TE Analog Devices Welcomes Hittite Microwave Corporation O B SO LE NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com TE O B SO LE THIS PAGE INTENTIONALLY LEFT BLANK HMC647 v01.0208 Typical Applications Features The HMC647 is ideal for: Low RMS Phase Error: 1.0° • EW Receivers Low Insertion Loss: 4 dB • Weather & Military Radar High Linearity: +54 dBm • Satellite Communications Positive Control Logic • Beamforming Modules 360° Coverage, LSB = 5.625° Functional Diagram TE Die Size: 3.85 x 1.90 x 0.1 mm • Phase Cancellation General Description B SO LE The HMC647 is a 6-bit digital phase shifter die which is rated from 2.5 to 3.1 GHz, providing 360 degrees of phase coverage, with a LSB of 5.625 degrees. The HMC647 features very low RMS phase error of 1.0 degrees and extremely low insertion loss variation of ±0.5 dB across all phase states. This high accuracy phase shifter is controlled with positive control logic of 0/+5V, and is internally matched to 50 Ohms with no external components. Electrical Specifi cations, TA = +25° C, Vss= -5V, Vdd= +5V, Control Voltage = 0/+5V, 50 Ohm System O PHASE SHIFTERS - DIGITAL - CHIP 3 GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 2.5 - 3.1 GHz Parameter Frequency Range Min. Typ. 2.5 Insertion Loss* 4 Input Return Loss* 16 Output Return Loss* 17 Phase Error* ±3 RMS Phase Error Insertion Loss Variation* Max. Units 3.1 GHz 6 dB dB dB +5 / -15 1.0 deg ±0.5 dB Input Power for 1 dB Compression 31 dBm Input Third Order Intercept 54 dBm Control Voltage Current 35 250 μA Bias Control Current 5 15 mA *Note: Major States Shown 3 - 32 deg For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC647 v01.0208 GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 2.5 - 3.1 GHz Insertion Loss, Major States Only Normalized Loss, Major States Only 0 4 3 -6 -10 0 -1 -2 -3 -12 -4 2 2.4 2.8 3.2 3.6 2 FREQUENCY (GHz) 2.4 3.2 3.6 LE 0 Phase Error, Major States Only 20 15 -5 -15 -20 -30 2 B SO -10 -25 2.4 2.8 3.2 10 5 0 -5 -10 -15 -20 3.6 2 2.4 FREQUENCY (GHz) O Output Return Loss, Major States Only 2.8 3.2 3.6 FREQUENCY (GHz) Relative Phase Shift Major States, Including All Bits 0 RELATIVE PHASE SHIFT (degrees) 400 -5 RETURN LOSS (dB) 2.8 FREQUENCY (GHz) Input Return Loss, Major States Only RETURN LOSS (dB) 3 1 TE -8 2 PHASE SHIFTERS - DIGITAL - CHIP NORMALIZED LOSS (dB) -4 PHASE ERROR (degrees) INSERTION LOSS (dB) -2 -10 -15 -20 -25 -30 350 300 250 200 150 100 50 0 2 2.4 2.8 FREQUENCY (GHz) 3.2 3.6 2 2.4 2.8 3.2 3.6 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 33 HMC647 v01.0208 GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 2.5 - 3.1 GHz Input IP3, Major States Only 30 80 25 75 20 70 IP3 (dBm) RMS AVERAGE MAX 15 10 0 2.6 2.7 2.8 2.9 3.0 40 2.5 3.1 2.6 2.7 2.8 2.9 3.0 3.1 3.0 3.1 3.0 3.1 LE 3.0 P1dB (dBm) B SO 120 30 25 20 15 10 2.5 3.1 2.6 FREQUENCY (GHz) O INSERTION LOSS (dB) +25C +85C -55C 0 -5 2.7 2.8 2.9 0 5 2.6 2.8 Insertion Loss vs. Temperature, Major States Only 15 10 2.7 FREQUENCY (GHz) 20 RELATIVE PHASE SHIFT (degrees) 2.9 35 RMS Phase Error vs. Temperature 2.9 FREQUENCY (GHz) 3 - 34 2.8 40 130 -10 2.5 2.7 Input P1dB, Major States Only 140 80 2.5 2.6 FREQUENCY (GHz) Input IP2, Major States Only 90 55 45 FREQUENCY (GHz) 100 60 50 -5 110 65 TE 5 -10 2.5 IP2 (dBm) PHASE SHIFTERS - DIGITAL - CHIP 3 RELATIVE PHASE SHIFT (degrees) Relative Phase Shift, RMS, Average, Max, All States 3.0 3.1 -2 -4 -6 -8 -10 2.5 2.6 2.7 2.8 2.9 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC647 v01.0208 GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 2.5 - 3.1 GHz Absolute Maximum Ratings 5 0 -5 -10 0 45 90 135 180 225 270 315 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 0 0 0 0 0 0 Reference* 1 0 0 0 0 0 5.625 1 150 °C Thermal Resistance (channel to die bottom) 140 °C/W Storage Temperature -65 to +150 °C B SO Bit 1 Phase Shift (Degrees) RFIN - RFOUT 0 +0.2 to -12V Channel Temperature (Tc) 1 0 0 0 0 11.25 0 1 0 0 0 22.5 0 0 1 0 0 45.0 0 -55 to +85 °C Bias Voltage & Current Control Voltage Input 0 Bias Voltage Range (Vss) LE Truth Table 0 -0.2 to +12V ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS 360 STATE (degrees) 0 33 dBm (T= +85 °C) Bias Voltage Range (Vdd) Operating Temperature 2.7, 2.8, 2.9, 3.0, 3.1 GHz 0 Input Power (RFIN) TE PHASE ERROR (degrees) 10 0 0 1 0 0 0 0 1 180.0 1 1 1 1 1 354.375 Idd 5.0 5.3mA Vss Iss -5.0 5.3mA Control Voltage 90.0 0 Vdd State Bias Condition Low (0) 0 to 0.2 Vdc High (1) Vdd ±0.2 Vdc @ 35 μA Typ. Any combination of the above states will provide a phase shift approximately equal to the sum of the bits selected. *Reference corresponds to monotonic setting 3 PHASE SHIFTERS - DIGITAL - CHIP Phase Error vs. State O Pad Descriptions Pad Number Function Description 1 RFIN This port is DC coupled and matched to 50 Ohms. 2, 11 GND These pads and die bottom must be connected to RF/DC ground. 3 Vdd Supply voltage. 4 - 6, 8 - 10 BIT1, BIT2, BIT3, BIT4, BIT5. BIT6 Control Input. See truth table and control voltage tables. 7 Vss Supply voltage. 12 RFOUT This port is DC coupled and matched to 50 Ohms. Interface Schematic For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 35 HMC647 v01.0208 GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 2.5 - 3.1 GHz Outline Drawing TE LE B SO Die Packaging Information [1] Standard Alternate GP-1 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. NOTES: 1. ALL DIMENSIONS IN INCHES (MILLIMETERS) 2. DIE THICKNESS IS 0.004 3. BACKSIDE METALLIZATION: GOLD 4. BACKSIDE METAL IS GROUND 5. BOND PADS METALLIZATION: GOLD 6. OVERALL DIE SIZE ±0.002 O PHASE SHIFTERS - DIGITAL - CHIP 3 3 - 36 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC647 v01.0208 GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 2.5 - 3.1 GHz Assembly Diagram Follow these precautions to avoid permanent damage. B SO Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean and fl at. PHASE SHIFTERS - DIGITAL - CHIP Handling Precautions LE TE 3 O Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils). For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 37