Final Data Sheet, Re v. 3.2, Apr. 2006 TLE 6251 G H ig h S p e ed C A N - T ra n s c ei v er w it h W ak e Detection A u to m o t iv e P o w e r N e v e r s t o p t h i n k i n g . Edition 2006-04-05 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany © Infineon Technologies AG 2005. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. High Speed CAN-Transceiver with Wake Detection TLE 6251 G Features • • • • • • • • • • • • • • • • • • • • • • • • • CAN data transmission rate up to 1 Mbaud Compatible to ISO/DIS 11898 Supports 12 V and 24 V automotive applications Low power modes with local wake-up input and remote wake-up via CAN bus Very low power consumption in sleep mode Wake-up input Wake-up source recognition Inhibit output to control an external power supply Diagnosis output RxD only mode for node failure analysis Split termination to stabilize the recessive level TxD time-out function with diagnosis RxD recessive clamping handler with diagnosis TxD to RxD short circuit handler with diagnosis Bus line short circuit diagnosis Bus dominant clamping diagnosis Undervoltage detection at VCC, VI/O and VBAT Cold start diagnosis (first battery connection) Adaptive to host logic supply levels (3.3 and 5 V) Wide common mode range for electromagnetic immunity (EMI) Low electromagnetic emission (EME) Short circuit proof to ground, battery and VCC Overtemperature protection Protected against automotive transients +/- 6kV ESD Robustness according to IEC 61000-4-2 P-DSO-14-13 Type Ordering Code Package TLE 6251 G SP000069400 P-DSO-14-13 Final Data Sheet 3 Rev. 3.2, 2006-04-05 TLE 6251 G Description The CAN-transceiver TLE 6251 G is a monolithic integrated circuit in a P-DSO-14-13 package for high speed differential mode data transmission (up to 1 Mbaud) and reception in automotive and industrial applications. It works as an interface between the CAN protocol controller and the physical bus lines compatible to ISO/DIS 11898. As a successor to the first generation of HS CAN, the TLE 6251 G is designed to provide an excellent passive behavior when the transceiver is switched off (mixed networks, clamp15/30 applications). The current consumption can be reduced, due to the low power modes.. This supports networks with partially powered down nodes. The TLE 6251 G offers two low power modes as well as a receive-only mode to support software diagnosis functions. A wake-up from the low power mode is possible via a message on the bus or via the bi-level sensitive wake input. An external voltage supply IC can be controlled by the inhibit output. So, the µC can be powered down and the TLE 6251 G still reacts to wake-up activities on the CAN bus or local wake input. A diagnosis output allows mode dependent enhanced diagnosis of bus failures and wake-up source. A VBAT fail flag reports an power-on condition at the battery supply input. The TLE 6251 G is designed to withstand the severe conditions of automotive applications and to support 12 V and 24 V applications. The IC is based on the Smart Power Technology SPT® which allows bipolar and CMOS control circuitry in accordance with DMOS power devices existing on the same monolithic circuit. Final Data Sheet 4 Rev. 3.2, 2006-04-05 TLE 6251 G Pin Configuration TLE 6251 G (P-DSO-14-13) TxD 1 14 NSTB GND 2 13 CANH VCC 3 12 CANL RxD 4 11 SPLIT VµC 5 10 VS EN 6 9 WK INH 7 8 NERR AEP03398.VSD Figure 1 Pin Configuration (top view) Table 1 Pin Definitions and Functions Pin No. Symbol Function 1 TxD CAN transmit data input; 20 kΩ pull-up, LOW in dominant state 2 GND Ground 3 VCC 5 V supply input; block to GND with 100 nF ceramic capacitor 4 RxD CAN receive data output; LOW in dominant state, push-pull output stage 5 VµC Logic voltage level adapter input; connect to pin VCC for 5 V microcontroller, connect to additional supply voltage for other logic voltage levels, block to GND with 100 nF ceramic capacitor 6 EN Mode control input 1; internal pull-down, see Figure 6 7 INH Control output; set HIGH to activate voltage regulator; open drain 8 NERR Diagnosis output 1; error and power on indication output, push-pull output stage 9 WK Wake-up input; bi-level sensitive Final Data Sheet 5 Rev. 3.2, 2006-04-05 TLE 6251 G Table 1 Pin Definitions and Functions (cont’d) Pin No. Symbol Function 10 VS Battery voltage supply input; block to GND with 100 nF ceramic capacitor 11 SPLIT Termination output; to support the recessive voltage level of the bus lines (see Table 2) 12 CANL Low line output; LOW in dominant state 13 CANH High line output; HIGH in dominant state 14 NSTB Mode control input 2; internal pull-down, see Figure 6 Final Data Sheet 6 Rev. 3.2, 2006-04-05 TLE 6251 G Functional Block Diagram VS VCC WK TLE 6251 G 10 7 3 9 Wake-Up Logic 6 Mode Control Logic 14 5 CANH CANL Driver Output Stage 12 EN NSTB VµC 8 Diagnosis Logic 13 INH NERR Temp.Protection 1 + timeout TxD = VµC MUX SPLIT GND 4 RxD Receiver + Bus Failure Detection 11 2 AEB03397.VSD Figure 2 Final Data Sheet Block Diagram 7 Rev. 3.2, 2006-04-05 TLE 6251 G Application Information As a successor to the first generation of HS CAN, the TLE 6251 G is designed to provide an excellent passive behavior when the transceiver is switched off (mixed networks, terminal 15/30 applications). The current consumption can be reduced, due to the low power modes. This supports networks with partially powered down nodes. A wake-up from the low power modes is possible via a message on the bus or via the bi-level sensitive wake input WK. An external voltage supply IC can be controlled by the inhibit output INH. So, the µC can be powered down and the TLE 6251 G still reacts to wake-up activities on the CAN bus or local wake input activities. A diagnosis output pin NERR, allows mode dependent enhanced diagnosis of bus failures and wake-up source. A VBAT fail flag reports a power-on condition at the battery supply input. The VBAT fail flag will be resetted after the first transition into normal mode. The TLE 6251 G has four operation modes, the normal, the receive only, the standby mode and the sleep mode. These modes can be controlled with the two control pins EN and NSTB pin (see Figure 6, Table 2). Both, EN and NSTB, have an implemented pull-down, so if there is no signal applied to EN and NSTB, the transceiver automatically changes to the standby mode. Normal Mode To transfer the TLE 6251 G into the normal mode, NSTB and EN have to be switched to HIGH level. This mode is designed for the normal data transmission/reception within the HS-CAN network. Transmission The signal from the µC is applied to the TxD input of the TLE 6251 G. Now the bus driver switches the CANH/L output stages to transfer this input signal to the CAN bus lines. TxD Time-out Feature If the TxD signal is dominant for a time t > tTxD, the TxD time-out function deactivates the transmission of the signal at the bus. This is realized to prevent the bus from being blocked permanently due to an error. The transmission is released again, after a mode state change. TxD to RxD Short Circuit Feature Similar to the TxD time-out, a TxD to RxD short circuit would also drive a permanent dominant signal at the bus and so block the communication. To avoid this, the TLE 6251 G has a TxD to RxD short circuit detection. Final Data Sheet 8 Rev. 3.2, 2006-04-05 TLE 6251 G Reduced Electromagnetic Emission The bus driver has an implemented control to reduce the electromagnetic emission (EME). This is achieved by controlling the symmetry of the slope, resp. of CANH and CANL. Overtemperature The driver stages are protected against overtemperature. Exceeding the shutdown temperature results in deactivation of the driving stages at CANH/L. To avoid a bit failure after cooling down, the signals can be transmitted again only after a dominant to recessive edge at TxD. Figure 3 shows the way how the transmission stage is deactivated and activated again. First an overtemperature condition causes the transmission stage to deactivate. After the overtemperature condition is no longer present, the transmission is only possible after the TxD bus signal has changed to recessive level. Failure Overtemp VCC Overtemperature GND t TxD VCC GND t CANH VCC R D VCC/2 R t AET03394.VSD Figure 3 Final Data Sheet Release of the Transmission after Overtemperature 9 Rev. 3.2, 2006-04-05 TLE 6251 G Reception The analog CAN bus signals are converted into a digital signal at RxD via the differential input receiver. In normal mode and RxD only, the split pin is used to stabilize the recessive common mode signal. Permanent Recessive Clamping If the RxD signal is permanent recessive, although there is a message sent on the bus, the host µC of this transceiver could start a message at any time, because the bus seems to be idle. To prevent this node to disturb the communication on the bus, the TLE 6251 G offers a so called permanent RxD recessive clamping. If the RxD signal is permanent recessive, an error flag is set and the transmitter is deactivated as long as the error occurs Receive Only Mode (RxOnly Mode) In the RxOnly mode, the transmission stage is deactivated but the reception of signals via the CAN bus is still possible. This mode is implemented to support hardware and software diagnosis functions. If there is an hardware error on the transmission part of a node (e.g. bubbling idiot failure), in the RxOnly mode, the bus is no longer blocked and the µC can still receive the messages on the bus. It is also possible to make a network analysis of the interconnections between the nodes. A connection between two nodes (in a network) is checked if both nodes are in the normal mode and all others are in RxOnly mode. If a message from one node is sent to the other, this has to be acknowledged. If there is no acknowledge of the message, the connection between the two nodes has an error. The RxD pin also works as an diagnosis flag, which is described more in detail in Table 2. Final Data Sheet 10 Rev. 3.2, 2006-04-05 TLE 6251 G Standby Mode In the standby mode, transmission and reception of signals is deactivated. This is the first step of reducing the current consumption. The internal voltage regulator control pin (INH) is still active, so all external (INH controlled) powered devices are also activated. Wake-Up The wake-up is possible via WK-pin (filtering time t > tWK) or CAN message (filtering time t > tWU) and sets the RxD/NERR pins to LOW, see Figure 4. Now the µC is able to detect this change at RxD and switch the transceiver into the normal mode. Once the wake-up flag is set (= LOW), it remains in this state, as long as the transceiver is not transferred into the normal mode. The detection of the wake-up source is possible during the first 4 recessive to dominant edges at TxD in the normal mode. Go-to Sleep Mode The go-to sleep mode is used to have an intermediate step between the sleep mode and all other modes. This mode has to control if the sleep command (EN = 1, NSTB = 0) is activated for a minimum hold time t > thSLP. Afterwards the TLE 6251 G automatically transfers into the sleep mode. The activated features in go-to sleep mode are similar to the standby mode. Sleep Mode In the sleep mode, transmission and reception of signals is deactivated. This is the second step of reducing the current consumption. The internal voltage regulator control pin (INH) is deactivated. Transition into other Modes during Sleep Mode Transition from sleep into other modes is possible if VCC and VµC active. Selection of the modes can be done by the mode control inputs. Wake-Up The wake-up is possible via WK-pin (filtering time t > tWK) or CAN message (filtering time t > tWU) and automatically transfers the TLE 6251 G into the standby mode and sets the RxD/NERR pins to LOW, see Figure 4. Once the TLE 6251 G has been set to the standby mode, the system voltage regulator is activated by the inhibit output INH, and the µC restarts. Now the µC is able to detect this change at RxD and switch the transceiver into the normal mode. Once the wake-up flag is set (= LOW), it remains in this state, as long as the transceiver is not transferred into the normal mode. The detection of the wake-up source is possible during the first 4 recessive to dominant edges at TxD in the normal mode. Final Data Sheet 11 Rev. 3.2, 2006-04-05 TLE 6251 G CAN_H CAN_L WAKE PATTERN Communication starts BUS WAIT BUS OFF Vdiff INH tWU DEVICE WAKE Vcc/Vio ECU WAKE LDO RAMP UP µC P.O.R. RxD NERR NSTB/EN µC set TLE6251G to normal operation Normal mode Figure 4 Final Data Sheet RxD during Sleep mode 12 Rev. 3.2, 2006-04-05 TLE 6251 G Split Circuit The split circuitry is activated during normal and RxOnly mode and deactivated (SPLIT pin high ohmic) during sleep and standby mode. The SPLIT pin is used to stabilize the recessive common mode signal in normal mode and RxOnly mode. This is realized with a stabilized voltage of 0.5 VCC at SPLIT. CANH CANH TLE 6251 G/DS 60 Ω Split Termination SPLIT 10 nF TLE 6251 G/DS 60 Ω CAN Bus Split Termination 60 Ω 60 Ω CANL SPLIT 10 nF CANL 10 nF Split Termination at Stub 1.5 kΩ CANH 1.5 kΩ SPLIT CANL TLE 6251 G/DS AEA03399.VSD Figure 5 Application example for the SPLIT Pin A correct application of the SPLIT pin is shown in Figure 5. The split termination for the left and right node is realized with two 60 Ω resistances and one 10 nF capacitor. The center node in this example is a stub node and the recommended value for the split resistances is 1.5 kΩ. Diagnosis-Flags at NERR and RxD Power-Up Flag • Task: to signalize a power-up state at VBAT Final Data Sheet 13 Rev. 3.2, 2006-04-05 TLE 6251 G • • Indicator: NERR = LOW in RxOnly mode Remarks: Power-up flag is cleared when entering the normal mode Wake-Up Flag • • • Task: to signalize a wake-up condition at the WK pin (filtering time t > tWK) or via CAN bus message (filtering time t > tWU) Indicator: RxD or NERR = LOW in sleep/stand-by mode immediately after wake-up Remarks: Flag is cleared on entering the RxOnly mode Wake-Up Source Flag • • • Task: to distinguish between the two wake-up sources Indicator: NERR = LOW in normal mode = wake-up via WK pin Remarks: only available if the power-up flag is cleared. After four recessive to dominant edges on TxD in normal mode, the flag is cleared. Leaving the normal mode clears the wakeup source flag. Bus Failure Flag • • • Task: to signalize a bus line short circuit condition to GND, VS or VCC Indicator: NERR = LOW in normal mode Remarks: flag is set after four consecutive recessive to dominant cycles on pin TxD when trying to drive the bus dominant. The bus failure flag is cleared if the normal mode is reentered or 4 recessive to dominant edges at TxD without failure condition. Local Failure Flag • • • Task: to signalize one of the five local failure conditions described in Local Failure-Flags and -Detection Indicator: NERR = LOW in RxOnly mode (local failure flag is set) Remarks: the flag is cleared when entering the normal mode from RxOnly mode or when RxD is dominant while TxD is recessive. Final Data Sheet 14 Rev. 3.2, 2006-04-05 TLE 6251 G Local Failure-Flags and -Detection TxD Dominant Failure Detection • • • • Effect: permanent dominant signal for t > tTxD at TxD Indicator: NERR = LOW in RxOnly mode (local failure flag is set) Action: disabling of the transmitter stage Remarks: release of the transmitter stage only after transition into RxOnly mode (failure diagnosis) and transition into normal mode. RxD Permanent Recessive Clamping • • • • Effect: internal RxD signal does not match signal at RxD pin because the RxD pin is pulled to HIGH (permanent HIGH) Indicator: NERR = LOW in RxOnly mode (local failure flag is set) Action: disabling of the receiver stage Remarks: the flag is cleared by changing from RxOnly (failure diagnosis) into normal mode or RxD gets dominant. TxD to RxD Short Circuit • • • • Effect: short circuit between RxD and TxD Indicator: NERR = LOW in RxOnly mode (local failure flag is set) Action: disabling of the transmitter stage Remarks: the flag is cleared by changing from RxOnly (failure diagnosis) into normal mode. Bus Dominant Clamping • • • • Effect: permanent dominant signal at the CAN bus for t > tBUS Indicator: NERR = LOW in RxOnly mode (local failure flag is set) Action: none Remarks: none Overtemperature Detection • • • • Effect: junction temperature at the driving stages exceeded Indicator: NERR = LOW in RxOnly mode (local failure flag is set) Action: disabling of the transmitter stage Remarks: the flag is cleared by changing from RxOnly (failure diagnosis) into normal mode or RxD gets dominant. Bus only released after the next dominant bit in TxD. Final Data Sheet 15 Rev. 3.2, 2006-04-05 TLE 6251 G Other Features VµC-level Adapter The advantage of the adaptive µC logic is the ratiometrical scaling of the I/O levels depending on the input voltage at the VµC pin. So it can be ensured that the I/O voltage of the µC fits to the internal logic levels of the TLE 6251 G. WAKE Input The wake-up input pin is a bi-level sensitive input. This means that both transitions, HIGH to LOW and LOW to HIGH, result in a wake-up. VCC, VµC Undervoltage Detection If an undervoltage condition at VCC, VµC is detected for longer than t = tUV,t, the TLE 6251 G automatically transfers into the sleep mode and the undervoltage flag is set. This flag is an internal flag and not available via NERR or RxD. The flag is cleared again, after setting the power on or wake flag (power-up or wake-up). VS Undervoltage Detection If an undervoltage condition at VS is detected, the TLE 6251 G immediately transfers into the standby mode and the undervoltage flag is set. This flag is an internal flag and not available via NERR or RxD. The flag is cleared again, after the supply voltage VS has reached the nominal value. Final Data Sheet 16 Rev. 3.2, 2006-04-05 TLE 6251 G Start Up Power Up Power Down Normal Mode EN NSTB IHH 1 1 High Undervoltage at VS Go to Sleep Receive-Only Stand-By EN NSTB EN NSTB INH EN NSTB INH 1 0 0 1 High 0 0 High t < thSLP Wake-Up: t > tWK t > tWU Undervoltage at VCC /VµC for t > tUV,t Sleep t > thSLP EN NSTB IHN 0 0 Float. AEA03400.VSD Figure 6 Final Data Sheet Mode State Diagram 17 Rev. 3.2, 2006-04-05 TLE 6251 G Table 2 Truth Table NSTB EN INH Mode 1 NORMAL No CAN bus failure1) 1 1 0 HIGH HIGH Event NERR RxD CAN bus failure1) 0 CANH/CANL driver off2) 1 Wake-up via CAN bus/no wake-up request detected 1 Wake-up via pin WK3) 0 RECEIVE No VBAT fail detected4) ONLY V fail detected4) 1 BAT 0 0 0 0 1 0 1 0 No TxD time-out, overtemperature, RxD recessive clamping or bus dominant time out detected5) 1 TxD time-out, overtemperature, RxD recessive clamping or bus dominant time out detected5) 0 LOW: bus ON dominant, HIGH: bus recessive LOW: bus ON dominant, HIGH: bus recessive Wake-up request detected6) 0 0 No Wake up request detected6) 1 1 HIGH7) GO TO SLEEP Wake-up request detected6) 0 0 No wake-up request detected6) 1 1 floating SLEEP8) Wake-up request detected6) 0 0 No wake-up request detected6) 1 HIGH STAND BY 1 SPLIT OFF OFF OFF 1) Only valid AFTER at least four recessive to dominant edges at TxD after entering the normal mode. 2) Due to an thermal overtemperature shutdown or TxD time-out. 3) Only valid BEFORE four recessive to dominant edges at TxD after entering the normal mode. 4) Power on situation, valid if VCC and VµC is active and transition from sleep, stand-by or goto sleep command. 5) Transition from normal mode. 6) Only valid if VCC and VµC are active. 7) If this mode is selected for a time longer than the hold time of the go-to sleep command (t > thSLP), INH is floating. Final Data Sheet 18 Rev. 3.2, 2006-04-05 TLE 6251 G 8) Transition into the sleep mode only if go-to sleep command was selected for a time longer than the hold time of the goto sleep command (t > thSLP). Final Data Sheet 19 Rev. 3.2, 2006-04-05 TLE 6251 G Table 3 Absolute Maximum Ratings Parameter Symbol Limit Values Unit Remarks Min. Max. VS VCC VµC VCANH/L -0.3 40 V – -0.3 5.5 V – -0.3 5.5 V – -27 40 V – VdiffESD -40 40 V CANH - CANL < |40 V|; CANH - SPLIT < |40 V| CANL - SPLIT < |40 V|; CANL - WK < |40 V|; CANH - WK < |40 V|; Split - WK < |40 V| -27 40 V – -27 40 V – -0.3 VS + 0.3 V – -0.3 VµC V 0 V < VµC < 5.5 V Voltages Supply voltage 5 V supply voltage Logic supply voltage CAN bus voltage (CANH, CANL) Differential voltage CANH, CANL, SPLIT, WK VSPLIT input voltage VSPLIT Input voltage at WK VWK Input voltage at INH VINH Logic voltages at EN, NSTB, VI NERR, TxD, RxD Electrostatic discharge voltage at SPLIT VESD -1 1 kV human body model (100 pF via 1.5 kΩ) Electrostatic discharge voltage at CANH, CANL, WK vs. GND VESD -6 6 kV human body model (100 pF via 1.5 kΩ) Electrostatic discharge voltage for all pin except SPLIT VESD -2 2 kV human body model (100 pF via 1.5 kΩ) Electrostatic discharge voltage at CANH, CANL vs. GND VESD -6 6 kV According to IEC61000-4-2 (150 pF via 330Ω) See Figure 101) Tj -40 150 °C – Temperatures Storage temperature 1) application circuits with and without terminated SPLIT pin Note: Maximum ratings are absolute ratings; exceeding any one of these values may cause irreversible damage to the integrated circuit. Final Data Sheet 20 Rev. 3.2, 2006-04-05 TLE 6251 G Table 4 Operating Range Parameter Supply voltage 5 V supply voltage Logic supply voltage Junction temperature Symbol Limit Values Unit Remarks Min. Max. VS VCC VµC Tj 5 40 V – 4.75 5.25 V – 3.0 5.25 V – -40 150 °C – Rthj-a – 120 K/W 1) 150 190 °C – – 10 K – Thermal Resistances Junction ambient Thermal Shutdown (junction temperature) Thermal shutdown temp. Thermal shutdown hyst. TjSD ∆T 1) Calculation of the junction temperature Tj = Tamb + P × Rthj-a Final Data Sheet 21 Rev. 3.2, 2006-04-05 TLE 6251 G Table 5 Electrical Characteristics 4.75 V < VCC < 5.25 V; 3.0 V < VµC < 5.25 V; 6.0 V < VS < 40 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Limit Values Unit Test Condition Min. Typ. Max. ICC+µC – 6 10 mA recessive state; TxD = high ICC+µC – 50 80 mA dominant state; TxD = low Current consumption RxD Only mode ICC+µC – 6 10 mA receive only mode Current consumption stand-by mode IVS – 25 50 µA stand-by mode; VS = WK = 12 V ICC+µC – 25 60 µA stand-by mode; VS = WK = 12 V VCC = VµC = 5V IVS – 25 35 µA sleep mode, VS = 12 V, Tj < 85 °C, VCC = VµC = 0 V ICC+µC – 2.5 10 µA sleep mode, VS = 12 V, Tj < 85 °C, VCC = VµC = 5V VCC,UV VµC,UV VS,Pon VS,Poff 2 3 4 V – 0.4 1.2 1.8 V – 2 4 5 V – 2 3.5 5 V – IRD,H IRD,L ISC,RxD – -4 -2 mA 2 4 – mA – 70 84 mA VRD = 0.8 × VµC VRD = 0.2 × VµC VµC = 5.25 V, Current Consumption Current consumption normal mode Current consumption sleep mode Supply Resets VCC undervoltage detection VµC undervoltage detection VS power ON detection level VS power OFF detection level Receiver Output RxD HIGH level output current LOW level output current Short circuit current RxD = LOW Final Data Sheet 22 Rev. 3.2, 2006-04-05 TLE 6251 G Table 5 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; 3.0 V < VµC < 5.25 V; 6.0 V < VS < 40 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Short circuit current Symbol ISC,RxD Limit Values Min. Typ. Max. – 35 45 Unit Test Condition mA VµC = 3.3 V, RxD = LOW Final Data Sheet 23 Rev. 3.2, 2006-04-05 TLE 6251 G Table 5 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; 3.0 V < VµC < 5.25 V; 6.0 V < VS < 40 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Limit Values Min. Typ. Unit Test Condition Max. Transmission Input TxD HIGH level input voltage threshold VTD,H LOW level input voltage threshold VTD,L TxD input hysteresis HIGH level input current TxD pull-up resistance 0.52 × 0.7 × – VµC V recessive state V dominant state VµC 0.30 × 0.48 × – VµC VµC VTD,hys 100 400 1000 mV Not subject to production test Specified by design. ITD RTD -5 0 5 µA VTxD = VµC 10 20 40 kΩ – – 0.52 × 0.7 × V – V – Mode Control Inputs EN, NSTB HIGH level input voltage threshold VM,H LOW level input voltage threshold VM,L Input hysteresis LOW level input current Pull-down resistance VµC VµC 0.30 × 0.48 × – VµC VµC VM,hys 100 400 1000 mV Not subject to production test Specified by design. IMD RM -5 0 5 µA VEN /VNSTB = 0V 10 20 40 kΩ – VNERR,H 0.8 × – – V INERR = -100 µA – 0.2 × V INERR = 1.25 mA VµC = 5.25 V VµC = 3.3 V Diagnostic Output NERR HIGH level output voltage VµC LOW level output voltage VNERR,L – VµC Short circuit current Short circuit current Final Data Sheet ISC,NERR ISC,NERR – 20 48 mA – 13 25 mA 24 Rev. 3.2, 2006-04-05 TLE 6251 G Table 5 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; 3.0 V < VµC < 5.25 V; 6.0 V < VS < 40 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Limit Values Min. Typ. Max. 0.3 × 0.5 × 0.7 × VCC VCC VCC Unit Test Condition Termination Output SPLIT Split output voltage VSPLIT VSPLIT V 0.45 × 0.5 × 0.55 × V VCC VCC VCC normal mode; -500 µA < ISPLIT < 500 µA normal mode; no load Leakage current ISPLIT -5 0 5 µA sleep mode VCC = VµC = 0 V Output resistance RSPLIT – 600 – Ω – VWK,th VS - 4 VS - Wake Input WK Wake-up threshold voltage VS - 2 V VNSTB = 0 V 2.5 IWKH IWKL – 5 10 µA -10 -5 – µA VWK = VWK,th + 1 VWK = VWK,th - 1 HIGH level voltage drop ∆VH = VS - VINH ∆VH – 0.4 0.8 V IINH = -1 mA Leakage current IINH,lk – – 5 µA sleep mode; VINH = 0 V CANL/CANH recessive output voltage VCANL/H 2.0 – 3.0 V no load CANH, CANL recessive output voltage difference Vdiff -500 – 50 mV VTxD = VµC; CANL dominant output voltage VCANL 0.5 – 2.25 V VTxD = 0 V; CANH dominant output voltage VCANH 2.75 – 4.5 V VTxD = 0 V CANH, CANL dominant output voltage difference Vdiff 1.5 – 3.0 V VTxD = 0 V HIGH level input current LOW level current Inhibit Output INH Bus Transmitter Final Data Sheet no load 25 Rev. 3.2, 2006-04-05 TLE 6251 G Table 5 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; 3.0 V < VµC < 5.25 V; 6.0 V < VS < 40 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Limit Values Min. CANL short circuit current CANH short circuit current Leakage current ICANLsc 50 ICANHsc -200 ICANHL,lk -5 Unit Test Condition Typ. Max. 80 200 mA -80 -50 mA 0 5 µA VCANLshort = 18 V VCANHshort = 0 V VS = VµC = VCC = 0 V; 0 V < VCANH,L < 5 V Bus Receiver Differential receiver threshold Vdiff,rdN voltage, Vdiff,drN normal mode – 0.8 0.9 V see CMR 0.5 0.6 – V see CMR 0.9 1.15 V recessive to dominant V dominant to recessive Differential receiver threshold, low power mode Vdiff,rdLP Vdiff,drLP 0.4 0.8 Common Mode Range CMR -12 – 12 V VCC = 5 V Differential receiver hysteresis Vdiff,hys – 200 – mV – CANH, CANL input resistance Ri 10 20 30 kΩ recessive state Differential input resistance Rdiff 20 40 60 kΩ recessive state 8 25 50 µs – 5 10 20 µs – 0.75 3 5 µs – – 150 255 ns CL = 47 pF; RL = 60 Ω; VCC = VµC = 5 V; CRxD = 15 pF Dynamic CAN-Transceiver Characteristics Min. hold time go to sleep command thSLP Min. wake-up time on pin WK tWK Min. dominant time for bus wake-up tWU td(L),TR Propagation delay TxD-to-RxD LOW (recessive to dominant) Final Data Sheet 26 Rev. 3.2, 2006-04-05 TLE 6251 G Table 5 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; 3.0 V < VµC < 5.25 V; 6.0 V < VS < 40 V; RL = 60 Ω; normal mode; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Limit Values Min. Typ. Max. Unit Test Condition Propagation delay TxD-to-RxD HIGH (dominant to recessive) td(H),TR – 150 255 ns Propagation delay TxD LOW to bus dominant td(L),T – 50 105 ns Propagation delay TxD HIGH to bus recessive td(H),T – 50 105 ns Propagation delay bus dominant to RxD LOW td(L),R – 50 150 ns Propagation delay bus recessive to RxD HIGH td(H),R – 100 150 ns TxD permanent dominant disable time tTxD 0.3 0.6 1.0 ms – Bus permanent time-out tBus,t tUV,t 0.3 0.6 1.0 ms – 50 80 120 ms – VCC, VµC undervoltage filter CL = 47 pF; RL = 60 Ω; VCC = VµC = 5 V; CRxD = 15 pF CL = 47 pF; RL = 60 Ω; VCC = VµC = 5 V CL = 47 pF; RL = 60 Ω; VCC = VµC = 5 V CL = 47 pF; RL = 60 Ω; VCC = VµC = 5 V; CRxD = 15 pF CL = 47 pF; RL = 60 Ω; VCC = VµC = 5 V; CRxD = 15 pF time Final Data Sheet 27 Rev. 3.2, 2006-04-05 TLE 6251 G Diagrams 10 VS NSTB 100 nF EN 13 47 pF CANH TxD 60 Ω RxD 12 6 1 4 15 pF CANL VµC 9 14 WK GND VCC 5 3 100 nF 2 100 nF = 5V = 3...5 V AEA03401.VSD Figure 7 Test Circuit for Dynamic Characteristics VTxD VµC GND VDIFF td(L),T VDIFF(d) VDIFF(r) td(L),R VRxD t td(H),T t td(H),R td(L),TR td(H),TR VµC 0.8 x VµC GND 0.2 x VµC t AET03402.VSD Figure 8 Final Data Sheet Timing Diagrams for Dynamic Characteristics 28 Rev. 3.2, 2006-04-05 TLE 6251 G Application VS 4.7 nF 1) 60 Ω 60 Ω TLE 6251 G 10 kΩ 9 VBat CAN Bus EN WK NSTB NERR 51 µH 13 1) 12 11 10 CANH RxD CANL TxD VµC SPLIT 6 14 8 µP with On Chip CAN Module 4 1 e.g. C164C C167C 5 100 nF VS 100 7 INH nF GND VCC 3 VQ1 INH e.g. TLE 4476 (3.3/5 V) or TLE 4471 TLE 4276 TLE 4271 22 + µF 100 nF GND 100 nF 2 VI1 100 nF GND VQ2 5V + 22 µF + 22 µF ECU TLE 6251 GS 51 µH 7 1) 6 5 CANH STB CANL RxD SPLIT TxD GND VCC 8 µP with On Chip CAN Module 4 1 e.g. C164C C167C 3 100 nF 2 100 nF GND e. g. TLE 4270 60 Ω 60 Ω 4.7 nF 1) VI 22 + µF 100 nF GND Final Data Sheet + 22 µF ECU 1) Optional, according to the car manufacturer requirements Figure 9 5V VQ AEA03396.VSD Application Circuit Example 29 Rev. 3.2, 2006-04-05 TLE 6251 G 100nF 100nF Vs CANH TLE 6251 G 100nF SPLIT 47 nF 100nF Vcc 60 Ω SPLIT 22 nF 30 Ω 100nF Vio CANH TLE 6251 G 30 Ω 100nF Vcc Vs CANL Vio 60 Ω CANL Case 1 Case 2 ESD TESTING.VSD 100nF 100nF Vs CANH TLE 6251 G 100nF Vcc 30 Ω Vs CANH TLE 6251 G 100nF SPLIT Vcc SPLIT Vio CANL 30 Ω 100nF Vio 100nF CANL Case 3 Figure 10 Case 4 ESD test for conformance to IEC 61000-4-2 The 100nF decoupling capacitors on Vs, Vio and Vcc are situated 5mm from the pins. The distance between the fixpoint where the Gun is applied and the pin CAN_H and CAN_L are 20mm. The test has been realized with NoiseKen ESS2000. Final Data Sheet 30 Rev. 3.2, 2006-04-05 TLE 6251 G Package Outlines 0.33 x 45˚ 1.27 14 +0.25 0.64 -0.23 6 ±0.2 14x 0.254 M A 8 7 1 1) 8.69 +0.05 -0.11 8˚ MAX. -0.01 C 0.1 0.254 M B C 14x +0.08 0.41 -0.06 A 0.2 +0.05 0.25 -0.15 (1.47) 1.75 MAX. 4 +0.05 1) -0.13 B Index Marking 1) Does not include plastic or metal protrusion of 0.25 max. per side GPS09330 Figure 11 P-DSO-14-13 (Plastic Dual Small Outline) You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Dimensions in mm SMD = Surface Mounted Device Final Data Sheet 31 Rev. 3.2, 2006-04-05