GP1S194HCZ0F

GP1S194HCZ0F
GP1S194HCZ0F
Gap : 1.7mm, Slit : 0.3mm
Phototransistor Output,
Compact Transmissive
Photointerrupter
■Description
■Agency approvals/Compliance
1. Compliant with RoHS directive (2002/95/EC)
GP1S194HCZ0F is a compact and low-profile,
transmissive photointerrupter with photo-transistor
output and detects an object between the emitter
and the detector.
The compact package has been molded by a unique
technology that is a combination of transfer and
injection molding.
■Applications
1. General purpose detection of object presence or
motion.
Example : Printer, lens control for camera
■Features
1. Transmissive with phototransistor output
2. Compact Gap Width : 1.7mm
3. Slit Width (detector side): 0.3mm
4. Package : 3.6×2.0×2.7mm
5. RoHS directive compliant
Notice
The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: OP13028EN
1
GP1S194HCZ0F
■Outline
Drawing No.CY12950i02
Scale : 10/1
Unit : mm
Sheet No.: OP13028EN
2
GP1S194HCZ0F
■Absolute maximum ratings
Parameter
Input
Output
Ta=25°C
Unit
Symbol
Rating
Forward current
IF
30
mA
Reverse voltage
VR
6
V
Power dissipation
P
75
mW
Collector-emitter voltage
VCEO
35
V
Emitter-collector voltage
VECO
6
V
Collector current
Ic
20
mA
Collector power dissipation
Pc
75
mW
Total power dissipation
Ptot
100
mW
Operating temperature
Topr
-25 to +85
°C
Storage temperature
Tstg
-40 to +100
°C
Tsol
260
°C
* Soldering temperature
* Soldering time : 3 s or less
0.3 mm or more
Soldering area
■Electro-optical characteristics
Input
Output
Parameter
Symbol
Forward voltage
VF
Reverse current
IR
Collector dark current
ICEO
Collector current
Transfer
characteris tics
Response time
Conditions
Ta=25°C
MAX.
Unit
MIN.
TYP.
IF=20mA
-
1.2
1.4
V
VR=3V
-
-
10
μA
VCE=20V
-
-
100
nA
150
-
600
μA
Ic
VCE=5V, IF=5mA
(Rise)
tr
-
50
150
μs
(Fall)
tf
VCE=5V, Ic=100μA
RL=1kΩ
-
50
150
μs
VCE(sat)
IF=10mA, Ic=40μA
-
-
0.4
V
Collector-emitter
saturation voltage
(Test circuit for response time)
Vcc
Input
RL
Test pin
Output
10%
90%
tr
tf
Sheet No.: OP13028EN
3
GP1S194HCZ0F
Foward current (mA)
Foward current vs. ambient temperature
50
40
30
20
10
5
0
-25
0
40
25
50
75 85
100
75
100
Power dissipation P, Pc, Ptot (mW)
Ambient temperature Ta (°C)
Power dissipation vs. ambient temperature
100
80
75
Total power dissipation
Input and output power dissipation
60
40
20
15
0
-25
0
25
50
85
Ambient temperature Ta (°C)
Sheet No.: OP13028EN
4
GP1S194HCZ0F
Shield
-
100
90
80
60
50
40
20
0
1
2
Shield distance L (mm)
+
Sensor
Test condition
IF=5.0mA
VCE=5V
Ta=25°C
10
-1
0
Shield distance L
Relative collector current (%)
Relative collector current vs. shield distance 1 (Reference value)
3
Shield
-
100
90
0
Shield distance L
Relative collector current (%)
Relative collector current vs. shield distance 2 (Reference value)
80
60
50
40
20
+
Sensor
10
-1
0
1
2
3
Shield distance L (mm)
Test condition
IF=5.0mA
VCE=5V
Ta=25°C
Sheet No.: OP13028EN
5
GP1S194HCZ0F
■Supplements
●Parts
Refer to the attached sheet, Page 8.
●Packing
Refer to the attached drawing No. CY12951i09B, Page 9.
●ODS materials
This product shall not contain the following materials.
Also, the following materials shall not be used in the production process for this product.
Materials for ODS : CFCS, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methyl chloroform)
●Specified brominated flame retardants
Specified brominated flame retardants (PBB and PBDE) are not used in this device at all.
●Compliance with each regulation
1) The RoHS directive(2002/95/EC)
This product complies with the RoHS directive(2002/95/EC)
Object substances: mercury,lead, cadmium,hexavalent chromium,polybrominated biphenyls (PBB)
and polybrominated diphenyl ethers (PBDE)
2) Content of six substances specified in Management Method for Control of Pollution Caused by Electronic
Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).
Toxic and hazardous substances
Hexavalent
Polybrominated
Polybrominated
Category
Lead
Mercury
Cadmium
chromium
biphenyls
diphenyl ethers
(Pb)
(Hg)
(Cd)
(Cr6+)
(PBB)
(PBDE)
Photointerrupter
✓
✓
✓
✓
✓
✓
✓: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part
is below the concentration limit requirement as described in SJ/T 11363-2006 standard.
●Product mass : Approximately 24mg
●Country of origin : Japan and China
Sheet No.: OP13028EN
6
GP1S194HCZ0F
■Notes
●Circuit design
In circuit designing, make allowance for the degradation of the light emitting diode output that results
from long continuous operation. (50% degradation/5 years)
●Prevention of detection error
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the
external light.
●Position of opaque board
Opaque board shall be installed at place 1.4mm or more from the top of elements.
(Example)
1.4mm or more
1.4mm or more
●Soldering
To solder onto lead pins, solder at the position of 0.3mm or more from the package's bottom at 260°C for 3s or less.
Please don't bend lead pins from the root of package when soldering.
Please also take care not to let any external force exert on lead pins.
Please don't do soldering with preheating, and please don't do soldering by reflow.
Please have soldering adjustment,etc. after GP1S194HCZ0F is cooled down, and also note that the outer mold
resin may be meltdown by heating for a long time.
●Cleaning
Cleaning shall be carried out under the below conditions to avoid keeping solvent, solder and flux on the device.
(1) Solvent cleaning : Solvent temperature 45°C or less, Immersion for 3min. or less
(2) Ultrasonic cleaning : Since the influence to the product may changes by the conditions of the
ultrasonic power, time, the tank size, PCB size, the product installation condition, etc.,
please evaluate with actual conditions and confirm before usage.
(3) The cleaning shall be carried out with solvent below.
Solvent : Ethyl alcohol, Methyl alcohol
●Lead pin
Lead terminals of this product are tin copper alloy plated. Before usage, please evaluate solder ability
with actual conditions and confirm. The uniformity in color for the lead terminals are not specified.
Sheet No.: OP13028EN
7
GP1S194HCZ0F
■Parts
This product uses the below parts.
●Light detector (Quantity : 1)
Type
Material
Maximum sensitivity
(nm)
Sensitivity
(nm)
Response time
(μs)
Phototransistor
Silicon
(Si)
930
700 to 1200
20
●Light emitter (Quantity : 1)
Type
Material
Maximum light emitting
wavelength (nm)
I/O Frequency
(MHz)
Infrared light emitting diode
(non-coherent)
GaAs
950
0.3
●Material
Case
Lead frame
Lead frame plating
Black PPS resin
(UL 94V-0)
42 Alloy
SnCu plating
●Others
This product shall not be proof against radiation flux.
Sheet No.: OP13028EN
8
GP1S194HCZ0F
■Packing (Drawing No.:CY12951i09B)
Sheet No.: OP13028EN
9
GP1S194HCZ0F
■Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection
with equipment that requires an extremely high level of
reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of SHARP
devices and are not intended to guarantee any circuit
design or license any intellectual property rights. SHARP
takes no responsibility for any problems related to any
intellectual property right of a third party resulting from
the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability.
Manufacturing locations are also subject to change without
notice.
· If the SHARP devices listed in this publication fall within
the scope of strategic products described in the Foreign
Exchange and Foreign Trade Law of Japan, it is necessary
to obtain approval to export such SHARP devices.
· Observe the following points when using any devices in
this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which does
not meet the conditions and absolute maximum ratings to
be used specified in the relevant specification sheet nor
meet the following conditions:
(i) The devices in this publication are designed for use in
general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP and
is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any use
of this publication may be made by a third party.
· Contact and consult with a SHARP representative if there
are any questions about the contents of this publication.
Sheet No.: OP13028EN
10