MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 8 April 2016, 12:51 GMT
Diotec Semiconductor AG
DUNS-Nummer: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations Autorisiert durch:
Udo Steinebrunner, Product Manager, -
Deklaration gilt ab: 1 May 2009 [Approved on 8 April 2016, 12:53 GMT]
Materialien und Stoffe
Verwendung/Andordnung
Chip (die)
Die attach
Encapsulation
Material
group
Other
inorganic
materials
Lead and
Lead alloys
EP (Epoxy
resin)
% w/w des
Materials
im Artikel
0.30000%
1.27000%
41.26000%
Leadfinish
Tin plating
1.38000%
Leadframe
Copper (e.g.
copper
amounts in
cable
harnesses)
55.79000%
Substances in the
material
CAS Number
% w/w des
Stoffs im
Artikel
Nickel
7440-02-0
1.00000%
Gold
7440-57-5
11.50000%
Polydimethylsiloxane
63394-02-5
rubber
25.00000%
Silicon
7440-21-3
62.50000%
Silver
7440-22-4
2.50000%
Tin
7440-31-5
5.00000%
Lead
7439-92-1
92.50000%
Carbon black
1333-86-4
0.30000%
Epoxy resin 89
26335-32-0
28.30000%
Quartz sand
60676-86-0
71.40000%
Silver
7440-22-4
3.50000%
Tin
7440-31-5
96.50000%
Copper
7440-50-8
100.00000%
Beigefügte Artikelliste
Part number
Artikelbezeichnung
Artikelmasse
Artikelmasse
UoM
TO-269AA/MiniDIL
Bridge Rectifier Dual Inline
0.1
g
Page 1
Report generated: 8 April 2016, 12:51 GMT