2.5Gbps Single Mode SFF LC Transceiver (IR1) C-13-2500/C-FDFB-SLC2 Features • Duplex LC Single Mode Transceiver • Small Form Factor Multi-sourced 2x5 Pin Package • 1310nm, DFB Laser • SONET /SDH STM-16 Compliant • Single +3.3V Power Supply • LVPECL/CML Differential level Inputs and Outputs • LVTTL or LVPECL logic level signal-detect output choice (C-13-2500-FDFB-SLC for LVPECL and C-13-2500C-FDFB-SLC for LVTTL) • LVTTL disable input • Temperature Range: 0 to 70º C • Class 1 Laser International Safety Standard IEC 825 Compliant • Complies with Bell Core TA-NWT-000983 General Operating Parameter Supply Voltage Total Current Inrush Current Power Supply Noise Rejectiona Operating Temperature (case) Storage Temperature Data Rate OC48/STM-16 Symbol Vcc Icc Icc' Top Tst DR Min 3.135 Typical 3.3 100 0 Max 3.465 300 30 70 -40 Unit V mA mA mVp-p ºC 85 ºC Mb/s Max Unit 0 -30 dBm dBm dB 2488 a) 20Hz to 155MHz Transmitter Specifications Parameter Optical Power Average Launch power of off Tx Extinction Ratio (dynamic) Eye Mask Optical Jitter generation Optical Rise timeb Optical Fall timeb Mean Wavelength Maximum RMS width (s) Relative Intensity Noise Symbol Min Pop Poff ER -5 Typical 8.2 SONET/SDH compliant Jgen tr tf λ ∆λ RIN 0.002 1260 130 130 1310 1360 1 -120 UI ps ps nm nm dB/Hz b) 20%-80% values Transmitter Electrical Parameter Input Differential PECL Single Ended data input swing PECL Differential data input swing TxFault_Fault TxFault_Normal TxDisable_Disable TxDisable_Enable Symbol Rin Vin Vin Vfault Vnormal Vd Ven Min 80 200 400 2 Vee 2 Vee Typical 100 Max 120 800 1600 Vcc 0.8 Vcc Vee+0.8 Unit Ohm mVp-p mVp-p V V V V 2.5Gbps Single Mode SFF LC Transceiver (IR1) C-13-2500/C-FDFB-SLC2 Receiver Specifications Parameter Receive Power Lowd Receive Power High Damage Threshold for Receiver Wavelength LOS Assert LOS De-assert LOS hysteresis Symbol Rsens,low Rsens,high Pin,damage λ Min Typical -20 1100 -28 Max -18 0 0 1600 -18 1 Unit dBm dBm dBm nm dBm dBm dB d) at 10-10 BER, PRBS 223-1 Electrical Output Parameter PECL Single ended data output swing PECL Differential data output swing Data output rise time Data output fall time Timing and Electrical Parameter Tx Disable Negate time Tx Disable assert time Time to initialize, including reset of TX fault Tx fault Assert time Tx Disable to reset LOS Assert time LOS De-assert time Serial ID Clock Rate RX_LOS Voltage (high) RX_LOS Voltage (low) LOS output voltage-Fault LOS output voltage-Normal MOD_DEF (0:2)-High MOD_DEF (0:2)-Low Symbol Vout Vout Tr Tf Symbol t_on t_off t_init t_fault t_reset t_loss_on t_loss_off f_serial_clock VLOS fault VLOS normal Vh Vl Min 250 500 Typical Max 500 1000 Unit mVp-p Max 1 Unit ms 10 300 100 µs ms µs µs µs µs KHz V V V V V V 130 130 Min Typical 10 100 100 100 2 0 2 Vee 2 Vee Vee+0.3 0.8 Vcc Vee+0.3 Vcc Vee+0.3 mVp-p ps ps 2.5Gbps Single Mode SFF LC Transceiver (IR1) C-13-2500/C-FDFB-SLC2 Outline Drawing Pinout Definitions Pin Symbol Notes v 1 RxGND 2 RxVcc +3.3V dc power for the receiver section 3 SD Active high on this indicates a received optical signal (LVTTL or LVPECL) 4 5 RDRD+ Receiver Data out Bar(LVPECL/CML) Receiver Data out (LVPECL/CML) 6 TxVcc +3.3V dc power for the transmitter section 7 TxGND Directly connect this pin to the transmitter ground plane 8 TxDIS Transmitter disable (LVTTL) 9 TD+ Transmitter Data In (LVPECL/CML) 10 TD- Transmitter Data In Bar (LVPECL/CML) Attaching Posts Directly connect this pin to the receiver ground plane The attaching posts are at the case potential and may be connected chassis ground. They are not isolated from circuit ground. Recommended Circuit Schematics Inputs to the C-1x-2500/C-Fx-SLCx series transmitters are AC coupled and internally terminated through 50 ohm to AC ground. These transceivers can operate with LVPECL or CML logic levels. The input signal must have at least a 200 mV peak to peak (single ended) signal swing. Output from the receiver section of the module is also AC coupled and is expected to drive into 50 ohm load. Different termination strategies may be required depending on the particular Serializer/Deserializer chip set used. The C-1x-2500/C-Fx-SLCx series product family are designed with AC coupled data inputs and outputs to provide the following a advantages: • Close positioning of SERDES with respect to transceiver; allow for shorter line lengths and at gigabit speeds reduces EMI. • Mininum number of external components. • Internal termination reduces the potential for unterminated stubs which would otherwise increase jitter and reduce transmission margin. Figure 1 & 2 illustrates the recommended transmit and receive data line terminations for SERDES with CML and LVPECL Inputs/outputs respectively. 2.5Gbps Single Mode SFF LC Transceiver (IR1) C-13-2500/C-FDFB-SLC2 TX_ DI S 8 TTL l ogic level TX_ GND 7 Z=50! MI TTE R TD TX _D 9 + DR IV E R Z=50! TX _D 10 TD - R Vc c_T X LA SE V cc_RX 6 See Fig. 4A 2 S w See Fi g. 3 3 SD Z=50! BIAS POST AMP TZ AMP RX _D 4 RX _D 5 R X _GND 1 erializer / De-S erializer ith CML lnputs/Outputs RD Z=50! RD - + Note 1 ER Figure 1. Recommended TRANSMIT adn RECEIVE Data Termination for SERDES with CML I/Os Note 1. Consult SERDES manufacurer's data sheet and application data for appropriate receiver iput biasing network. Some deserializer inputs are internally termintated and may not need external termination resistors. TX_DI S 8 T T L logic le ve l TX_ GND 7 TR AN SM IT T E R Z=50! TD + TX _D 9 DR I V E R Z=50! TX_ D 10 TD - LA SE R V cc_T X Vc c_R X 6 2 3 SD BI AS PI N See F ig. 4A Note 1 Ser ializ er / De- S eria liz e r with LV P E C L lnpu ts/Outputs See Fi g. 3 Vc c = + 3 .3 V Z=50! TZ AMP PO ST AM P RX _D 4 RX _D 5 R X _GND 1 Z=50! 13 0 13 0 RD - RD + RE CE I V E R Figure 2. Recommended TRANSMIT and RECEIVE Data Terminations for SERDES with LV PECL I/Os. Note 1. Consult SERDES manufacurer's data sheet and application data for appropriate receiver iput biasing network. Some deserializer inputs are internally termintated and may not need external termination resistors. 2.5Gbps Single Mode SFF LC Transceiver (IR1) C-13-2500/C-FDFB-SLC2 SIGNAL DETECT The C-13-2500-F-SLC/C-13-2500C-F-SLC transceivers are equipped with LVTTL / LVPECL signal detect outputs. The standard LVTTL output eliminates the need for a LVPECL to LVTTL level shifter in most applications. LVPECL or LVTTL Logic R: For LVTTL leve l R= 100k or N.C LVPECL level R= 510 Figure 3: Signal Detect POWER COUPLING Ac c L1 C3 C1 C4 C2 VA LUES: C 1, C 2 = 1000p F, C 3, = 0.1 u F C 4, = 10 uF, L1, L2 = R e a l im p e d n c e o f 50 to 100 O hm s to 1000 MHz. F igure 4A: SuggestedPower Coupling-Electrical Schematic L1 C2 TOP VI EW C3 C4 C1 VA LUES: C 1, C 2 = 1000p F, C 3, = 0.1uF C 4, = 10uF, L1, L2 = Re a l im p e d a nc e of 50 to 100 O hms to 1000MHz. L2 NO TE : 1.) Com p o nent s shown ore p la c ed on t he b o ttom la yer a nd a re v ie we d throug h the b oard . LEHEND: Vc c PL ANE C O NN EC TION ! ! A suggested layout for power and ground connections is given in figure 4B below. Connections are made via separate voltage and ground planes. The mounting posts are at case ground and should not be connected to circuit ground. The mounting posts are at case gound and should not be connected to circuit ground. The ferrite gead should provide a real impedance of 50 to 100 ohms at 100 to 1000MHz. Bypass capacitors should be placed as close to the 10-pin connector as possible. CIRCUIT GRO UND PLA NE CO NNEC TION CA SE GRO UND F igure 4B: Suggested Power Coupling-Component Placement 2.5Gbps Single Mode SFF LC Transceiver (IR1) C-13-2500/C-FDFB-SLC2 Printed Circuit Board Layout Consideration A fiber-optic receiver employs a very high gain, wide bandwidth transimpedance amplifier. This ampifier detects and amplifies signals that are only tens of nA in amplitude when the receiver is operating near its limit. Any unwanted signal current that couples into the receiver circuitry causes a decrease in the receiver's senitivity and can also degrade the receiver's signal detect(SD) circuit. To minimize the coupling of unwanted noise into the receiver, careful attention must be given to the printed circuit board. At a minimun, a double-sided printed circuit board (PCB) with a large component side ground plane beneath the transceiver must be used. In applications that include many other high speed devices, a multi-layer PCB is highly recommended. This permits the placement of power and ground on separate layers, which allows them to be isolated from the signal lines. Multilayer construction also permits the routing of signal traces away from high level, high speed signal lines. To minimize the possibility of coupling noise into the receiver section, high level, high speed signals such as transmitter inputs and clock lines should be routed as far away as possible from the recevier pins. Noise that couples into the receiver through the power supply pins can also degrade performance. It is recommended that a pi filter in both the transmitter and receiver be supplied. EMI and ESD Considerations OIC transceivers offer a metalized plastic case and a special chassis grounding clip. As shown in the drawing, this clip connects the module case to chassis grounding clip then installs flush through the panel cutout. The grounding clip in this way brushes the edge of the cutout in order to make a proper contact. The use of a grounding clip also provides increased electrostatic protection and helps reduce radiated emissions from the module or the host circuit board through the chassis faceplate. The attaching posts are at case potential and may be connected to chassis ground. They should not be connected to circuit ground. Plastic optical subassemblies are used to further reduce the possibility of radiated emissions by eliminating the metal from the transmitter and receiver diode housings, which extend into connector space. By proficing a non-metal receptacle for the optical cable ferrule, the gigabit speed RF electrical signal is isolated from the connector area thus preventing radiated energy leakage from these surfaces to the outside of the panel. Laser Safety This single mode transceiver is a Class 1 laser product. It complies with IEC 825 and FDA 21 DFR 1040.10 and 1040.11. The transceiver must be operated within the specified temperature and voltage limits. The optical ports of the module shall determinate with an optical connector or with a dust plug. Package Diagram Units in mm (inch) 48.8+0 -0 .2 (0.400) #0.#6 .000) (0.535) +( -(0.004) &3. 6+0 - 0. & #3.20 (0.520) (0.594) &5. 08 .000) (1.921)+( -(0.008) 6.97 (0.070) #7.78 5.08 (0.200) (0.700) Case with EMI Shielding Finger 9. 80 .000) (0.386) +( -(0.004) 3.8# 7.#2 (0.280) (0.150) #.78 (0.039±0.002) 9. 8 +0 - 0. & 9.50 0.50 (0.020) #.00%0.05 (0.374) &&. 36 (0.447) #0.50 (0.413) 6.25 (0.246) (0.386) &3.50 (0.53#) (0.086) 3.95 (0.#55) 2. &8 (0.274) 2.5Gbps Single Mode SFF LC Transceiver (IR1) C-13-2500/C-FDFB-SLC2 Recommended Board layout Hole Pattern vvvvvvvvvvv DI ME NSIO N IN MI L L IM ET ER (IN CHES ) NOT E S: 1.T HI S F I GUR E DE SCR I BE T HE RE COMMAND CI RCUI T BOAR D L AYOU T F OR T HE SF F TR ANSCE I VE R. 2.T HE HAT CHE D AR E AS AR E KE E P-OUT AR E AS RE SE RV E D FOR HOUS I NG STANDO F F. NO ME TAL T R ACE S OR GROUND CONNE CT I ON I N KE E P-OUT AR E AS. 3.T HE MOUN T I NG ST UD S SHOUL D BE SOL DE R E D TO CHASSI S GROUND F OR ME CHANI CAL INT E GRI T Y. Recommended Panel mounting DI ME NSIO N IN MI L L IM ET ER (IN CHES ) 2.5Gbps Single Mode SFF LC Transceiver (IR1) C-13-2500/C-FDFB-SLC2 Warnings Handling Precautions: This device is susceptible to damage as a result of electrostatic discharge (ESD). A static free environment is highly recommended. Follow guidelines according to proper ESD procedures. Laser Safety: Radiation emitted by laser devices can be dangerous to human eyes. Avoid eye exposure to direct or indirect radiation. Legal Notice IMPORTANT NOTICE! All information contained in this document is subject to change without notice, at Luminent’s sole and absolute discretion. Luminent warrants performance of its products to current specifications only in accordance with the company’s standard one-year warranty; however, specifications designated as “preliminary” are given to describe components only, and Luminent expressly disclaims any and all warranties for said products, including express, implied, and statutory warranties, warranties of merchantability, fitness for a particular purpose, and non-infringement of proprietary rights. Please refer to the company’s Terms and Conditions of Sale for further warranty information. Luminent assumes no liability for applications assistance, customer product design, software performance, or infringement of patents, services, or intellectual property described herein. No license, either express or implied, is granted under any patent right, copyright, or intellectual property right, and Luminent makes no representations or warranties that the product(s) described herein are free from patent, copyright, or intellectual property rights. Products described in this document are NOT intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. Luminent customers using or selling products for use in such applications do so at their own risk and agree to fully defend and indemnify Luminent for any damages resulting from such use or sale. THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN “AS IS” BASIS. Customer agrees that Luminent is not liable for any actual, consequential, exemplary, or other damages arising directly or indirectly from any use of the information contained in this document. Customer must contact Luminent to obtain the latest version of this publication to verify, before placing any order, that the information contained herein is current. © Luminent, Inc. 2002 All rights reserved 20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486 • LUMINENT.COM LUMNDS235-1023