Bruckewell Technology Corp., Ltd. High Current Density Surface Mount Schottky Rectifier SS10PU50/ A/B FEATURES Very low profile - typical height of 1.1 mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level 1, per J-STD-020 Solder dip 260 °C max. 10 s, per JESD 22-A111 Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC MECHANICAL DATA Case: Conform to JEDEC TO-277A; Suffix /A Industry TO-277B; Suffix /B Molding compound meets UL 94 V-0 flammability Maximum Ratings (Tc=25°C unless otherwise noted) Parameter Symbol SS10PU50 Unit Maximum repetitive peak reverse voltage VRRM 50 V Working peak reverse voltage VRWM 30 V Maximum DC blocking voltage VDC 50 V IF(AV) 10 IFSM 200 A EAS 20 m'J TJ -55 to +150 °C TSTG -55 to +150 °C Maximum average forward rectified current Total device A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Non-repetitive avalanche energy at 25 °C IAS = 2 A per diode Operating junction temperature range Storage temperature range Note: (1) Mounted on 30 mm x 30 mm Al P.C.B. with 50 mm x 25 mm x 100 mm fin heat sink (2) Free air, mounted on recommended copper pad area Bruckewell Technology Corp., Ltd. Electrical characteristics (Tc=25°C unless otherwise noted) Parameter Symbol Instantaneous forward voltage at IF=10A, Tj=25°C Value Typical Max 0.45 0.50 VF at IF=10A, Tj=125°C Maximum reverse current Tj=25°C Unit V 0.38 IR at working peak reverse voltage Tj=125°C 150 u'A 50 m'A Thermal characteristics (Tc=25°C unless otherwise noted) Parameter Typical thermal resistance Symbol Value RθJA 60 Rthjc 3 Notes: (1) Pulse test: 300 µs pulse width, 1 % duty cycle (2) Pulse test: Pulse width ≤ 40 ms Unit °C/W Bruckewell Technology Corp., Ltd. Characteristics Curve