AU3PK, AU3PM www.vishay.com Vishay General Semiconductor Ultrafast Avalanche Surface Mount Rectifiers FEATURES eSMP ® Series • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement K • Glass passivated pellet chip junction • Fast reverse recovery time 1 • Controlled avalanche characteristics • Low leakage current 2 • High forward surge capability TO-277A (SMPC) K Cathode • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Anode 1 • AEC-Q101 qualified available - Automotive ordering code: base P/NHM3 Anode 2 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 PRIMARY CHARACTERISTICS IF(AV) 3.0 A VRRM 800 V, 1000 V IFSM 45 A trr 75 ns EAS 20 mJ VF at IF = 3.0 A 1.45 V TJ max. 175 °C Package TO-277A (SMPC) Diode variations Single die TYPICAL APPLICATIONS For use in lighting, fast switching rectification of power supplies, inverters, converters, and freewheeling diodes for consumer, automotive, and telecommunication. MECHANICAL DATA Case: TO-277A (SMPC) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3 - halogen-free, RoHS-compliant and AEC-Q101 qualified Base P/NHM3_X - halogen-free, RoHS-compliant and AEC-Q101 qualified (“_X” denotes revision code e.g. A, B,.....) Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix meets JESD 201 class 2 whisker test MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL Device marking code Maximum repetitive peak reverse voltage VRRM Maximum DC forward current (fig. 1) Peak forward surge current 10 ms single half sine-wave superimposed on rated load Non-repetitive avalanche energy at TJ = 25 °C IAS = 2.5 A max. IAS = 1.0 A typ. Operating junction and storage temperature range AU3PK AU3PM AU3K AU3M 800 1000 IF (1) 3.0 IF (2) 1.4 IFSM 45 EAS TJ, TSTG 20 30 -55 to +175 UNIT V A A mJ °C Notes (1) Mounted on 20 mm x 20 mm pad areas, 1 oz. FR4 PCB (2) Free air, mounted on recommended pad area Revision: 19-Feb-15 Document Number: 89339 1 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AU3PK, AU3PM www.vishay.com Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS TA = 25 °C SYMBOL VF (1) TYP. MAX. 2.27 2.5 1.45 2.0 0.40 10 107 500 UNIT Instantaneous forward voltage IF = 3.0 A Reverse current Rated VR Maximum reverse recovery time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A trr 58 75 ns Typical junction capacitance per diode Rated VR = 4.0 V, 1 MHz CJ 42 - pF TA = 125 °C TA = 25 °C TA = 125 °C IR (2) V μA Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: Pulse width 40 ms THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL Typical thermal resistance AU3PK AU3PM RJA (1) 85 RJM (2) 5 UNIT °C/W Notes (1) Free air, mounted on recommended PCB 1 oz. pad are; thermal resistance R JA - junction to ambient (2) Units mounted on PCB with 20 mm x 20 mm copper pad areas; R JM - junction to mount ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE AU3PM-M3/86A 0.10 86A 1500 7" diameter plastic tape and reel AU3PM-M3/87A 0.10 87A 6500 13" diameter plastic tape and reel AU3PMHM3/86A (1) 0.10 86A 1500 7" diameter plastic tape and reel AU3PMHM3/86A (1) 0.10 87A 6500 13" diameter plastic tape and reel AU3PMHM3_A/H (1) 0.10 H 1500 7" diameter plastic tape and reel 0.10 I 6500 13" diameter plastic tape and reel AU3PMHM3_A/I (1) Note (1) AEC-Q101 qualified Revision: 19-Feb-15 Document Number: 89339 2 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AU3PK, AU3PM www.vishay.com Vishay General Semiconductor 3.4 3.2 3.0 2.8 3.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 10 000 TA = 25 °C TM Measured at the Cathode Band Terminal 0 25 50 75 100 125 150 TA = 175 °C 100 TA = 125 °C 10 TA = 75 °C 1 TA = 25 °C 0.1 0.01 175 10 20 30 40 50 60 70 80 90 100 Percent of Rated Peak Reverse Voltage (%) Fig. 1 - Maximum Forward Current Derating Curve Fig. 4 - Typical Reverse Leakage Characteristics 6.0 D = 0.5 1000 D = 0.8 TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p D = 0.3 5.0 D = 0.2 4.5 4.0 D = 1.0 D = 0.1 3.5 3.0 2.5 T 2.0 1.5 1.0 D = tp/T 0.5 100 tp 10 0 0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 0.1 1 10 100 Average Forward Current (A) Reverse Voltage (V) Fig. 2 - Average Power Loss Characteristics Fig. 5 - Typical Junction Capacitance 100 TA = 175 °C TA = 125 °C 10 TA = 75 °C 1 TA = 25 °C 0.1 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 Transient Thermal Impedance (°C/W) 100 Instantaneous Forward Current (A) 1000 TM - Mount Temperature (°C) 5.5 Average Power Loss (W) Instantaneous Reverse Current (μA) TM = 150 °C Junction Capacitance (pF) DC Forward Current (A) RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) Junction-to-Ambient 10 1 0.01 0.1 1 10 100 Instantaneous Forward Voltage (V) t - Pulse Duration (s) Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 6 - Typical Transient Thermal Impedance Revision: 19-Feb-15 Document Number: 89339 3 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AU3PK, AU3PM www.vishay.com Vishay General Semiconductor PACKAGE OUTLINE DIMENSIONS in inches (millimeters) TO-277A (SMPC) 0.187 (4.75) 0.175 (4.45) 0.016 (0.40) 0.006 (0.15) K 0.262 (6.65) 0.250 (6.35) 0.242 (6.15) 0.238 (6.05) 2 1 0.047 (1.20) 0.039 (1.00) 0.171 (4.35) 0.167 (4.25) 0.146 (3.70) 0.134 (3.40) Mounting Pad Layout 0.087 (2.20) 0.075 (1.90) 0.189 (4.80) MIN. 0.189 (4.80) 0.173 (4.40) 0.186 (4.72) MIN. 0.268 (6.80) 0.155 (3.94) NOM. 0.030 (0.75) NOM. 0.049 (1.24) 0.037 (0.94) 0.050 (1.27) MIN. 0.084 (2.13) NOM. 0.053 (1.35) 0.041 (1.05) 0.041 (1.04) 0.055 (1.40) MIN. Conform to JEDEC® TO-277A Revision: 19-Feb-15 Document Number: 89339 4 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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