductor AG DUNS number: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations authorised by: Udo Steinebrunner, Product Manager, - Declaration effective from: 1 January 2004 [Approved on 23 January 2014, 06:50 GMT] Materials and substances Use/Location Chip (die) Die attach Encapsulation Leadfinish Leadframe Material group Other inorganic materials Lead and Lead alloys EP (Epoxy resin) Tin plating % w/w of material in the part 7.70000% 0.80000% 45.00000% 3.50000% Copper (e.g. copper amounts in cable harnesses) 43.00000% Substances in the material CAS Number % w/w of substance in the material Nickel 7440-02-0 1.00000% Gold 7440-57-5 11.50000% Polydimethyl siloxane 63148-62-9 25.00000% Silicon 7440-21-3 62.50000% Silver 7440-22-4 2.50000% Tin 7440-31-5 5.00000% Lead 7439-92-1 92.50000% Carbon black 1333-86-4 0.30000% Epoxy resin 89 26335-32-0 28.30000% Quartz sand 60676-86-0 71.40000% Copper 7440-50-8 0.30000% Silver 7440-22-4 3.20000% Tin 7440-31-5 96.50000% Copper 7440-50-8 100.00000% Attached parts list Part number Part name Part Mass Part Mass UoM MicroDil/3x3x1.8/1.5 Bridge Rectifier Dual Inline 0.04 g Page 1 Report generated: 23 December 2015, 12:59 GMT