Application Note AC275 CCGA to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . The CCGA to FBGA Adapter Socket . . . . . . . . . CCGA to FBGA Ceramic Adapter Configurations . . . Assembly Procedure. . . . . . . . . . . . . . . . . . PCB Pad Layout . . . . . . . . . . . . . . . . . . . . Alignment Pins. . . . . . . . . . . . . . . . . . . . . Reflow Profile . . . . . . . . . . . . . . . . . . . . . CCGA to FBGA Adapter Pin Mapping List . . . . . . Prototyped Product, Adapter, and PCB Design Matrix Support . . . . . . . . . . . . . . . . . . . . . . . . Related Documents . . . . . . . . . . . . . . . . . . List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 .1 .3 .4 .7 .8 .9 .9 .9 11 11 11 Introduction Microsemi® SoC Products Group recently introduced RTAX-S/L, the next generation designed-for-space antifuse field programmable gate arrays (FPGAs). RTAX-S/L, with up to four million system gates, is SoC Products Group's highest density family, providing the space designer with nearly 250 k ASIC gates and error correction and detection (EDAC) protected static RAM. RTAX-S/L is the first SoC Products Group family designed for use in the ceramic column grid array (CCGA) package configuration. SoC Products Group has developed a low cost prototyping methodology for RTAX-S/L using the Axcelerator® family of FPGAs. RTAX-S/L is a derivative of the Axcelerator family. RTAX-S/L FPGAs can be prototyped using the comparable commercial Axcelerator device at a much lower cost than the equivalent space device. SoC Products Group has developed a CCGA to fine pitch ball grid array (FBGA) adapter socket to reduce RTAX-S/L development costs. SoC Products Group is also offering the CG624 package with the RTSX72SU, using the A54SX72A as the prototyping vehicle. This assembly procedure document covers the RTAX-S/L and RTSX-SU product families, which explains what a CCGA-FBGA adapter socket is, defines the component parts, and describes how to assemble the adapter. Once the adapter is assembled, the care and handling are similar to a CCGA packaged device. The intention of the prototyping adaptors is to provide functional validation and not at-speed timing validation. The prototyping adaptors may limit the performance of the FPGA I/O buffers. The CCGA to FBGA Adapter Socket The CCGA to FBGA adapter socket has a CCGA ceramic package configuration on the bottom and an FBGA configuration on top. The SoC Products Group CG (abbreviated for CCGA or ceramic column grid array) to FG (abbreviated for FBGA or fine pitch ball grid array) adapter socket offering allows for easy prototyping when using an FG package to prototype a CG package. The ordering part numbers are listed in Table 1 on page 2. November 2011 © 2011 Microsemi Corporation 1 CCGA to FBGA Adapter Sockets Table 1 • Ordering Part Numbers Adapter Socket Ordering Part Number CG624 to FG484 SK-SX72-CG624RTFG484 Prototyped and Prototype Device For prototyping RTSX72SU-CG624 or A54SX72A-CG624 using A54SX7A FG484 CG624 to FG896 SK-AX1-AX2-KITTOP and SK-AX1-CG624-KITBTM For prototyping RTAX1000S-CG624, RTAX1000SL-CG624, or AX1000-CG624 using AX1000-FG896 package CG624 to FG896 SK-AX1-AX2-KITTOP and SK-AX2-CG624-KITBTM For prototyping RTAX2000S-CG624, RTAX2000SL-CG624, or AX2000-CG624 using AX2000-FG896 package Figure 1 • CCGA to FBGA Adapter Socket Components Notes: 1. Top, from left: ceramic adapter, socket lid, socket housing. 2. Bottom, from left: socket interposer, alignment pins, fixing screws. 2 CCGA to FBGA Ceramic Adapter Configurations CCGA to FBGA Ceramic Adapter Configurations RTSX72SU (or A54SX72A) CG624 to A54SX72A FG484 Adapter Outline Dimension RTAX1000S (or AX1000) CG624 to AX1000 FG896 Adapter Outline Dimension RTAX2000S (or AX2000) CG624 to AX2000 FG896 Adapter Outline Dimension Figure 2 • Ceramic Adapter Top View (Left) and Bottom View (Right) with Dimensions 3 CCGA to FBGA Adapter Sockets Assembly Procedure Step 1 Note: The -KITBTM parts for CG624 devices contain all the parts needed for Step 1. Both the SK-AX1CG624-KITBTM and SK-AX2-CG624-KITBTM contain the housing, ceramic adapter, eight screws and two alignment pins. Note: See Figure 11 on page 7 for an outline drawing of the CG624 to FG484 23x23 Adapter Socket. Alignment pins can (optionally) be used prior to step 1 to align the housing to the ceramic adapter. The same alignment pins can be (optionally) used to align the assembled housing plus adapter to the circuit board just prior to Step 2. Reflow in "Step 2" on page 5 means that you must have put the solder onto the board, place the assembled ceramic adapter onto the PCB, and then complete the reflow. Placing the assembled adapter onto the PCB is made easier if the alignment pins are used, but corresponding alignment holes must have been pre-drilled into the PCB during PCB manufacture for this to work. Tighten the socket housing to the adapter. Step 1 includes three sub-steps: 1. Turn the socket housing and ceramic adapter upside down (Figure 3). 2. Fasten the socket housing to the ceramic adapter using eight of the screws provided (Figure 4). 3. Turn the ceramic adapter (with socket housing) over (Figure 5 on page 5). Front Socket Housing Back Socket Housing Figure 3 • View of Ceramic Adapter (Top) and Socket Housing (Bottom) Turned Over Figure 4 • View of Ceramic Adapter Fastened to Socket Housing Using the Screws Provided 4 Assembly Procedure Figure 5 • View of Adapter Socket Assembly with Socket Housing Attached Step 2 Reflow the adapter to the printed circuit board (PCB) (Figure 6). B PC Figure 6 • Adapter Reflowed to the PCB Step 3 Place the socket interposer into the adapter (Figure 7). B PC B PC Figure 7 • Socket Interposer Placement in the Adapter Assembly 5 CCGA to FBGA Adapter Sockets Step 4 Place the FBGA package into the adapter (Figure 8). B PC B PC Figure 8 • View of the FPGA Package Placement in the Adapter Assembly Step 5 Fasten the socket lid to the socket housing using the remaining eight screws provided (Figure 9). B PC B PC Figure 9 • View of the Socket Lid and Screw Placement Note: If prototyping CG624 parts using AX1000-FG896 or AX2000-FG896, -KITTOP contains the screws, interposer, and lid. The SoC Products Group part for these components is SK-AX1-AX2-KITTOP. 6 PCB Pad Layout PCB Pad Layout Pads should be laid out according to the solder column dimensions of the CG package. Refer to the CG package drawing and the SoC Products Group application note, CCGA. Since the socket adapter’s overall size is larger than the actual CG package, you must consider the size difference between the socket adapter and CG package during board layout, particularly if the same board will be used for both prototyping and production. Figure 10 shows PCB pad layout specifications. a) Solder Mask Window (Diameter) 45˚ Typical b) Diameter c) Dia A Solderable Surface b) Mounting Pad (Diameter) Section A–A d) Via Solder Mask Window (Diameter) A e) Via (Diameter) 0.3mm Line f) Land (Diameter) g) Typical h Feature 1.27mm Pitch 1.00mm Pitch a 0.851mm 0.8mm 0.749mm 0.7mm b 0.72mm 0.67mm c d 0.483mm 0.38mm e 0.305mm 0.20mm 0.56mm 0.46mm f 0.635mm 0.50mm g 0.635mm 0.50mm h Figure 10 • PCB Pad Layout Specifications G) Screws X16 #0–18,1/4L A) Socket Lid H) Alignment Pins X2 B) FG896 Package FG 48 4 C) Socket Interposer 40.00 D) Socket Housing FG484 40.00 F) Ceramic Adapter Unit: mm 14. 96 14. 03 Figure 11 • CG624 to FG484 23x23 Adapter Socket Outline Drawing 7 CCGA to FBGA Adapter Sockets G) Screws X16 #0–18,1/4L A) Socket Lid H) Alignment Pins X2 B) FG896 Package FG 89 6 C) Socket Interposer 43.00 D) Socket Housing FG896 43.00 F) Ceramic Adapter 14.96 14.03 Unit: mm Figure 12 • CG624 to FG896 Adapter Socket Outline Drawing Note: 1. A set of boards will require at least one -KITTOP and one -KITBTM kit for each board. The -KITTOP components may be moved from board to board for testing one at a time, if a cost saving is required. 2. SK-AX1-AX2-KITTOP contains a socket lid (A), an interposer (C), eight screws and two alignment pins (half of G).SK-AX1-CG624-KITBTM contains the socket housing (D) a unique ceramic adapter for AX1000 use (F), eight screws and two alignment pins. (half of G). 3. SK-AX2-CG624-KITBTM contains socket housing (D), a unique ceramic adapter for AX2000 use (F), eight screws and two alignment pins (half of G). Alignment Pins There are two alignment pins for aligning the socket housing to the adapter. The same pins can be used to align the assembled adapter socket to the PCB. Alignment holes on the PCB are optional. You must decide whether or not to include alignment holes on a board. Two alignment pins are included in the KITBTM units. No alignment pins are included in -KITTOP units. 8 Reflow Profile Reflow Profile Since reflow profiles depend heavily upon the size of the board and other components, you must perform additional fine tuning from the general profile shown in Figure 13. 250 200 180˚C 150 Temperature (˚C) 220˚C: 30 Seconds Maximum Maximum Package Body Temperature = 220˚C (±5˚C) 125 ˚C 80 to 1 1˚C to 3˚C Per Second ˚C 1˚C to 4˚C Per Second Keep Temperature Above 183˚C (Solder Melting Point) For at Least 60 Seconds 100 120 Seconds Minimum 50 0 1˚C to 3˚C Per Second 50 100 150 200 250 300 Time (Seconds) Figure 13 • Sample Temperature Profile for Infrared (IR) or Convection Reflow CCGA to FBGA Adapter Pin Mapping List The CCGA to FBGA adapter is routed from the FBGA package to match the existing die pad available to the CCGA device being prototyped (Table 2 on page 10). Prototyped Product, Adapter, and PCB Design Matrix Designing the PCB for a specific product requires an understanding of which adapter socket will work. Each adapter socket is routed differently, depending on the commercial Axcelerator FG package used for prototyping and the Axcelerator device or RadTolerant equivalent derivative being prototyped. Table 3 on page 10 shows the combinations that will work. 9 CCGA to FBGA Adapter Sockets Table 2 • CCGA to FBGA Adapter Pin Mapping List Documents Adapter Socket Ordering Part Number Prototyped and Prototype Device Adapter Pin Mapping List Document Number CG624 to FG484 SK-SX72-CG624RTFG484 For prototyping www.microsemi.com/soc/te chdocs/package/default.as RTSX72SU-CG624 or px A54SX72A-CG624 using A54SX72A FG484 CG624 to FG896 SK-AX1-AX2-KITTOP and SK-AX1-CG624-KITBTM For prototyping RTAX1000S-CG624, RTAX1000SL-CG624, or AX1000-CG624 using AX1000-FG896 package CG624 to FG896 SK-AX1-AX2-KITTOP and SK-AX2-CG624-KITBTM For prototyping RTAX2000S-CG624, RTAX2000SL-CG624, or AX2000-CG624 using AX2000-FG896 package Table 3 • PCB Design Matrix Prototyped Product Adapter Part Number Prototype Vehicle PCB Design A54SX72A-CG624 SK-SX72-CG624RTFG484 A54SX72A-FG484 A54SX72A-CG624 RTSX72SU-CG624 SK-SX72-CG624RTFG484 A54SX72A-FG484 A54SX72A-CG624 AX1000-CG624 SK-AX1-AX2-KITTOP and SK-AX1-CG624-KITBTM AX1000-FG896 AX1000-CG624 AX2000-CG624 SK-AX1-AX2-KITTOP and SK-AX2-CG624-KITBTM AX2000-FG896 AX2000-CG624 RTAX1000SL-CG624 SK-AX1-AX2-KITTOP and SK-AX1-CG624-KITBTM AX1000-FG896 AX1000-CG6241 RTAX2000SL-CG624 SK-AX1-AX2-KITTOP and SK-AX2-CG624-KITBTM AX2000-FG896 AX2000-CG6241 RTAX1000SL-CG624 SK-AX1-AX2-KITTOP and SK-AX1-CG624-KITBTM AX1000-FG896 RTAX1000S-CG6241,2 RTAX2000SL-CG624 SK-AX1-AX2-KITTOP and SK-AX2-CG624-KITBTM AX2000-FG896 RTAX2000S-CG624 1,2 Note: 1. The PCB designer should consider the eight pin-pairs of the Phase-Locked Loop (PLL) analog power supply (VCCPLA/VCOMPLA, VCCPLB/VCOMPLB, VCCPLC/VCOMPLC, VCCPLD/VCOMPLD, VCCPLE/VCOMPLE,VCCPLF/VCOMPLF, VCCPLG/VCOMPLG, and VCCPLH/VCOMPLH). They should be treated as follows: VCCPLA/B/C/D/E/F/G/H – there are eight in each device. VCCPLA supports the PLL associated with global resource HCLKA,VCCPLB supports the PLL associated with global resource HCLKB, etc. These PLL analog power supply pins should be connected to 1.5 V, whether or not the PLL is used. Refer to the Axcelerator Family FPGAs and RTAX-S/L Family FPGAs datasheets for pin assignment information. VCOMPLA/B/C/D/E/F/G/H – these are compensation reference signals for the internal PLLs. There are eight in each device. VCOMPLA supports the PLL associated with global resource HCLKA, VCOMPLE supports the PLL associated with global resource HCLKE, etc. 10 Support The VCOMPLX pins should be left floating if the PLL is not being used. Refer to the Axcelerator Family FPGAs and RTAX-S/L Family FPGAs datasheets for pin assignment information. 2. Since the AX and the RTAX-S/L devices are exactly pin compatible except for the PLL, which the RTAX-S/L does not have, designing the PCB with VCCPL(X) pins connected to 1.5 V will not affect the function of the RTAX-S/L devices. Pins for VCOMPL(X) can be designed with land patterns only. These 16 PLL pins are not connected internally inside the RTAX-S/L packages. Support Visit Technical Support online at www.microsemi.com/soc/support/search/default.aspx Email Technical Support at [email protected] Call Technical Support between 7:00 AM and 6:00 PM Pacific Time, Monday through Friday: 650.318.4460 800.262.1060 Related Documents Application Notes Ceramic Column Grid Arrays (CCGA) www.microsemi.com/soc/documents/CCGA_AN.pdf Datasheets Axcelerator Family FPGAs www.microsemi.com/soc/documents/AX_DS.pdf RTAX-S RadTolerant FPGAs www.microsemi.com/soc/documents/RTAXS_DS.pdf Pin Mapping Lists All pin mapping lists are available at www.microsemi.com/soc/techdocs/package/default.aspx. List of Changes The following table lists critical changes that were made in each revision of the document. Revision* Changes Page 55900016-4/11.11 Added 2 lines at the end of "Introduction" section (SAR 33472). 1 55900016-3/7.06 All tables were updated to include current ordering part numbers 1, 10, and 11 Clarifying notes added to Step 5 and Figure 12 6, 9 Note: *The revision number is located in the part number after the hyphen. The part number is displayed at the bottom of the last page of the document. The digits following the slash indicate the month and year of publication. 11 Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif. Learn more at www.microsemi.com. Microsemi Corporate Headquarters One Enterprise Drive, Aliso Viejo CA 92656 Within the USA: (800) 713-4113 Outside the USA: (949) 221-7100 Fax: (949) 756-0308 · www.microsemi.com © 2011 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. 55900016-4/11.11