AR3PD, AR3PG, AR3PJ www.vishay.com Vishay General Semiconductor Fast Switching Avalanche Surface Mount Rectifiers FEATURES eSMP ® Series • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement K • Glass passivated pellet chip junction • Fast reverse recovery time • Controlled avalanche characteristics 1 • Low leakage current 2 • High forward surge capability TO-277A (SMPC) K Cathode • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Anode 1 • AEC-Q101 qualified available - Automotive ordering code: base P/NHM3 Anode 2 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS PRIMARY CHARACTERISTICS IF(AV) 3.0 A VRRM 200 V, 400 V, 600 V IFSM 50 A trr 140 ns EAS 20 mJ VF at IF = 3.0 A 1.04 V TJ max. 175 °C Package TO-277A (SMPC) Diode variation Single die For use in lighting, fast switching rectification of power supplies, inverters, converters, and freewheeling diodes for consumer, automotive, and telecommunication. MECHANICAL DATA Case: TO-277A (SMPC) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3 - halogen-free, RoHS-compliant and AEC-Q101 qualified Base P/NHM3_X - halogen-free, RoHS-compliant and AEC-Q101 qualified (“_X” denotes revision code e.g. A, B,.....) Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix meets JESD 201 class 2 whisker test MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL Device marking code Maximum repetitive peak reverse voltage VRRM Peak forward surge current 10 ms single half sine-wave superimposed on rated load Non-repetitive avalanche energy at TJ = 25 °C IAS = 2.5 A max. IAS = 1.0 A typ. Operating junction and storage temperature range AR3PG AR3PJ AR3D AR3G AR3J 200 400 600 (1) 3.0 IF (2) 1.8 IFSM 50 IF Maximum DC forward current (fig. 1) AR3PD EAS TJ, TSTG 20 30 -55 to +175 UNIT V A A mJ °C Notes (1) Mounted on 14 mm x 14 mm pad areas, 1 oz. FR4 PCB (2) Free air, mounted on recommended pad area Revision: 23-Feb-16 Document Number: 89332 1 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AR3PD, AR3PG, AR3PJ www.vishay.com Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS Instantaneous forward voltage TA = 25 °C IF = 3.0 A Reverse current TA = 125 °C TA = 25 °C Rated VR TA = 125 °C SYMBOL VF (1) IR (2) TYP. MAX. 1.24 1.6 1.04 1.20 0.33 10 44 250 UNIT V μA Maximum reverse recovery time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A trr 122 140 ns Typical junction capacitance per diode Rated VR = 4.0 V, 1 MHz CJ 44 - pF AR3PJ UNIT Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: Pulse width 40 ms THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL RJA Typical thermal resistance AR3PD AR3PG (1) 85 RJM (2) °C/W 5 Notes (1) Free air, mounted on recommended PCB 1 oz. pad are; thermal resistance R JA - junction to ambient (2) Units mounted on PCB with 14 mm x 14 mm copper pad areas; R JM - junction to mount ORDERING INFORMATION (Example) PREFERRED P/N AR3PJ-M3/86A AR3PJ-M3/87A UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE 0.10 86A 1500 7" diameter plastic tape and reel 6500 13" diameter plastic tape and reel 0.10 87A (1) 0.10 86A 1500 7" diameter plastic tape and reel AR3PJHM3/87A (1) 0.10 87A 6500 13" diameter plastic tape and reel AR3PJHM3_A/H (1) 0.10 H 1500 7" diameter plastic tape and reel AR3PJHM3_A/I (1) 0.10 I 6500 13" diameter plastic tape and reel AR3PJHM3/86A Note (1) AEC-Q101 qualified Revision: 23-Feb-16 Document Number: 89332 2 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AR3PD, AR3PG, AR3PJ www.vishay.com Vishay General Semiconductor RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) 3.5 DC Forward Current (A) 3.0 2.5 TA = 25 °C 2.0 1.5 1.0 0.5 TM Measured at the Cathode Band Terminal Instantaneous Reverse Current (μA) 1000 TM = 158 °C 0 25 50 75 100 125 150 10 TA = 75 °C 1 TA = 25 °C 0.1 175 10 20 30 40 50 60 70 80 90 100 TM - Mount Temperature (°C) Percent of Rated Peak Reverse Voltage (%) Fig. 1 - Maximum Forward Current Derating Curve Fig. 4 - Typical Reverse Leakage Characteristics 4.5 100 D = 0.3 3.0 D = 0.1 Junction Capacitance (pF) D = 0.2 3.5 D = 1.0 2.5 2.0 T 1.5 1.0 D = tp/T 0.5 tp 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.1 1 10 100 Average Forward Current (A) Reverse Voltage (V) Fig. 2 - Average Power Loss Characteristics Fig. 5 - Typical Junction Capacitance 100 TA = 175 °C TA = 125 °C TA = 75 °C 1 TA = 25 °C 0.1 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 Transient Thermal Impedance (°C/W) 100 10 TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p D = 0.5 D = 0.8 4.0 Average Power Loss (W) TA = 125 °C 0.01 0 Instantaneous Forward Current (A) TA = 175 °C 100 Junction-to-Ambient 10 1 0.01 0.1 1 10 100 Instantaneous Forward Voltage (V) t - Pulse Duration (s) Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 6 - Typical Transient Thermal Impedance Revision: 23-Feb-16 Document Number: 89332 3 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AR3PD, AR3PG, AR3PJ www.vishay.com Vishay General Semiconductor PACKAGE OUTLINE DIMENSIONS in inches (millimeters) TO-277A (SMPC) 0.187 (4.75) 0.175 (4.45) 0.016 (0.40) 0.006 (0.15) K 0.262 (6.65) 0.250 (6.35) 0.242 (6.15) 0.238 (6.05) 2 1 0.047 (1.20) 0.039 (1.00) 0.171 (4.35) 0.167 (4.25) 0.146 (3.70) 0.134 (3.40) Mounting Pad Layout 0.087 (2.20) 0.075 (1.90) 0.189 (4.80) MIN. 0.189 (4.80) 0.173 (4.40) 0.186 (4.72) MIN. 0.268 (6.80) 0.155 (3.94) NOM. 0.030 (0.75) NOM. 0.049 (1.24) 0.037 (0.94) 0.050 (1.27) MIN. 0.084 (2.13) NOM. 0.053 (1.35) 0.041 (1.05) 0.041 (1.04) 0.055 (1.40) MIN. Conform to JEDEC® TO-277A Revision: 23-Feb-16 Document Number: 89332 4 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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