GP1A52HRJ00F GP1A52HRJ00F Gap : 3mm, Slit : 0.5mm *OPIC Output Case package Transmissive Photointerrupter ■ Description ■ Agency approvals/Compliance GP1A52HRJ00F is a standard, OPIC output, transmissive photointerrupter with opposing emitter and detector in a case, providing non-contact sensing. For this family of devices, the emitter and detector are inserted in a case, resulting in a through-hole design. 1. Compliant with RoHS directive ■ Applications 1. General purpose detection of object presence or motion. 2. Example : Printer, FAX, Optical storage unit ■ Features 1. Transmissive with OPIC output 2. Highlights: • Vertical Slit for alternate motion detection • Output Low Level at intercepting optical path 3. Key Parameters: • Gap Width : 3mm • Slit Width (detector side) : 0.5mm • Package : 12.2×10×5mm 4. Lead free and RoHS directive compliant * "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signalprocessing Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D3-A03701EN Date Oct. 3. 2005 © SHARP Corporation GP1A52HRJ00F ■ Internal Connection Diagram Top view 1 2 Amp 3 2 3 4 5 Anode Cathode VCC VO GND 1 4 (15kΩ) 5 Voltage regulator ■ Outline Dimensions (Unit : mm) Top view 12.2±0.3 3+0.2 −0.1 5 A52 Sharp mark “S” A-Aʼ section A B 10 7.5 Aʼ Bʼ 5−0.4+0.3 −0.1 4−0.45+0.3 −0.1 (1.27) 0.5 E 2.5 Date code 3.5 0.5 Model code 9MIN. C1 B-Bʼ section 1.5 2.5 (Detctor center) Model No. (1.5) (9.2) (1.27) 5 1 3 2 4 • Unspecified tolerance shall be as follows ; Dimensions(d) d≤6 6<d≤18 Tolerance ±0.1 ±0.2 • ( ) : Reference dimensions Product mass : approx. 0.7g Dip soldering material : Sn−3Ag−0.5Cu Sheet No.: D3-A03701EN 2 GP1A52HRJ00F Date code Month of production Month Mark 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 10 X 11 Y 12 Z Model code E e Year of production (Christian year) Even year Odd year Country of origin Japan, Indonesia or Philippines (Indicated on the packing case) Sheet No.: D3-A03701EN 3 GP1A52HRJ00F ■ Absolute Maximum Ratings Parameter ∗1 Forward current ∗1, 2 Peak forward current Input Reverse voltage Power dissipation Supply voltage Output current Output Power dissipation Operating temperature Storage temperature ∗3 Soldering temperature ∗ ∗ ∗ Symbol Rating IF 50 IFM 1 VR 6 P 75 VCC −0.5 to +17 IO 50 250 PO Topr −25 to +85 Tstg −40 to +100 Tsol 260 (Ta=25˚C) Unit mA A V mW V mA mW ˚C ˚C ˚C 1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1, 2, 3 2 Pulse width ≤ 100μs, Duty ratio=0.01 3 For 5s or less ■ Electro-optical Characteristics Output Transfer characteristics ∗ ∗ ∗ Responce time Input Parameter Symbol Forward voltage VF Reverse current IR Operating supply voltage VCC Low level output voltage VOL High level output voltage VOH Low level supply current ICCL High level supply current ICCH ∗4 "Low→High" threshold input current IFLH ∗5 Hysteresis IFHL/IFLH ∗6 "Low→High" Propagation delay time tPLH "High→Low" Propagation delay time tPHL Rise time tr Fall time tf Condition IF=5mA VR=3V − VCC=5V, IOL=16mA, IF=0 VCC=5V, IF=5mA VCC=5V, IF=0 VCC=5V, IF=5mA VCC=5V VCC=5V VCC=5V, IF=5mA, RL=280Ω MIN. − − 4.5 − 4.9 − − − 0.55 − − − − TYP. 1.1 − − 0.15 − 1.7 0.7 1 0.75 3 5 0.1 0.05 MAX. 1.4 10 17 0.4 − 3.8 2.2 5 0.95 9 15 0.5 0.5 (Ta=25˚C) Unit V μA V V V mA mA mA − μs 4 IFLH represents forward current when output goes from "Low" to "High". 5 IFHL represents forward current when output goes from "High" to "Low". 6 Test circuit for response time is shown in Fig.12. Sheet No.: D3-A03701EN 4 GP1A52HRJ00F Fig.2 Output Power Dissipation vs. Ambient Temperature 60 300 50 250 Output power dissipation PO (mW) Forward current IF (mA) Fig.1 Forward Current vs. Ambient Temperature 40 30 20 10 0 −25 0 25 50 75 85 Ambient temperature Ta (˚C) 200 150 100 50 0 −25 100 0 25 50 75 85 100 Ambient temperature Ta (C) Fig.3 Low Level Output Current vs. Ambient Temperature Fig.4 Forward Current vs. Forward Voltage 60 40 30 20 100 10 10 0 −20 1 0 25 50 75 85 0 100 0.5 1 1.8 1.1 Relative threshold input current IFHL,IFLH Ta=25˚C IFLH=1 at VCC=5V IFLH 0.9 0.8 IFHL 0.7 0.6 5 10 15 20 1.6 2.5 3 3.5 25 VCC=5V IFLH=1 at Ta=25˚C 1.4 IFLH 1.2 IFHL 1 0.8 0.6 0.4 −25 0.5 0 2 Fig.6 Relative Threshold Input Current vs. Ambient Temperature Fig.5 Relative Threshold Input Current vs. Supply Voltage 1 1.5 Foward voltage VF (V) Ambient temperature Ta (˚C) Relative threshold input current IFHL,IFLH 25˚C 0˚C −25˚C 50˚C Forward current IF (mA) Low level output current IOL (mA) Ta=75˚C 50 0 25 50 75 100 Ambient temperature Ta (˚C) Supply voltage VCC (V) Sheet No.: D3-A03701EN 5 GP1A52HRJ00F Fig.7 Low Level Output Voltage vs. Low Level Output Current 0.6 VCC=5V Ta=25˚C VCC=5V Low level output voltage VOL (V) Low level output voltage VOL (V) 1 Fig.8 Low Level Output Voltage vs. Ambient Temperature 0.1 0.5 0.4 IOL=30mA 0.3 0.2 16mA 0.1 5mA 0.01 1 2 5 10 20 50 0 −25 100 0 Low level output current IOL (mA) 12 Propagation delay time tPLH, tPHL (μs) Supply current ICC (mA) 75 100 Fig.10 Propagation Delay Time vs. Forward Current 3 VCC=17V 2 10V ICCL 5V 1 VCC=17V ICCH 10V 5V VCC=5V RL=280Ω Ta=25˚C 10 tPHL 8 6 4 tPLH 2 0 0 25 50 75 0 100 10 Fig.11 Rise Time,Fall Time vs. Load Resistance 30 40 50 60 Fig.12 Test Circuit for Response Time 0.8 IF=5mA Ta=25˚C VCC=5V IF=5mA 0.7 Voltage regulator +5V Input 280Ω (15kΩ) 0.6 tr=tf=0.01μs ZO=50Ω 47Ω 0.5 0.4 20 Forward current IF (mA) Ambient temperature Ta (˚C) Rise time, fall time tr, tf (μs) 50 Ambient temperature Ta (˚C) Fig.9 Supply Current vs. Ambient Temperature 0 −25 25 Output 0.01μF Amp. tr GND 0.3 Input 50% 0.2 0.1 0 0.1 tPLH tf 1 Output 10 Load resistance RL (kΩ) tPHL V 90% OH 1.5V 10% tr tf VOL Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D3-A03701EN 6 GP1A52HRJ00F ■ Design Considerations ● Recommended operating conditions Parameter Output current Forward current Operating terperature Symbol IO IF Topr MIN. − 10 0 TYP. − − − MAX. 16 20 70 Unit mA mA ˚C ● Notes about static electricity Transisiter of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handing these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ● Design guide 1) Prevention of detection error To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. 2) In order to stabilize power supply line, connect a by-pass capacitor of more than 0.01μF between VCC and GND near the device. 3) Position of opaque board Opaque board shall be installed at place 4mm or more from the top of elements. (Example) 4mm or more This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. Sheet No.: D3-A03701EN 7 GP1A52HRJ00F ● Parts This product is assembled using the below parts. • Photodetector (qty. : 1) [Using a silicon photodiode as light detecting portion, and a bipolar IC as signal processing circuit] Category Maximum Sensitivity wavelength (nm) Sensitivity wavelength (nm) Response time (μs) Photodiode 900 400 to 1 200 3 • Photo emitter (qty. : 1) Category Material Maximum light emitting wavelength (nm) I/O Frequency (MHz) Infrared emitting diode (non-coherent) Gallium arsenide (GaAs) 950 0.3 • Material Case Lead frame plating Black NORYL resin Solder dip. (Sn−3Ag−0.5Cu) • Others Laser generator is not used. Sheet No.: D3-A03701EN 8 GP1A52HRJ00F ■ Manufacturing Guidelines ● Soldering Method Flow Soldering: Soldering should be completed below 260˚C and within 5 s. Please take care not to let any external force exert on lead pins. Please don't do soldering with preheating, and please don't do soldering by reflow. Hand soldering Hand soldering should be completed within 3 s when the point of solder iron is below 350̊C. Please solder within one time. Please don't touch the terminals directly by soldering iron. Soldered product shall treat at normal temperature. Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the cooling and soldering conditions. Flux Some flux, which is used in soldering, may crack the package due to synergistic effect of alcohol in flux and the rise in temperature by heat in soldering. Therefore, in using flux, please make sure that it does not have any influence on appearance and reliability of the photointerrupter. Sheet No.: D3-A03701EN 9 GP1A52HRJ00F ● Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D3-A03701EN 10 GP1A52HRJ00F ■ Package specification ● Case package Package materials Anti-static plastic bag : Polyethtylene Moltopren : Urethane Partition : Corrugated fiberboard Packing case : Corrugated fiberboard Package method 100 pcs of products shall be packaged in a plastic bag, Ends shall be fixed by stoppers. The bottom ot the packing case is covered with moltopren, and the partition is set in the packing case. Each partition should have 1 plastic bag. The 10 plastic bags containing a product are put in the packing case. Moltopren should be located after all product are settled (1 packing contains 1 000 pcs). Packing composition Moltopren Partition Anti-static plastic bag Packing case Sheet No.: D3-A03701EN 11 GP1A52HRJ00F ■ Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D3-A03701EN [H162] 12