ZENIGATA LED
June 15, 2016
SPECIFICATIONS
MINI ZENIGATA-LED
GW6B*G**HD6
*G**:MG27,MG30,MG40
GG27,GG30
Notice
Contents in this technical document be changed without any notice due to the product modification.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc.
LIGHTING DEVICE BUSINESS UNIT
http://www.sharp-world.com/products/device/
ELECTRONIC COMPONENTS AND DEVICES COMPANY
SHARP CORPORATION
sharp LD-E15-4-16-A
Model No. GW6B*G**HD6
“Contents in this technical document be changed without any notice due to the product modification.”
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1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp").
Please handle with great cares and do not reproduce or cause anyone to reproduce them without Sharp's consent.
2. When using this Sharp product, please observe the absolute maximum ratings, other conditions and instructions for use
described in the specification sheets, as well as the precautions mentioned below.
Sharp assumes no responsibility for any damages resulting from use of the product which does not comply with absolute
maximum ratings, other conditions and instructions for use included in the specification sheets, and the precautions
mentioned below.
(Precautions)
(1) In making catalogue or instruction manual based on the specification sheets, please verify the validity of the catalogue
or instruction manuals after assembling Sharp products in customer's products at the responsibility of customer.
(2) This Sharp product is designed for use in the following application areas ;
• Computers • OA equipment • Telecommunication equipment (Terminal) • Measuring equipment
• Tooling machines ・ Audio visual equipment • Home appliances
If the use of the Sharp product in the above application areas is for equipment listed in paragraphs (3) or (4),
please be sure to observe the precautions given in those respective paragraphs.
(3) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall
system and equipment, should be taken to ensure reliability and safety when Sharp product is used for equipment
in responsibility of customer which demands high reliability and safety in function and precision, such as ;
• Transportation control and safety equipment (aircraft, train, automobile etc.)
• Traffic signals • Gas leakage sensor breakers • Rescue and security equipment
• Other safety equipment
(4)Sharp product is designed for consumer goods and controlled as consumer goods in production and quality.
Please do not use this product for equipment which require extremely high reliability and safety in function and
precision, such as ;
• Space equipment • Telecommunication equipment (for trunk lines)
• Nuclear power control equipment • Medical equipment
(5) Please contact and consult with a Sharp sales representative if there are any question regarding interpretation of
the above four paragraphs.
3. Disclaimer
The warranty period for Sharp product is one (1) year (or six (6) months in case of generalized product) after shipment.
During the period, if there are any products problem, Sharp will repair (if applicable), replace or refund.
Except the above, both parties will discuss to cope with the problems.
The failed Sharp product after the above one (1) year ( or six (6) month for generalized product) period will be coped
with by Sharp, provided that both parties shall discuss and determine on sharing responsibility based on the analysis results
thereof subject to the above scope of warranty.
The warranty described herein is only for Sharp product itself which are purchased by or delivered to customer.
Damages arising from Sharp product malfunction or failure shall be excepted.
Sharp will not be responsible for the Sharp product due to the malfunction or failures thereof which are caused by:
(1) storage keep trouble during the inventory in the marketing channel.
(2) intentional act, negligence or wrong/poor handling.
(3) equipment which Sharp products are connected to or mounted in.
(4) disassembling, reforming or changing Sharp products.
(5) installation problem.
(6) act of God or other disaster (natural disaster, fire, flood, etc.)
(7) external factors (abnormal voltage, abnormal electromagnetic wave, fire, etc.)
(8) special environment (factory, coastal areas, hotspring area, etc.)
(9) phenomenon which cannot be foreseen based on the practical technologies at the time of shipment.
(10) the factors not included in the product specification sheet.
4. Please contact and consult with a Sharp sales representative for any questions about Sharp product.
sharp LD-E15-4-16-A
Model No. GW6B*G**HD6
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GW6B*G**HD6 specifications
1. Application
These specifications apply to the light emitting diode module Model No. GW6B*G**HD6.
[ LED module (InGaN Blue LED chip + Phosphor) ]
Main application : Lighting
2. External dimensions and equivalent circuit
Refer to Page 2.
3. Ratings and characteristics
Refer to Page 3 ～ 6.
3-1. Absolute maximum ratings
3-2. Electro-optical characteristics
3-3. Derating curve
3-4. Characteristics diagram (TYP.)
Refer to Page 7.
4．Reliability
4-1. Test items and test conditions
4-2. Failure criteria
Refer to Page 8.
5．Quality level
5-1. Applied standard
5-2. Sampling inspection
5-3. Inspection items and defect criteria
Refer to Page 9 ～ 12.
6．Supplements
6-1. Chromaticity rank table
6-2. Packing
6-3. Label
6-4. Indication printed on product
Refer to Page 13 ～ 15.
7．Precautions
1
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2．External dimensions and equivalent circuit
15.0
+0.5 / -0.1
①
(11.6)
（Unit︓mm）
12.0
+0.5 / -0.1
②
Top view (6.5)
3.5
1.4
（Φ10.0）
±0.1
±0.1
（Φ8.8）
Side view
(1.4)
1.0
±0.1
Values inside parentheses are reference values.
External sizes of ①, ② are determined by maximum dimensions,
that include salient areas on the edges of respective sides.
R
＋connection
terminal
－connection
terminal
12 series × 2 parallel ＝ 24 pcs of LEDs
2
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3．Ratings and characteristics
3-1. Absolute maximum ratings
Item
Symbol
Rating
Unit
Power Dissipation ※1,4
P
15.2
W
Forward Current ※1,4
IF
400
mA
Reverse Voltage ※2,4
VR
-15
V
Operating Temperature ※3
Topr
-30 ～ +100
℃
Storage Temperature
Tstg
-40 ～ +100
℃
Junction Temperature
Tj
145
℃
（※１）Power dissipation and forward current are the values when the module temperature
is set lower than the rating by using an adequate heat sink.
（※２）The maximum rating of reverse voltage is assumed, after considering the voltage that occur
due to initial connection error that may occur suddenly.
(Not dealing with the possibility of always-on reverse voltage.)
（※３）Operating temperature is the Case temperature Tc
(Refer to measuring point for case temperature in the next page.)
Refer to "Derating curve" in the next page as for operating current.
（※４）Tc=25℃
3
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3-2.Electro-optical characteristics
Above lumen values are center number of minimum and maximum values of each color temperature.
Actual performance is known by rank information of each delivery.
MG**
Item
common Forward Voltage※5
27
30
40
（Tj＝90℃）
Symbol
Condition
MIN.
TYP.
MAX.
Unit
VF
I F =200mA
31.1
（34.5）
37.9
V
Luminous Flux※６
Φ
745
（830）
-
lm
Chromaticity
x
-
（0.4610）
-
-
Coordinates※７
y
-
（0.4150）
-
-
Color Temperature
-
-
（2 720）
-
K
General Color
Rendering Index※8
Ra
80
（83）
-
-
Luminous Flux※６
Φ
795
（885）
-
lm
Chromaticity
x
-
（0.4370）
-
-
Coordinates※７
y
-
（0.4030）
-
-
Color Temperature
-
-
（2 990）
-
K
General Color
Rendering Index※8
Ra
80
（83）
-
-
Luminous Flux※６
Φ
830
（925）
-
lm
Chromaticity
x
-
（0.3820）
-
-
Coordinates※７
y
-
（0.3800）
-
-
Color Temperature
-
-
（3 980）
-
K
General Color
Rendering Index※8
Ra
80
（83）
-
-
Luminous Flux※６
Φ
630
（700）
-
lm
Chromaticity
x
-
（0.4610）
-
-
Coordinates※７
y
-
（0.4150）
-
-
Color Temperature
-
-
（2 720）
-
K
General Color
Rendering Index※8
Ra
90
（93）
-
-
Luminous Flux※６
Φ
675
（750）
-
lm
Chromaticity
x
-
（0.4370）
-
-
Coordinates※７
y
-
（0.4030）
-
-
Color Temperature
-
-
（2 990）
-
K
Ra
90
（93）
-
-
I F =200mA
I F =200mA
I F =200mA
GG**
27
30
General Color
Rendering Index※8
I F =200mA
I F =200mA
※５(After 20 ms drive, Measurement tolerance: ± 3 %)
(Note) Values inside parentheses are shown for reference purpose only.
※６ Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPD-LE3400
(After 20 ms drive, Measurement tolerance: ± 10 %)
※７ Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPD-LE3400
(After 20 ms drive, Measurement tolerance: ± 0.005)
※８ Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPD-LE3400
(After 20 ms drive, Measurement tolerance: ± 2)
4
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3-3.Derating curve
Forward Current Derating Curve
Forward Current I F [mA]
500
400
300
200
100
0
-30 -20 -10
0
10
20
30
40
50
60
70
80
90
100 110
Case Temperature Tc[℃]
(Note) To keep the case temperature lower than the rating, enough heat-radiation performance needs to
be secured by using an adequate heat sink (refer to section 7-③).
For soldering connection, please evaluate in your usage environment to make sure soldering reliability.
( Above derating curve is specified to LED device, not for soldering connection )
And please consider to avoid physical stress between wire and substrate,
and some protection like silicon bond on top of soldered wire is recommended.
Please ensure the maintenance of heat radiation does not exceed case temperature over the rating
in operation.
（Measuring point for case temperature）
Please take note of the following, when measuring case temperature.
1 The LED device mounting surface should be flat/plain surface.
2 The substrate surface temperature should be uniform.
measuring point
Thermal Resistance: 3.4 ℃/W(Typical value)
5
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3-4.Characteristics diagram (TYP.)
Forward Voltage vs. Forward Current
Forward Current vs. Relative Luminous Flux
T j ＝90℃
450
Forward Current I F [mA]
Relative Luminous Flux [%]
200
180
160
140
120
100
80
60
40
20
0
T j ＝90℃
400
350
300
250
200
150
100
50
0
0 50 100 150 200 250 300 350 400 450
Forward Current I F [mA]
I F =200mA
Relative Luminous Flux [%]
Forward Voltage V F [V]
80
60
40
20
0
30
60
Case Temperature Tc[℃]
33
34
35
36
37
Forward Voltage V F [V]
38
I F =200mA
38
100
0
32
Case Temperature vs. Forward Voltage
Case Temperature vs. Relative Luminous Flux
120
31
37
36
35
34
33
90
0
30
60
Case Temperature Tc[℃]
90
(Note) Characteristics data shown here are for reference purpose only. (Not guaranteed data)
6
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Tc=90℃,I F =280mA,Time=1000 時間
4．Reliability
The reliability of products shall be satisfied with items listed below.
Confidence level:90％
No.
Test item
1
Temperature Cycle
2
Temperature Humidity
3
High Temperature
4
5
6
Storage
Test conditions
C
(%)
- 40 ℃(30 min) ～ + 100 ℃(30 min), 100 cycles
11
0
20
Tstg = + 60 ℃, RH = 90 %, Time = 1000 h
11
0
20
Tstg = + 100℃, Time = 1000 h
11
0
20
Tstg = - 40 ℃, Time = 1000 h
11
0
20
Tc = 90 ℃, I F = 280 mA, Time = 1000 h
11
0
20
5
0
50
5
0
50
Low Temperature
Storage
Life
2
Acceleration: 15000 m/s , Pulse width: 0.5 ms
Shock
LTPD
n
Storage
Steady State Operating
Samples Defective
Direction: 3 directions (X, Y and Z)
3 trials in each direction
Frequency: 100 to 2000 Hz for 4 minutes per trial
7
Vibration
Acceleration: 200 m/s
2
Direction: 3 directions (X, Y and Z)
4 trials in each direction
4-2.Failure criteria
No.
1
2
Parameter
Forward Voltage
Luminous Flux
Symbol
Failure criteria
V F ＞ Initial value ×1.1
Φ ＜ Initial value ×0.7
VF
Φ
7
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5．5．Quality level
5-1.Applied standard(ISO2859-1)
5-2.Sampling inspection A single normal sampling plan, level S-4.
5-3.Inspection items and defect criteria
No.
Item
Defect criteria
1
No radiation
No light emitting
2
3
Electro-optical
characteristics
External
Not conforming to the specification
dimensions
(Forward voltage, Luminous flux and Chromaticity values)
as defective only when electro-optical characteristics is affected by.
<If any question arises regardless of above mentioned criterion>
Appearance
Major
defect
AQL
0.1
Not conforming to the specification
Nonconformity observed in product appearance is determined
4
Classification
Major
defect
0.4
■Foreign material, scratch, or bubble at emitting area: 0.8 mm φ
■Fiber generation at emitting area: 0.2 mm in width and 2.5 mm in length
■Foreign material at connection terminal: 0.8 mm φ
■Substrate burr on edge: Over dimension tolerance
(Note) Products with removable foreign material attached on are not determined to be defective.
(Note) Substrate cracks that do not effect the electrical/optical charecteristics are not determined to be defective.
8
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6．Supplements
6-1.Chromaticity rank table
(Tolerance︓x,y±0.005)
(I F =200mA,Tj=90℃)
2 700K
Center Point
Color Region
Oval parameter
Major Axis
Major Axis
Ellipse
Rotation Angle
a
b
Θ
0.00774
0.00411
57.28
（ ｘ , ｙ ）
3-step
MacAdam ellipse
0.4610
0.4150
(I F =200mA,Tj=90℃)
3 000K
Center Point
Color Region
Oval parameter
Major Axis
Major Axis
Ellipse
Rotation Angle
a
b
Θ
0.00834
0.00408
53.17
（ ｘ , ｙ ）
3-step
MacAdam ellipse
0.4370
0.4030
(I F =200mA,Tj=90℃)
4 000K
Center Point
Color Region
Oval parameter
Major Axis
Major Axis
Ellipse
Rotation Angle
a
b
Θ
0.00939
0.00402
54.00
（ ｘ , ｙ ）
3-step
MacAdam ellipse
0.3820
0.3800
※ Color region stay within MacAdam 3-step ellipse from the chromaticity center.
※ Θ Is the angle between the major axis of the ellipse and the x-axis,and b are major and
minor semi-axes of an ellipse.(Ref. IEC 60081:1997 AnnexD)
2 700K Chromaticity Diagram
0.435
y
0.425
0.415
1
0.405
2800K
0.395
0.440
0.450
2700K
2600K
0.460
x
9
0.470
0.480
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3 000K Chromaticity Diagram
0.425
0.415
y
0.405
1
0.395
3000K 2900K
3100K
0.385
0.415
0.425
0.435
x
0.445
0.455
4 000K Chromaticity Diagram
0.400
y
0.390
0.380
1
0.370
3900K
4100K
4000K
0.360
0.360
0.370
3800K
0.380
x
10
0.390
0.400
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6-2.Packing
■ One tray composed of 80 pieces
■ 5 trays (400 piecies) and one upper lid-tray in one moisture-proof bag
■ 2 bags (800 pieces) in one carton
■ Dimensions of outer carton: 235 × 220 × 90 mm (Reference value)
(Note 1) There are cases of one carton composed of one bag. (400 pieces)
(Note 2) State of packing is subject to change.
＜Outer carton＞
＜One bag＞
400 pieces × 2 bags = 800 pieces 80 pieces × 5 trays = 400 pieces
＜One tray＞
10 × 8 ＝ 80 pieces
(225mm)
silica gel
silica gel
11
(210mm)
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6-3.Label
1)Outer carton
Following label is attached on outer carton.
・ Lot No. indication
(Note 3) Label format is subjected to change.
XX 11 B 25
① ② ③ ④
① Production plant code A
SHIPMENT TABLE
PART No. GW6B*G**HD6
← Model number
(GW6B*G**HD6M)
←（Model number + suffix code）
QUANTITY︓800
LOT No.
XX11B25
RANK
SHARP
← Quantity
CORPORATION
MADE IN ***********
③ Shipping month
← Lot No.
1
RC
(from January to December in ABC order)
← Rank
← Production country
④ Shipping date（01 ～ 31）
・ MADE IN ****
※Notation may be different
・ MADE IN ****
SHARP LABEL
② Shipping year（Year last 2 digits）
・ Lot No. indication
1)Moisture-Proof bag
Following label is attached on moisture-proof bags.
XX 1 9 G 11 123 A
① ② ③ ④ ⑤ ⑥ ⑦
(Note 3) Label format is subjected to change.
① Production plant code B
SHIPMENT TABLE
PART No. GW6B*G**D6
QUANTITY︓400 RANK １
SHARP
5020G2064A
CORPORATION
MADE IN ***********
③ Shipping month（1 ～ 9 or O, N, D）
←（Model number+ suffix code）
(GW6B*G**HD6M)
LOT No.
② Shipping year（Year last digit）
← Model number
④ Fixed code G
← Quantity and Rank
⑤ Shipping date（01 ～ 31）
← Lot No.
RC
⑥ Serial No.
← Production country
⑦ Backup code A
・ MADE IN ****
・ MADE IN ****
SHARP LABEL
※Notation may be different
Indication printed on product
Model No. and control No. are indicated on substrate surface.
1）Control No.
Indicated as follows;
*G**6
① - 1 F 11 ② ③ ④ ① Abbreviated Model No.
② Chromaticity Rank
③ Month of production
(to be indicated alphabetically with January corresponding to A)
④ with January corresponding to A)
Control No.
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7．Precautions
①
Storage conditions
Please follow the conditions below.
・Before opened: Temperature 5 ～ 30 ℃, Relative humidity less than 60 %.
(Before opened LED should be used within a year)
・After opened: Temperature 5 ～ 30 ℃, Relative humidity less than 60 %.
(Please apply soldering within 1 week)
・After opened LED should be kept in an aluminum moisture proof bag with a moisture
absorbent material (silica gel).
・Avoid exposing to air with corrosive gas.
If exposed, electrode surface would be damaged, which may affect soldering.
②
Usage conditions
This product is not designed for the use under any of the following conditions.
Please carefully check the performance and reliability well enough in case of using under any of the
following conditions;
・In a place with a lot of moisture, dew condensation, briny air, and corrosive gas.
(Cl, H2S, NH3, SO2, NOX, etc.)
・Under the direct sunlight, outdoor exposure, and in a dusty place.
・In water, oil, medical fluid, and organic solvent.
Please do not use component parts like rubber which may contain sulfur (gasket packing, adhesive material,
etc.).
Please note that any strong acidic or alcoholic elements could effect the silicon resin used in the LED device.
The heat and light released from the LED device, could generate halogen gas from the surrounding materials,
which may have adverse impact on the module. Before using please consider carefully about this issue.
③
Heat radiation and Installation
If forward current (IF) is applied to single-state module at any current, there is a risk of damaging LED
or emitting smoke, due to increase in temperature.
Equip with specified heat radiator(heat sink), and avoid heat being stuffed inside the module.
Material of substrate is alumina ceramic. If installed inappropriately, trouble of insufficient heat radiation may
occur , which may result in board cracks or lighting defects due to overheat. Please take particular notice for
installation.
Refer to the following cautions while installing the LED device on heat sink.
・Apply thermolysis adhesive, adhesive sheet or peculiar connector when mounted on heat radiator.
In case of applying adhesive or adhesive sheet only, check the effectiveness and reliability before fixing.
If LED comes off from heat radiator, unusual temperature rise entails hazardous phenomena including
device deterioration, coming off of solder at leads, and emitting smoke, along with LED device deffects.
・When LED device is mechanically fixed or locked, Please take into consideration regarding the method of
attachment due to fail from stress.
・Please apply appropriate stress and design carefully, when fixing the LED device using holder. Any
excessive or uneven stress could break LED deviceʼs substrate.
・Avoid convexly uneven boards.
Convex board is subject to substrate cracking or debasement of heat release.
・It is recommended to apply adhesive or adhesive sheet with high thermal conductivity
for radiation of heat effectively.
・Please take care about the influence of color change of adhesive or adhesive sheet in initial and long term
period, which may affect light output or color due to change of reflectance from backside.
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・Any excessive or uneven stress on the ceramic substrate could break the substrate. Please design such that,
proper/uniform stress is applied on the substrate, when fixing the LED device using a holder.
・When fixing the LED device with a holder, please take note if any excessive or uneven stress is applied
when pressing the substrate with holder. Due to this, the gap may arise between LED device and
adhesive material, which may affect the heat dissipation of the device.
・Do not touch resin part including white resin part on the surface of LED.
No light emission may occur due to damage of resin or cutting wire of LEDs by outer force.
When using tweezers, please handle by ceramic substrate part and avoid touching resin part.
For mounting, please handle by side part of ceramic or the specified area shown below.
(0.5)
(6.0)
Handring area
(4.0)
・The outer edges of the substrate may be uneven in some cases. Please avoid choosing these areas as fixing
points, while designing for installation.
・In case of using heat radiation sheet or heat radiation adhesive, light reflection or absorption of these
materials may influence the output of LED device. Especially, the color change that occur due to l
ong-term use has direct impact on output of LED devices, and hence careful consideration is required
while choosing the radiation sheet ro adhesive.
・Please avoid using any materials(such as PBT resin) that may release corrosive gases, around LED device.
④
Connecting method
Use soldering for conncetions. Follow the conditions mentioned below, to preserve the connection strength.
・Use soldering iron with thermo controller (tip temperature 380 ℃), within 5 seconds per one place.
・Secure the solderwettability on whole solder pad and leads.
・During the soldering process, put the ceramic board on materials whose conductivity is poor enough
not to radiate heat of soldering.
・Warm up (with using a heated plate) the substrate is recommended before soldering.
( preheat condition: 100 ℃ ～ 150 ℃, within 60 sec )
・Avoid touching any part of resin with soldering iron.
・This product is not designed for reflow and flow soldering.
・Avoid such lead arrangement as applying stress to solder-applied area.
・Please do not detach solder and make re-solder.
・Please solder evenly on each electrode.
・Please prevent flux from touching to resin.
・Do the soldering on stable stand. Avoid soldering on moving or vibrating objects.
・Please avoid touching the soldering unit to resin.
⑤
Static electricity
This product is subject to static electricity, so take measures like wearing wrist band to cope with it.
Install circuit protection device to drive circuit, if necessary.
14
sharp LD-E15-4-16-A
Model No. GW6B*G**HD6
“Contents in this technical document be changed without any notice due to the product modification.”
http://www.sharp-world.com/products/device/
⑥
Drive method
・Any reverse voltage cannot be applied to LEDs when they are in operation or not.
Design a circuit so that any flow of reverse or forward voltage can not be applied to LEDs
when they are out of operation.
・Module is composed of LEDs connected in both series and parallel.
Constant voltage power supply runs off more than specified current amount due to lowered VF
caused by temperature rise. Constant current power supply is recommended to drive.
・Be cautious while putting on/off the power supply, as excess current, excess voltage or reverse voltage may get
injucted to the device in some cases.
⑦
Cleaning
Avoid cleaning, since LED device may be effected in some cases by cleaning.
⑧
Color-tone variation
Chromaticity of this product is monitored by integrating sphere right after the operation.
Chromaticity varies depending on measuring method, light spread condition, or ambient temperature.
Please verify your actual conditions before use.
⑨
Safety
･Looking directly at LEDs for a long time may result in hurting your eyes.
･In case that excess current (over ratings) is supplied to the device, hazardous phenomena including
abnormal heat generation, emitting smoke, or catching fire can be caused.
Take appropriate measures to excess current and voltage.
・In case of solder connecting method, there is a possibility of fatigue failure by heat.
Please fix the leads in such case to protect from short circuit or leakage of electricity caused by contact.
・Please confirm the safety standards or regulations of application devices.
・Please be careful with substrate edges, that may injure your hands.
⑩
Other cautions
Guarantee covers the compliance to the quality standards mentioned in the specifications,
however it does not cover the compatibility with application of the end-use, including assembly
and usage environment.
In case any quality problems occurred in the application of end-use, details will be separately discussed
and determined between the parties hereto.
15
sharp LD-E15-4-16-A
http://www.sharp-world.com/products/device/