SS10PU50

Bruckewell Technology Corp., Ltd.
High Current Density Surface Mount
Schottky Rectifier
SS10PU50/ A/B
FEATURES
Very low profile - typical height of 1.1 mm
Ideal for automated placement
Low forward voltage drop, low power losses
High efficiency
Low thermal resistance
Meets MSL level 1, per J-STD-020
Solder dip 260 °C max. 10 s, per JESD 22-A111
Compliant to RoHS directive 2002/95/EC and in accordance to
WEEE 2002/96/EC
MECHANICAL DATA
Case: Conform to JEDEC TO-277A; Suffix /A
Industry TO-277B; Suffix /B
Molding compound meets UL 94 V-0 flammability
Maximum Ratings (Tc=25°C unless otherwise noted)
Parameter
Symbol
SS10PU50
Unit
Maximum repetitive peak reverse voltage
VRRM
50
V
Working peak reverse voltage
VRWM
30
V
Maximum DC blocking voltage
VDC
50
V
IF(AV)
10
IFSM
200
A
EAS
20
m'J
TJ
-55 to +150
°C
TSTG
-55 to +150
°C
Maximum average forward rectified current
Total device
A
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
Non-repetitive avalanche energy at 25 °C
IAS = 2 A per diode
Operating junction temperature range
Storage temperature range
Note:
(1) Mounted on 30 mm x 30 mm Al P.C.B. with 50 mm x 25 mm x 100 mm fin heat sink
(2) Free air, mounted on recommended copper pad area
Bruckewell Technology Corp., Ltd.
Electrical characteristics (Tc=25°C unless otherwise noted)
Parameter
Symbol
Instantaneous forward voltage
at IF=10A, Tj=25°C
Value
Typical
Max
0.45
0.50
VF
at IF=10A, Tj=125°C
Maximum reverse current
Tj=25°C
Unit
V
0.38
IR
at working peak reverse voltage Tj=125°C
150
u'A
50
m'A
Thermal characteristics (Tc=25°C unless otherwise noted)
Parameter
Typical thermal resistance
Symbol
Value
RθJA
60
Rthjc
3
Notes:
(1) Pulse test: 300 µs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width ≤ 40 ms
Unit
°C/W
Bruckewell Technology Corp., Ltd.
Characteristics Curve