GP1A57HRJ00F

GP1A57HRJ00F
GP1A57HRJ00F
Gap : 10mm, Slit : 1.8mm
*OPIC Output
Case package Transmissive
Photointerrupter
■ Description
■Agency approvals/Compliance
GP1A57HRJ00F is a standard, OPIC output, transmissive photointerrupter with opposing emitter and detector in a case, providing non-contact sensing. For this
family of devices, the emitter and detector are inserted in
a case, resulting in a through-hole design.
This device has a wide gap.
1. Compliant with RoHS directive
■Applications
1. General purpose detection of object presence or motion.
2. Example : Printer, FAX, Optical storage unit
■ Features
1. Transmissive with OPIC output
2. Highlights :
• Vertical Slit for alternate motion detection
• Output Low Level at intercepting optical path
• Wide gap width (10mm)
• Positioning Pin to prevent misalignment
3. Key Parameters :
• Gap Width : 10mm
• Slit Width (detector side) : 1.8mm
• Package : 18.6×15.2×5mm
4. RoHS directive compliant
* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signalprocessing
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D3-A03901FEN
Date Oct. 3. 2005
© SHARP Corporation
GP1A57HRJ00F
■ Internal Connection Diagram
Top view
Voltage regulator
Amp.
3
2
1
(15kΩ)
2
4
3
4
5
5
1
■ Outline Dimensions
Anode
Cathode
VCC
VO
GND
Detector center
(2.5)
5
(Unit : mm)
5−0.4
C0.3
0.7
(1.5)
φ 0.7
Date
code
4MIN.
C1
C
0.
2
GP1A57HR
3
1.8±0.1
15.2
10
1.5
18.6
Slit width
(Detector side)
5−0.45
(2.54)
(15.2)
φ1
3
4
1
2
.5
5
φ0
.7
8.95
2
• Tolerance : ±0.2mm
• ( ) : Reference dimensions
Product mass : approx. 0.7g
Dip soldering material : Sn−3Ag−0.5Cu
Sheet No.: D3-A03901FEN
2
GP1A57HRJ00F
Date code (2 digit)
1st digit
Year of production
A.D.
Mark
2000
0
2001
1
2002
2
2003
3
2004
4
2005
5
2006
6
2007
7
2008
8
2009
9
2010
0
:
:
2nd digit
Month of production
Month
Mark
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
X
11
Y
12
Z
repeats in a 10 year cycle
Country of origin
Japan, Indonesia or Philippines
(Indicated on the packing case)
Sheet No.: D3-A03901FEN
3
GP1A57HRJ00F
■ Absolute Maximum Ratings
Parameter
∗1
Forward current
∗1, 2
Peak forward current
Input
Reverse voltage
Power dissipation
Supply voltage
Output current
Output
Power dissipation
Operating temperature
Storage temperature
∗3
Soldering temperature
∗
∗
∗
Symbol
Rating
IF
50
IFM
1
VR
6
P
75
VCC
−0.5 to +17
IO
50
PO
250
Topr
−25 to +85
Tstg
−40 to +100
Tsol
260
(Ta=25˚C)
Unit
mA
A
V
mW
V
mA
mW
˚C
˚C
˚C
1 Refer to Fig. 1, 2, 3
2 Pulse width ≤ 100μs, Duty ratio=0.01
3 For 5s or less
■ Electro-optical Characteristics
Output
Transfer
characteristics
∗
∗
∗
Responce time
Input
Parameter
Symbol
Forward voltage
VF
Reverse current
IR
Operating supply voltage
VCC
Low level output voltage
VOL
High level output voltage
VOH
Low level supply current
ICCL
High level supply current
ICCH
∗4
"Low→High" threshold input current
IFLH
∗5
Hysteresis
IFHL/IFLH
∗6 "Low→High" Propagation delay time
tPLH
"High→Low" Propagation delay time
tPHL
Rise time
tr
Fall time
tf
Condition
IF=7mA
VR=3V
−
VCC=5V, IOL=16mA, IF=0
VCC=5V, IF=7mA
VCC=5V, IF=0
VCC=5V, IF=7mA
VCC=5V
VCC=5V
VCC=5V, IF=7mA, RL=280Ω
MIN.
−
−
4.5
−
4.9
−
−
−
0.55
−
−
−
−
TYP.
1.14
−
−
0.15
−
1.7
0.7
1
0.75
3
5
0.1
0.05
MAX.
1.4
10
17
0.4
−
3.8
2.2
7
0.95
9
15
0.5
0.5
(Ta=25˚C)
Unit
V
μA
V
V
V
mA
mA
mA
−
μs
4 IFLH represents forward current when output goes from "Low" to "High".
5 IFHL represents forward current when output goes from "High" to "Low".
6 Test circuit for response time is shown in Fig.12.
Sheet No.: D3-A03901FEN
4
GP1A57HRJ00F
Fig.2 Output Power Dissipation vs.
Ambient Temperature
60
300
50
250
Output power dissipation PO (mW)
Forward current IF (mA)
Fig.1 Forward Current vs.
Ambient Temperature
40
30
20
10
0
−25
0
25
50
75 85
Ambient temperature Ta (˚C)
200
150
100
50
0
−25
100
0
25
50
75 85
100
Ambient temperature Ta (C)
Fig.3 Low Level Output Current vs.
Ambient Temperature
Fig.4 Forward Current vs. Forward Voltage
60
25˚C
40
30
20
100
10
10
0
−20
1
0
25
50
75 85
0
100
0.5
1
Fig.5 Relative Threshold Input Current vs.
Supply Voltage
1.1
0.9
0.8
IFHL
0.7
0.6
0.5
0
5
10
15
20
2.5
3
1.6
Relative threshold input current IFHL,IFLH
1
2
Fig.6 Relative Threshold Input Current vs.
Ambient Temperature
Ta=25˚C
IFLH=1
at VCC=5V
IFLH
1.5
Foward voltage VF (V)
Ambient temperature Ta (˚C)
Relative threshold input current IFHL,IFLH
0˚C
−25˚C
50˚C
Forward current IF (mA)
Low level output current IOL (mA)
Ta=75˚C
50
1.4
1.2
IFLH
1
Supply voltage VCC (V)
IFHL
0.8
0.6
0.4
−25
25
VCC=5V
IFLH=1
at Ta=25˚C
0
25
50
75
100
Ambient temperature Ta (˚C)
Sheet No.: D3-A03901FEN
5
GP1A57HRJ00F
Fig.7 Low Level Output Voltage vs.
Low Level Output Current
Fig.8 Low Level Output Voltage vs.
Ambient Temperature
0.6
1
VCC=5V
Low level output voltage VOL (V)
Low level output voltage VOL (V)
VCC=5V
Ta=25˚C
0.1
0.5
0.4
0.3
IOL=30mA
0.2
16mA
0.1
5mA
0.01
1
10
0
−25
100
0
Low level output current IOL (mA)
12
Propagation delay time tPLH, tPHL (μs)
2.5
Supply current ICC (mA)
75
100
Fig.10 Propagation Delay Time vs.
Forward Current
3
VCC=17V
2
10V
ICCL
1.5
5V
1
VCC=17V
ICCH
0.5
5V
10V
VCC=5V
RL=280Ω
Ta=25˚C
10
tPHL
8
6
4
tPLH
2
0
0
25
50
75
0
100
10
20
30
40
50
60
Forward current IF (mA)
Ambient temperature Ta (˚C)
Fig.11 Rise Time,Fall Time vs.
Load Resistance
Fig.12 Test Circuit for Response Time
0.8
Voltage regulator
Ta=25˚C
VCC=5V
IF=7mA
0.7
Rise time, fall time tr, tf (μs)
50
Ambient temperature Ta (˚C)
Fig.9 Supply Current vs.
Ambient Temperature
0
−25
25
+5V
Input
280Ω
(15kΩ)
0.6
Output
tr=tf=0.01μs
ZO=50Ω
0.5
0.01μF
47Ω
0.4
Amp.
tr
GND
0.3
Input
50%
0.2
tPLH
0.1
0
0.1
tPHL
V
90% OH
1.5V
tf
1
Output
10
Load resistance RL (kΩ)
10%
tr
tf
VOL
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D3-A03901FEN
6
GP1A57HRJ00F
■ Design Considerations
● Recommended operating conditions
Parameter
Output current
Forward current
Operating terperature
Symbol
IO
IF
Topr
MIN.
−
10
0
TYP.
−
−
−
MAX.
16
20
70
Unit
mA
mA
˚C
● Notes about static electricity
Transisiter of detector side in bipolar configuration may be damaged by static electricity due to its minute
design.
When handing these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Design guide
1) Prevention of detection error
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to
the external light.
2) In order to stabilize power supply line, connect a by-pass capacitor of more than 0.01μF between VCC and
GND near the device.
3) Position of opaque board
Opaque board shall be installed at place 4mm or more from the top of elements.
(Example)
4mm or more
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
Sheet No.: D3-A03901FEN
7
GP1A57HRJ00F
● Parts
This product is assembled using the below parts.
• Photodetector (qty. : 1) [Using a silicon photodiode as light detecting portion, and a bipolar IC as signal processing circuit]
Category
Maximum Sensitivity
wavelength (nm)
Sensitivity
wavelength (nm)
Response time (μs)
Photodiode
900
400 to 1 200
3
• Photo emitter (qty. : 1)
Category
Material
Maximum light emitting
wavelength (nm)
I/O Frequency (MHz)
Infrared emitting diode
(non-coherent)
Gallium arsenide (GaAs)
950
0.3
• Material
Case
Lead frame plating
Black NORYL resin
Solder dip. (Sn−3Ag−0.5Cu)
• Others
Laser generator is not used.
Sheet No.: D3-A03901FEN
8
GP1A57HRJ00F
■ Manufacturing Guidelines
● Soldering Method
Flow Soldering:
Soldering should be completed below 260˚C and within 5 s.
Please take care not to let any external force exert on lead pins.
Please don't do soldering with preheating, and please don't do soldering by reflow.
Hand soldering
Hand soldering should be completed within 3 s when the point of solder iron is below 350̊C.
Please solder within one time.
Please don't touch the terminals directly by soldering iron.
Soldered product shall treat at normal temperature.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
Flux
Some flux, which is used in soldering, may crack the package due to synergistic effect of alcohol in flux and
the rise in temperature by heat in soldering. Therefore, in using flux, please make sure that it does not have
any influence on appearance and reliability of the photointerrupter.
Sheet No.: D3-A03901FEN
9
GP1A57HRJ00F
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning
time, PCB size or device mounting condition etc.
Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic
cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D3-A03901FEN
10
GP1A57HRJ00F
■ Package specification
● Case package
Package materials
Anti-static plastic bag : Polyethtylene
Moltopren : Urethane
Packing case : Corrugated fiberboard
Package method
50 pcs of products shall be packaged in a plastic bag, Ends shall be fixed by stoppers. The bottom ot the
packing case is covered with moltopren, and 2 plastic bags shall be put int the packing case.
Moltopren should be located after all product are settled (1 packing contains 100 pcs).
Packing composition
Packing case
Moltopren
Anti-static
Plastic bag
Sheet No.: D3-A03901FEN
11
GP1A57HRJ00F
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
Sheet No.: D3-A03901FEN
[H164]
12