GP1S195HCZSF GP1S195HCZSF Gap : 1.5mm, Slit : 0.3mm Phototransistor Output, Compact Transmissive Photointerrupter ■Description ■Agency approvals/Compliance 1. Compliant with RoHS directive (2002/95/EC) GP1S195HCZSF is a compact and low-profile, transmissive photointerrupter with photo-transistor output and detects an object between the emitter and the detector. The compact package has been molded by a unique technology that is a combination of transfer and injection molding. ■Applications 1. General purpose detection of object presence or motion. Example : Printer, lens control for camera ■Features 1. Transmissive with phototransistor output 2. Compact Gap Width : 1.5mm 3. Slit Width (detector side): 0.3mm 4. Package : 3.4×2.0×2.7mm 5. RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: OP13030EN 1 GP1S195HCZSF ■Outline Drawing No.CY13002i02 Scale : 10/1 Unit : mm Sheet No.: OP13030EN 2 GP1S195HCZSF ■Absolute maximum ratings Parameter Input Output Ta=25°C Unit Symbol Rating Forward current IF 30 mA Reverse voltage VR 6 V Power dissipation P 75 mW Collector-emitter voltage VCEO 35 V Emitter-collector voltage VECO 6 V Collector current Ic 20 mA Collector power dissipation Pc 75 mW Total power dissipation Ptot 100 mW Operating temperature Topr -25 to +85 °C Storage temperature Tstg -40 to +100 °C Tsol 260 °C * soldering temperature * Soldering time : 3s or less ■Electro-optical characteristics Input Output Parameter Symbol Forward voltage VF Reverse current IR Collector dark current ICEO Collector current Transfer characteris tics Response time Conditions Ta=25°C MAX. Unit MIN. TYP. IF=20mA - 1.2 1.4 V VR=3V - - 10 μA VCE=20V - - 100 nA 150 - 600 μA Ic VCE=5V, IF=5mA (Rise) tr - 50 150 μs (Fall) tf VCE=5V, Ic=100μA RL=1kΩ - 50 150 μs VCE(sat) IF=10mA, Ic=40μA - - 0.4 V Collector-emitter saturation voltage (Test circuit for response time) Vcc Input RL Test pin Output 10% 90% tr tf Sheet No.: OP13030EN 3 GP1S195HCZSF Foward current IF (mA) Foward current vs. ambient temperature 50 40 30 20 10 5 0 -25 0 40 25 50 75 85 100 Power dissipation P, Pc, Ptot (mW) Ambient temperature Ta (°C) Power dissipation vs. ambient temperature 100 Total power dissipation 80 Input and output power dissipation 75 60 40 20 15 0 -25 0 25 50 75 85 100 Ambient temperature Ta (°C) Sheet No.: OP13030EN 4 GP1S195HCZSF Shield － 100 90 80 60 50 40 20 0 1 2 ＋ Sensor Test condition IF=5.0mA VCE=5V Ta=25°C 10 -1 ０ Shield distance L Relative collector current (%) Relative collector current vs. shield distance 1 (Reference value) 3 Shield distance L (mm) Relative collector current vs. shield distance 2 (Reference value) － 100 90 ０ Shield distance L Relative collector current (%) Shield 80 60 50 40 ＋ Sensor 20 10 -1 0 1 2 3 Shield distance L (mm) Test condition IF=5.0mA VCE=5V Ta=25°C Sheet No.: OP13030EN 5 GP1S195HCZSF ■Supplements ●Parts Refer to the attached sheet, Page 8. ●Packing Refer to the attached drawing No. CY13003i09B, Page 9. ●ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFCS, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methyl chloroform) ●Specified brominated flame retardants Specified brominated flame retardants (PBB and PBDE) are not used in this device at all. ●Compliance with each regulation 1) The RoHS directive(2002/95/EC) This product complies with the RoHS directive(2002/95/EC) Object substances: mercury,lead, cadmium,hexavalent chromium,polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) 2) Content of six substances specified in Management Method for Control of Pollution Caused by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法). Toxic and hazardous substances Hexavalent Polybrominated Polybrominated Category Lead Mercury Cadmium chromium biphenyls diphenyl ethers (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) Photointerrupter ✓ ✓ ✓ ✓ ✓ ✓ ✓: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard. ●Product mass : Approximately 22mg Sheet No.: OP13030EN 6 GP1S195HCZSF ■Notes ●Circuit design In circuit designing, make allowance for the degradation of the light emitting diode output that results from long continuous operation. (50% degradation/5 years) ●Prevention of detection error To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. ●Position of opaque board Opaque board shall be installed at place 1.4mm or more from the top of elements. (Example) 1.4mm or more 1.4mm or more ●Print circuit board design Because a portion of the internal lead may be exposed at the back of the product, please consider it in the pattern design for a print circuit board design. ●Soldering (1) Reflow soldering Please do only one soldering at the temperature and the time within the temperature profile in attachment-1. (2) Hand soldering To solder onto lead pins, please iron ahead temperature at260°C for 3seconds or less. Please also take care not to let mechanical stress exert on package and lead pins when soldering. Please have soldering adjustment, etc. after GP1S195HCZSF is cooled down, and also note that the outer mold resin may be meltdown by heating for a long time. In case that a soldering iron touches its package directly or in case that position adjustment on PWB is required, the solder at the 4 pins must be melt for repairing by using a hot plate set for getting 240°C at the surface of the PWB. Since the tip of the lead has exposed lead frame base material, there is a case not to be soldered, so please consider the soldering pattern on a print circuit board to solder well with the bottom and side surface of the lead. ●Cleaning Cleaning shall be carried out under the below conditions to avoid keeping solvent, solder and flux on the device. (1) Solvent cleaning : Solvent temperature 45°C or less, Immersion for 3min. or less (2) Ultrasonic cleaning : Since the influence to the product may changes by the conditions of the ultrasonic power, time, the tank size, PCB size, the product installation condition, etc., please evaluate with actual conditions and confirm before usage. (3) The cleaning shall be carried out with solvent below. Solvent :Ethyl alcohol, Methyl alcohol ●Lead pin Lead terminals of this product are tin copper alloy plated. Before usage, please evaluate solder ability with actual conditions and confirm. The uniformity in color for the lead terminals are not specified. ●Storage and management after open 1-1 Storage condition : Storage shall be in accordance with the below conditions. Storage temp. : 5 to 30°C Storage humidity : 70%RH or less 1-2 Treatment after open (1) After open, please mount at the conditions of humidity 60%RH or less and temperature 5 to 25°C within 2 days. In case that one times reflow soldering are required, please complete your 2nd reflow soldering within 2 days after the 1st reflow soldering. (2) In case of long time storage after open, please storage at the conditions of humidity 70%RH or less and temperature 5 to 30°C by using dry box or resealing with desiccant in moisture-proof bag by sealer and mount within 2 weeks. Sheet No.: OP13030EN 7 GP1S195HCZSF 1-3 Baking before mounting In case that it could not carry out the above treatment, it is able to mount with baking treatment. However baking treatment shall be limited only 1 time. Although it is possible to have baking treatment with the sleeve package, the sleeve may become warped in the heat. Since a fixing tape for the sleeve does not have enough heat resistance, please remove it before baking. Recommended baking conditions : 100°C, 16 to 24 hours ■Parts This product uses the below parts. ●Light detector (Quantity : 1) Type Material Maximum sensitivity (nm) Sensitivity (nm) Response time (μs) Phototransistor Silicon (Si) 930 700 to 1200 20 ●Light emitter (Quantity : 1) Type Material Maximum light emitting wavelength (nm) I/O Frequency (MHz) Infrared light emitting diode (non-coherent) GaAs 950 0.3 ●Material Case Lead frame Lead frame plating Black PPS resin (UL 94V-0) 42 Alloy SnCu plating ●Others This product shall not be proof against radiation flux. Sheet No.: OP13030EN 8 GP1S195HCZSF ■Packing (Drawing No.:CY13003i09B) Sheet No.: OP13030EN 9 GP1S195HCZSF (Attachment-1) Precautions for Soldering photointerrupter 1. In case of reflow soldering. Please do only one soldering at the temperature and the time within the temperature profile as shown in the figure below. MAX 240°C 1~4°C/s 200°C MAX 160°C 1~4°C/s 1~4°C/s 25°C MAX10s MAX120s MAX30s MAX60s 2. Other precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item 1. Also avoid immersing the resin part in the solder. Even if within the temperature profile above, there is the possibility that the gold wire in package is broken in case that the deformation of PCB gives the affection to lead pins. Please use after confirmation the conditions fully by actual solder reflow machine. Sheet No.: OP13030EN 10 GP1S195HCZSF ■Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: OP13030EN 11