BSC029N025S G OptiMOS®2 Power-Transistor Product Summary Features • Fast switching MOSFET for SMPS • Optimized technology for notebook DC/DC converters V DS 25 V R DS(on),max 2.9 mΩ ID 100 A 1 • Qualified according to JEDEC for target applications • Logic level / N-channel • Excellent gate charge x R DS(on) product (FOM) PG-TDSON-8 • Very low on-resistance R DS(on) • Superior thermal resistance • Avalanche rated • dv /dt rated • Pb-free lead plating; RoHS compliant Type Package Marking BSC029N025S PG-TDSON-8 29N025S Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Continuous drain current ID Value T C=25 °C 100 T C=100 °C 81 T A=25 °C, R thJA=45 K/W 2) I D,pulse T C=25 °C3) 200 Avalanche energy, single pulse E AS I D=50 A, R GS=25 Ω 680 Reverse diode dv /dt dv /dt I D=50 A, V DS=24 V, di /dt =200 A/µs, T j,max=150 °C 6 Gate source voltage V GS Power dissipation P tot T A=25 °C, R thJA=45 K/W 2) Operating and storage temperature T j, T stg Rev. 0.94 mJ kV/µs ±20 V 78 W 2.8 -55 ... 150 IEC climatic category; DIN IEC 68-1 A 24 Pulsed drain current T C=25 °C Unit °C 55/150/56 page 1 2006-05-10 BSC029N025S G Parameter Values Symbol Conditions Unit min. typ. max. - - 1.6 minimal footprint - - 62 6 cm2 cooling area2) - - 45 25 - - Thermal characteristics Thermal resistance, junction - case R thJC Thermal resistance, R thJA junction - ambient K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=1 mA Gate threshold voltage V GS(th) V DS=V GS, I D=80 µA 1.2 1.6 2 Zero gate voltage drain current I DSS V DS=25 V, V GS=0 V, T j=25 °C - 0.1 1 V DS=25 V, V GS=0 V, T j=125 °C - 10 100 V µA Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 10 100 nA Drain-source on-state resistance R DS(on) V GS=4.5 V, I D=50 A - 3.6 4.5 mΩ V GS=10 V, I D=50 A - 2.4 2.9 - 1.2 - Ω 53 106 - S Gate resistance RG Transconductance g fs 1) |V DS|>2|I D|R DS(on)max, I D=50 A J-STD20 and JESD22 2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 3) See figure 3 Rev. 0.94 page 2 2006-05-10 BSC029N025S G Parameter Values Symbol Conditions Unit min. typ. max. - 3830 5090 - 1460 1940 Dynamic characteristics Input capacitance C iss Output capacitance C oss Reverse transfer capacitance Crss - 170 255 Turn-on delay time t d(on) - 7.5 11 Rise time tr - 8 11 Turn-off delay time t d(off) - 33 49 Fall time tf - 6 9 Gate to source charge Q gs - 11 15 Gate charge at threshold Q g(th) - 6 8 Gate to drain charge Q gd - 8 12 Switching charge Q sw - 13 19 Gate charge total Qg - 31 41 Gate plateau voltage V plateau - 2.9 - Gate charge total, sync. FET Q g(sync) V DS=0.1 V, V GS=0 to 5 V - 27 36 Output charge Q oss V DD=15 V, V GS=0 V - 32 42 - - 50 - - 200 V GS=0 V, V DS=15 V, f =1 MHz V DD=15 V, V GS=10 V, I D=25 A, R G=2.7 Ω pF ns Gate Charge Characteristics 4) V DD=15 V, I D=25 A, V GS=0 to 5 V nC V nC Reverse Diode Diode continous forward current IS Diode pulse current I S,pulse Diode forward voltage V SD V GS=0 V, I F=50 A, T j=25 °C - 0.84 1 V Reverse recovery charge Q rr V R=15 V, I F=I S, di F/dt =400 A/µs - - 15 nC 4) T C=25 °C A See figure 16 for gate charge parameter definition Rev. 0.94 page 3 2006-05-10 BSC029N025S G 2 Drain current P tot=f(T C) I D=f(T C); V GS≥10 V 90 120 75 100 60 80 I D [A] P tot [W] 1 Power dissipation 45 60 30 40 15 20 0 0 0 40 80 120 160 0 40 T C [°C] 80 120 160 T C [°C] 3 Safe operating area 4 Max. transient thermal impedance I D=f(V DS); T C=25 °C; D =0 Z thJC=f(t p) parameter: t p parameter: D =t p/T 103 101 limited by on-state resistance 10 µs 102 100 0.5 I D [A] Z thJC [K/W] 100 µs 1 ms 0.2 0.1 0.05 101 10-1 10 ms 0.02 0.01 DC single pulse 100 10 10-2 -1 10 0 10 1 10 2 V DS [V] Rev. 0.94 10-5 10-4 10-3 10-2 10-1 100 t p [s] page 4 2006-05-10 BSC029N025S G 5 Typ. output characteristics 6 Typ. drain-source on resistance I D=f(V DS); T j=25 °C R DS(on)=f(I D); T j=25 °C parameter: V GS parameter: V GS 200 10 3V 10 V 3.2 V 3.4 V 3.7 V 4.5 V 160 8 4V R DS(on) [mΩ] 120 I D [A] 3.7 V 80 6 4V 4 4.5 V 3.4 V 3.2 V 40 10 V 2 3V 2.8 V 0 0 0 1 2 3 0 50 V DS [V] 100 I D [A] 7 Typ. transfer characteristics 8 Typ. forward transconductance I D=f(V GS); |V DS|>2|I D|R DS(on)max g fs=f(I D); T j=25 °C parameter: T j 150 160 120 120 90 I D [A] g fs [S] 200 80 60 40 30 150 °C 25 °C 0 0 0 1 2 3 4 5 Rev. 0.94 0 25 50 75 I D [A] V GS [V] page 5 2006-05-10 BSC029N025S G 9 Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(on)=f(T j); I D=50 A; V GS=10 V V GS(th)=f(T j); V GS=V DS parameter: I D 5 2.4 2 4 900 µA 1.6 98 % 90 µA V GS(th) [V] R DS(on) [mΩ] 3 typ 2 1.2 0.8 1 0.4 0 0 -60 -10 40 90 140 190 -60 -10 40 90 140 190 T j [°C] T j [°C] 11 Typ. capacitances 12 Forward characteristics of reverse diode C =f(V DS); V GS=0 V; f =1 MHz I F=f(V SD) parameter: T j 104 103 10000 25 °C 150 °C, 98% Ciss 150 °C 102 103 I F [A] C [pF] Coss 1000 25 °C, 98% 101 Crss 102 100 100 0 10 20 30 V DS [V] Rev. 0.94 0 0.5 1 1.5 2 V SD [V] page 6 2006-05-10 BSC029N025S G 13 Avalanche characteristics 14 Typ. gate charge I AS=f(t AV); R GS=25 Ω V GS=f(Q gate); I D=25 A pulsed parameter: T j(start) parameter: V DD 100 12 15 V 10 25 °C 6V 100 °C 24 V 8 V GS [V] I AV [A] 125 °C 10 6 4 2 1 0 1 10 100 1000 0 20 40 60 Q gate [nC] t AV [µs] 15 Drain-source breakdown voltage 16 Gate charge waveforms V BR(DSS)=f(T j); I D=1 mA 29 V GS Qg 27.5 V BR(DSS) [V] 26 24.5 V g s(th) 23 21.5 Q g(th) Q sw Q gs 20 -60 -10 40 90 140 Q g ate Q gd 190 T j [°C] Rev. 0.94 page 7 2006-05-10 BSC029N025S G Package Outline P-TDSON-8 : Outline Footprint Dimensions in mm Rev. 0.94 page 8 2006-05-10 BSC029N025S G Package Outline P-TDSON-8: Tape Dimensions in mm Rev. 0.94 page 9 2006-05-10 BSC029N025S G Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2006. All Rights Reserved. Attention please! The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 0.94 page 10 2006-05-10