PD 6.118 IRPT1061A IRPT1061A PRELIMINARY ™ Power Module for 1 hp Motor Drives · 1 hp (0.75 kW) power output Industrial rating at 150% overload for 1 minute · · · · · · · · · · 180-240V AC input, 50/60 Hz 3-phase rectifier bridge 3-phase ultrafast IGBT inverter HEXFRED ultrafast soft recovery freewheeling diodes Brake IGBT and diode Low inductance (current sense) shunts in positive and negative DC rail NTC temperature sensor Pin-to-baseplate isolation 2500V rms Easy-to-mount two-screw package Case temperature range -25°C to 125°C operational Figure 1. IRPT1061A Power Module IRPT1061C 180-240V 3-phase input IRPT1061A Power Module IRPT1061D Driver-Plus Board PWM generator PWM variable frequency output AC motor feedback (non-isolated) feedback processing keyboard Figure 2. The IRPT1061C control system within a motor page 1 IRPT1061A System Description The IRPT1061A Power Module The IRPT1061A power module, shown in figure 1, is a chip and wire epoxy encapsulated module. It houses input rectifiers, brake IGBT and freewheeling diode, output inverter, current sense shunts and NTC thermistor. The 3-phase input bridge rectifiers are rated at 800V. The inverter section uses 600V, short circuit rated, ultrafast IGBTs and ultrafast freewheeling diodes. Current sensing is achieved through 75 mΩ low inductance shunts provided in the positive and negative DC bus rail. The NTC thermistor provides temperature sensing capability. The lead spacing on the power module meets UL840 pollution level 3 requirements. The power circuit and layout within the module are carefully designed to minimize inductance in the power path, to reduce noise during inverter operation and to improve the inverter efficiency. The Driver-Plus Board required to run the inverter can be soldered to the power module pins, thus minimizing assembly and alignment. The power module is designed to be mounted to a heat sink with two screw mount positions, in order to insure good thermal contact between the module substrate and the heat sink. and Design Kit The IRPT1061A (Figure 3) provides the complete power conversion function for a 1 hp (0.75 kW) variable voltage, variable frequency AC motor controller. The combines the Power Module (IRPT1061A) with a Driver-Plus Board (IRPT1061D). The Design Kit, IRPT1061E includes the following: • Complete integrated power stage • Specification and operating instructions • Bill of materials • Electrical schematic • Mechanical layout for Driver-Plus Board • Software transferrable file for easy design integration • Application information and layout considerations Figure 3. IRPT1061C page 2 IRPT1061A Specifications PARAMETERS Input Power VALUES Voltage 220V, -15%, +10%, 3-phase Frequency 50/60 Hz Current 6.2A rms @ nominal output IFSM 150A CONDITIONS TA = 40°C, RthSA = 1.24°C/W 10 ms half-cycle, non-repetitive surge Output Power Voltage 0 - 230V rms Nominal motor hp (kW) 1 hp (0.75 kW) nominal full load power defined by external PWM control Vin = 220V AC, fpwm = 4 kHz, Nominal motor current 150% overload for 1 minute 4.4A rms nominal full load power 6.6A rms 150% overload for 1 minute fo = 60 Hz, TA = 40°C, RthSA = 1.24°C/W DC Link DC link voltage 425V maximum Brake Current 7.9A Sensor Temp. sense resistance Current sense 50kOhms ±5% @ TNTC = 25°C 3.1kOhms ±10% @ TNTC = 100°C 75mOhms ±5% @ TSHUNT = 25°C Protection IGBT short circuit time Recommended short circuitshutdown current 10 µs 20A peak DC bus = 425V, VGE = 15V, line to line short Gate Drive QG 34 nC (typical) Recommended gate driver IR2132J (refer figure 10) VGE = 15V, refer figure 5b refer to design kit IRPT1061E Module Isolation voltage 2500V rms Operating case temperature -25°C to 125°C Mounting torque 1 Nm Storage temperature range -40°C to 125°C Soldering temperature for 10 sec. 260°C maximum pin to baseplate, 60 Hz, 1 minute 95% RH max. (non-condensing) M4 screw type at the pins (.06" from case) page 3 RthSA 100% load (continuous) 10-60 Hz Power 150% RthSA 150% load (1 min.)10-60 Hz Total Power Dissipation (Watt) Thermal Resistance(RthSA°C/W) IRPT1061A Power 100% RthSA 150% load (1 min.) down to 3 Hz PWM Frequency (kHz) – (Induction Motor Load) RthSA 100% load (continuous) 10-60 Hz RthSA 150% load (1 min.)10-60 Hz Power 150% RthSA 150% load (1 min.) down to 3 Hz Power 100% PWM Frequency (kHz) – (Induction Motor Load) Figure 4b. 0.75 hp/3.5A Output Heat Sink Thermal Resistance and Power Dissipation vs. PWM Frequency page 4 NOTE: For Figures 4a and 4b: Operating Conditions: Vin = 230 Vrms, MI = 1.15, PF = 0.8, TA = 40°C, ZthSA limits ∆T c rise during 1 minute overload to 10°C Total Power Dissipation (Watt) Thermal Resistance(RthSA°C/W) Figure 4a. 1 hp/4.4A Output Heat Sink Thermal Resistance and Power Dissipation vs. PWM Frequency IRPT1061A Figure 5a. Typical Capacitance vs Collector-to-Emitter Voltage Figure 5b. Typical Gate Charge vs Gate-to-Emitter Voltage Figure 5c. Typical Transfer Characteristics Figure 6. Nominal R-T Characteristics of the NTC Thermistor page 5 IRPT1061A Mounting Procedure Functional Information Mounting Heat Sink Requirements 1. Connect the driver board and the IRPT1061A power module. 2. Remove all particles and grit from the heat sink and power substrate. 3. Spread a .004" to .005" layer of silicone grease on the heat sink, covering the entire area that the power substrate will occupy. Recommended heat sink flatners is .001 inch/inch and Total Indicator Readout (TIR) of .003 inch below substrate. 4. Place the power substrate onto the heat sink with the mounting holes aligned and press it firmly into the silicone grease. 5. Place the 2 M4 mounting screws through the PCB and power module and into the heat sink and tighten the screws to 1 Nm torque. Figure 4 shows the thermal resistance of the heat sink required for various output power levels and Pulse-Width-Modulated (PWM) switching frequencies. Maximum total losses of the unit are also shown. This data is based on the following key operating conditions: • The maximum continuous combined losses of the rectifier and inverter occur at full pulse-width-modulation. These maximum losses set the maximum continuous operating temperature of the heat sink. • The maximum combined losses of the rectifier and inverter at full pulse-width-modulation under overload set the incremental temperature rise of the heat sink during overload. • The minimum output frequency at which full load current is to be delivered sets the peak IGBT junction temperature. • At low output frequency, IGBT junction temperature tends to follow the instantaneous fluctuations of the output current. Thus, peak junction temperature rise increases as output frequency decreases. 123456789012345678901234567890 123456789012345678901234567890 123456789012345678901234567890 123456789012345678901234567890 123456789012345678901234567890 123456789012345678901234567890 123456789012345678901234567890 1 2 123456789012345678901234567890 123456789012345678901234567890 123456789012345678901234567890 123456789012345678901234567890 123456789012345678901234567890 Figure 7. Power Module Mounting Screw Sequence Power Connections The power module pin designation, function and other details can be obtained from the package outline in Figure 8 and circuit diagram in Figure 9. Three phase input connections made to pins R, S and T and inverter output connections are made to pins U, V and W. Positive rectifier output and positive inverter bus are brought out to pins RP and P respectively in order to provide DC bus capacitor soft charging implementation option. The current shunt terminals are connected to pins IS1, IS2 and IS3, IS4 on the positive and negative DC rails respectively. page 6 Over Temperature Protection Over temperature can be detected using the NTC thermistor included in the power module for thermal sensing. Protection circuit that initiates a shutdown if the temperature of the IMS substrate exceeds a set level can be implemented. The nominal resistance vs. temperature characteristic of the thermistor is given in Figure 6. Voltage Rise During Braking The motor will feed energy back to the DC link during regenerative braking, forcing the DC bus voltage to rise above the level defined by the input line voltage. Deceleration of the motor must be controlled by appropriate PWM control to keep the DC bus voltage within the rated maximum value. IRPT1061A NOTE: Dimensions are in inches (millimeters) 31X 3.215 .032 [0.81] .650 .020 [0.51] [16.51] N/C RT1 RT2 G5 E5 THICKNESS G3 E3 G1 E1 RP P IS1 IS2 N R [81.66] 2.105 2.040 [51.82] 1.662 W G4 E4 G6 E6 N/C V U G7 IS4 IS3 G2 E2 BR T [42.21] S [53.47] F HATCHED SURFACE 3.854 [97.89] .307 [7.80] .507 [12.87] HATCHED SURFACE E Figure 8a. Power Module Package Outline page 7 IRPT1061A NOTE: Dimensions are in inches (millimeters) ALL PIN COORDINATE DIMENSIONS ARE BASIC 1.550 [39.37] 1.350 [34.29] 1.450 [36.83] .850 [21.59] .450 [11.43] .750 [19.05] .350 [ 8.89] .050 [ 1.27] .050 [ 1.27] .350 [ 8.89] .650 [16.51] .550 [13.97] .450 [11.43] 2X Ø .104 ± .002 [2.64 ± 0.05] 1.250 [31.75] 1.550 [39.37] 3.420 [86.87] MINUS DRAFT X .400 Ø .010 S 1.020 [25.91] A B-C PIN CENTER G .187 [4.75] .175 [4.45] 2X B C .800 [20.32] .000 [ 0.00] .400 [10.16] 2X R .250 [6.35] 4X Ø .260 [6.60] PIN CENTER 1.250 [31.75] .950 [24.13] 1.050 [26.67] 1.150 [29.21] .550 [13.97] .250 [ 6.35] .000 [ 0.00] .250 [ 6.35] .150 [ 3.81] .950 [24.13] 1.450 [36.83] 1.750 [44.45] 1.020 [25.91] PIN DIAGONAL .037 - .034 [.940 - .864] 31X Ø .019 M E-F Ø .010 M E-F G B-C 31X ( .026 - .024) 31X .050 [1.27] HATCHED SURFACE E F HATCHED SURFACE MOUNTING SURFACE IN CLAMPED CONDITION A Figure 8b. Power Module Package Outline page 8 IRPT1061A RP P IS1 IS2 E1 G1 RS1 D7 D9 D11 E3 G3 Q1 D13 E5 G5 Q3 D1 RT1 Q5 D3 RT2 D5 RT Q7 R S T U V W Q2 D8 D10 D12 Q4 D2 Q6 D4 D6 RS2 N BR G7 IS4 1S3 G2 E2 G4 E4 G6 E6 Figure 9. Power Module Circuit Diagram page 9 IRPT1061A Figure 10. Recommended Gate Drive Circuit page 10 IRPT1061A Part Number Identification and Ordering Instructions IRPT1061A Power Module IRPT1061D Driver-Plus Board Chip and wire epoxy encapsulated module with 800V rectifiers, 600V short-circuit rated, ultra-fast IGBT inverter with ultra-fast freewheeling diodes, temperature sensing NTC thermistor and current-sensing low-inductance shunts. Printed circuit board assembled with DC link capacitors, NTC in-rush limiting thermistors, high-power terminal blocks, surge suppression MOVs, IGBT gate drivers, protection circuitry and low power supply. The PCB is functionally tested with standard power module to meet all system specifications. IRPT1061C Integrated Power Module (IRPT1061A) and Driver-Plus Board (IRPT1061D) pre-assembled and tested to meet all system specifications. IRPT1061E Design Kit Complete (IRPT1061C) with full set of design documentation including schematic diagram, bill of material, mechanical layout of Driver-Plus Board, schematic files, Gerber files and design tips. page 11 IRPT1061A WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: 171 (K&H Bldg.), 3-30-4 Nishi-ikebukuro 3-Chome, Toshima-ku, Tokyo Japan Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ Data and specifications subject to change without notice. 10/97 page 12