RadReport VRG8651 (2/10)

February 04, 2010
Radiation Performance Data Package
VRG8651-S & VRG8652-S
VRG8651-S, DSCC SMD Part Number: 5962-0920101KUC
VRG8652-S, DSCC SMD Part Number: 5962-0920101KZC
Dual voltage regulator,
positive (RH1086) and negative (RH1185), adjustable
Prepared by:
Aeroflex Plainview, Inc.
35 South Service Road
Plainview, NY 11803
1. Part Descriptions:
1.1
1.1.1
1.2
1.2.1
VRG8651-S
Dual voltage regulator, positive (RH1086) and negative (RH1185), adjustable, thru-hole.
VRG8652-S
Dual voltage regulator, positive (RH1086) and negative (RH1185), adjustable, surface mount.
2. Applicable Documents
2.1
Appendix A:
Data Sheet:
SCD8651
DUAL ADJUSTABLE POSITIVE/NEGATIVE
LDO VOLTAGE REGULATORS
2.2
Appendix B:
Die Spec:
05-08-5134
MICROCIRCUIT, LINEAR, RH1086BHK, 0.5A
AND RH1086BKK, 1.5A POSITIVE
ADJUSTABLE LDO REGULATOR
2.3
Appendix C:
Die Spec:
05-08-5232
MICROCIRCUIT, LINEAR, RH1185MK DICE
NEGATIVE ADJUSTABLE LDO REGULATOR
WITH CURRENT LIMIT
2.4
Appendix D:
Report:
March 2, 2009
SINGLE EVENT EFFECTS TEST REPORT
SUMMARY: LDO REGULATORS
2.5
Appendix E:
DSCC SMD:
5962-09201
MICROCIRCUIT, HYBRID, DUAL VOLTAGE
REGULATOR, POSITIVE AND NEGATIVE,
LOW DROPOUT, ADJUSTABLE
3. Radiation Performance
3.1
3.1.1
3.1.2
3.1.3
3.2
3.2.1
3.3
3.3.1
3.4
3.4.1
Total Dose:
100 krads(Si), Dose rate = 50 - 300 rads(Si)/s
See Appendix B: RH1086 per IC manufacturer's Die Specification.
See Appendix C: RH1185 per IC manufacturer's Die Specification.
Every wafer lot is subjected to RLAT testing at the stated total dose and dose rate.
SEU:
Tested up to 60 MeV-cm2/mg
See Appendix D: Lockheed Martin, Newtown: Single Event Effects Test Report Summary: LDO
Regulators.
SEL:
Immune up to 60 MeV-cm2/mg
See Appendix D: Lockheed Martin, Newtown: Single Event Effects Test Report Summary: LDO
Regulators.
ELDRS:
ESTIMATED: 50 krads(Si), Dose rate = 10 mrads(Si)/s
Testing in process as of February 4, 2010. Estimated completion date: March 12, 2010.
PAGE 2 of 2
Standard Products
VRG8651/VRG8652
Low Drop Out(LDO)Adjustable Voltage Regulators
Positive and Negative
Radiation Tolerant
www.aeroflex.com/voltreg
September 22, 2009
FEATURES
❑
❑
❑
❑
❑
❑
❑
Manufactured using
Linear Technology Corporation ® Space Qualified RH1086 and RH1185 die
❑ Negative regulator features (RH1185)
Radiation performance
– Output voltage adjustable: -2.37 to -25V
- Total dose > 100 krad (Si)
– Dropout voltage: 1.05V at 3Amps
Two-Independent voltage regulators
– 5-Terminal
Thermal shutdown
– Output current: 3A
Adjustable Output Voltages
– Voltage reference: -2.370V ±3%
Positive regulator features (RH1086)
– Load regulation: 0.8% max
– Output voltage adjustable: 1.25V to 23V
– Line regulation: 0.02% max
– Dropout voltage: 1.55V at 1.5Amps
– Ripple rejection: >60dB
– 3-Terminal
❑ Designed for aerospace and high reliability space
– Output current: 1.0A, See note 13
applications
– Voltage reference: 1.25V +2%, -3.2%
❑
Available
on DSCC SMD 5962-09201
– Load regulation: 0.3% max
– Line regulation: 0.25% max
– Ripple rejection: >60dB
Packaging – Hermetic metal
– Thru-hole or Surface mount
– 8 Leads, .75" x .42" x .200"
NOTE: Aeroflex Plainview does not currently have a
– Power package
DSCC certified Radiation Hardened Assurance Program
– Weight - 6 gm max
DESCRIPTION
The Aeroflex Plainview VRG8651/8652 consists of one Positive Adjustable (RH1086) and one Negative Adjustable
(RH1185) LDO voltage regulator capable of supplying 1.0Amps (RH1086) /3Amps(RH1185) respectively over the
output voltage range as defined under recommended operating conditions. The VRG8651/8652 offers excellent line
and load regulation specifications and ripple rejection. There is full electrical isolation between the regulators and each
regulator to the package.
The VRG8651/8652 serves a wide variety of applications including SCSI-2 Active Terminator, High Efficiency Linear
Regulators, Post Regulators for Switching Supplies, Constant Current Regulators, Battery Chargers and
Microprocessor Supply.
The VRG8651/8652 has been specifically designed to meet exposure to radiation environments. The VRG8651 is
configured for a Thru-Hole 8 lead metal power package and the VRG8652 is configured for a Surface Mount 8 lead
metal power package. It is guaranteed operational from -55°C to +125°C. Available screened to MIL-STD-883, the
VRG8651/8652 is ideal for demanding military and space applications.
Dropout (VIN - VOUT) decreases at lower load currents for both regulators.
For detailed performance characteristic curves, applications information and typical applications see the
latest
Linear Technology Corporation ® data sheets for their RH/LT1086 and RH/LT1185, which is available
on-line at www.linear.com.
1
3
ADJ
RH1086
7
VOUT
VOUT
VIN
4
Reference
2
Feedback
6
RH1185
VIN
GND
Positive
Regulator
Negative
Regulator
5
8
SCD8651 Rev E
FIGURE 1 – BLOCK DIAGRAM / SCHEMATIC
ABSOLUTE MAXIMUM RATINGS
RANGE
PARAMETER
Input Voltage
RH1086
RH1185
25+VREF
-35
Lead temperature (soldering 10 Sec)
UNITS
VDC
°C
300
Input Output Differential
Feedback & Reference Voltage
Output Voltage
25
30
VDC
-
-7
VDC
+25
-30
VDC
2000 1/
V
Operating Junction Temperature Range
-55 to +150
°C
Storage Temperature Range
-65 to +150
°C
ESD
NOTICE: Stresses above those listed under "Absolute Maximums Rating" may cause permanent damage to the device. These are stress rating
only; functional operation beyond the "Operation Conditions" is not recommended and extended exposure beyond the "Operation
Conditions" may effect device reliability.
RECOMMENDED OPERATING CONDITIONS
RANGE
PARAMETER
Output Voltage Range
Input Output Differential
UNITS
RH1086
RH1185
1.275 to 23
-2.45 to -25
VDC
1.5 to 25
1 to 28
VDC
Case Operating Temperature Range
-55 to +125
°C
5
°C/W
Thermal Resistance, Junction to case θjc
ELECTRICAL PERFORMANCE CHARACTERISTICS 2/
PARAMETER
SYM
CONDITIONS (P ≤ PMAX)
MIN
MAX
UNITS
1.210
1.275
V
ΔVOUT ILOAD = 10mA, 1.5V < VIN - VOUT < 15V
ΔVIN
-
0.25
%
Load Regulation 3/
ΔVOUT 10mA < IOUT < 1.0A, VIN - VOUT = 3V
ΔIOUT
-
0.3
%
Dropout Voltage
VDROP ΔVREF = 1%, IOUT = 1.0A
-
1.30
V
-
120
µA
-
5
µA
RH1086 Positive LDO section only
Reference Voltage 3/
Line Regulation
VREF
3/
4/
Adjust Pin Current
-
Adjust Pin Current Change
-
Current Limit
Minimum Load Current
5/
Ripple Rejection 3/
1.5V < VIN - VOUT < 15V, ILOAD = 10mA
10 mA < IOUT < 1.0A, 1.5V < VIN - VOUT < 15V
IMAX
VIN - VOUT = 5V
VIN - VOUT < 25V
1.0
0.047
-
A
A
IMIN
VIN - VOUT = 25V
-
10
mA
60
-
dB
-
IOUT = 1.0A, VIN - VOUT = 3V, f = 120Hz,
CADJ = COUT = 25µF
Thermal Regulation
30ms pulse, TC = +25°C
-
0.04
%/W
VREF Long-Term Stability 5/
Burn In: TC = +125°C @ 1000hrs minimum, tested @ 25°C
-
0.3
%
SCD8651 Rev E 9/22/09
2
Aeroflex Plainview
ELECTRICAL PERFORMANCE CHARACTERISTICS 2/ (con’t)
PARAMETER
CONDITIONS (P ≤ PMAX)
MIN
MAX
UNITS
1mA < IOUT < 3A, VIN - VOUT = 1.2V to 28V, VOUT = -5V
-2.29
-2.45
V
IOUT = 0.5A, VOUT = -5V
-
0.425
V
IOUT = 3A, VOUT = -5V
-
1.05
V
SYM
RH1185 Negative LDO section only 1/, 9/
Reference Voltage
(At pin 6) 9/
Dropout Voltage
VREF
6/
VDROP
Line Regulation
10/
ΔVOUT
ΔVIN
1.0V < VIN - VOUT < 20V, VOUT = -5V
-
0.02
%/V
Load Regulation
10/
ΔVOUT
ΔIOUT
5mA < IOUT < 3A, VIN - VOUT = 1.5V to 10V, VOUT = -5V
-
0.8
%
-
-4.50
V
1.5V < VIN - VOUT < 10V
3.3
4.55
A
VIN - VOUT = 15V
2.0
4.5
A
VIN - VOUT = 20V
1.0
3.1
A
VIN - VOUT = 30V 5/
0.2
1.6
A
RLIM = 5KΩ 12/
2.7
3.7
A
RLIM = 15KΩ 12/
0.9
1.6
A
IOUT = 5mA, VOUT = VREF, -4V < VIN < -25V
-
3.5
mA
VIN – VOUT = VSAT
-
35
mA/A
-
21
mA/A
60
-
dB
-
0.014
%/W
Minimum Input Voltage
7/
Internal Current Limit (See
Graph for Guaranteed Curve See Figure 6)
External Current Limit
Quiescent Supply Current 8/
Supply Current
Change with Load
VIN MIN IOUT = 3A , VOUT = VREF
ICL
ILIM
IQ
IQΔ
11/
VIN – VOUT ≥ 2V
Ripple Rejection
-
IOUT = 1.0A, VIN - VOUT = 3V, f = 120Hz,
Thermal Regulation (See
application information
LT1185) 5/
-
VIN –VOUT = 10V, IOUT = 5mA to 2A, TC = +25°C
Notes
1. Meets ESD testing per MIL-STD-883, method 3015, Class 2.
2. Unless otherwise specified, these specifications apply for post radiation and -55°C < Tc < +125°C.
3. Line and load regulation are guaranteed up to the maximum power dissipation of 15W. Power dissipation is determined by the input/output
differential voltage and the output current. Guaranteed maximum power dissipation will not be available over the full input/output voltage
range.
4. Dropout voltage is specified over the full output current range of the device.
5. Not tested. Shall be guaranteed by design, characterization, or correlation to other tested parameters.
6. Dropout voltage is tested by reducing input voltage until the output drops 1% below its nominal value. Tests are done at 0.5A and 3A. The
power transistor looks basically like a pure resistance in this range so that minimum differential at any intermediate current can be
calculated by interpolation; VDROPOUT = 0.25V + (0.25Ω x IOUT). For load current less than 0.5A, see Figure 4.
7. “Minimum input voltage” is limited by base emitter voltage drive of the power transistor section, not saturation as measured in Note 6. For
output voltages below 4V, “minimum input voltage” specification may limit dropout voltage before transistor saturation limitation.
8. Supply current is measured on the ground pin, and does not include load current, RLIM, or output divider current.
9. The 25W power level is guaranteed for an input-output voltage of 8.3V to 17V. At lower voltages the 3A limit applies, and at higher
voltages the internal power limiting may restrict regulator power below 25W.
10. Line and load regulation are measured on a pulse basis with a pulse width of 2ms, to minimize heating. DC regulation will be affected by
thermal regulation and temperature coefficient of the reference.
11. VSAT is the maximum specified dropout voltage; 0.25V +(0.25Ω x IOUT).
12. Current limit is programmed with a resistor from REF pin to GND pin. RLIM = 15KΩ/ILIM.
13. For compliance with MIL-STD- 883 revision C current density specification, the RH1086MK is derated to 1 Amp but is capable of
1.5 Amps
SCD8651 Rev E 9/22/09
3
Aeroflex Plainview
60
50
40
Maximum Power
Dissipation
(Watts)
30
Both Regulators
20
1 Regulator
10
0
0
20
40
60
80
100
120
140
Case Temperature (°C)
FIGURE 2 – MAXIMUM POWER vs CASE TEMPERATURE
The maximum Power dissipation is limited by the thermal shutdown function of each regulator chip in the VRG8651/8652. The
graph above represents the achievable power before the chip shuts down. The first line in the graph represents the maximum
power dissipation of the VRG8651/8652 with one regulator on (the other off) and the other line represents both regulators on
dissipating equal power. If both regulators are on and one regulator is dissipating more power that the other, the maximum power
dissipation of the VRG8651/8652 will fall between the two lines. This graph is based on the maximum junction temperature of
150°C and a thermal resistance (ΘJC) of 5°C/W.
SCD8651 Rev E 9/22/09
4
Aeroflex Plainview
MINIMUM INPUT/OUTPUT DIFFERENTIAL (V)
2
1
TJ = – 55°C
TJ = 25°C
TJ = 150°C
See Note 13, pg 3.
0
0
1
0.5
OUTPUT CURRENT (A)
1.5
FIGURE 3 – RH1086 DROPOUT VOLTAGE
TYPICAL CURVE
FIGURE 4 – RH1185 DROPOUT VOLTAGE
TYPICAL CURVE
See Note 13, pg 3.
FIGURE 6 – RH1185 INTERNAL CURRENT LIMIT
FIGURE 5 – RH1086 SHORT CIRCUIT CURRENT
SCD8651 Rev E 9/22/09
5
Aeroflex Plainview
8
VIN
10µF
Tant.
VRG8651/52 7
(RH1086)
Vout
1
10µF
Tant.
R1
VREF
ADJ
VREF = 1.25V, IADJ = 50µA
+Reg = VOUT = VREF (1+R2/R1) + (IADJ x R2)
R2
FIGURE 7 – BASIC RH1086 ADJUSTABLE REGULATOR APPLICATION
The RH1185 output voltage is set by two external resistors.
Internal reference voltage is trimmed to
2.37V so that a standard 1% 2.37k resistor (R1) can be
used to set divider current at 1mA. R2 is then selected
from:
+
+
+
PARASITIC
LEAD RESISTANCES
C1
VIN
R2 =
+
5
2
– 2.37) R1
(V
R2 = OUT
VREF
REF
GND
FB
for R1 = 2.37k and VREF = 2.37V, this reduces to:
V OUT – 2.37
10 -3
4
–
– rb +
IGND
ra
RLIM
VIN
6
VRG8651/52
RH1185
(RH1185)
VOUT
C2
R1*
2.37k
LOAD
VOUT
R2
3
–
suggested values of 1% resistors are shown.
VOUT
R2 WHEN R1 = 2.37k
2.5V
3.3V
.
5V
12V
15V
130Ω
930Ω
2.67k
9.76k
12.7k
*R1 SHOULD BE CONNECTED DIRECTLY TO GROUND LEAD, NOT TO THE LOAD,
SO THAT ra ≈ 0Ω. THIS LIMITS THE OUTPUT VOLTAGE ERROR TO (IGND)(rb).
ERRORS CREATED BY ra ARE MULTIPLIED BY (1 + R2/R1). NOTE THAT VOUT
INCREASES WITH INCREASING GROUND PIN CURRENT. R2 SHOULD BE CONNECTED
DIRECTLY TO LOAD FOR REMOTE SENSING. C1 = C2 > 2µF Tantalum.
SETTING OUTPUT VOLTAGE
R1 & R2 LOCATION & PROPER CONNECTION OF
POSITIVE SENSE LEAD
FIGURE 8 – BASIC RH1185 ADJUSTABLE REGULATOR APPLICATION
SCD8651 Rev E 9/22/09
6
Aeroflex Plainview
TABLE I – PIN NUMBERS vs FUNCTION
PIN
FUNCTION
1
POS_ADJ_1
2
NEG_REF_2
3
NEG_VOUT_2
4
NEG_VIN_2
5
NEG_GND_2
6
NEG_FB_2
7
POS_VOUT_1
8
POS_VIN_1
.300
.090
8X
.100
.108
ø .010
M
CBA
.150 REF.
ø.145 THRU
2x .028
MAX.
7
8
6
2° MAX. TYP.
5
.720 ±.020
MEASURED
LEAD TIP
.415
.2075
–C–
2
1
3
4
ESD/PIN 1
IDENT
.230 MIN
.515
R.065 TYP.
4 PLCS
.632
.755
±.003
.122
–B–
ø .010
BCA
.220 MAX.
±.005
–A–
.040
Notes:
1. Dimension Tolerance: ±.005 inches
2. Package contains BeO substrate
3. Case electrically isolated
.030 DIA.
±.002
ø .010
M
CBA
FIGURE 9 – PACKAGE OUTLINE — THRU-HOLE POWER PACKAGE
SCD8651 Rev E 9/22/09
7
Aeroflex Plainview
TABLE II – PIN NUMBERS vs FUNCTION
PIN
FUNCTION
1
POS_ADJ_1
2
NEG_REF_2
3
NEG_VOUT_2
4
NEG_VIN_2
5
NEG_GND_2
6
NEG_FB_2
7
POS_VOUT_1
8
POS_VIN_1
.300
.090
8X
.100
.108
ø .010
CBA
ø.145 THRU
2x .028
MAX.
.150 REF.
M
7
8
6
.060 ±.005
5
.415
.886 ±.020
.2075
–C–
R.065 TYP.
4 PLCS
2
1
3
4
ESD/PIN 1
IDENT
.515
.632
.755
±.003
.122
–B–
ø .010
BCA
.220 MAX.
±.005
–A–
.020±.005
.030 DIA.
±.002
ø .010
M
CBA
.040
Notes:
1. Dimension Tolerance: ±.005 inches
2. Package contains BeO substrate
3. Case electrically isolated
FIGURE 10 – PACKAGE OUTLINE — SURFACE MOUNT POWER PACKAGE
SCD8651 Rev E 9/22/09
8
Aeroflex Plainview
ORDERING INFORMATION
MODEL
DSCC SMD #
SCREENING
-
Military Temperature, -55°C to +125°C
Screened in accordance with MIL-PRF-38534, Class K.
VRG8651-S
VRG8651-7
Commercial Flow, +25°C testing only
VRG8652-S
Military Temperature, -55°C to +125°C
Screened in accordance with MIL-PRF-38534, Class K
VRG8652-7
Commercial Flow, +25°C testing only
VRG8651-201-1S
VRG8651-201-2S
5962-0920101KUC
5962-0920101KUA
VRG8652-201-1S
VRG8652-201-2S
5962-0920101KZC
5962-0920101KZA
PACKAGE
8 Lead Thru-Hole
Power Pkg
8 Lead Surface
Mount Power Pkg
8 Lead Thru-Hole
Power Pkg
In accordance with DSCC SMD
8 Lead Surface
Mount Power Pkg
EXPORT CONTROL:
EXPORT WARNING:
This product is controlled for export under the International Traffic in
Arms Regulations (ITAR). A license from the U.S. Department of
State is required prior to the export of this product from the United
States.
Aeroflex’s military and space products are controlled for export under
the International Traffic in Arms Regulations (ITAR) and may not be
sold or proposed or offered for sale to certain countries. (See ITAR
126.1 for complete information.)
PLAINVIEW, NEW YORK
Toll Free: 800-THE-1553
Fax: 516-694-6715
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Tel: 805-778-9229
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Tel: 603-888-3975
Fax: 603-888-4585
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Tel: 321-951-4164
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WEST COAST
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CENTRAL
Tel: 719-594-8017
Fax: 719-594-8468
www.aeroflex.com
[email protected]
Aeroflex Microelectronic Solutions reserves the right to
change at any time without notice the specifications, design,
function, or form of its products described herein. All
parameters must be validated for each customer's application
by engineering. No liability is assumed as a result of use of
this product. No patent licenses are implied.
Our passion for performance is defined by three
attributes represented by these three icons:
solution-minded, performance-driven and customer-focused
and the Linear Technology logo are registered trademarks and RH1185 & RH1086 are a copyright of Linear Technology
SCD8651 Rev E 9/22/09
9
SPEC NO. 05-08-5134 REV. G
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
REVISION RECORD
REV
0
A
B
DESCRIPTION
DATE
INITIAL RELEASE
PAGE 11, FIGURES 6, 7, CHANGED θja AND θjc.
PAGE 3, PARAGRAPH 3.8 CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 1.
06/02/98
09/24/99
03/07/01
PAGE 4, PARAGRAPH 5.0 CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 3.
PARAGRAPH 5.2 ADDED “HEREIN” AFTER TABLE 2.
PARAGRAPH 6.2 ADDED “HEREIN” AFTER TABLE 3.
PAGE 5, 6.3 CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 3.
C
• REMOVED THE “M” FROM THE DEVICE TITLE, THROUGHOUT THE SPEC, TO MATCH THE
07/16/02
DATA SHEET AND RPL.
• PAGE 3, PARAGRAPH 3.6 CHANGED TO REFLECT ONLY FIGURE 1 FOR BOTH DEVICE
OPTIONS.
PARAGRAPH 3.7.1, CHANGED THE DOSAGE RATE FROM “APPROXIMATELY 20 RADS PER
SECOND” TO “LESS THAN OR EQUAL TO 10 RADS PER SECOND”.
PARAGRAPH 3.7.3, NOW REFLECTS TOTAL DOSE BIAS AS FIGURE 2.
• PAGE 4, PARAGRAPH 5.5, NOW REFLECTS BURN-IN CIRCUITS AS FIGURES 3 AND 4.
PARAGRAPH 5.6, NOW REFLECTS CASE OUTLINES AS FIGURES 5 AND 6.
PARAGRAPH 5.7, NOW REFLECTS TERMINAL CONNECTIONS AS FIGURES 7 AND 8.
PARAGRAPH 6.1 CHANGED QUALITY ASSURANCE PROVISIONS TO STATE THAT LTC IS
QML CERTIFIED AND THAT RAD HARD CANDIDATES ARE ASSEMBLED ON QUALIFIED
CLASS S MANUFACTURING LINES.
• PAGES 6 THROUGH 12, ALL FIGURE TITLES CHANGED TO HAVE DEVICE OPTIONS AND
PACKAGE TYPES AT TOP OF PAGE, AND HAVE ALL FIGURES AT BOTTOM OF PAGE.
• CONVERSION OF SPECIFICATION FROM WORD PERFECT TO MICROSOFT WORD.
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
REVISION
INDEX
PAGE NO.
REVISION
1
G
2
G
3
G
4
G
5
G
6
G
APPLICATION
8
G
9
G
10
G
11
G
12
G
13
G
14
G
15
G
16
G
LINEAR TECHNOLOGY CORPORATION
MILPITAS, CALIFORNIA
TITLE: MICROCIRCUIT, LINEAR,
RH1086BHK, 0.5A AND RH1086BKK, 1.5A,
LOW DROPOUT POSITIVE
REGULATOR DICE
ORIG
DSGN
ENGR
MFG
CM
QA
PROG
FUNCT
7
G
SIZE
SIGNOFFS
DATE
CAGE
CODE
64155
DRAWING
NUMBER
05-08-5134
CONTRACT:
FOR OFFICIAL USE ONLY
LINEAR TECHNOLOGY CORPORATION
Page 1 of 16
REV
G
SPEC NO. 05-08-5134 REV. G
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
REVISION RECORD
REV
DESCRIPTION
DATE
D
CHANGED RH1086H TO RH1086BHK AND RH1086K TO RH1086BKK THROUGHOUT SPEC.
10/28/03
E
•
PAGE 3, CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC.
03/22/05
F
•
•
05/21/08
G
•
PAGE 4, PARAGRAPH 3.7.1 CHANGED VERBIAGE.
PAGE 5, PARAGRAPH 5.8 CHANGED ALLOY 42 TO ALLOY 52 TO3 PACKAGE
REQUIREMENT.
PAGE 10, FIGURE 4 STATIC BURN-IN CIRCUIT CHANGED TO 04-06-0302 PER ENG.
•
PAGE 16, CHANGED RH CANNED SAMPLE TABLE III FOR QUALIFYING DICE SALES
ADDED TEMPERATURE CYCLE, CONSTANT ACCELERATION & REMOVED PIND TEST.
FOR OFFICIAL USE ONLY
LINEAR TECHNOLOGY CORPORATION
Page 2 of 16
SPEC NO. 05-08-5134 REV. G
1.0
SCOPE:
1.1
2.0
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
This specification defines the performance and test requirements for a microcircuit processed to a
space level manufacturing flow.
APPLICABLE DOCUMENTS:
2.1
Government Specifications and Standards: the following documents listed in the Department of
Defense Index of Specifications and Standards, of the issue in effect on the date of solicitation,
form a part of this specification to the extent specified herein.
SPECIFICATIONS:
2.2
3.0
MIL-PRF-38535
Integrated Circuits (Microcircuits) Manufacturing, General Specification
for
MIL-STD-883
Test Method and Procedures for Microcircuits
MIL-STD-1835
Microcircuits Case Outlines
Order of Precedence: In the event of a conflict between the documents referenced herein and the
contents of this specification, the order of precedence shall be this specification, MIL-PRF-38535
and other referenced specifications.
REQUIREMENTS:
3.1
General Description: This specification details the requirements for the RH1086BHK, 0.5A and
RH1086BKK, 1.5A, Low Dropout Positive Regulator Dice and Element Evaluation Test Samples,
processed to space level manufacturing flow as specified herein.
3.2
Part Number:
3.3
3.2.1
OPTION 1 – RH1086BHK Dice
3.2.2
OPTION 2 – RH1086BKK Dice
Special Handling of Dice: Rad Hard dice require special handling as compared to standard IC
dice. Rad Hard dice are susceptible to surface damage due to the absence of silicon nitride
passivation as on standard dice. Silicon nitride protects the dice surface from scratches by it’s hard
and dense properties. The passivation on Rad Hard dice is silicon dioxide which is much “softer”
than silicon nitride.
LTC recommends that dice handling be performed with extreme care so as to protect the dice
surface from scratches. If the need arises to move the die around from the chip tray, use a Teflon
tipped vacuum wand. This wand can be made by pushing a small diameter of Teflon tubing onto
the tip of a steel tipped wand. The inside diameter of the Teflon tip should match the dice size for
efficient pickup. The tip of the Teflon should be cut square and flat to ensure good vacuum to dice
surface. Ensure the Teflon tip remains clean from debris by inspecting under stereo scope.
During die attach, care must be exercised to ensure no tweezers touch the top of the dice.
LINEAR TECHNOLOGY CORPORATION
Page 3 of 16
SPEC NO. 05-08-5134 REV. G
3.4
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
The Absolute Maximum Ratings:
Power Dissipation
. . . . . . .
Input to Output Voltage Differential . .
Operating Junction Temperature Range
Control Section
Power Transistor
Storage Temperature Range
. . . .
.
Lead Temperature (Soldering, 10 sec)
. . . . . .
Internally Limited
. . . . . . . .
25V
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
-55°C to +150°C
-55°C to +200°C
. . . . . . . . -65°C to +150°C
. . . . . . . .
300°C
3.5
Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions,
and electrical requirements shall be specified herein.
3.6
Outline Dimensions and Pad Functions: Dice outline dimensions, pad functions, and locations shall
be specified in Figure 1.
3.7
Radiation Hardness Assurance (RHA):
3.7.1
The manufacturer shall perform a lot sample test as an internal process monitor for total
dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019
Condition A as a guideline..
3.7.2
For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose
irradiation, the manufacturer will provide certified RAD testing and report through an
independent test laboratory when required as a customer purchase order line item.
3.7.3
Total dose bias circuit is specified in Figure 2.
3.8
Wafer (or Dice) Probe: Dice shall be 100% probed at Ta = +25°C to the limits shown in Table I
herein. All reject dice shall be removed from the lot. This testing is normally performed prior to
dicing the wafer into chips. Final specifications after assembly are sample tested during the
element evaluation.
3.9
Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535,
Appendix A, except for the following: Top side glassivation thickness shall be a minimum of
4KÅ.
3.10
Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018. Copies of
SEM photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data
Pack when specified as a customer purchase order line item.
3.11
Traceability: Wafer Diffusion Lot and Wafer traceability shall be maintained through Quality
Conformance Inspection.
4.0
QUALITY CONFORMANCE INSPECTION: Quality Conformance Inspection shall consist of the tests
and inspections specified herein.
5.0
SAMPLE ELEMENT EVALUATION: A sample from each wafer supplying dice shall be assembled and
subjected to element evaluation per Table III herein.
LINEAR TECHNOLOGY CORPORATION
Page 4 of 16
SPEC NO. 05-08-5134 REV. G
6.0
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
5.1
100 Percent Visual Inspection: All dice supplied to this specification shall be inspected in
accordance with MIL-STD-883, Method 2010, Condition A. All reject dice shall be removed from
the lot.
5.2
Electrical Performance Characteristics for Element Evaluation: The electrical performance
characteristics shall be as specified in Table I and Table II herein.
5.3
Sample Testing: Each wafer supplying dice for delivery to this specification shall be subjected to
element evaluation sample testing. No dice shall be delivered until all the lot sample testing has
been performed and the results found to be acceptable unless the customer supplies a written
approval for shipment prior to completion of wafer qualification as specified in this specification.
5.4
Part Marking of Element Evaluation Sample Includes:
5.4.1
LTC Logo
5.4.2
LTC Part Number
5.4.3
Date Code
5.4.4
Serial Number
5.4.5
ESD Identifier per MIL-PRF-38535, Appendix A
5.4.6
Diffusion Lot Number
5.4.7
Wafer Number
5.5
Burn-In Requirement: Burn-In circuit for TO39 package is specified in Figure 3 and Burn-In
circuit for TO3 package is specified in Figure 4.
5.6
Mechanical/Packaging Requirements: Case Outline and Dimensions are in accordance with
Figure 5 and Figure 6.
5.7
Terminal Connections: The terminal connections shall be as specified in Figure 7 and Figure 8.
5.8
Lead Material and Finish: The lead material and finish shall be Kovar for device option 1 and
Alloy 52 for device option 2, with hot solder dip (Finish letter A) in accordance with MIL-PRF38535.
VERIFICATION (QUALITY ASSURANCE PROVISIONS)
6.1
Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MILPRF-38535. Linear Technology is a QML certified company and all Rad Hard candidates are
assembled on qualified Class S manufacturing lines.
6.2
Sampling and Inspection: Sampling and Inspection shall be in accordance with Table III herein.
6.3
Screening: Screening requirements shall be in accordance with Table III herein.
LINEAR TECHNOLOGY CORPORATION
Page 5 of 16
SPEC NO. 05-08-5134 REV. G
6.4
6.5
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
Source Inspection:
6.4.1
The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal
internal visual.
6.4.2
The procuring activity has the right to perform source inspection at the supplier’s facility
prior to shipment for each lot of deliverables when specified as a customer purchase order
line item. This may include wafer lot acceptance, die visual, and final data review.
Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered:
6.5.1
Lot Serial Number Sheets identifying all Canned Sample devices accepted through final
inspection by serial number.
6.5.2
100% attributes (completed element evaluation traveler).
6.5.3
Element Evaluation variables data, including Burn-In and Op Life
6.5.4
SEM photographs (3.10 herein)
6.5.5
Wafer Lot Acceptance Report (3.9 herein)
6.5.6
A copy of outside test laboratory radiation report if ordered
6.5.7
Certificate of Conformance certifying that the devices meet all the requirements of this
specification and have successfully completed the mandatory tests and inspections herein.
Note: Items 6.5.1 and 6.5.7 will be delivered as a minimum, with each shipment.
7.0
Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All dice
shall be packaged in multicavity containers composed of conductive, anti-static, or static dissipative
material with an external conductive field shielding barrier.
LINEAR TECHNOLOGY CORPORATION
Page 6 of 16
SPEC NO. 05-08-5134 REV. G
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
DICE OUTLINE DIMENSIONS AND PAD FUNCTIONS
OPTION 1, RH1086BHK, 0.5A DICE AND OPTION 2, RH1086BKK, 1.5A DICE
“H” OR “K” (DEPENDING ON THE DEVICE OPTION)
WILL BE REFLECTED HERE
FIGURE 1
LINEAR TECHNOLOGY CORPORATION
Page 7 of 16
SPEC NO. 05-08-5134 REV. G
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
TOTAL DOSE BIAS CIRCUIT
FIGURE 2
LINEAR TECHNOLOGY CORPORATION
Page 8 of 16
SPEC NO. 05-08-5134 REV. G
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
TO39 STATIC BURN-IN CIRCUIT
OPTION 1, T039 METAL CAN / 3 LEADS
FIGURE 3
LINEAR TECHNOLOGY CORPORATION
Page 9 of 16
SPEC NO. 05-08-5134 REV. G
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
STATIC BURN-IN CIRCUIT
OPTION #2, TO3 / 2 LEADS
FIGURE 4
LINEAR TECHNOLOGY CORPORATION
Page 10 of 16
SPEC NO. 05-08-5134 REV. G
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
DEVICE OPTION # 1
(H) TO39 METAL CAN / 3 LEADS CASE OUTLINE
FIGURE 5
θja = +150°C/W
θjc = +40°C/W
LINEAR TECHNOLOGY CORPORATION
Page 11 of 16
SPEC NO. 05-08-5134 REV. G
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
DEVICE OPTION # 2
(K) TO3 METAL CAN / 2 LEADS CASE OUTLINE
θja = +35°C/W
θjc = +3°C/W
FIGURE 6
LINEAR TECHNOLOGY CORPORATION
Page 12 of 16
SPEC NO. 05-08-5134 REV. G
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
TERMINAL CONNECTIONS
DEVICE OPTION #1, TO39 / 3 LEAD METAL CAN
FIGURE 7
DEVICE OPTION #2, TO3 / 2 LEAD METAL CAN
FIGURE 8
LINEAR TECHNOLOGY CORPORATION
Page 13 of 16
SPEC NO. 05-08-5134 REV. G
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
TABLE I DICE ELECTRICAL CHARACTERISTICS – Element Evaluation (Note 1)
LINEAR TECHNOLOGY CORPORATION
Page 14 of 16
SPEC NO. 05-08-5134 REV. G
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
TABLE II ELECTRICAL CHARACTERISTICS (POSTIRRADIATION)
TA = 25°C unless otherwise noted.
LINEAR TECHNOLOGY CORPORATION
Page 15 of 16
SPEC NO. 05-08-5134 REV. G
RH1086BHK, 0.5A AND RH1086BKK , 1.5A
LOW DROPOUT POSITIVE REGULATOR DICE
TABLE III RH ELEMENT EVALUATION TABLE QUALLIFICATION OF DICE SALES
LINEAR TECHNOLOGY CORPORATION
Page 16 of 16
SPEC NO. 05-08-5232 REV. A
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
REVISION RECORD
REV
DESCRIPTION
DATE
0
INITIAL RELEASE
02/11/09
A
RH1185MK DICE/DWF DATA SHEET AMENDED. PAGE 11, PRE-IRRADIATION
ELECTRICAL TEST LIMITS CHANGED REFERENCE VOLTAGE FROM -1.1V MIN,
1.1V MAX TO -2.344V MIN., -2.396V MAX, WITH A TYPICAL OF -2.37 V.
12/02/09
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
REVISION
INDEX
REVISION
INDEX
PAGE NO.
REVISION
PAGE NO.
REVISION
1
A
2
A
3
A
4
A
5
A
6
A
7
A
APPLICATION
9
A
10
A
11
A
12
A
13
A
LINEAR TECHNOLOGY
CORPORATION
MILPITAS, CALIFORNIA
ORIG
DSGN
ENGR
MFG
CM
QA
PROG
FUNCT
8
A
TITLE:
MICROCIRCUIT, LINEAR, RH1185MK
DICE NEGATIVE REGULATOR WITH
ADJUSTABLE CURRENT LIMIT
SIZE
SIGNOFFS
DATE
CAGE
CODE
DRAWING NUMBER
REV
64155
05-08-5232
A
CONTRACT:
FOR OFFICIAL USE ONLY
LINEAR TECHNOLOGY CORPORATION
PAGE 1 OF 13
SPEC NO. 05-08-5232 REV. A
1.0
SCOPE:
1.1
2.0
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
This specification defines the performance and test requirements for a microcircuit processed to a space
level manufacturing flow.
APPLICABLE DOCUMENTS:
2.1
Government Specifications and Standards: the following documents listed in the Department of
Defense Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a
part of this specification to the extent specified herein.
SPECIFICATIONS:
2.2
3.0
MIL-PRF-38535
Integrated Circuits (Microcircuits) Manufacturing, General Specification for
MIL-STD-883
Test Method and Procedures for Microcircuits
MIL-STD-1835
Microcircuits Case Outlines
Order of Precedence: In the event of a conflict between the documents referenced herein and the
contents of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and
other referenced specifications.
REQUIREMENTS:
3.1
General Description: This specification details the requirements for the RH1185MK, DICE and
Element Evaluation Test Samples, processed to space level manufacturing flow as specified herein.
3.2
Part Number:
3.3
Special Handling of Dice: Rad Hard dice require special handling as compared to standard IC dice.
Rad Hard dice are susceptible to surface damage due to the absence of silicon nitride passivation as on
standard dice. Silicon nitride protects the dice surface from scratches by its hard and dense properties.
The passivation on Rad Hard dice is silicon dioxide which is much “softer” than silicon nitride.
RH1185MKDice
LTC recommends that dice handling be performed with extreme care so as to protect the dice surface
from scratches. If the need arises to move the die around from the chip tray, use a Teflon tipped
vacuum wand. This wand can be made by pushing a small diameter of Teflon tubing onto the tip of a
steel tipped wand. The inside diameter of the Teflon tip should match the dice size for efficient pickup.
The tip of the Teflon should be cut square and flat to ensure good vacuum to dice surface. Ensure the
Teflon tip remains clean from debris by inspecting under stereo scope.
During die attach, care must be exercised to ensure no tweezers touch the top of the dice.
LINEAR TECHNOLOGY CORPORATION
PAGE 2 OF 13
SPEC NO. 05-08-5232 REV. A
3.4
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
The Absolute Maximum Ratings:
Input Voltage
. . . . .
Input - Output Differential
. . .
FB Voltage
. . . . . . . .
REF Voltage
. . . . . . .
Output Voltage . . . . . . .
Output Reverse Voltage
. . . .
Operating Ambient Temperature Range
4.0
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
Operating Junction Temperature Range
Control Section . . . . . . . . .
Power Transistor Section . . . . . .
. . . . . .
Storage Temperature Range
. . .
Lead Temperature (Soldering, 10 sec)
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
. . . . .
35V
. . . .
30V
7V
. . . . .
. . . . .
7V
30V
. . . . .
2V
. . . . .
. -55°C to 125°C
.
.
.
.
.
-55°C to +150°C
-55°C to +175°C
-65°C to +150°C
. . . +300°C
3.5
Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and
electrical requirements shall be specified herein.
3.6
Outline Dimensions and Pad Functions: Dice outline dimensions, pad functions, and locations shall be
specified in Figure 1.
3.7
Radiation Hardness Assurance (RHA):
3.7.1
The manufacturer shall perform a lot sample test as an internal process monitor for total
dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019
Condition A as a guideline.
3.7.2
For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation,
the manufacturer will provide certified RAD testing and report through an independent test
laboratory when required as a customer purchase order line item.
3.7.3
Total dose bias circuit is specified in Figure 2.
3.8
Wafer (or Dice) Probe: Dice shall be 100% probed at Ta = +25°C to the limits shown in Table I
herein. All reject dice shall be removed from the lot. This testing is normally performed prior to dicing
the wafer into chips. Final specifications after assembly are sample tested during the element
evaluation.
3.9
Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix
A, except for the following: Top side glassivation thickness shall be a minimum of 4KÅ.
3.10
Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018. Copies of SEM
photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack
when specified as a customer purchase order line item.
3.11
Traceability: Wafer Diffusion Lot and Wafer traceability shall be maintained through Quality
Conformance Inspection.
QUALITY CONFORMANCE INSPECTION: Quality Conformance Inspection shall consist of the tests and
inspections specified herein.
LINEAR TECHNOLOGY CORPORATION
PAGE 3 OF 13
SPEC NO. 05-08-5232 REV. A
5.0
6.0
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
SAMPLE ELEMENT EVALUATION: A sample from each wafer supplying dice shall be assembled and
subjected to element evaluation per Table III herein.
5.1
100 Percent Visual Inspection: All dice supplied to this specification shall be inspected in accordance
with MIL-STD-883, Method 2010, Condition A. All reject dice shall be removed from the lot.
5.2
Electrical Performance Characteristics for Element Evaluation: The electrical performance
characteristics shall be as specified in Table I and Table II herein.
5.3
Sample Testing: Each wafer supplying dice for delivery to this specification shall be subjected to
element evaluation sample testing. No dice shall be delivered until all the lot sample testing has been
performed and the results found to be acceptable unless the customer supplies a written approval for
shipment prior to completion of wafer qualification as specified in this specification.
5.4
Part Marking of Element Evaluation Sample Includes:
5.4.1
LTC Logo
5.4.2
LTC Part Number
5.4.3
Date Code
5.4.4
Serial Number
5.4.5
ESD Identifier per MIL-PRF-38535, Appendix A
5.4.6
Diffusion Lot Number
5.4.7
Wafer Number
5.5
Burn-In Requirement: Burn-In circuit for TO3 package is specified in Figure 3.
5.6
Mechanical/Packaging Requirements: Case Outline and Dimensions are in accordance with
Figure 4.
5.7
Terminal Connections: The terminal connections shall be as specified in Figure 5.
5.8
Lead Material and Finish: The lead material and finish shall be alloy 52 with hot solder dip (Finish
letter A) in accordance with MIL-PRF-38535.
VERIFICATION (QUALITY ASSURANCE PROVISIONS)
6.1
Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF38535. Linear Technology is a QML certified company and all Rad Hard candidates are assembled on
qualified Class S manufacturing lines.
6.2
Sampling and Inspection: Sampling and Inspection shall be in accordance with Table III herein.
6.3
Screening: Screening requirements shall be in accordance with Table III herein.
LINEAR TECHNOLOGY CORPORATION
PAGE 4 OF 13
SPEC NO. 05-08-5232 REV. A
6.4
6.5
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
Source Inspection:
6.4.1
The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal
internal visual.
6.4.2
The procuring activity has the right to perform source inspection at the supplier’s facility prior
to shipment for each lot of deliverables when specified as a customer purchase order line item.
This may include wafer lot acceptance, die visual, and final data review.
Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered:
6.5.1
Lot Serial Number Sheets identifying all Canned Sample devices accepted through final
inspection by serial number.
6.5.2
6.5.3
100% attributes (completed element evaluation traveler).
Element Evaluation variables data, including Burn-In and Op Life
6.5.4
SEM photographs (3.10 herein)
6.5.5
Wafer Lot Acceptance Report (3.9 herein)
6.5.6
A copy of outside test laboratory radiation report if ordered
6.5.7
Certificate of Conformance certifying that the devices meet all the requirements of this
specification and have successfully completed the mandatory tests and inspections herein.
Note: Items 6.5.1 and 6.5.7 will be delivered as a minimum, with each shipment.
7.0
Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All dice
shall be packaged in multicavity containers composed of conductive, anti-static, or static dissipative material
with an external conductive field shielding barrier.
LINEAR TECHNOLOGY CORPORATION
PAGE 5 OF 13
SPEC NO. 05-08-5232 REV. A
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
DICE OUTLINE DIMENSIONS AND PAD FUNCTIONS
FIGURE 1
LINEAR TECHNOLOGY CORPORATION
PAGE 6 OF 13
SPEC NO. 05-08-5232 REV. A
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
TOTAL DOSE BIAS CIRCUIT
FIGURE 2
LINEAR TECHNOLOGY CORPORATION
PAGE 7 OF 13
SPEC NO. 05-08-5232 REV. A
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
BURN-IN CIRCUIT
FIGURE 3
LINEAR TECHNOLOGY CORPORATION
PAGE 8 OF 13
SPEC NO. 05-08-5232 REV. A
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
TO3, 4 LEADS, CASE OUTLINE
θja = +35°C/W
θjc = +3°C/W
FIGURE 4
LINEAR TECHNOLOGY CORPORATION
PAGE 9 OF 13
SPEC NO. 05-08-5232 REV. A
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
TERMINAL CONNECTIONS
FIGURE 5
LINEAR TECHNOLOGY CORPORATION
PAGE 10 OF 13
SPEC NO. 05-08-5232 REV. A
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
TABLE I DICE ELECTRICAL CHARACTERISTICS – Element Evaluation (Note 1)
VIN = 7.4V, VOUT = 5V, IOUT = 1mA, RLIM = 4.02k, unless otherwise noted.
LINEAR TECHNOLOGY CORPORATION
PAGE 11 OF 13
SPEC NO. 05-08-5232 REV. A
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
TABLE II ELECTRICAL CHARACTERISTICS – Post-Irradiation (Note 5)
LINEAR TECHNOLOGY CORPORATION
PAGE 12 OF 13
SPEC NO. 05-08-5232 REV. A
RH1185MK DICE, NEGATIVE REGULATOR WITH ADJUSTABLE CURRENT LIMIT
TABLE III RH ELEMENT EVALUATION TABLE QUALIFICATION OF DICE SALES
RH CANNED SAMPLE TABLE FOR QUALIFYING DICE SALES
SUBGROUP
1
2
3
4
5
6
7
CLASS
K/S
H/B
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
OPERATION
METHOD
2018
MIL-STD-883
CONDITION
N/A
X
SEM
ELEMENT ELECTRICAL (WAFER SORT @ 25°C)
ELEMENT VISUAL (2nd OP)
INTERNAL VISUAL (3rd OP)
DIE SHEAR MONITOR
BOND PULL MONITOR
STABILIZATION BAKE
TEMPERATURE CYCLE
CONSTANT ACCELERATION
FINE LEAK
GROSS LEAK
FIRST ROOM ELECTRICAL - READ & RECORD
(REPLACE ANY ASSEMBLY-RELATED REJECTS)
ELECT. READ & RECORD @ +125°C or +150°C, -55°C
X
X
X
BURN-IN: +125°C/240 hrs. or +150°C/120 hrs.
POST BURN-IN ELECTRICAL @ 25°C READ & RECORD
PRE OP-LIFE ELECTRICAL @ 25°C READ & RECORD
1015
+125°C MINIMUM
240 HOURS
X
X
X
OPERATING LIFE: +125°C/1000 hrs. or +150°C/500 hrs.
POST OP-LIFE ELECT. (R&R 25°C, +125°C or +150°C, -55°C)
WIRE BOND EVALUATION
1005
+125°C MINIMUM
1000 HOURS
X
2010
2010
2019
2011
1008
1010
2001
1014
1014
C
C
E
A
C
ASSEMBLED PARTS ONLY
43 (3)
2011
NOTE:
LTC is not qualified to process to MIL-PRF-38534. This is an LTC imposed element evaluation that follows
MIL-STD-883 test methods and conditions. Please note the quantity and accept number from a Sample Size Series of
15%, accept on 3, and note that the actual sample and accept number does not begin until Subgroup 6.
NOTE:
Tests within Subgroup 5 may be performed in any sequence.
NOTE:
LTC's radiation tolerant (RH) die has a topside glassivation thickness of 4KÅ minimum.
NOTE:
Sample sizes on the travelers may be larger than that indicated in the above table; however, the larger sample size is
to accommodate extra units for replacement devices in the event of equipment or operator error and for assembly
related rejects in Subgroup 6, and for Wire Bond Evaluation, Subgroup 7. The larger sample size is at all times
kept segregated and, if used for qualification, has all the required processing imposed.
LINEAR TECHNOLOGY CORPORATION
A
A
QUANTITY
(ACCEPT NUMBER)
REF. METHOD 2018 FOR S/S
100%
100%
ASSEMBLED PARTS ONLY
PAGE 13 OF 13
15 (0) or 25 (1) - # of wires
Aeroflex Plainview
SEE TEST REPORT SUMMARY: LDO REGULATORS
Date:
Monday, March 02, 2009
Subject:
Details:
Summary of SEE Test data for VRG8651 Hybrid Devices
The VRG8651 consists of one LTC RH1086 Positive Voltage LDO Regulator and one LTC
RH1185 Negative LDO Voltage Regulator. These ICs are used in the following Aeroflex Voltage
Regulator products: VRG8651, VRG8652, VRG8657, VRG8658, VRG8662, and VRG8663
Test was performed on February 24, 2009 at Texas A & M university cyclotron. Steve Moyer, Tony Ward and
Surinder Seehra participated in the test from LMCSS Newtown. Other participants were Dan Clymer from Space
System Company Denver (customer representative) and Bill Stapor of Stapor Research, representative from
Government Program Office.
Four Hybrids containing both RH1185 and RH1086 devices were irradiated with Argon, Krypton and Xenon ions
with LET ranging from 5.6 to 60 MeV-cm2/mg. The fluence of ions was 1 E+06 during the single event transient
(SET) test and was 1 E+07 ions during the Single Event Latchup (SEL) test. Tests were performed on both
unfiltered devices and filtered devices. Unfiltered devices present data for any application of devices, whereas the
filtered devices represented ACSS application. Devices were irradiated under both applications of + 8 volts and +
15 volts.
Single Event Transients Data
Unfiltered Devices
When irradiated with xenon ions (LET = 40 to 60 MeV-cm2/mg) the RH1185 devices experienced many transients
with an amplitude of up to 10 Volts for a duration of up to 10 us. The amplitude and duration of transients
decreased when irradiated with ions of lower LET.
The RH1086 devices experienced transients with amplitude of up to 13 volts for a period of up to 50 uS. The
amplitude and duration of transients decreased when irradiated with ions of lower LET.
Filtered Devices
When irradiated with ions of LET of up to 60 MeV-cm2/mg, the RH1185 devices experienced no transients.
However, RH1086 devices experienced occasional very small transients. The effect of these transients needs to
be determined.
Single Event Latchup (SEL) data
The SEL test was performed by irradiating both RH1185 and RH1086 devices with Xenon ions with an LET of 40
MeV-cm2/mg at ion fluence of 1 E+07 ions/cm2. The LET of the ions was then increased to 60 MeV-cm2/mg and
with the same fluence of 1 E+07 ions/cm2. In each case, very little change in power supply current was observed
indicating no latch-up for both the devices.
It is concluded that the filter seems to do its job of filtering nearly all the transients. Some transients were
observed for the RH1086 devices. The effects of these transients need to be determined. In addition, none of
the devices suffered from Single Event Latchup.
Surinder S. Seehra
Senior Staff Engineer
Lockheed Martin Commercial Space Systems
100 Campus Drive, Newtown, PA 18940
REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
A
Table I; changed the max limit for the Dropout voltage test from 1.55 V
to 1.30 V. Removed 3/ on the Standard Microcircuit Drawing Bulletin
page and added Vendor CAGE number 88379. -sld
09-10-01
APPROVED
Charles F. Saffle
REV
SHEET
REV
A
A
A
A
A
A
SHEET
15
16
17
18
19
20
REV STATUS
OF SHEETS
PMIC N/A
STANDARD MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
REV
A
A
A
A
A
A
A
A
A
A
A
A
A
A
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PREPARED BY
Steve Duncan
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil/
CHECKED BY
Greg Cecil
APPROVED BY
Charles F. Saffle
DRAWING APPROVAL DATE
MICROCIRCUIT, HYBRID, DUAL VOLTAGE
REGULATOR, POSTIVE AND NEGATIVE,
LOW DROPOUT, ADJUSTABLE
09-08-19
REVISION LEVEL
A
SIZE
A
SHEET
DSCC FORM 2233
APR 97
CAGE CODE
67268
1
OF
5962-09201
20
5962-E504-09
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962



Federal
stock class
designator
\



RHA
designator
(see 1.2.1)
09201
01



Device
type
(see 1.2.2)
/
K



Device
class
designator
(see 1.2.3)
U



Case
outline
(see 1.2.4)
X



Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
8651, 8652
02
8657, 8658
Circuit function
Dual voltage regulator, positive and negative, low
dropout, adjustable
Dual voltage regulator, positive, low dropout, adjustable
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
Device performance documentation
K
Highest reliability class available. This level is intended for use in space
applications.
H
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
G
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
U
Z
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
Package style
6
6
8
8
Thru-Hole
Surface Mount
Thru-hole
Surface Mount
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Input voltage:
Positive regulator:
Device type 01 and 02 ........................................................
Negative regulator:
Device type 01....................................................................
Input-Output differential voltage:
Positive regulator:
Device types 01and 02 ......................................................
Negative regulator:
Device type 01....................................................................
Junction temperature (TJ) ..........................................................
Thermal resistance, junction-to-case (θJC) each regulator .........
Lead temperature (soldering, 10 seconds) ................................
Storage temperature range ........................................................
25+VREF
-35 V
25 V
30 V
+150°C
5°C/W
300°C
-65°C to +150°C
1.4 Recommended operating conditions.
Output voltage range:
Postive voltage regulator
Device types 01 and 02 .....................................................
Negative voltage regulator:
Device type 01....................................................................
Case operating temperature range (TC) ......................................
+1.275 V to +23 V dc
-2.45 V to -25 V dc
-55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
________
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
3
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.2.4 Maximum power dissipation verses case temperature table. The maximum power dissipation verses case temperature
is specified in table IA.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Group A
subgroups
Conditions
-55°C ≤ TC ≤+125°C
P ≤ PMAX
unless otherwise specified
Device
types
Limits
Unit
Min
Max
1.210
1.275
V
POSITIVE REGULATOR
1.5 V ≤ (VIN - VOUT) ≤ 15 V,
ILOAD = 10 mA
1,2,3
01,02
Line regulation 1/
1.5 V ≤ (VIN - VOUT) ≤ 15 V,
ILOAD = 10 mA
1,2,3
01,02
0.25
%
Load regulation 1/
10 mA ≤ IOUT ≤ 1.0 A, (VIN - VOUT)
=3V
1,2,3
01,02
0.3
%
Thermal regulation
30 ms pulse, TC = +25°C
1
01,02
0.04
%/W
∆VREF = 1%, IOUT = 1.0 A
1,2,3
01,02
1.30
V
IOUT = 1.0 A, (VIN - VOUT) = 3 V,
f = 120 Hz, CADJ = COUT = 25 µF
1,2,3
01,02
1
01,02
120
µA
Reference voltage
Dropout voltage
VREF
VDROP
Ripple rejection
60
dB
Adjustment pin current
IADJ
TC = +25°C
Adjustment pin current
change
∆IADJ
10 mA ≤ IOUT ≤ 1.0 A,
1.5 V ≤ (VIN - VOUT) ≤ 15 V
1,2,3
01,02
5
µA
Minimum load current 2/
IMIN
(VIN - VOUT) = 25 V
1,2,3
01,02
10
mA
Current limit
IMAX
(VIN - VOUT) = 5 V
1,2,3
01,02
(VIN - VOUT) ≤ 25 V
1,2,3
VREF Long term stability
2/
Burn-in: TC = +125°C at 1000
hours minimum, tested at +25°C
1.0
A
0.047
1
01,02
1,3
01
0.3
%
-2.45
V
NEGATIVE REGULATOR
Reference voltage
VREF
VIN - VOUT = -1.2 V to -28 V,
1 mA ≤ IOUT ≤ 3 A, VOUT = -5 V,
TC = +25°C and -55°C
-2.29
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
5
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Group A
subgroups
Conditions
-55°C ≤ TC ≤+125°C
P ≤ PMAX
unless otherwise specified
Device
types
Limits
Min
Unit
Max
NEGATIVE REGULATOR - CONTINUED
Dropout Voltage
VDROP
IOUT = 0.5 A, VOUT = -5 V
1,2,3
01
V
0.425
IOUT = 3 A, VOUT = -5 V
1.05
Ripple rejection
IOUT = 1.0 A, (VIN - VOUT) = 3 V,
f = 120 Hz, CADJ = COUT = 25 µF
1,2,3
01
Line regulation 1/
1 V ≤ (VIN - VOUT) ≤ 20 V,
VOUT = -5 V
1,2,3
01
0.02
%/V
Load regulation 1/
5 mA ≤ IOUT ≤ 3 A, (VIN - VOUT) =
-1.5 V to -10 V, VOUT = -5 V
1,2,3
01
0.8
%
Thermal regulation 2/
VIN - VOUT = 10 V, IOUT = 5 mA to 2
A, TC = +25°C
1
01
0.014
%/W
1,2,3
01
-4.5
V
1,3
01
3.3
4.55
A
(VIN - VOUT) =-15 V,
TC = +25°C and -55°C
2.0
4.5
(VIN - VOUT) = -20 V,
TC = +25°C and -55°C
1.0
3.1
(VIN - VOUT) = -30 V, 2/
TC = +25°C and -55°C
0.2
1.6
2.7
3. 7
0.9
1.6
Minimum input voltage
VIN MIN
IOUT = 3 A, VOUT = VREF
Internal Current limit
IMAX
-1.5 V ≤ (VIN - VOUT) ≤ -10 V,
TC = +25°C and -55°C
External current limit
ILIM
1,2,3
RLIM = 5 kΩ
01
RLIM = 15 kΩ
60
dB
A
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
6
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Group A
subgroups
Conditions
-55°C ≤ TC ≤+125°C
P ≤ PMAX
unless otherwise specified
Device
types
Limits
Min
Unit
Max
NEGATIVE REGULATOR - CONTINUED
Quiescent supply current
IQ
IOUT = 5 mA, VOUT = VREF,
(-4 V ≤ VIN ≤ -25 V)
1,2,3
01
3.5
mA
Supply current change
with load
IQ∆
(VIN - VOUT) = .25 V +(.25Ω x IOUT)
1,2,3
01
35
mA/A
(VIN - VOUT) ≥ -2 V
1/
2/
21
Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in
output voltage due to heating effects are covered under the specification for thermal regulation. Measurements taken at
the output lead must be adjusted for lead resistance.
Parameter shall be tested at intial device characterization and after design or process changes. Parameter shall be
guaranteed to the limits specified in table I for all lots not specifically tested.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
7
Table IA. Maximum power dissipation verses case temperature table.
Case
Temperature
(°C)
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
125
130
135
140
145
150
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
Maximum power dissipation
(Watts)
One regulator
"ON"
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Both regulators
"ON"
53
51
49
48
46
44
42
41
39
37
35
34
32
30
28
26
25
23
21
19
18
16
14
12
11
9
7
5
4
2
0
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
8
Case U
FIGURE 1. Case outline(s).
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
APR 97
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REVISION LEVEL
A
SHEET
9
Case U - Continued.
Inches
Symbol
Min
A
Millimeters
Max
Min
.220
Max
5.59
∅b
.028
.032
0.71
0.81
∅b3
.085
.095
2.12
2.41
D
.750
.760
19.05
19.30
D1
.510
.520
12.95
13.21
e
.100 BSC
2.54 BSC
e1
.300 BSC
7.62 BSC
e2
.108 BSC
2.74 BSC
eA
.700
.740
17.78
18.80
E
.410
.420
10.41
10.67
F
.035
.045
0.90
1.14
G1
.632 BSC
G2
.2025
L1
.230
L2
.2125
16.05 BSC
5.144
5.84
.150 REF
∅p
.140
5.408
3.81 REF
.150
3.56
3.81
Q
.122 TYP
3.10 TYP
R
.065 TYP
1.65 TYP
S1
.028
0.71
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. The package contains a BeO substrate.
3. The case is electrically isolated.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
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REVISION LEVEL
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SHEET
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Case Z
FIGURE 1. Case outlines(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
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DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
A
SHEET
11
Case Z - Continued.
Inches
Symbol
Min
Millimeters
Max
A
Min
Max
.220
5.59
A1
.015
.025
0.38
0.64
∅b
.028
.032
0.71
0.81
∅b3
.085
.095
2.12
2.41
D
.750
.760
19.05
19.30
D1
.510
.520
12.95
13.21
e
.100 BSC
2.54 BSC
e1
.300 BSC
7.62 BSC
e2
.108 BSC
2.74 BSC
E
.410
.420
10.41
10.67
F
.035
.045
0.90
1.14
G1
.632 BSC
16.05 BSC
G2
.2025
.2125
5.144
5.408
H
.866
.906
22.00
23.01
L1
.055
.065
1.40
1.65
L2
.150 REF
∅p
.140
3.81 REF
.150
3.56
3.81
Q
.122 TYP
3.10 TYP
R
.065 TYP
1.65 TYP
S1
.028
0.71
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. The package contains a BeO substrate.
3. The case is electrically isolated.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
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REVISION LEVEL
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SHEET
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Case outline X.
FIGURE 1. Case outline(s).
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
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REVISION LEVEL
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SHEET
13
Case outline X - Continued.
Inches
Min
Millimeters
Max
A
Min
Max
.220
5.59
∅b
.028
.032
0.71
0.81
∅b3
.085
.095
2.12
2.41
D
.650
.660
16.51
16.76
D1
.410
.420
10.41
10.67
e
.100 BSC
2.54 BSC
e1
.200 BSC
5.08 BSC
e2
.108 BSC
2.74 BSC
eA
.700
.740
17.78
18.80
E
.410
.420
10.41
10.67
F
.035
.045
0.90
1.14
G1
.123 BSC
G2
.2025
L1
.230
L2
.2125
3.12 BSC
5.144
5.84
.150 REF
∅p
.140
5.408
3.81 REF
.150
3.56
3.81
Q
.122 TYP
3.10 TYP
R
.065 TYP
1.65 TYP
S1
.028
0.71
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. The package contains a BeO substrate.
3. The case is electrically isolated.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
14
Case outline Y.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
15
Case outline Y - continued.
Inches
Symbol
Min
A
Millimeters
Max
Min
Max
.220
5.59
A2
.015
.025
0.38
0.64
∅b
.028
.032
0.71
0.81
∅b3
.085
.095
2.12
2.41
D
.650
.660
16.51
16.76
D1
.410
.420
10.41
10.67
e
.100 BSC
2.54 BSC
e1
.200 BSC
5.08 BSC
e2
.108 BSC
2.74 BSC
E
.410
.420
10.41
10.67
F
.035
.045
0.90
1.14
G1
.123 BSC
3.12 BSC
G2
.2025
.2125
5.144
5.408
H
.866
.906
22.00
23.01
L1
.055
.065
1.40
1.65
L2
.150 REF
∅p
.140
3.81 REF
.150
3.56
3.81
Q
.122 TYP
3.10 TYP
R
.065 TYP
1.65 TYP
S1
.028
0.71
NOTES:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. The package contains a BeO substrate.
3. The case is electrically isolated.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
16
Device types
Case outlines
Terminal number
01
02
U and Z
X and Y
Terminal symbol
POS_ ADJ_1
NEG_REF_2
NEG_VOUT_2
NEG_VIN_2
NEG_GND_2
NEG_FB_2
POS_VOUT_1
POS_VIN_1
1
2
3
4
5
6
7
8
POS_ADJ_1
POS_VOUT_1
POS_VIN_1
POS_ADJ_2
POS_VIN_2
POS_VOUT_2
FIGURE 2. Terminal connections.
Device type 01
FIGURE 3. Block diagram.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
17
Device type 02
FIGURE 3. Block diagram - Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
18
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A
test table)
Interim electrical parameters
---
Final electrical parameters
1,2,3
Group A test requirements
1,2,3
Group C end-point electrical
parameters
1,2,3
End-point electrical parameters
for Radiation Hardness Assurance
(RHA) devices
Not applicable
* PDA applies to subgroup 1.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
b.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in method 1015 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1015 of MIL-STD-883.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 4, 5, 6, 7, 8A, 8B, 9, 10, and 11 shall be omitted.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
19
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in method 1005 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1005 of MIL-STD-883.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be
used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC
5962) should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614)
692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-09201
A
REVISION LEVEL
A
SHEET
20
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 09-10-01
Approved sources of supply for SMD 5962-09201 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded
by the next dated revisions of MIL-HDBK-103 and QML-38534. DSCC maintains an online database of all current
sources of supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-0920101KUA
5962-0920101KUC
5962-0920101KZA
5962-0920101KZC
88379
88379
88379
88379
VRG8651-201-2S
VRG8651-201-1S
VRG8652-201-2S
VRG8652-201-1S
5962-0920102KXA
5962-0920102KXC
5962-0920102KYA
5962-0920102KYC
88379
88379
88379
88379
VRG8657-201-2S
VRG8657-201-1S
VRG8658-201-2S
VRG8658-201-1S
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the Vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
88379
Vendor name
and address
Aeroflex Plainview Incorporated,
(Aeroflex Microelectronics Solutions)
35 South Service Road
Plainview, NY 11803-4193
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.