Fiber Optics V23818-K305-Lxx Small Form Factor Multimode 850 nm 1.0625 GBd Fibre Channel 1.25 Gigabit Ethernet Transceiver 2x5 Pinning with LC™ Connector Features • Small Form Factor transceiver • Complies with Fibre Channel and Gigabit Ethernet standards • Excellent EMI performance • RJ-45 style LC™ connector system • Available with or without collar • Half the size of SC Duplex 1x9 transceiver • Single power supply (3.3 V) • Extremely low power consumption, 445 mW typical • LVPECL differential inputs and outputs • AC/AC coupling in accordance to SFF MSA or optional DC/DC coupling version • Optimized for 62.5/50 µm graded index fiber • For distances of up to 700 m • Multisource 2x5 footprint1) • Small size for high port density • UL-94 V-0 certified • ESD Class 1 per MIL-STD 883D Method 3015.7 • Compliant with FCC (Class B) and EN 55022 • Class 1 FDA and IEC laser safety compliant 1) Current MSA documentation can be found at www.infineon.com/fiberoptics LC™ is a trademark of Lucent Part Number Voltage Signal Detect Collar Input Output V23818-K305-L17 3.3 V LVTTL DC DC AC AC DC DC AC AC yes V23818-K305-L57 V23818-K305-L15 3.3 V LVTTL no V23818-K305-L55 Data Sheet 1 2003-01-22 V23818-K305-Lxx Pin Configuration Pin Configuration Tx MS HL HL 10 9 8 7 6 TOP VIEW Rx MS 1 2 3 4 5 HL HL File: 1331 Figure 1 Pin Description Pin No. Symbol Level/Logic Description 1 Ground Receiver signal ground 2 VEEr VCCr Power supply Receiver power supply 3 SD LVTTL output Receiver optical input level monitor 4 RD– LVPECL output Receiver data out bar 5 RD+ LVPECL output Receiver data out 6 Power supply Transmitter power supply 7 VCCt VEEt Ground Transmitter signal ground 8 TDis LVTTL input Transmitter disable 9 TD+ LVPECL input Transmitter data in 10 TD– LVPECL input Transmitter data in bar MS Mounting studs HL Housing leads Data Sheet 2 2003-01-22 V23818-K305-Lxx Pin Configuration VEEr / VEEt Connect pins 1 and 7 to signal ground. VCCr / VCCt A 3.3 V DC power supply must be applied at pins 2 and 6. A recommended power supply filter network is given in the termination scheme. Locate power supply filtering directly at the transceiver power supply pins. Proper power supply filtering is essential for good EMI performance. TD+ / TD– Transmitter data LVPECL level inputs. Terminated and AC coupled internally. RD– / RD+ Receiver data LVPECL level outputs. Biased and AC coupled internally. TDis A logical LVTTL high input will disable the laser. To enable the laser, an LVTTL low input must be applied. Leave pin unconnected if feature not required. SD LVTTL output. A logical high output indicates normal optical input levels to the receiver. Low optical input levels at the receiver result in a low output. Signal Detect can be used to determine a definite optical link failure; break in fiber, unplugging of a connector, faulty laser source. However it is not a detection of a bad link due to data-related errors. MS Mounting studs are provided for transceiver mechanical attachment to the circuit board. They also provide an optional connection of the transceiver to the equipment chassis ground. The holes in the circuit board must be tied to chassis ground. HL Housing leads are provided for additional signal grounding. The holes in the circuit board must be included and tied to signal ground. Data Sheet 3 2003-01-22 V23818-K305-Lxx Description Description The Infineon Gigabit Ethernet multimode transceiver – part of Infineon Small Form Factor transceiver family – is based on and compliant to the Physical Medium Depend (PMD) sublayer and baseband medium, type 1000-Base-SX (short wavelength) as specified in IEEE 802.3 and Fibre Channel FC-PI Rev. 13 100-M5-SN-I, 100-M6-SN-I. The appropriate fiber optic cable is 62.5 µm or 50 µm multimode fiber with LC™ connector. Operating Range over each Optical Fiber Type Fiber Type Limit Values min. typ. max. 62.5 micron MMF 0.5 2 to 300 400 50.0 micron MMF 0.5 2 to 550 700 Unit meters The Infineon Gigabit Ethernet multimode transceiver is a single unit comprised of a transmitter, a receiver, and an LC™ receptacle. This design frees the customer from many alignment and PC board layout concerns. This transceiver supports the LC™ connectorization concept. It is compatible with RJ-45 style backpanels for high end Data Com and Telecom applications while providing the advantages of fiber optic technology. The module is designed for low cost SAN, LAN, WAN, Fibre Channel and Gigabit Ethernet applications. It can be used as the network end device interface in mainframes, workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, hubs, and local and wide area switches. This transceiver operates at 1.0625 and 1.25 Gbit/s from a single power supply (+3.3 V). The full differential data inputs and outputs are LVPECL compatible. Data Sheet 4 2003-01-22 V23818-K305-Lxx Description Functional Description of 2x5 Pin Row Transceiver This transceiver is designed to transmit serial data via multimode cable. Automatic Shut-Down TxDis Tx Coupling Unit LEN e/o Laser Driver TD− TD+ Laser o/e Power Control Rx Coupling Unit Monitor RD− RD+ SD Receiver Multimode Fiber o/e File: 1358 Figure 2 Functional Diagram The receiver component converts the optical serial data into LVPECL compatible electrical data (RD+ and RD–). The Signal Detect (SD) shows whether an optical signal is present. The transmitter converts LVPECL compatible electrical serial data (TD+ and TD–) into optical serial data. Data lines are differentially 100 W terminated. The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits. Single fault condition is ensured by means of an integrated automatic shutdown circuit that disables the laser when it detects laser fault to guarantee the laser Eye Safety. The transceiver contains a supervisory circuit to control the power supply. This circuit makes an internal reset signal whenever the supply voltage drops below the reset threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage has risen above the reset threshold. During this time the laser is inactive. A low signal on TxDis enables transmitter. If TxDis is high the transmitter is disabled. Data Sheet 5 2003-01-22 V23818-K305-Lxx Description Regulatory Compliance Feature Standard Comments ESD: Electrostatic Discharge to the Electrical Pins EIA/JESD22-A114-B (MIL-STD 883D Method 3015.7) Class 1C Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle EN 61000-4-2 IEC 61000-4-2 Discharges ranging from 2 kV to 15 kV on the receptacle cause no damage to transceiver (under recommended conditions). Immunity: Against Radio Frequency Electromagnetic Field EN 61000-4-3 IEC 61000-4-3 With a field strength of 3 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits. Emission: Electromagnetic Interference (EMI) FCC 47 CFR Part 15, Class B EN 55022 Class B CISPR 22 Noise frequency range: 30 MHz to 18 GHz Data Sheet 6 2003-01-22 V23818-K305-Lxx Technical Data Technical Data Absolute Maximum Ratings Parameter Symbol Limit Values min. Unit max. Package Power Dissipation 0.6 W Data Input Levels VCC+0.5 V 5 V 85 °C Soldering Conditions, Temp/Time (MIL-STD 883C, Method 2003) 250 /5.5 °C/s VCC max. 5.5 V PECL Output Current 50 mA VIDpk-pk Differential Data Input Voltage Swing Storage Ambient Temperature –40 Exceeding any one of these values may destroy the device immediately. Recommended Operating Conditions Parameter Symbol Limit Values min. Ambient Temperature Power Supply Voltage TAMB VCC–VEE typ. 0 3.1 3.3 Unit max. 70 °C 3.5 V Transmitter Data Input High Voltage DC/DC VIH–VCC –1165 –880 mV VIL–VCC VIDpk-pk –1810 –1475 mV 500 3200 mV lC 770 860 nm Data Input Low Voltage DC/DC Differential Data Input Voltage Swing AC/AC Receiver Input Center Wavelength The electro-optical characteristics described in the following tables are valid only for use under the recommended operating conditions. Data Sheet 7 2003-01-22 V23818-K305-Lxx Technical Data Transmitter Electro-Optical Characteristics Parameter Symbol Limit Values min. typ. max. –4 Output Power (Average)1) PO –9.5 –6 Optical Modulation Amplitude2) OMA 156 450 Center Wavelength lC 830 850 Spectral Width (RMS) Unit dBm µW 860 nm sl 0.85 nm Relative Intensity Noise RIN –116 dB/Hz Extinction Ratio (Dynamic) ER Total Tx Jitter TJ 3) Reset Threshold 3) Reset Time Out Rise Time, 20% - 80% 9 VTH tRES tR Power Supply Current 1) 2) 3) 13 dB 53 130 ps 2.2 2.7 2.99 V 140 240 560 ms 260 ps 75 mA 65 Into multimode fiber, 62.5 µm or 50 µm diameter. Fibre Channel PI Standard. Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES. Data Sheet 8 2003-01-22 V23818-K305-Lxx Technical Data Receiver Electro-Optical Characteristics Parameter Symbol Limit Values min. Sensitivity (Average Power)1) Saturation (Average Power) PIN PSAT Unit typ. max. –20 –17 dBm 0 Min. Optical Modulation Amplitude2) OMA 19 31 µW Stressed Receiver Sensitivity 50 µm Fiber SPIN 24 55 µW3) –17 –13.5 dBm4) Stressed Receiver Sensitivity 62.5 µm Fiber SPIN 32 67 µW3) –16 –12.5 dBm4) Signal Detect Assert Level5) PSDA PSDD PSDA –PSDD tASS tDAS –24 –18 dBm Signal Detect Deassert Level6) Signal Detect Hysteresis Signal Detect Assert Time Signal Detect Deassert Time –30 –27 dBm 3 dB 100 µs 350 µs Receiver 3 dB Cut-off Frequency2) 1.25 1.5 GHz Receiver 10 dB Cut-off Frequency2) 1.5 3 GHz 700 1230 mV Differential Data Output Voltage VODpk-pk Swing AC/AC7) 500 Return Loss of Receiver ORL 12 Output Data Rise/Fall Time tR , tF ICCRx Supply Current 8) 1) 2) 3) 4) 5) 6) 7) 8) dB 75 260 ps 90 mA Average optical power at which the BER is 1x10–12. Measured with a 27–1 NRZ PRBS and ER = 9 dB. Fibre Channel PI Standard. Measured at the given Stressed Receiver Eyeclosure Penalty and DCD component given in Fibre Channel PI Standard (2.03/2.18 dB & 40/80 ps). Measured according to IEEE 802.3 An increase in optical power above the specified level will cause the Signal Detect output to switch from a low state to a high state. A decrease in optical power below the specified level will cause the Signal Detect to change from a high state to a low state. AC/AC for data. Load 50 W to GND or 100 W differential. For dynamic measurement a tolerance of 50 mV should be added. Supply current excluding Rx output load. Data Sheet 9 2003-01-22 V23818-K305-Lxx Eye Safety Eye Safety This laser based multimode transceiver is a Class 1 product. It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11. To meet laser safety requirements the transceiver shall be operated within the maximum operating limits. Attention: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Note: Failure to adhere to the above restrictions could result in a modification that is considered an act of “manufacturing”, and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Data Wavelength 850 nm Total output power (as defined by IEC: 7 mm aperture at 14 mm distance) < 675 µW Total output power (as defined by FDA: 7 mm aperture at 20 cm distance) < 70 µW Beam divergence 12 FDA IEC Complies with 21 CFR 1040.10 and 1040.11 Class 1 Laser Product File: 1401 Figure 3 Required Labels Indication of laser aperture and beam 10 9 8 7 6 Tx Top view Rx 1 2 3 4 5 File: 1332 Figure 4 Data Sheet Laser Emission 10 2003-01-22 V23818-K305-Lxx Application Notes Application Notes Small Form Factor Pinning Comparison The drawing below gives you a comparison between the different pinnings 2x5, 2x6, 2x10. Dimension for diameter and distance of additional pins is similar to the existing dimensions of the other pins. Top view Rx RxVEE RxVCC SD RxD− RxD+ 1 2 3 4 5 RS RxVEE RxVCC SD RxD− RxD+ 1 2 3 4 5 6 Tx 20 19 18 17 16 15 14 13 12 11 VCCPIN 1 RxVEE 2 RxVEE 3 RxCLK− 4 RxCLK+ 5 RxVEE 6 RxVCC 7 SD 8 RxD− 9 RxD+ 10 PMON+ PMON− BIASMON+ BIASMON− TxVEE TxD− TxD+ TxDis TxVEE TxVCC 12 11 10 9 8 7 Laser Fault TxD− TxD+ TxDis TxVEE TxVCC 10 9 8 7 6 TxD− TxD+ TxDis TxVEE TxVCC 2 x 10 2x6 2x5 File: 1506 Figure 5 Pin Description RS pin - The RS (Rate Select) is not connected. LF pin - The LF pin (Laser Fault) is an LVTTL output of the Laser Driver Supervisor Circuit. A Logic 1 level can be measured in case of a laser fault. It will not show a fault if the laser is being disabled using the TxDis input, since this is not a fault condition. EMI-Recommendations To avoid electromagnetic radiation exceeding the required limits please take note of the following recommendations. When Gigabit switching components are found on a PCB (multiplexers, clock recoveries etc.) any opening of the chassis may produce radiation also at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as possible. On the board itself every data connection should be an impedance matched line (e.g. strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should be avoided. A terminating resistor of 100 W should be placed at the end of each matched Data Sheet 11 2003-01-22 V23818-K305-Lxx Application Notes line. An alternative termination can be provided with a 50 W resistor at each (D, Dn). In DC coupled systems a thevenin equivalent 50 W resistance can be achieved as follows: for 3.3 V: 125 W to VCC and 82 W to VEE, for 5 V: 82 W to VCC and 125 W to VEE at Data and Datanot. Please consider whether there is an internal termination inside an IC or a transceiver. In certain cases signal GND is the most harmful source of radiation. Connecting chassis GND and signal GND at the plate/ bezel/ chassis rear e.g. by means of a fiber optic transceiver may result in a large amount of radiation. Even a capacitive coupling between signal GND and chassis may be harmful if it is too close to an opening or an aperture. If a separation of signal GND and chassis GND is not planned, it is strongly recommended to provide a proper contact between signal GND and chassis GND at every location where possible. This concept is designed to avoid hotspots. Hotspots are places of highest radiation which could be generated if only a few connections between signal and chassis GND exist. Compensation currents would concentrate at these connections, causing radiation. By use of Gigabit switching components in a design, the return path of the RF current must also be considered. Thus a split GND plane of Tx and Rx portion may result in severe EMI problems. A recommendation is to connect the housing leads to signal GND. However, in certain applications it may improve EMI performance by connecting them to chassis GND. The cutout should be sized so that all contact springs make good contact with the face plate. Please consider that the PCB may behave like a waveguide. With an er of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. In this scenario even the smallest PCBs may have unexpected resonances. (13.97) *) .550 *) min. pitch between SFF transceiver according to MSA. Dimensions in (mm) inches Figure 6 Data Sheet File: 1501 Transceiver Pitch 12 2003-01-22 V23818-K305-Lxx Recommended Termination Schemes Recommended Termination Schemes 2x5 DC/DC Transceiver 9 100 Ω VCC C6 TD− 10 C8 TDis 8 VCCt 6 VCCr 2 SD 3 RD− RD− 4 RD+ RD+ 5 VEEr 1 SerDat Out − L1 VCC 3.3 V C1 Serializer/ Deserializer L2 C3 C10 C2 SD C4 R1 SerDat In − C9 C5 SerDat In + Receiver PLL etc. R3 Signal Detect Limiting Amplifier C7 ECL/ PECL Driver TDis SFF Transceiver PreAmp SerDat Out + R5 TD+ VCC SerDes R4 7 R2 Laser Driver VEEt C1/2/3 = 4.7 ... 10 µF C4/5/6/7 = 100 nF C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. *) = 1 ... 4.7 µH L1/2 R1 = 100 Ω (depending on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω differential is provided. Check for termination inside of SerDes chip). R2/3 = 150 Ω R4/5 = Biasing for outputs depending on Serializer. Place R1/4/5 close to SerDes chip. Place R2/3 close to Infineon transceiver. *) The inductors may be replaced by appropriate Ferrite beads. File: 1392 Figure 7 Data Sheet 13 2003-01-22 V23818-K305-Lxx Recommended Termination Schemes 2x5 AC/AC Transceiver VCC SerDes 7 VCC TD+ 9 SerDat Out + TD− 10 C4 TDis 8 VCCt 6 VCCr 2 SD 3 RD− RD− 4 RD+ RD+ 5 VEEr 1 SerDat Out − TDis L1 VCC 3.3 V C1 SFF Transceiver Serializer/ Deserializer L2 C3 C6 C2 SerDat In − C5 Receiver PLL etc. R4 SerDat In + R3 Limiting Amplifier R2 SD R1 Signal Detect PreAmp ECL/ PECL Driver R6 100 Ω R5 Laser Driver VEEt C1/2/3 C4/5/6 = 4.7 ... 10 µF = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 µH L1/2*) R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω differential is provided. Check for termination inside of SerDes chip. = Biasing (depends on SerDes chip). R5/6 Place R1/2/3/4/5/6 close to SerDes chip. *) The inductors may be replaced by appropriate Ferrite beads. File: 1393 Figure 8 Data Sheet 14 2003-01-22 V23818-K305-Lxx Package Outlines Package Outlines a) recommended bezel position Drawing shown is with collar Dimensions in mm [inches] File: 1212 Figure 9 Data Sheet 15 2003-01-22 V23818-K305-Lxx Revision History: 2003-01-22 Previous Version: 2002-03-22 Page DS1 Subjects (major changes since last revision) Document completely revised; V23818-K305-L15 and V23818-K305-L55 added For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com. Edition 2003-01-22 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany © Infineon Technologies AG 2002. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.