BBY52... Silicon Tuning Diodes • High Q hyperabrupt tuning diode • Designed for low tuning voltage operation • For VCO's in mobile communications equipment • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BBY52-02L BBY52-02W Type BBY52-02L BBY52-02W Package TSLP-2-1 SCD80 Configuration single, leadless single LS(nH) 0.4 0.6 Marking K KK Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Diode reverse voltage VR 7 Forward current IF 20 mA Operating temperature range Top -55 ... 150 °C Storage temperature Tstg -55 ... 150 1Pb-containing Value Unit V package may be available upon special request 1 2007-04-20 BBY52... Electrical Characteristics at TA = 25°C, unless otherwise specified Symbol Values Parameter min. typ. Unit max. DC Characteristics Reverse current IR nA VR = 6 V - - 10 VR = 6 V, TA = 85 °C - - 200 AC Characteristics Diode capacitance pF CT VR = 1 V, f = 1 MHz 1.4 1.85 2.2 VR = 2 V, f = 1 MHz 0.95 1.5 2 VR = 3 V, f = 1 MHz 0.9 1.35 1.75 VR = 4 V, f = 1 MHz 0.85 1.15 1.45 1.1 1.6 2.1 - 0.9 1.7 Capacitance ratio CT1/C T4 VR = 1 V, VR = 4 V, f = 1 MHz Series resistance rS Ω VR = 1 V, f = 1 GHz 2 2007-04-20 BBY52... Diode capacitance CT = ƒ (VR) Reverse current IR = ƒ(VR) TA = 25°C f = 1MHz 45 2.6 pF pA 2.4 2.3 35 2.2 30 IR CT 2.1 2 25 1.9 1.8 20 1.7 1.6 15 1.5 1.4 10 1.3 1.2 5 1.1 1 0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 V 0 0 4 VR 1 2 3 4 5 V 7 VR 3 2007-04-20 Package SCD80 BBY52... Package Outline 0.2 M A +0.05 0.13 -0.03 0.8 ±0.1 0.2 ±0.05 10˚MAX. 1.7 ±0.1 1 0.3 ±0.05 Cathode marking 7˚ ±1.5˚ 1.3 ±0.1 A 2 0.7 ±0.1 0.35 1.45 Foot Print 0.35 Marking Layout (Example) 2005, June Date code BAR63-02W Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Reel with 2 mm Pitch 2 0.2 2.5 8 1.45 Standard 4 Cathode marking 0.4 0.9 Cathode marking 4 0.7 2007-04-20 BBY52... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code Month 2 0 03 2 0 04 2005 2006 2 0 07 2008 2009 2010 2011 2012 2 0 13 2014 01 a p A P a p A P a p A P 02 b q B Q b q B Q b q B Q 03 c r C R c r C R c r C R 04 d s D S d s D S d s D S 05 e t E T e t E T e t E T 06 f u F U f u F U f u F U 07 g v G V g v G V g v G V 08 h x H X h x H X h x H X 09 j y J Y j y J Y j y J Y 10 k z K Z k z K Z k z K Z 11 l 2 L 4 l 2 L 4 l 2 L 4 12 n 3 N 5 n 3 N 5 n 3 N 5 1) New Marking Layout for SC75, implemented at October 2005. . 5 2007-04-20 Package TSLP-2-1 BBY52... Package Outline Top view Bottom view 0.4 +0.1 0.6 ±0.05 0.05 MAX. 1 1) 1) 0.5 ±0.035 Cathode marking 0.25 ±0.035 2 1 1 ±0.05 0.65±0.05 2 1) Dimension applies to plated terminal Foot Print 0.6 0.275 For board assembly information please refer to Infineon website "Packages" Copper Solder mask 0.375 0.275 0.35 1 0.3 0.925 0.35 0.45 Stencil apertures Marking Layout (Example) BAS16-02L Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) 0.5 1.16 Cathode marking 8 4 0.76 6 2007-04-20 BBY52... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 2007-04-20