Video Modulator for FM-Audio TDA 5666-5 Preliminary Data Bipolar IC Features ● ● ● ● ● ● ● ● ● ● ● FM-audio modulator Sync level clamping of video input signal Controlling of peak white value Continuous adjustment of modulation depth for positive or negative values Symmetrical mixer output with separate ground area Symmetrical oscillator with separate RF-ground Low spurious radiation High stability of the RF-oscillator frequency High stability of the audio oscillator Internal reference voltage 12 V supply voltage P-DIP-18 -5 Type Ordering Code Package TDA 5666-5 Q67000-A5168 P-DIP-18-5 Functional Description and Application The monolitic integrated circuit TDA 5666-5 is especially suitable as a modulator for the 48- to 860-MHz frequency range. Video recorders, cable converters, TV-converter networks, demodulators, video generators, video security systems, amateur TV-applications and personal computers. Semiconductor Group 1 02.95 TDA 5666-5 Circuit Description Oscillator The RF-oscillator is available at pins 3-7. The oscillator operates as a symmetrical Colpitts circuit. The oscillator chip ground, pin 5, should be connected to ground at the resonance circuit shielding point. An external oscillator can be injected inductively or capacitively via pins 3 and 7. The layout of the PCB should be such as to provide a minimum shielding attenuation between the oscillator pins 3-7 and modulator output pins 13-15 of approximately 80 dB. For optimal residual carrier suppression, the symmetrical mixer outputs at pins 13, 15 should be connected to a matched balanced-to-unbalanced broadband transformer, e.g. a Guanella transformer with good phase precision at 0o and 180o. The transmission loss should be less than 3 dB. In addition, an LC-low pass filter combination is required at the output. The cut-off frequency of the low pass filter combination must exceed the maximum operating frequency. Video The video signal with the negative synchronous level is capacitively connected to pin 10. The internal clamping circuit is referenced to the synchronizing level. Should the video signal change by 6 dB, this change will be compensated by the resonance circuit which is set by the peak white value. At pin 11, the current pulses of the peak white detector are filtered through the capacitor which also determines the control time constant. The RFcarrier switches from negative to positive video modulation, when pin 12 is connected to ground. By varying the value of resistance R at pin 12 between ∞ ... 0 Ω the modulation depth can be increased from 70% to 100% when the modulation is negative and decreased from 100% to 70% when the modulation is positive. Audio Via pin 1, the audio signal is capacitively coupled to the AF-input for the FM-modulation of the oscillator. A parallel resonance circuit is connected to the audio carrier oscillator at pins 17, 18. The unloaded Q of the resonant circuit must be Q = 25 and the parallel resistor RT = 8.2 kΩ to ensure a video to audio carrier ratio of 12.5 dB. At the same time, the capacitative and/or inductive reactance for the resonance frequency should have a value of XC ≈ XL ≈ 800 Ω. The video to audio carrier ratio can be changed by connecting an external voltage to pin 16, which deviates from the internal reference voltage. At the output of the above described mixer the FM modulated audio signal is added to the video signal and mixed with the oscillator signal in the RF-mixer. Source The internal reference voltage is available at pin 2 and has to be capacitively blocked there. Semiconductor Group 2 TDA 5666-5 Pin Configuration (top view) Semiconductor Group 3 TDA 5666-5 Pin Definitions and Functions Pin No. Symbol Function 1 FM-Audio AF-input for FM-modulation 2 VREF Internal reference voltage (7.5 V) 3 OSC-Input 1 Symmetrical oscillator input 4 OSC-Out 1 Symmetrical oscillator output 5 OSC-Ground Oscillator ground 6 OSC-Out 2 Symmetrical oscillator output 7 OSC-Input 2 Symmetrical oscillator input 8 VS Supply voltage (12 V) 9 N.C. Not connected 10 Video Video input with clamping 11 Video-Capacitor Connection for smoothing capacitor for video control loop 12 Modulation Switch-over for positive and negative modulation 13 Output 2 Symmetrical RF-output 14 Ground Ground 15 Output 1 Symmetrical RF-output 16 Audio carrier ratio Video to audio carrier ratio adjustment 17 FM-Audio OSC FM-audio oscillator; symmetrical inputs for tank circuit 18 FM-Audio OSC FM-audio oscillator; symmetrical inputs for tank circuit Semiconductor Group 4 TDA 5666-5 Block Diagram Semiconductor Group 5 TDA 5666-5 Absolute Maximum Ratings TA = 0 to 70 oC Parameter Symbol Limit Values min. typ. Unit max. Supply voltage pin 8 VS – 0.3 14.5 V Current from pin 2 –I2 0 2 mA Voltage at pin 1 Voltage at pin 2 Voltage at pin 10 V1 V2 V10 0 6 0 2 8.5 1.5 V V Vpp Capacitance at pin 2 C2 Capacitance at pin 11 C11 0 0 100 15 nF µF Voltage at pin 12 Voltage at pin 13 Voltage at pin 15 Voltage at pin 16 – 0.3 V2 V2 V2 -1.5 1.4 VS VS VS+1.5 V V V V V12 V13 V15 V16 Remarks V2 = 7-8 V VS = 10-13.5 V only via C (max. 1 µF) VS = 10-13.5 V According to the application circuit, only the provided circuitry can be connected to pins 3,4,6,7,17 and 18. 150 oC 125 oC 80 K/W 10 13.5 V Video input frequency fVideo Audio input frequency fAF 0 6 MHz 0 20 kHz Output frequency fQ 30 860 MHz Ambient temperature TA 0 70 oC Audio oscillator fOSC 4 7 MHz Voltage at pin 2 Voltage at pin 13,15 V2 V13, 15 6.75 V2 7.75 VS V V Junction temperature Tj Storage temperature Tstg Thermal resistance Rth – 40 Operating Range Supply voltage Semiconductor Group VS 6 depending on the oscillator circuitry at pins 3-7 TDA 5666-5 AC/DC-Characteristics TA = 25 oC; VS = 12 V Parameter Symbol Limit Values Unit Test Condition Test Circuit min. typ. max. Current consumption I8 Current consumption I13 + I15 15 2.0 20 2.6 26 3.4 mA mA I2 = 0 mA 1 Reference voltage V2 6.75 7.25 7.75 V 0 ≤ I2 ≤ 1 mA 1 fOSC 30 860 MHz external circuitry adjusted to frequency Source Oscillator Oscillator frequency range Switch-on, warm up drift; (TC-value of capacitor in osc. circuit is 0) drift is referenced only to selfheating of the component. ∆ fOSC 0 0 Frequency drift as function of VS ∆ fOSC –150 RF-output impedance R13; R15 10 C13 = C15 0.5 – 50 – 500 – 200 – 500 150 kHz Ch 30 kHz Ch 40 t = 0.5-10 s; kHz VS = 10-13.5 V TA = const.; Ch 40 1 kΩ parallel equivalent circuit parallel equivalent circuit 1 1 2.0 pF TA = const. RF-output voltage VQ 2.5 4.5 5.5 mVrms Ch 40; video 100% white; without audiosignal RF-output phase α13, 15 140 180 220 deg RF-output voltage changes ∆VQ 0 1.5 dB ∆VQ ∆VQ 0 0 1.5 1.5 Intermodulation ratio αIMR Harmonic wave ratio αO Semiconductor Group 50 75 35 7 1 1 1 1 1 dB dB f = 543-623 MHz Ch 30...40 f = 100-300 MHz f = 48-100 MHz dB fVC + 1.07 MHz 2 dB fVC + 8.8 MHz without video 2 1 1 TDA 5666-5 AC/DC-Characteristics (cont’d) TA = 25 oC; VS = 12 V Parameter Symbol Limit Values min. typ. Unit max. Test Condition Test Circuit Unmodulated video and audio carrier, measured with the spectrum analyzer as difference between video carrier signal level and sideband signal level; loaded Q factor QL of the audio oscillator resonance circuit adjusted by RP to provide the required video to audio carrier ratio of 12.5 dB; QU = 25 αV/A 10 12.5 Harmonic wave ratio αO 35 Harmonic wave ratio αO 42 Video to audio carrier ratio 15 dB fVC + fAC (5.5 MHz) 1 48 dB 1 48 dB fVC + 2 fAC (11 MHz) fVC + 3 fAC (16.5 MHz) 1 All remaining harmonic waves; multiple of fundamental wave of video carrier, without video signal, measured with spectrum analyzer; fVC = 523.25-623.25 MHz; pin 12 open α 15 dB Residual carrier suppression αR 32 dB Ch 30...40 3 Signal-to-noise in video; unmodulated audio carrier αN/V 48 74 dB Ch 30...40 4 Interference product ratio audio in video FM-modulation of audio carrier αA/V 48 60 dB Ch 30...40 4 Unweighted FMinterference level ratio video in audio αV/A 48 54 dB Ch 39; test picture FuBK 5 Signal-to-noise ratio of audio oscillator αN/A 48 54 dB FM-audio carrier 5 Video input current at pin 10 –I10 0 1 µA C10 ≤ 100 nF 1 Video input voltage at pin 10 V10 0.7 1.4 Vpp C10 ≤ 100 nF 1 Modulation depth mD/N 60 80 % staircase signal at video input; VVideo = 1 Vpp 6 1 Video Semiconductor Group 70 8 TDA 5666-5 AC/DC-Characteristics (cont’d) TA = 25 oC; VS = 12 V Parameter Symbol Limit Values min. Stability of mod. depth Unit Test Condition Test Circuit 6 6 typ. max. ∆mD 1 ± 2.5 % ∆mD 1 ± 2.5 % ∆VVideo = 1 Vpp ± 3 dB; TA = 0-60 oC ∆mD 1 ± 2.5 % VS = 10-13.5 V Differential gain αdif 10 % Differential phase Φdif 15 deg 6 7 measured with measurement demodulator, video test signals and vector scope 7 Amplitude response of video signal; VVideo = 1 Vpp with additional modulation f = 15 kHz-5 MHz sine signal between black and white αV 0 1.5 dB 8 Period of time required for peak white detector to reach steady state for full modulation depth with 1-white pulse per half frame when control is already in the steady state 6 t 50 µs C at pin 11 = 10 µF; I leakage ≤ 2 µA 1 Setting time for video signal change from 0 Vpp to 1.4 Vpp; video blanking signal content is uniform white level 120 t 500 µs 1 Setting time for video blanking signal from 100% white level to 42% grey level with subsequent rise in grey level to 71% of video blanking signal (due to decontrol process) t 0.4 2 10 min 1 Audio Audio oscillator frequency range; unloaded Q factor of resonance circuit Qu = 25; fresonance = 5.5 MHz fA/OSC 4 7 MHz 1 Switch-on, warm-up drift of oscillator frequency; TC-value of capacitor in audio oscillator circuit is 0, the drift is only based on self-heating of component ∆ fA/OSC 5 15 kHz TA = const.; 1 Audio signal frequency deviation ∆ fA/OSC 5 10 kHz VS = 10.0-13.5 V; Qu = 25 1 FM-mod.; total harmonic distortion THDFM 0.6 1.5 % V1 = 150 mVrms 9 Semiconductor Group 9 TDA 5666-5 AC/DC-Characteristics (cont’d) TA = 25 oC; VS = 12 V Parameter Symbol Limit Values min. typ. max. Unit Test Condition Test Circuit FM-mod.; static mod. characteristic ∆ fA/OSC ± 150 ± 210 ± 270 kHz ∆VAF = V1-V2 = ± 1 V 1 FM-mod.; dynamic mod. characteristic ∆ fA/OSC/ ∆VAF 0.25 0.32 0.39 kHz/ mV 1 Audio preamplifier input impedance (dynamic) Z1 200 kΩ 1 Semiconductor Group 10 TDA 5666-5 Test Circuit 1 Test and Measurement Circuit for FM-Audio Carrier and Negative Video Modulation Semiconductor Group 11 TDA 5666-5 Test Circuit 2 Description of the Measurement Configuration to Measure the 1.07-MHz Moire CC-level lies below the activation point and has been set to provide a ratio of 17 dB with respect to the video carrier. f VC = 623.25 MHz Semiconductor Group 12 TDA 5666-5 Test Circuit 3 Description of the Measurement Configuration to Measure the Residual Carrier Suppression Semiconductor Group 13 TDA 5666-5 Test Circuit 4 Description of the Measurement Configuration to Measure the Audio and/or Noise in Video during FM-modulation of the Audio Carrier Calibration: AF-signals are switched off, video signal is present at video input, modulation measurement device set at AM is adjusted to video carrier; filter: 300 Hz...20 kHz; detector: (P+P)/2; Wave analyzer at video signal level (16 kHz) adjusted and resultant level as reference av defined. 1) Measurement of audio interference product ratio in video while the audio carrier FM modulated: AF-signal is connected to FM-audio input; video signal is present at video input; Modulation measurement device set at AM; filter: 300 Hz...20 kHz; detector: (P+P)/2; the automatic RF-level position of the measurement device is switched off; wave analyzer at video signal level 1 kHz or 2 kHz or 3 kHz adjusted and resultant level is set to aA. The audio noise ratio in video results from aA/V = aA-aV (dB). 2) Measurement of signal-to-noise ratio in video without FM-modulation of audio carrier: AF-signals are switched off; video signal is switched on; modulation measurement device set at AM; filter: 300 Hz...3 kHz; detector: RMS x 2 ; Wave analyzer at video signal level (16 kHz) detuned; read out in dB to reference level of calibration is aN/V; 3) The noise limit of the measurement device is approx. 85 dB. Semiconductor Group 14 TDA 5666-5 Test Circuit 5 Description of the Measurement Configuration to Measure the Video and/or Noise in Audio Calibration: Measuring: AF-signal of f = 1 kHz, corresponding with a nominal deviation of 30 kHz, is connected to the audio input, and the demodulated AF-reference level at the audio measurement device is defined as 0 dB. No video signal is present. 1) The AF-signal is switched off and the FuBK-video signal is connected to the video input with Vvid = 1 Vpp. The audio level in relation to the AF-reference calibration level is measured as ratio aV/A. 2) AF- and video signal are switched off. The noise ratio in relation to the AFreference calibration level is measured as signal-to-noise ratio in the audio signal aN/A. Semiconductor Group 15 TDA 5666-5 Test Circuit 6 Description of the Measurement Configuration to Measure the Modulation Depth for Positive and Negative Modulation Calibration: Measuring: A zero reference signal with the TV-measuring receiver is given to the video signal. A video signal with Vvid = 1 Vpp is connected to the video input. 1) Modulation depth mD/N for negative modulation: pin 12 open, range peak white value – sync level in relation to range zero reference – sync level gives mD/N. 2) Modulation depth mD/P for positive modulation: pin 12 to ground, range peak white value – sync level in relation to range zero reference – peak white value gives mD/P. Semiconductor Group 16 TDA 5666-5 Test Circuit 7 Description of the Measurement Configuration to Measure the Differential Gain and Phase Semiconductor Group 17 TDA 5666-5 Test Circuit 8 Description of the Measurement Configuration to Measure the Video Amplitude Response Semiconductor Group 18 TDA 5666-5 Test Circuit 9 Description of the Measurement Configuration to Measure the Harmonic Distorsion Factor Semiconductor Group 19 TDA 5666-5 Application Circuit Semiconductor Group 20 TDA 5666-5 Diagram Function of Video Signal Connection a) Demodulated RF-output video signal V13/15rms = f (V10rms); fmod = 16 kHz b) V11 = f (V10rms) Semiconductor Group 21 TDA 5666-5 GPS05586 Plastic Package, P-DIP-18-5 (Plastic Dual In-Line Package) Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book “Package Information” Dimensions in mm Semiconductor Group 22