TLE6251-3G Data Sheet (1.5 MB, EN)

TLE6251-3G
High Speed CAN-Transceiver with Wake and Failure Detection
Data Sheet
Rev. 1.1, 2011-06-06
Automotive Power
TLE6251-3G
Table of Contents
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
3.1
3.2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
4.1
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
High Speed CAN Physical Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5
5.1
5.2
5.3
5.4
5.5
Operation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Normal Operation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Receive-Only Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Stand-By Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Go-To-Sleep Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6
6.1
6.2
6.3
Wake-Up Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Remote Wake-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Local Wake-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mode Change via the EN and NSTB pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14
14
15
16
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.3
7.3.1
7.3.2
7.4
Fail Safe Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CAN Bus Failure Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Local Failures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TxD Time-Out Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TxD to RxD Short Circuit Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RxD Permanent Recessive Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bus Dominant Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Over-Temperature Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Under-Voltage Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Under-Voltage Event on VCC and VIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Under-Voltage Event on VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage Adaptation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17
17
18
18
19
19
19
20
20
20
22
22
8
Diagnosis-Flags at NERR and RxD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9
9.1
9.2
9.3
General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
10.1
10.2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Functional Device Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
11
11.1
11.2
11.3
11.4
11.5
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Application Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Robustness according to IEC61000-4-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage Drop over the INH Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mode Change to Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Further Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
13
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Data Sheet
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25
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Rev. 1.1, 2011-06-06
High Speed CAN-Transceiver with Wake and Failure
Detection
1
TLE6251-3G
Overview
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
HS CAN Transceiver with data transmission rates up to 1 MBaud
Compliant to ISO 11898-5
Very low power consumption in Sleep mode
Bus Wake-Up and local Wake-Up
Inhibit output to control external circuitry
Separate VIO input to adapt different micro controller supply voltages
Separate output for failure diagnosis
Optimized for low electromagnetic emission (EME)
Optimized for a high immunity against electromagnetic interference (EMI)
Very high ESD robustness, ± 9 kV according to IEC 61000-4-2
Protected against automotive transients
Receive-Only mode for node failure analysis
TxD time-out function and RxD recessive clamping with failure indication
TxD to RxD short circuit recognition with failure indication
CANH and CANL short circuit recognition with failure indication
Bus dominant clamping diagnosis
Under-voltage detection at VCC, VIO and VS
Power-Up and Wake-Up source recognition
Short circuit proof and Over-Temperature protection
Green Product (RoHS compliant)
AEC Qualified
PG-DSO-14
Description
As a successor of the TLE6251G, the TLE6251-3G is designed to provide an excellent passive behavior in Power Down.
This feature makes the TLE6251-3G extremely suitable for mixed power supply HS-CAN networks. The TLE6251-3G
provides different operation modes with a very low quiescent current in Sleep mode. Based on the high symmetry of the
CANH and CANL signals, the TLE6251-3G provides a very low level of electromagnetic emission (EME) within a broad
frequency range. The TLE6251-3G is integrated in a RoHS compliant PG-DSO-14 package and fulfills or exceeds the
requirements of the ISO11898-5. The TLE6251G and the TLE6251-3G are fully pin compatible and function compatible.
Based on the Infineon Smart Power Technology SPT®, the TLE6251-3G provides industry leading ESD
robustness together with a very high electromagnetic immunity (EMI). The Infineon Smart Power Technology
SPT® allows bipolar and CMOS control circuitry in accordance with DMOS power devices to exist on the same
monolithic circuit. The TLE6251-3G and the Infineon SPT® technology are AEC qualified and tailored to withstand
the harsh conditions of the automotive environment.
Type
Package
Marking
TLE6251-3G
PG-DSO-14
TLE6251-3G
Data Sheet
3
Rev. 1.1, 2011-06-06
TLE6251-3G
Block Diagram
2
Block Diagram
VS
N.C.
CANL
7
3
VCC
CANH
10
11
6
INH
EN
Mode Control
Logic
13
Driver
Output
Stage
12
14
Temp.Protection
NSTB
+
timeout
5
VIO
Diagnosis &
Failure
Logic
VCC/2
1
Wake-Up
Detection
TxD
VIO
Normal
Receiver
8
RxD Output
Control
Low Power
Receiver
NERR
VS
VIO
WK
9
Wake-Up
Comparator
4
RxD
2
GND
Figure 1
Data Sheet
Block Diagram
4
Rev. 1.1, 2011-06-06
TLE6251-3G
Pin Configuration
3
Pin Configuration
3.1
Pin Assignment
TxD
1
14
NSTB
GND
2
13
CANH
VCC
3
12
CANL
RxD
4
11
N.C.
VIO
5
10
VS
EN
6
9
WK
INH
7
8
NERR
Figure 2
Pin Configuration
3.2
Pin Definitions and Functions
9
Table 1
Pin Definitions and Functions
Pin
Symbol
Function
1
TxD
Transmit Data Input;
integrated pull-up resistor to VIO, “Low” for “Dominant” state.
2
GND
Ground
3
VCC
Transceiver Supply Voltage;
100 nF decoupling capacitor to GND recommend.
4
RxD
Receive Data Output;
“Low” in “Dominant” state.
Output voltage level dependent on the VIO supply
5
VIO
Logic Supply Voltage;
Digital Supply Voltage for the logic pins TxD, RxD, EN, NERR and NSTB;
Usually connected to the supply voltage of the external microcontroller;
100 nF decoupling capacitor to GND recommend.
6
EN
Mode Control Input;
Integrated pull-down resistor;
“High” for Normal Operation mode.
Data Sheet
5
Rev. 1.1, 2011-06-06
TLE6251-3G
Pin Configuration
Table 1
Pin Definitions and Functions
Pin
Symbol
Function
7
INH
Inhibit Output;
Open drain output to control external circuitry;
High impedance in Sleep mode
8
NERR
Error Flag Output;
Failure and Wake-Up indication output, active “Low”
Output voltage level depends on the VIO supply
9
WK
Wake-Up Input;
Local Wake-Up input;
Wake-Up input sensitive to a level change in both directions, “High” to “Low” and
vice versa.
10
VS
Battery Voltage Supply;
100 nF decoupling capacitor to GND recommend.
11
N.C.
Not Connected;
12
CANL
CAN Bus Low Level I/O;
“Low” in “Dominant” state
13
CANH
CAN Bus High Level I/O;
“High” in “Dominant” state
14
NSTB
Stand-By Control input;
Integrated pull-down resistor;
“High” for Normal Operation mode.
Data Sheet
6
Rev. 1.1, 2011-06-06
TLE6251-3G
Functional Description
4
Functional Description
CAN is a serial bus system that connects microcontrollers, sensor and actuators for real-time control applications.
The usage of the Control Area Network (abbreviated CAN) within road vehicles is described by the international
standard ISO 11898. According to the 7 layer OSI reference model the physical layer of a CAN bus system
specifies the data transmission from one CAN node to all other available CAN nodes inside the network. The
physical layer specification of a CAN bus system includes all electrical and mechanical specifications of a CAN
network. The CAN transceiver is part of the physical layer specification. Several different physical layer standards
of CAN networks have been developed over the last years. The TLE6251-3G is a High Speed CAN transceiver
with dedicated Wake-Up functions. High Speed CAN Transceivers with Wake-Up functions are defined by the
international standard ISO 11898-5.
4.1
High Speed CAN Physical Layer
TxD
VIO
t
VCC
CAN_H
CAN_L
= Logic Supply
= Transceiver Supply
= Input from the
Microcontroller
RxD = Output to the
Microcontroller
CANH = Voltage on CANH
Input/Output
CANL = Voltage on CANL
Input/Output
Differential Voltage
VDIFF =
VDIFF = VCANH – VCANL
VIO
VCC
TxD
t
VDIFF
Dominant
VDIFF = ISO Level Dominant
VDIFF = ISO Level Recessive
Recessive
t
RxD
VIO
t
Figure 3
Data Sheet
High Speed CAN Bus Signals and Logic Signals
7
Rev. 1.1, 2011-06-06
TLE6251-3G
Functional Description
The TLE6251-3G is a High Speed CAN transceiver, operating as an interface between the CAN controller and the
physical bus medium. A High Speed CAN network (abbreviated HS CAN) is a two wire differential network which
allows data transmission rates up to 1 MBaud. Characteristic for a HS CAN network are the two CAN bus states
“Dominant” and “Recessive” (see Figure 3).
A HS CAN network is a Carrier Sense Multiple Access network with Collision Detection. This means, every
participant of the CAN network is allowed to place its message on the same bus media simultaneously. This can
cause data collisions on the bus, which might corrupt the information content of the data stream. In order avoid
the loss of any information and to prioritize the messages, it is essential that the “Dominant” bus signal overrules
the “Recessive” bus signal.
The input TxD and the output RxD are connected to the microcontroller of the ECU. As shown in Figure 1, the
HS CAN transceiver TLE6251-3G has a receive unit and a output stage, allowing the transceiver to send data to
the bus medium and monitor the data from the bus medium at the same time. The HS CAN TLE6251-3G converts
the serial data stream available on the transmit data input TxD into a differential output signal on CAN bus. The
differential output signal is provided by the pins CANH and CANL. The receiver stage of the TLE6251-3G monitors
the data on the CAN bus and converts them to a serial data stream on the RxD pin. A logical “Low” signal on the
TxD pin creates a “Dominant” signal on the CAN bus, followed by a logical “Low” signal on the RxD pin (see
Figure 3). The feature, broadcasting data to the CAN bus and listening to the data traffic on the CAN bus
simultaneous is essential to support the bit to bit arbitration on CAN networks.
The voltage levels for a HS CAN on the bus medium are defined by the ISO 11898-2/-5 standards. If a data bit is
“Dominant” or “Recessive”, this depends on the voltage difference between CANH and CANL:
VDIFF = VCANH - VCANL
To transmit a “Dominant” signal to the CAN bus the differential signal VDIFF is larger or equal to 1.5 V. To receive
a “Recessive” signal from the CAN bus the differential signal VDIFF is smaller or equal to 0.5 V.
The voltage level on the digital input TxD and the digital output RxD is determined by the power supply level at the
pin VIO. Depending on voltage level at the VIO pin, the signal levels on the logic pins (EN, NERR, NSTB, TxD and
RxD) are compatible to microcontrollers with 5 V or 3.3 V I/O supply. Usually the VIO power supply of the
transceiver is connected to same power supply as I/O power supply of the microcontroller.
Partially supplied CAN networks are networks where the participants have a different power supply status. Some
nodes are powered up, other nodes are not powered, or some other nodes are in a Low-Power mode, like Sleep
mode for example. Regardless on the supply status of the HS CAN node, each participant which is connected to
the common bus, shall not disturb the communication on the bus media. The TLE6251-3G is designed to support
partially supplied networks. In Power Down condition, the resistors of the Normal Receiver are switched off and
the bus input on the pins CANH and CANL is high resistive.
Data Sheet
8
Rev. 1.1, 2011-06-06
TLE6251-3G
Operation Modes
5
Operation Modes
Five different operation modes are available on TLE6251-3G. Each mode with specific characteristics in terms of
quiescent current, data transmission or failure diagnostic. For the mode selection the digital input pins EN and
NSTB are used. Both digital input pins are event triggered. Figure 4 illustrates the different mode changes
depending on the status of the EN and NSTB pins. A mode change via the mode selections pins EN and NSTB is
only possible if the power supplies VCC, VIO and VS are activated.
Normal Operation
mode
EN -> 1
NSTB = 1
EN
1
NSTB
1
Stand-By
mode
EN = 0
NSTB -> 0
INH
On
Start – Up
Supply VS
Supply VCC within t < tUV(VCC)
Supply VIO within t < tUV(VIO)
EN -> 0
NSTB -> 0
Receive Only
mode
NSTB
1
Power Down
INH
On
EN = 1
NSTB ->1
EN -> 0
NSTB = 1
EN
0
EN -> 1
NSTB -> 1
EN
0
EN = 0
NSTB -> 1
NSTB
0
INH
On
VS > VS,Pon
EN = 0
NSTB -> 1
VCC & VIO ON
EN = 1
NSTB -> 0
EN -> 0
NSTB -> 1
Go-To-Sleep
command
EN -> 1
NSTB -> 0
EN
1
NSTB
0
EN -> 1
NSTB = 0
EN -> 0
t < thSLP
NSTB = 0
INH
On
thSLP
Timing important
for mode selection
EN -> 0
t > thSLP
NSTB = 0
Wake-Up Event
Bus-Wake:
t > tBUSdom
Local-Wake:
t > tWake
Sleep mode
EN -> 1
NSTB -> 1
VCC & VIO ON
EN
0
VCC < VCC,UV
t > tUV(VCC)
Under-voltage
on VCC
Figure 4
Data Sheet
NSTB
0
Under-voltage
on VS
VS < VS,Poff
INH
Off
VIO < VIO,UV
t > tUV(VIO)
Under-voltage
on VIO
Operation Modes
9
Rev. 1.1, 2011-06-06
TLE6251-3G
Operation Modes
In Sleep mode the power supply VCC and the logic power supply VIO are usually turned off. A Wake-Up event, via
the CAN bus or the local Wake-Up pin, shifts the device from Sleep mode into Stand-By mode.
The following operations mode are available on the TLE6251-3G:
•
•
•
•
•
Normal Operation mode
Receive-Only mode
Stand-By mode
Sleep mode
Go-To-Sleep Command
Depending on the operation mode, the output driver stage, the receiver stage and the bus biasing are active or
inactive. Table 2 shows the different operation modes depending on the logic signal on the pins EN and NSTB
with the related status of the INH pin and the bus biasing.
Table 2
Overview Operation Modes
Operation mode
EN
NSTB
INH
Bus Bias
Normal Operation
1
1
Receive-Only
0
1
VCC/2
VCC/2
Stand-By
0
0
Go-To-Sleep
1
0
VS
VS
VS
VS
Sleep
0
0
Floating
GND
Power Down
0
0
Floating
Floating
5.1
GND
GND
Normal Operation Mode
In Normal Operation mode the HS CAN transceiver TLE6251-3G sends the serial data stream on the TxD pin to
the CAN bus while at the same time the data available on the CAN bus is monitored on the RxD output pin. In
Normal Operation mode all functions of the TLE6251-3G are active:
•
•
•
•
•
•
•
•
•
The output stage is active and drives data from the TxD to the CAN bus.
The normal receiver unit is active and provides the data from the CAN bus to the RxD pin.
The low power receiver and the bus Wake-Up function is inactive.
The local Wake-Up pin is disabled.
The INH pin is connected to VS.
The RxD pin is “Low” for a “Dominant” bus signal and “High” for a “Recessive” bus signal”
The bus basing is set to VCC/2.
The failure detection is active and failures are indicated at the NERR pin. (see Chapter 8).
The under-voltage detection on the all 3 power supplies VCC, VIO and VS is active.
The HS CAN transceiver TLE6251-3G enters Normal Operation mode by setting the mode selection pins EN and
NSTB to logical “High” (see Table 2 or Figure 4).
5.2
Receive-Only Mode
The Receive-Only mode can be used to test the connection of the bus medium. The TLE6251-3G can still receive
data from the bus, but the output stage is disabled and therefore no data can be sent to the CAN bus. All other
functions are active:
•
•
•
•
•
The output stage is disabled and data which is available on the TxD pin will be blocked and not communicated
to the CAN bus.
The normal receiver unit is active and provides the data which is available on the CAN bus to the RxD pin.
The INH pin is connected to VS.
The RxD pin is “Low” for a “Dominant” bus signal and “High” for a “Recessive” bus signal.
The bus biasing is set to VCC/2.
Data Sheet
10
Rev. 1.1, 2011-06-06
TLE6251-3G
Operation Modes
•
•
•
•
The low power receiver and the bus Wake-Up function is inactive.
The local Wake-Up pin WK is disabled.
The failure diagnostic is active and local failures are indicated at the NERR pin (see Chapter 8).
The under-voltage detection on the all 3 power supplies VCC, VIO and VS is active.
The HS CAN transceiver TLE6251-3G enters Receive-Only mode by setting the EN pin to logical “Low” and the
NSTB to logical “High” (see Table 2 or Figure 4).
5.3
Stand-By Mode
After the power-up sequence the TLE6251-3G enters automatically into Stand-By mode. Stand-By mode is an idle
mode of the TLE6251-3G with optimized power consumption. In Stand-By mode the TLE6251-3G can not send
or receive any data. The output driver stage and the normal receiver unit are disabled. Both CAN bus pins, CANH
and CANL are connected to GND. The following functions are available in Stand-By mode:
•
•
•
•
•
•
•
•
•
•
•
The output stage is disabled.
The normal receiver unit is disabled.
The low power receiver is active and monitors the CAN bus. In case of a message on the CAN bus the
TLE6251-3G sets an internal Wake-Up flag. If the power supplies VCC and VIO are active, the Wake-Up event
is indicated by the RxD pin and the NERR pin (see Chapter 8).
The local Wake-Up pin is active and a local Wake-Up event is indicated by the RxD and NERR pin, if the power
supplies VCC and VIO are active (see Chapter 8).
The INH output is active and set to VS.
Through the internal resistors RI (see Figure 1), the pins CANH and CANL are connected to GND.
If the power supplies VCC and VIO are active, the RxD pin indicates the Wake-Up events.
The TxD pin is disabled
The failure diagnostic is disabled.
The under-voltage detection on the all 3 power supplies VCC, VIO and VS is active.
The TLE6251-3G detects a Power-Up event and indicates it at the NERR pin (see Chapter 8).
There are several ways to enter the Stand-By mode (see Figure 4):
•
•
•
•
•
After the start-up sequence the device enters per default Stand-By mode. Mode changes are only possible if
VCC and VIO are present.
The device is in Sleep mode and a Wake-Up event occurs.
The device is in the Go-To-Sleep command and the EN pin goes low before the time t < thSLP has expired.
The device is in Normal Operation mode or Receive-Only mode and the EN pin and NSTB pin are set to logical
“Low”.
An under-voltage event occurs on the power supply VS. In case of an under-voltage event, the TLE6251-3G
device always changes to Stand-By mode regardless in which mode the device currently operates.
Data Sheet
11
Rev. 1.1, 2011-06-06
TLE6251-3G
Operation Modes
5.4
Go-To-Sleep Command
The Go-To-Sleep command is a transition mode allowing external circuitry like a microcontroller to prepare the
ECU for the Sleep mode. The TLE6251-3G stays in the Go-To-Sleep command for the maximum time t = thSLP,
after exceeding the time thSLP the device changes into Sleep mode. A mode change into Sleep mode is only
possible via the Go-To-Sleep command. During the Go-To-Sleep command the following functions on the
TLE6251-3G are available:
•
•
•
•
•
•
•
•
•
The output driver stage is disabled.
The normal receiver unit is disabled.
The low power receiver is active and monitors the CAN bus. In case of a message on the CAN bus the
TLE6251-3G sets an internal Wake-Up flag.
The local Wake-Up pin is active and can detect a local Wake-Up event.
The INH output is active and set to VS.
Through the internal resistors RI (see Figure 1), the pins CANH and CANL are connected to GND.
The TxD pin is disabled.
The failure diagnostic is disabled.
The under-voltage detection on all 3 power supplies VCC, VIO and VS is active.
Setting the NSTB pin to logical “Low”, while the EN signal remains at logical “High”, activates the Go-To-Sleep
command. The Go-To-Sleep command can be entered from Normal Operation mode, Receive-Only mode and
from Stand-By mode.
5.5
Sleep Mode
The Sleep mode is a power save mode. In Sleep mode the current consumption of the TLE6251-3G is reduced to
a minimum while the device is still able to Wake-Up by a message on the CAN bus or a local Wake-Up event on
the pin WK. Most of the functions of the TLE6251-3G are disabled:
•
•
•
•
•
•
•
•
•
The output driver stage is disabled.
The normal receiver unit is disabled.
The low power receiver is active and monitors the CAN bus. In case of a message on the CAN bus the
TLE6251-3G changes from Sleep mode to Stand-By mode and sets an internal Wake-Up flag.
The local Wake-Up pin is active and in case of a signal change on the WK pin the operation mode changes to
Stand-By mode.
The INH output is floating.
Through the internal resistors RI (see Figure 1), the pins CANH and CANL are connected to GND.
If the power supplies VCC and VIO are present, the RxD pin indicates the Wake-Up event.
The TxD pin is disabled
The under-voltage detection on the power supply VS is active and sends the device into Stand-By mode in case
of an under-voltage event.
There are only two ways to enter Sleep mode:
•
•
The device can activate the Sleep mode via the mode control pins EN and NSTB.
An under-voltage event on the power supplies VCC and VIO changes the operation mode to Sleep mode.
Data Sheet
12
Rev. 1.1, 2011-06-06
TLE6251-3G
Operation Modes
In order to enter the Stand-By mode or the Sleep mode, the EN signal needs to be set to logical “Low” a defined
time after the NSTB pin was set to logical “Low”. Important for the mode selection is the timing between the falling
edge of the NSTB signal and the EN signal. If the logical signal on the EN pin goes low before the transition time
t < thSLP has been reached, the TLE6251-3G enters into Stand-By mode and the INH pin remains connected to the
VS supply. In the case the logical signal on the EN pin goes low after the transition time t > thSLP, the TLE6251-3G
enters into Sleep mode simultaneous with the expiration of the time window thSLP and the INH becomes
disconnected from the VS supply and is floating. (see Figure 5).
thSLP
NSTB
t
EN
t
INH
t
t < thSLP
Normal Operation
mode
Go-To Sleep
command
Stand-By mode
thSLP
NSTB
t
EN
t > thSLP
t
INH
t
Normal Operation
mode
Figure 5
Go-To Sleep
command
Sleep mode
Entering Sleep Mode or Stand-By Mode
The signal on the CAN bus has no impact to mode changes. The operation mode can be changed regardless if
the CAN bus is “Dominant” or “Recessive”.
Data Sheet
13
Rev. 1.1, 2011-06-06
TLE6251-3G
Wake-Up Functions
6
Wake-Up Functions
There are several possibilities for a mode change from Sleep mode to another operation mode.
•
•
•
•
Remote Wake-Up via a message on the CAN bus.
Local Wake-Up via a signal change on the pin WK.
A status change of the logical signals applied to the mode control pins EN and NSTB.
An under-voltage detection on the VS power supply.
In typical applications the power supplies VCC and VIO are turned off in Sleep mode, meaning a mode change can
only be caused by an external event, also called Wake-Up. In case the VCC and VIO power supply are available, a
mode change can be simple caused by changing the status on the mode control pins EN and NSTB.
6.1
Remote Wake-Up
A remote Wake-Up or also called bus Wake-Up occurs via a CAN bus message and changes the operation mode
from Sleep mode to Stand-By mode. A signal change from “Recessive” to “Dominant”, followed by a “Dominant”
signal for the time t > tWake initiates a bus Wake-Up (see Figure 6).
t < tWake
CANH
CANL
„Recessive“ to „Dominant“
change
t > tWake
Wake-Up
No Wake-Up
t
INH
t
Normal
Operation
mode
Figure 6
Go-To
Sleep
command
Sleep mode
Stand-By mode
Remote Wake-Up
In case the time of the “Dominant” signal on the CAN bus is shorter than the filtering time tWake, no bus Wake-Up
occurs. The filter time is implemented to protect the HS CAN transceiver TLE6251-3G against unintended bus
Wake-Up’s, triggered by spikes on the CAN bus. The signal change on the CAN bus from “Recessive” to
“Dominant” is mandatory, a permanent “Dominant” signal would not activate any bus Wake-Up.
In Stand-By mode the RxD output pin and the NERR output pin display the CAN bus Wake-Up event by a logical
“Low” signal (Details see Chapter 8). Once the HS CAN Transceiver TLE6251-3G has recognized the Wake-Up
event and has changed to Stand-By mode, the INH output pin becomes active and provides the voltage VS to the
external circuitry.
Data Sheet
14
Rev. 1.1, 2011-06-06
TLE6251-3G
Wake-Up Functions
6.2
Local Wake-Up
The TLE6251-3G can be activated from Sleep mode by a signal change on the WK pin, also called local WakeUp. Designed to withstand voltages up to 40V the WK pin can be directly connected to VS. The internal logic on
the WK pin works bi-sensitive, meaning the Wake-Up logic on the pin WK triggers on a both signal changes, from
“High” to “Low” and from “Low” to “High” (see Figure 7).
t < tWk(local)
VWK
t > tWk(local)
Wake-Up
No Wake-Up
VWK,H
t
INH
t
Sleep mode
Stand-By mode
t < tWk(local)
t > tWk(local)
VWK
VWK,L
No Wake-Up
Wake-Up
t
INH
t
Sleep mode
Figure 7
Sleep Mode
Stand-By mode
Stand-By Mode
Local Wake - Up
A filter time tWK(local) is implemented to protect the TLE6251-3G against unintended Wake-Up’s, caused by spikes
on the pin WK. The threshold values VWK,H and VWK,L depend on the level of the VS power supply.
In Stand-By mode the RxD output pin and the NERR output pin display the CAN bus Wake-Up event by a logical
“Low” signal (Details see Chapter 8). Once the HS CAN Transceiver TLE6251-3G has recognized the Wake-Up
event and has changed to Stand-By mode, the INH output pin becomes active and provides the voltage VS to the
external circuitry.
Data Sheet
15
Rev. 1.1, 2011-06-06
TLE6251-3G
Wake-Up Functions
6.3
Mode Change via the EN and NSTB pin
Besides a mode change issued by a Wake-Up event, the operation mode on the TLE6251-3G can be changed by
changing the signals on the EN and NSTB pins. Therefore the power supplies VCC and VIO have to be active.
According to the mode diagram in Figure 4 the operation mode can be changed directly from Sleep mode to the
Receive-Only mode, Normal Operation mode. A change from Sleep mode direct to Stand-By mode is only possible
via a Wake-Up event. For example by setting the NSTB pin and the EN pin to logical “High” the TLE6251-3G
changes from Sleep mode to Normal Operation mode (see Figure 8).
The pins EN and NSTB have a hysteresis between the logical “Low” and the logical “High” signal in order to avoid
any toggling during the operation mode change.
NSTB
thSLP
VM,H
VM,L
t
EN
VM,H
VM,L
tMode
t
tMode
INH
t
Sleep mode
Figure 8
Data Sheet
Normal Operation
mode
Go-To-Sleep
command
Sleep mode
Wake-Up via Mode Change
16
Rev. 1.1, 2011-06-06
TLE6251-3G
Fail Safe Features
7
Fail Safe Features
7.1
CAN Bus Failure Detection
The High Speed CAN Transceiver TLE6251-3G is equipped with a bus failure detection unit. In Normal Operation
mode the TLE6251-3G can detect the following bus failures:
•
•
•
•
•
•
CANH shorted to GND
CANL shorted to GND
CANH shorted to VCC
CANL shorted to VCC
CANH shorted to VS
CANL shorted to VS
The TLE6251-3G can not detect the bus failures:
•
•
•
CANH open
CANL open
CANH short to CANL
The TLE6251-3G detects the bus failures while sending a “Dominant” signal to the CAN bus. After sending four
“Dominant” bits to the CAN bus, a logical “Low” on the NERR pins indicates the CAN bus failure. For the failure
indication the “Dominant” bits require a minimum pulse width of 4 μs. In case the TLE6251-3G detects an CAN bus
failure, the failure is only indicated by the NERR pin, the transceiver doesn’t stop or block the communication, by
disabling the output stage for example.
CANH
CANL
Short to VCC
t
TxD
t
RxD
t
NERR
t
Four Dominant Bits
Figure 9
CAN Bus Failure CANH short to VCC1)
1) The communication on the CAN bus could still be possible even with a short CANH to VCC or CANH to VS. If the CAN bus
communication is possible or not, depends on parameters like the number of participants inside the CAN network, the
network termination, etc. This figure shows a working CAN bus communication as an example and it shall not be
considered as a liability that on HS CAN networks the CAN bus communication continues in every CAN bus failure case.
Data Sheet
17
Rev. 1.1, 2011-06-06
TLE6251-3G
Fail Safe Features
7.2
Local Failures
If a local failure occurs during the operation of the TLE6251-3G, the devices sets an internal local failure flag. The
local failure flag can be displayed to the microcontroller during the Receive-Only mode and the failures are
indicated by a logical “Low” signal on the NERR pin. The following local failures can be detected:
•
•
•
•
•
TxD time-out
TxD to RxD Short
RxD permanent Recessive Clamping
Bus Dominant Clamping
Over-Temperature Detection
7.2.1
TxD Time-Out Feature
The TxD time-out feature protects the CAN bus against permanent blocking in case the logical signal on the TxD
pin is continuously “Low”.
In Normal Operation mode, a logical “Low” signal on the TxD input pin for the time t > tTXD enables the TxD timeout feature and the TLE6251-3G disables the output driver stage. In Receive-Only mode the TLE6251-3G
indicates the TxD time-out by a logical “Low” signal on the NERR pin (see Figure 10). To release the output driver
stage after the permanent “Low” signal on the TxD input pin disappears, a mode change from Receive-Only mode
to Normal Operation mode is required.
TxD time–out
released
t = tTXD
Output stage
released
CANH
CANL
t
TxD time-out
TxD
t
RxD
t
EN
t
NSTB
t
NERR
Receive-Only
mode
Normal Operation mode
Figure 10
Data Sheet
Normal Operation
mode
TxD Time-Out Feature
18
Rev. 1.1, 2011-06-06
TLE6251-3G
Fail Safe Features
7.2.2
TxD to RxD Short Circuit Feature
A short between the pins TxD and RxD causes permanent blocking of the CAN bus. In the case, that the low side
driver capability of the RxD output pin is stronger as the high side driver capability of the external microcontroller
output, which is connected to the TxD pin of the TLE6251-3G, the RxD output signal overrides the TxD signal
provided by the microcontroller. In this case a continuous “Dominant” signal blocks the CAN bus. The TLE62513G detects the short between the TxD and the RxD pin, disables the output driver stage and sets the internal local
failure flag. In Receive-Only mode the TLE6251-3G indicates the TxD to RxD short by a logical “Low” signal on
the NERR pin. The TLE6251-3G releases the failure flag and the output driver stage by an operation mode change
from Receive-Only mode to Normal Operation mode.
7.2.3
RxD Permanent Recessive Clamping
A logical “High” signal on the RxD pin indicates the external microcontroller, that there is no CAN message on the
CAN bus. The microcontroller can transmit a message to the CAN bus only if the bus is recessive. In case the
logical “High” signal on the RxD pin is caused by a failure, like a short from RxD to VIO, the RxD signal doesn’t
mirror the signal on the CAN bus. This allows the microcontroller to place a message to the CAN bus at any time
and corrupts CAN bus messages on the bus. The TLE6251-3G detects a permanent logical “High” signal on the
RxD pin and set the local error flag. In order to avoid any data collisions on the CAN bus the output driver stage
gets disabled. In Receive-Only mode the TLE6251-3G indicates the RxD Clamping by a logical “Low” signal on
the NERR pin. The TLE6251-3G releases the failure flag and the output driver stage by a operation mode change
or if the RxD clamping failure disappears.
7.2.4
Bus Dominant Clamping
Due to a fail function on one of the CAN bus participants, the CAN bus could be permanent in “Dominant” state. The
external microcontroller doesn’t transmit any data to the CAN bus as long as the CAN bus remains “Dominant”. Even
if the permanent “Dominate” state on the CAN bus is caused by a short from CANH to VCC, or similar, the transceiver
can not detect the failure, because the CAN bus failure detection works only when the transceiver is active sending
data to the bus. Therefore the TLE6251-3G has a bus dominant clamping detection unit installed. In case the bus
signal is “Dominant” for the time t > tBus,t the TLE6251-3G detects the bus clamping and sets the local failure flag.
The output driver stage remains active. In Receive-Only mode the TLE6251-3G indicates the bus dominant clamping
by a logical “Low” signal on the NERR pin.
Data Sheet
19
Rev. 1.1, 2011-06-06
TLE6251-3G
Fail Safe Features
7.2.5
Over-Temperature Detection
The output driver stage is protected against over temperature. Exceeding the shutdown temperature results in
deactivation of the output driving stage. To avoid any toggling after the device cools down, the output driver stage
is enabled again only after a “Recessive” to “Dominant” signal change on the TxD pin (see Figure 11).
An Over-Temperature event only deactivates the output driver stage, the TLE6251-3G doesn’t change its
operation mode in this failure case. The Over - Temperature event is indicated by a logical “Low” signal on the
NERR pin in Receive-Only mode.
Thermal Shutdown
Hysteresis ΔTJ
Thermal Shutdown
Temp. TJSD
Output-Stage Release
Temp.
Cool Down
t
CANH
CANL
t
TxD
t
RxD
t
Normal Operation mode
Figure 11
Release of the Transmission after an Over-Temperature event
7.3
Under-Voltage Detection
The TLE6251-3G provides a power supply monitoring on all three power supply pins: VCC, VIO and VS. In case of
an under - voltage event on any of this three power supplies, the TLE6251-3G changes the operation mode and
sets an internal failure flag. The internal failure flag is not indicated by the NERR output pin.
7.3.1
Under-Voltage Event on VCC and VIO
An under-voltage event on the power supply VCC or the power supply VIO causes the change of the operation mode
to Sleep mode, regardless of the operation mode in which the TLE6251-3G might currently operate. The logical
signals on the digital input pins EN and NSTB are also disregarded. After the power supplies VCC and VIO are
activated again, the operation mode can be changed the usual way. From Sleep mode to Stand-By mode by a
Wake-Up event or from Sleep mode direct to Normal Operation mode, Receive-Only mode by the digital input pins
EN and NSTB.
Data Sheet
20
Rev. 1.1, 2011-06-06
TLE6251-3G
Fail Safe Features
The under-voltage monitoring on the power supply VCC and VIO is combined with an internal filter time. Only if the
voltage drop on each of these two power supplies is longer present as the time tDrop > tUV(VIO) (tDrop > tUV(VCC)) the
operation mode change will be activated (see Figure 12).
Under-voltage events on the power supplies VCC or VIO are not indicated by the NERR pin nor by the RxD pin.
VCC
t < tUV(VCC)
t > tUV(VCC)
VCC,UV
t
INH
t
Normal Operation mode / Receive–Only mode / Stand–By mode
or Go-To Sleep command
VIO
t < tUV(VIO)
Sleep mode
t > tUV(VIO)
VIO,UV
t
INH
t
Normal Operation mode / Receive–Only mode / Stand–By mode
or Go-To Sleep command
Figure 12
Data Sheet
Sleep mode
Under-Voltage on VIO or VCC
21
Rev. 1.1, 2011-06-06
TLE6251-3G
Fail Safe Features
7.3.2
Under-Voltage Event on VS
If an under-voltage event is detected at the power supply VS, the TLE6251-3G immediately transfers into the
Stand-By mode, regardless of the operation mode in which the TLE6251-3G might currently operate. After the
power supply VS has been reestablished, the operation mode can be changed by applying a logical “High” signal
to the EN pin or the NSTB pin.
In the case the TLE6251-3G detects an under-voltage event on the VCC or VIO power supply, the TLE6251-3G
changes to Sleep mode. If the TLE6251-3G detects in Sleep mode an under-voltage event on the VS power supply,
the device changes to the Stand-By mode, even if the under-voltage event on the VCC or VIO power supply is still
present.
VS
VS,Pon
VS,Poff
t
any mode
Figure 13
Under-Voltage on VS
7.4
Voltage Adaptation
Power Down
Stand-By mode
The advantage of the adaptive microcontroller logic is the ratio metrical scaling of the I/O levels depending on the
input voltage at the VIO pin. Connecting the VIO input to the I/O supply of the microcontroller ensures, that the I/O
voltage of the microcontroller fits to the internal logic levels of the TLE6251-3G.
Data Sheet
22
Rev. 1.1, 2011-06-06
TLE6251-3G
Diagnosis-Flags at NERR and RxD
8
Diagnosis-Flags at NERR and RxD
Table 3
Truth Table
NSTB
1
EN
1
INH
High
Mode
Normal
Event
No CAN bus failure
CAN bus failure
1
0
0
0
High
High
Receive
Only
Stand-By
1)
1)
0
Floating
Sleep
RxD
1
“Low”: bus
dominant,
“High”: bus
recessive
0
Wake-up via CAN bus/no wake-up
request detected2)
1
Wake-up via pin WK3)
0
4)
No VS fail detected
VS fail detected
1
4)
0
No TxD time-out,
Over-Temperature event,
RxD recessive clamping or
bus dominant time out
detected5)
1
TxD time-out,
Over-Temperature event,
RxD recessive clamping or
bus dominant time out
detected5)
0
Wake-up request detected6)
No Wake up request detected
0
NERR
Wake-up request detected
6)
6)
No wake-up request detected
6)
“Low”: bus
dominant,
“High”: bus
recessive
0
0
1
1
0
0
1
1
1)
2)
3)
4)
Only valid after at least four recessive to dominant edges at TxD when entering the Normal Operation mode.
Only valid before four recessive to dominant edges at TxD when entering the Normal Operation mode.
Only valid before four recessive to dominant edges at TxD when entering the Normal Operation mode.
Power-Up flag only available, if VCC and VIO are active. Power-Up flag will be cleared when entering Normal Operation
mode.
5) Valid after a transition from Normal Operation mode.
6) Only valid if VCC and VIO are active.
Data Sheet
23
Rev. 1.1, 2011-06-06
TLE6251-3G
General Product Characteristics
9
General Product Characteristics
9.1
Absolute Maximum Ratings
Table 4
Absolute Maximum Ratings 1)
All voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Unit Conditions
Min.
Max.
VS
VCC
VIO
VCANH
VCANL
VWK
VINH
VDiff,CAN
-0.3
40
V
–
-0.3
6.0
V
–
-0.3
6.0
V
–
-40
40
V
–
-40
40
V
–
-27
40
V
–
Voltages
9.1.1 Supply voltage
9.1.2 Transceiver supply voltage
9.1.3 Logic supply voltage
9.1.4 CANH DC voltage versus GND
9.1.5 CANL DC voltage versus GND
9.1.6 Input voltage at WK
-0.3
VS + 0.3 V
–
-40
40
V
Max. differential voltage
between CAN and CANL
VLogic
-0.3
VIO
V
0 V < VIO < 6.0 V
IINH(max)
-5
0
mA
–
Tj
Tstg
-40
150
°C
–
-55
150
°C
–
9.1.13 ESD Resistivity at CANH, CANL, VESD
and WK versus GND
-8
8
kV
HBM2) (100 pF / 1.5 kΩ)
VESD
-2
2
kV
HBM2) (100 pF / 1.5 kΩ)
9.1.7 Input voltage at INH
9.1.8 Differential voltage CANH to
CANL
9.1.9 Logic voltages at EN, NSTB,
NERR, TxD, RxD
Currents
9.1.10 Maximum Output Current INH
Temperatures
9.1.11 Junction Temperature
9.1.12 Storage Temperature
ESD Susceptibility
9.1.14 ESD Resistivity all other pins
1) Not subject to production test, specified by design.
2) ESD susceptibility, HBM according to AEC-Q100-002D.
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Data Sheet
24
Rev. 1.1, 2011-06-06
TLE6251-3G
General Product Characteristics
9.2
Functional Range
Table 5
Operating Range
Pos.
Parameter
Symbol
Limit Values
Min.
Max.
Unit
Conditions
Supply Voltages
9.2.1
Supply Voltage Range for
Normal Operation
VS(nom)
5.5
18
V
–
9.2.2
Extended Supply Voltage Range
for Operation
VS(ext)
5.0
40
V
Parameter
Deviations possible
9.2.3
Transceiver Supply Voltage
4.75
5.25
V
–
9.2.4
Logic Supply Voltage
VCC
VIO
3.0
5.25
V
–
TJ
-40
150
°C
1)
Thermal Parameters
9.2.5
Junction temperature
1) Not subject to production test, specified by design
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
9.3
Thermal Resistance
Table 6
Thermal Characteristics1)
Pos.
Parameter
Symbol
Limit Values
Unit
Conditions
Min.
Typ.
Max.
RthJSP
RthJA
–
–
25
K/W
measured to pin 2
–
130
–
K/W
2)
Thermal Resistance
9.3.1
Junction to Soldering Point1)
9.3.2
Junction to Ambient1)
Thermal Shutdown Junction Temperature
9.3.3
Thermal shutdown temp.
TJSD
150
175
190
°C
–
9.3.4
Thermal shutdown hysteresis
ΔT
–
10
–
K
–
1) Not subject to production test, specified by design
2) EIA/JESD 52_2, FR4, 80 × 80 × 1.5 mm; 35μ Cu, 5μ Sn; 300 mm2
Data Sheet
25
Rev. 1.1, 2011-06-06
TLE6251-3G
Electrical Characteristics
10
Electrical Characteristics
10.1
Functional Device Characteristics
Table 7
Electrical Characteristics
4.75 V < VCC < 5.25 V; 3.0 V < VIO < 5.25 V; 5.5 V < VS < 18 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all
voltages with respect to ground; positive current flowing into pin; unless otherwise specified.
Pos. Parameter
Symbol
Limit Values
Min.
Typ.
Max.
Unit Conditions
Current Consumption
10.1.1 Current consumption in
Normal Operation mode on
VCC and VIO
ICC+VIO
–
6
10
mA
“Recessive” state;
TxD = “High”
ICC+VIO
–
50
80
mA
“Dominant” state;
TxD = “Low”
10.1.2 Current consumption in
Receive-Only mode on VCC
and VIO
ICC+VIO
–
6
10
mA
–
–
45
70
μA
–
2.5
10
μA
10.1.5 Current consumption in Sleep IVS
mode on VS
–
20
30
μA
10.1.6 Current consumption in Sleep ICC+VIO
mode on VCC and VIO
–
2.5
10
μA
VS = WK = 12 V
VCC = VIO = 5V
VS = VWK = 12 V
VCC = VIO = 5V
VS = 12 V, Tj < 85 °C,
VCC = VIO = 0 V
VS = 12 V, Tj < 85 °C,
VCC = VIO = 5V
2
3
4
V
–
1.5
2.5
2.8
V
–
2
4
5
V
–
2
3.5
5
V
–
–
-4
-2
mA
VRxD = 0.8 V x VIO
2
4
–
mA
VRxD = 0.2 V x VIO
10.1.3 Current consumption in Stand- IVS
By mode on VS
10.1.4 Current consumption in StandBy mode on VCC and VIO
ICC+VIO
Supply Resets
10.1.7 VCC under-voltage detection
VCC,UV
10.1.8 VIO under-voltage detection
VIO,UV
10.1.9 VS power ON detection level
VS,Pon
10.1.10 VS power OFF detection level VS,Poff
Receiver Output RxD
10.1.11 HIGH level output current
10.1.12 LOW level output current
Data Sheet
IRD,H
IRD,L
26
Rev. 1.1, 2011-06-06
TLE6251-3G
Electrical Characteristics
Table 7
Electrical Characteristics (cont’d)
4.75 V < VCC < 5.25 V; 3.0 V < VIO < 5.25 V; 5.5 V < VS < 18 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all
voltages with respect to ground; positive current flowing into pin; unless otherwise specified.
Pos. Parameter
Symbol
Limit Values
Unit Conditions
Min.
Typ.
Max.
VTD,H
0.7 ×
–
VIO +
0.3 V
V
“Recessive” state
VTD,L
- 0.3
–
0.3 ×
V
“Dominant” state
ITD
RTD
-5
0
5
μA
VTxD = VIO
10
20
40
kΩ
–
VM,H
0.7 ×
–
VIO +
0.3 V
V
“Recessive” state
VM,L
- 0.3
–
0.3 ×
V
“Dominant” state
IMD
RM
-5
0
5
μA
VEN and VNSTB = 0V
50
100
200
kΩ
–
Transmission Input TxD
10.1.13 High level input range
10.1.14 Low level input range
10.1.15 HIGH level input current
10.1.16 TxD pull-up resistance
VIO
VIO
Mode Control Inputs EN, NSTB
10.1.17 High level input range
10.1.18 Low level input range
10.1.19 LOW level input current
10.1.20 Pull-down resistance
VIO
VIO
Diagnostic Output NERR
10.1.21 HIGH level output voltage
10.1.22 LOW level output voltage
VNERR,H 0.8 × –
VIO
VNERR,L –
–
–
mA
INERR = -100 μA
0.2 ×
mA
INERR = 1.25 μA
VWK,H
VS +
V
VEN = VNSTB = 0 V, rising edge
V
VEN = VNSTB = 0 V, falling edge
VWK = Vs - 2 V
VWK = Vs - 4 V
VIO
Wake Input WK
10.1.23 High Level voltage range at
WK
10.1.24 Low Level voltage range at WK VWK,L
VS 2V
–
- 27
–
3V
VS 4V
IWKH
IWKL
-10
-5
–
μA
–
5
10
μA
10.1.27 HIGH level voltage drop
ΔVH = VS - VINH
Δ VH
–
0.4
0.8
V
–
0.8
1.6
V
10.1.28 Leakage current
IINH,lk
–
–
5
μA
10.1.25 HIGH level input current
10.1.26 LOW level current
Inhibit Output INH
Data Sheet
IINH = -1 mA
1)
IINH = -5 mA
Sleep mode;
VINH = 0 V
27
Rev. 1.1, 2011-06-06
TLE6251-3G
Electrical Characteristics
Table 7
Electrical Characteristics (cont’d)
4.75 V < VCC < 5.25 V; 3.0 V < VIO < 5.25 V; 5.5 V < VS < 18 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all
voltages with respect to ground; positive current flowing into pin; unless otherwise specified.
Pos. Parameter
Symbol
Limit Values
Min.
Typ.
Max.
Unit Conditions
Bus Transmitter
10.1.29 CANL and CANH recessive
output voltage
VCANL/H 2.0
–
3.0
V
Normal Operation mode
no load
10.1.30 CANL and CANH recessive
output voltage
VCANL/H -0.1
–
0.1
V
Sleep or Stand-By mode
no load
10.1.31 CANH to CANL recessive
output voltage difference
Vdiff
-500
–
50
mV
VTxD = VIO;
0.5
–
2.25
V
2.75
–
4.5
V
1.5
–
3.0
V
no load
10.1.32 CANL dominant output voltage VCANL
10.1.33 CANH dominant output
voltage
VCANH
10.1.34 CANH, CANL dominant output Vdiff
voltage difference
VTxD = 0 V; 50 Ω < RL < 65 Ω
VTxD = 0 V;
50 Ω < RL < 65 Ω
VTxD = 0 V; 50 Ω < RL < 65
ICANLsc 50
ICANHsc -200
ICANHL,lk -5
80
200
mA
-80
-50
mA
0
5
μA
VS = VIO = VCC = 0 V;
0 V < VCANH,L < 5 V
10.1.38 Differential receiver input
range - Dominant
Vdiff,rdN
0.9
–
5.0
V
Normal Operation mode,
In respect to CMR
10.1.39 Differential receiver input
range - Recessive
Vdiff,drN
-1.0
–
0.5
V
Normal Operation mode,
In respect to CMR
10.1.40 Differential receiver input
range - Dominant
Vdiff,rdL
1.15
–
5.0
V
Sleep mode, Stand-By mode
In respect to CMR
10.1.41 Differential receiver input
range - Recessive
Vdiff,drL
-1.0
–
0.4
V
Sleep mode, Stand-By mode
In respect to CMR
10.1.42 Common mode range
CMR
-12
–
12
V
VCC = 5 V
10.1.43 Differential receiver hysteresis Vdiff,hys
–
100
–
mV
–
10.1.44 CANH, CANL input resistance Ri
10
20
30
kΩ
“Recessive” state
20
40
60
kΩ
“Recessive” state
10.1.35 CANL short circuit current
10.1.36 CANH short circuit current
10.1.37 Leakage current
VCANLshort = 18 V
VCANHshort = 0 V
Bus Receiver
10.1.45 Differential input resistance
Data Sheet
Rdiff
28
Rev. 1.1, 2011-06-06
TLE6251-3G
Electrical Characteristics
Table 7
Electrical Characteristics (cont’d)
4.75 V < VCC < 5.25 V; 3.0 V < VIO < 5.25 V; 5.5 V < VS < 18 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all
voltages with respect to ground; positive current flowing into pin; unless otherwise specified.
Pos. Parameter
Symbol
Limit Values
Unit Conditions
Min.
Typ.
Max.
td(L),TR
–
150
255
ns
CL = 100 pF;
VCC = VIO = 5 V; CRxD = 15 pF
10.1.47 Propagation delay
td(H),TR
TxD-to-RxD HIGH (“Dominant”
to “Recessive”)
–
150
255
ns
CL = 100 pF;
VCC = VIO = 5 V; CRxD = 15 pF
td(L),T
–
50
120
ns
10.1.49 Propagation delay
td(H),T
TxD HIGH to bus “Recessive”
–
50
120
ns
td(L),R
–
100
135
ns
10.1.51 Propagation delay
td(H),R
bus “Recessive” to RxD “High”
–
100
135
ns
CL = 100 pF;
VCC = VIO = 5 V; CRxD = 15 pF
CL = 100 pF;
VCC = VIO = 5 V; CRxD = 15 pF
CL = 100 pF;
VCC = VIO = 5 V; CRxD = 15 pF
CL = 100 pF;
VCC = VIO = 5 V; CRxD = 15 pF
8
25
50
μs
–
Dynamic CAN-Transceiver Characteristics
10.1.46 Propagation delay
TxD-to-RxD LOW
(“Recessive” to “Dominant”)
10.1.48 Propagation delay
TxD LOW to bus “Dominant”
10.1.50 Propagation delay
bus “Dominant” to RxD “Low”
10.1.52 Min. hold time go to sleep
command
thSLP
10.1.53 Min. wake-up time on pin WK
tWK(local) 5
tWake
0.75
10
20
μs
–
3
5
μs
–
10.1.55 TxD permanent “Dominant”
disable time
tTxD
0.6
1.0
ms
–
10.1.56 Bus permanent time-out
tBus,t
0.3
tUV(VIO) 200
tUV(VCC)
tMode
–
10.1.54 Min. “Dominant” time for bus
wake-up
10.1.57 VCC, VµC undervoltage filter
time
10.1.58 Time for mode change
0.3
0.6
1.0
ms
–
320
480
ms
–
20
–
μs
1)
1) Not subject to production test, specified by design.
Data Sheet
29
Rev. 1.1, 2011-06-06
TLE6251-3G
Electrical Characteristics
10.2
Diagrams
10
VS
NSTB
100 nF
EN
13
CL
CANH
TxD
RxD
RL
12
6
1
4
CRxD
CANL
VIO
9
14
WK
GND
VCC
5
3
100
nF
2
Figure 14
100
nF
= VCC
=
VIO
Test Circuit for Dynamic Characteristics
VTxD
VIO
GND
VDIFF
td(L),T
0.9 V
0.5 V
td(L),R
VRxD
VIO
t
td(H),T
t
td(H),R
td(L),TR
td(H),TR
0.8 x VIO
GND
0.2 x VIO
t
Figure 15
Data Sheet
Timing Diagrams for Dynamic Characteristics
30
Rev. 1.1, 2011-06-06
TLE6251-3G
Application Information
11
Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
11.1
Application Example
4.7 nF 1)
60 Ω
VS
60 Ω
TLE6251-3G
10 kΩ
9
VBat
CAN
Bus
WK
EN
NSTB
NERR
51 µH
13
1)
12
11
10
CANH
RxD
TxD
CANL
VIO
N.C.
6
14
8
4
Micro
Controller
E.g. XC22xx
1
5
100
nF
VS
100 7
INH
nF
GND
VCC
3
VQ1
INH
e.g. TLE 4476
(3.3/5 V) or
TLE 4471
TLE 4276
TLE 4271
100
nF
VI1
GND
100
nF
2
22 +
µF
100
nF
GND
VQ2
5V
+
22
µF
+
22
µF
ECU
TLE6251DS
51 µH
7
1)
6
5
CANH
STB
CANL
RxD
SPLIT
TxD
GND
VCC
8
Micro
Controller
E.g. XC22xx
4
1
3
100
nF
2
100
nF
GND
e. g. TLE 4270
60 Ω
60 Ω
4.7 nF 1)
VI
22 +
µF
100
nF
5V
VQ
GND
+
22 µF
ECU
1) Optional, according to the car manufacturer requirements
Figure 16
Data Sheet
Application Circuit Example
31
Rev. 1.1, 2011-06-06
TLE6251-3G
Application Information
11.2
ESD Robustness according to IEC61000-4-2
Test for ESD robustness according to IEC61000-4-2 “Gun test” (150 pF, 330 Ω) have been performed. The results
and test conditions are available in a separate test report.
Table 8
ESD Robustness according to IEC61000-4-2
Performed Test
Result
Unit
Remarks
Electrostatic discharge voltage at pin VS, CANH, ≥ 9
CANL and WK versus GND
kV
1)
Positive pulse
Electrostatic discharge voltage at pin VS, CANH, ≤ −9
CANL and WK versus GND
kV
1)
Negative pulse
1) ESD susceptibility “ESD GUN” according to “Gift ICT Evaluation of CAN Transceiver “Section 4.3. (IEC 61000-4-2:
2001-12) -Tested by external test house (IBEE Zwickau, EMC Testreport Nr. 07a-04-09 referenced to the TLE6251-2G).
11.3
Voltage Drop over the INH Output
Voltage Drop on the INH output pin
1,00
Voltage Drop (V)
TJ = 150°C
TJ = 25°C
TJ = -40°C
0,00
0,00
1,00
2,00
3,00
4,00
5,00
INH Output Current (mA)
Figure 17
Data Sheet
INH output voltage drop versus output current (typical values only!)
32
Rev. 1.1, 2011-06-06
TLE6251-3G
Application Information
11.4
Mode Change to Sleep mode
Mode changes are applied either by a host command, an Wake-Up event or by an under-voltage event. To trigger
a mode change by a host command or in other words by a signal change on the digital input pins EN and NSTB
all power supplies, VS VIO and VCC need to be available.TLE6251-3G.
By setting the EN pin to logical “High” and the NSTB pin to logical “Low”, the TLE6251-3G enters the Go-To-Sleep
command and after the time t = thSLP expires, the TLE6251-3G enters into the Sleep mode (see Chapter 5.5). For
any mode change, also for a mode change to Sleep mode the TLE6251-3G disregards the signal on the CAN bus.
Therefore the TLE6251-3G can enter Sleep mode and remain in Sleep mode even if there is a short circuit on the
CAN bus, for example CANH shorted to VS or VCC.
In order to recognize a remote Wake-Up, the TLE6251-3G requires a signal change from “Recessive” to
“Dominant” before the Wake-Up filter time starts (see Figure 6 and Figure 18).
EN
t
t = thSLP
NSTB
t
Normal
Operation mode
Go-To Sleep
command
Sleep mode
Stand-By mode
CANH
CANL
t = tWake
t = tWake
no Wake-Up
„Recessive“ to „Dominant“
change
Wake-Up
t
INH
t
RxD
t
Figure 18
Mode change to Sleep while the CANH bus is “Dominant”
11.5
Further Application Information
•
•
•
Please contact us for information regarding the pin FMEA.
Existing App. Note
For further information you may contact http://www.infineon.com/transceiver
Data Sheet
33
Rev. 1.1, 2011-06-06
TLE6251-3G
Package Outlines
12
Package Outlines
gps09033
Figure 19
PG-DSO-14 (Plastic Dual Small Outline PG-DSO-14-24)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Data Sheet
34
Dimensions in mm
Rev. 1.1, 2011-06-06
TLE6251-3G
Revision History
13
Revision History
Revision
Date
Changes
1.1
2011-05-23
Update Data Sheet Rev.1.1 based on Data Sheet Rev. 1.0:
• All Pages:
correct spelling and grammar.
• Update cover page, with new Infineon logo.
• Page 7, Figure 3: updated.
• Page 9, Figure 4: updated.
• Page 18, Figure 10: updated.
• Page 20, Figure 11, updated.
• Page 22, Figure 13, updated.
• Page 25, table 5, pos. 9.2.1:
New supply voltage range VS(Nom) from 5.5 V to 18 V.
• Page 25, table 5, pos. 9.2.2:
New extended supply voltage range VS(Nom) from 5.0 V to 40 V.
• Page 26ff, table 7, update table title:
New supply range 5.5 V < VS < 18 V.
• Page 29, table 7, pos. 10.1.58:
Changed to typical value.
• Page 30, Figure 15: updated.
• Page 33, table 8:
Change algebraic sign of the negative pulse
• Page 33:
Add new chapter 11.4
Data Sheet
35
Rev. 1.1, 2011-06-06
Edition 2011-06-06
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2005 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
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For further information on technology, delivery terms and conditions and prices, please contact the nearest
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