INFINEON PMB2401S

GSM Receiver Circuit
PMB 2401
Preliminary Data
Bipolar IC
Features
● Heterodyne receiver with demodulator
● Down mixing from 900 MHz receiver band to the base
●
●
●
●
●
●
●
●
●
●
●
●
band
Demodulation and generation of I/Q-baseband
components
Low mixer noise 10 dB (SSB)
Input high intercept point + 2 dB
Integrated 0˚ and 90˚ phase shifter
82 dB AGC-range
On-chip second LO-oscillator with external tuning circuit
Two differential operational amplifiers
Low power consumption due to highly flexible powerdown capability
Wide input frequency range up to 1 GHz
Wide IF-range from 35 MHz to 100 MHz
P-DSO-28 package and P-DSO-28-4 shrink package
Temperature range – 25 ˚C to 85 ˚C
P-DSO-28
P-DSO-28-4
Applications
● Digital mobile cellular systems as GSM, DAMPS, JDC
● Various demodulation schemes, such as PM, PSK, FSK, QAM, QPSK, GMSK
● Space and power saving optimizations of existing discrete demodulator circuits
Type
Version
Ordering Code
Package
PMB 2401T
V 2.1
Q67000-A6061
P-DSO-28 (SMD)
PMB 2401T
V 2.1
Q67006-A6061
P-DSO-28
(SMD, Tape + Reel)
PMB 2401S
V 2.1
Q67000-A6062
P-DSO-28-4
(Shrink, SMD)
PMB 2401S
V 2.1
Q67006-A6062
P-DSO-28-4 (Shrink,
SMD, Tape + Reel)
Semiconductor Group
1
01.94
PMB 2401
Functional Description
The PMB 2401 is a single-chip single-conversion heterodyn PM-receiver with phase shifting
circuitry for the I/Q-phase baseband demodulation on chip. It also includes the second local
oscillator, a gain controlled second IF-amplifier, two differential operational amplifiers for baseband
filtering purposes and power down circuitry.
The PMB 2401 is designed for digital mobile telephones according to the GSM-standard and other
digital systems.
Pin Configuration
(top view)
Semiconductor Group
2
PMB 2401
Pin Definitions and Functions
Pin No.
Symbol
Function
1
SOI
Non-inverting in-phase signal output
2
SOQ
Non-inverting quadratur signal output
3
INQ
Inverting op. amp. signal output (Q)
4
OUTQ
Non-inverting op. amp. signal output (Q)
5
OUTQ
Inverting op. amp. signal output (Q)
6
INQ
Non-inverting op. amp. signal input (Q)
7
SOQ
Inverting quadratur signal output
8
LO2E
External capacitors for oscillator
9
LO2B
VCO-tuning circuit
10
GND
Ground
11
IFI
Inverting IF input
12
IFI
Non-inverting IF input
13
GC
Gain control input
14
LO2O
VCO-signal output
15
MO
Inverted output of first mixer
16
MO
Non-inverted output of first mixer
17
VS
Supply voltage
18
SI
Non-inverted signal input of first mixer
19
SI
Inverted signal input of first mixer
20
PD1
Power-down input 1
21
LO1
Non-inverting input for first local oscillator
22
LO1
Inverting input for first local oscillator
23
PD2
Power-down input 2
24
SOI
Inverting in-phase signal output
25
INI
Non-inverting op. amp. signal input (I)
26
OUTI
Inverting op. amp. signal output (I)
27
OUTI
Non-inverting op. amp. signal output (I)
28
INI
Inverting op. amp. signal input (I)
Semiconductor Group
3
PMB 2401
Block Diagram
Semiconductor Group
4
PMB 2401
Circuit Description
The input signal SI/SI and the amplified first local oscillator signal LO1/LO1 are mixed down to an
intermediate frequency (IF). The open collector output of the mixer generates a differential current
at pins MO/MO which is filtered by an external resonant circuit. The resulting voltage drives an
external SAW-filter.
The second local oscillator signal LO2 is generated in an on chip VCO and is fed to two dividers,
which generate orthogonal signals at a quarter of VCO-frequency. The internal LO-signal is fed to
an additionally divider, whose output signal LO2O is fed to the RF-signal of PLL-synthesizer. The
filtered IF-signal reenters the chip at the IFI/IFI input, where it is amplified and demodulated to the
final baseband output frequency with each of the orthogonal signals. The resulting in-phase and
quadrature signals pass through differential output drivers and appear at SOI/SOI and SOQ/SOQ
outputs, respectively. The amplification of the IF-signal before the second mixer stage is performed
by a gain-controlled amplifier, the gain being determined by the voltage at the gain control input GC.
Two differential operational amplifiers with the input signals INI/INI (INQ/INQ) and the output signals
OUTI/OUTI (OUTQ/OUTQ) can be used as active filters.
Differential signals and symmetrical circuitry are used throughout, except at the signal output. Bias
drivers generate internal temperature- and supply voltage-compensated reference voltages
required by various circuit blocks. Switching the power down inputs PD1 and PD2 from high to low
(see table) sets the circuit from its normal operating mode into a mode with reduced supply current.
PD1
PD2
RF-Part
IF-Part
VCO/Divders
L
L
OFF
OFF
ON
L
H
OFF
ON
ON
H
L
ON
OFF
ON
H
H
ON
ON
ON
Semiconductor Group
5
PMB 2401
Internal Input / Output Circuits
Semiconductor Group
6
PMB 2401
Electrical Characteristics
Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not even momentarily and
individually, as permanent damage to the IC will result.
TA = – 25 ˚C to 85 ˚C
Parameter
Symbol
Limit Values
min.
max.
Unit
Remarks
Supply voltage
VS
– 0.5
7
V
Input/output voltage
(any except open collector)
VIO
– 0.5
– 0.5
VS + 0.5
V
V
VS ≤ 7 V
VS ≤ 7 V
Open collector output voltage
(MO/MO)
VOC
– 0.5
– 0.5
VS + 2.5
7.5
V
V
VS ≥ 5 V
VS ≥ 5 V
Differential input voltage
(any differential input)
VI
–3
3
V
Junction temperature
Tj
125
˚C
Storage temperature
Tstg
125
˚C
Thermal resistance
(junction to ambient)
Rth JA
55
K/W
K/W
– 55
7.5
The pins 15, 16, 18, 19 have no additional internal ESD protection circuitry
Semiconductor Group
7
P-DSO-28
P-DSO-28-4
PMB 2401
Operational Range
Within the operational range the IC operates as described in the circuit description. The AC/DCcharacteristics limits are not guaranteed.
VS = 4.5 V to 5.5 V; TA = – 25 ˚C to 85 ˚C; refer to test circuit 1.
Parameter
Symbol
Limit Values
min.
Unit
max.
SI/SI input level
PSI
– 11
dBm
SI/SI input frequency
fSI
1000
MHz
LO1/LO1 input level
PLO1
3
dBm
LO1/LO1 input frequency
fLO1
1100
MHz
Intermediate frequency
fIF
100
MHz
IFI/IFI input level
PIFI
– 24
dBm
IFI/IFI input frequency
fIFI
35
100
MHz
LO2 input level
PLO2
– 20
0
dBm
LO2 input frequency
fLO2
140
400
MHz
VCO frequency range
fVCO
120
250
MHz
LO2O output level
PLO2O
120
180
mVpp
LO2O output frequency
fLO2O
15
50
MHz
SOI/SOI, SOQ/SOQ
output Bandwidth
BSO
0
0.8
MHz
GC input voltage
VGC
0
2
V
L-PD1/PD2 voltage
VPDL
0
1
V
H-PD1/PD2 voltage
VPDH
4
VS
V
– 11
35
Note: Power levels are referred to resistance of 50 Ω
Semiconductor Group
8
Remarks
VCO external
with ext. capacitors
– 3 dB roll off
PMB 2401
AC/DC Characteristics
AC/DC-characteristics involve the spread of values guaranteed within the specified supply voltage
and ambient temperature range. Typical characteristics are the median of the production.
VS = 4.75 to 5.25 V; TA = 25 ˚C;
Parameter
Supply current
Symbol
IS
Limit Values
Unit
Test Condition
Test
Circuit
PD1 = L
PD1 = L
PD1 = H
PD1 = H
1
min.
typ.
max.
3.1
12
11.5
20
5.5
15.5
15
24.5
6.8
19
18.5
30
mA
mA
mA
mA
PD2 = L
PD2 = H
PD2 = L
PD2 = L
First Mixer Signal Input SI/SI
Input resistance
RSI
17
25
33
Ω
Input inductance
LSI
3.5
5
6.5
nH
In series to RSI
2a
Max. input level
PSI
– 13
– 11
dBm
1 dB compr. at MO/MO
1
Input intercept
Point
PIPI
0
2
3
dBm
GMO = 14 dB
1
Blocking level
PB
– 16
– 14
– 12
dBm
3 dB attenuation of
wanted Signal at MO
1
Input interference
level at f = fint
Pint
– 38
dBm
– 98 dBm interference at
f = (fint ± fLO1) X2 at MO
3
Input frequency
fSI
Noise figure
NSI
NSI
7.5
9.5
8
10
2a
960
MHz
1
9.5
11.5
dB
dB
DSB-noise, fC = 900 MHz
SSB-noise, fC = 900 MHz
including optimum noise
matching
1
Output of First Mixer MO/MO (open collector)
11.2
7
16
10
20.8
13
kΩ
kΩ
fMO = 45 MHz
fMO = 71 MHz
2c
2c
Output capacitance CMO
0.7
1
1.3
pF
parallel to RMO
2c
Total output current IMO + MO
3.5
5
6.5
mA
1
13
14
dB
1
100
MHz
1
Output resistance
RMO
RMO
Power gain from
Signal input
GMO
Intermediate
frequency
fIF
Semiconductor Group
35
9
PMB 2401
AC/DC Characteristics (cont’d)
Parameter
Symbol
Limit Values
min.
typ.
Unit
Test Condition
Test
Circuit
max.
Input of First Mixer Local Oscillator LO1/LO1
Input resistance
RLO1
490
700
910
Ω
fLO1 = 900 MHz
2a
Input capacitance
CLO1
0.7
1
1.3
pF
parallel to RLO1
2a
Input level
PLO1
VLO1
– 11
178
3
890
dBm
mVpp
see diagram 1
1
1
Input frequency
fLO1
1100 MHz
1
Isolation of First Mixer
From SI
to MO
ASI – MO
30
dB
fSI = 945 MHz;
fLO1 = 900 MHz
1
SI
to LO1
ASI – LO1
60
dB
fSI = 945 MHz;
fLO1 = 900 MHz
1
LO1 to MO
ALO1 – MO 50
dB
fSI = 945 MHz;
fLO1 = 900 MHz
1
LO1 to SI
ALO1 – SI
60
dB
fSI = 945 MHz;
fLO1 = 900 MHz
1
MO to SI
AMO – SI
50
dB
fSI = 945 MHz;
fLO1 = 900 MHz
1
MO to LO1
AMO – LO1 65
dB
fSI = 945 MHz;
fLO1 = 900 MHz
1
IF Input IFI/IFI
Input resistance
RIFI
63
90
117
Ω
Input capacitance
CIFI
0.35
0.5
0.65
pF
parallel to RIFI
2a
Max. input level
PIFI
VIFI
– 17
89
dBm
mVpp
VGC = 2 V, 1 dB compr. at
1
1
Input intercept
point
PIPI
see diagram 5
Input frequency
fSI
35
Noise figure
NSI
10
11
2a
SO; see diagram 4
1
100
MHz
14
dB
1
SSB-noise
1
fLO2 = 180 MHz
fLO2 = 360 MHz
2b
2b
Input for Second Local Oscillator LO2 (VCO external)
Input resistance
RLO2
Semiconductor Group
1.9
1.3
2.4
1.8
3.1
2.3
10
kΩ
kΩ
PMB 2401
AC/DC Characteristics (cont’d)
Parameter
Symbol
Limit Values
Unit
min.
typ.
max.
1
1.3
pF
Input capacitance
CLO2
0.7
Input level
PLO2
VLO2
– 20
63
0
630
dBm
mVpp
Input frequency
fLO2
140
400
MHz
250
MHz
Test Condition
Test
Circuit
2b
into 50 Ω
1.1
1.1
1.1
Voltage Controlled Oscillator VCO (LO2)
fVCO
120
RLO2O
0.9
1.2
1.5
kΩ
Output capacitance CLO2O
0.7
1
1.3
pF
Output level
VLO2O
150
120
160
140
Output frequency
fLO2O
15
VCO-frequency
with ext. capacitors
1.2
IF ≤ 75 MHz
IF ≥ 75 MHz
1
1
VCO Output LO2O
Output resistance
mVpp
mVpp
50
MHz
1
Signal Outputs SOI/SOI, SOQ/SOQ
RSO
175
250
325
Ω
Output capacitance CSO
0.7
1
1.3
pF
Output resistance
SO frequency
roll off
fSO
DC output level
VSO
Diff. output offset
voltage
VSO/SO
Voltage gain from
IF to I/Q-output
GSO
800
2.0
70
– 12
74
–8
kHz
see diagram 6
2.5
V
1
28
mV
between I/I or Q/Q
1
78
–4
dB
dB
VGC = 0 V
VGC = 2 V
1
2
V
1
µA
0 V ≤ VGC ≤ 2 V
1
dB/V
FGC = dGSO/dVGC
1
see diagram 2 + 3
Gain Control Input GC
GC-input voltage
VGC
GC-input current
– IGC
Gain control factor
FGC
0
40
1
see diagram 3
Semiconductor Group
11
PMB 2401
AC/DC Characteristics (cont’d)
Parameter
Symbol
Limit Values
min.
typ.
Unit
Test Condition
max.
Test
Circuit
Power-Down Inputs PD1, PD2
L-PD input voltage
VPDL
L-PD input current
IPD1L
IPD2L
H-PD input voltage VPDH
H-PD input current
0
4
IPDH
1
V
0.1
0.2
µA
µA
VS
V
10
µA
1
0 ≤ VPD1, 2L ≤ 1 V
1
1
4 ≤ VPD1, 2L ≤ VS
1
Differential Operational Amplifier (open loop)
Slew rate
SR
4.6
V/µs
1
Gain Bandwidth
Prod.
GBW
12
MHz
1
Voltage gain
AVo
55
dB
1
Phase margin
ϕR
60
degr.
1
Gain margin
AR
14
dB
1
Common mode
Rejection Ratio
CMRR
58
dB
1
Offset voltage
VOFF
1
mV
1
Output voltage
VOUT
Semiconductor Group
0.8
VS –1 V
12
1
PMB 2401
*1)
*2)
*3)
*4)
Test Circuit 1
Semiconductor Group
13
Balun 1:2
“NEOSID” 00553110
Balun 1:1
“NEOSID” 00553100
Transformer Kit “Vogt”1
5171100002 Cul 0.008
Tuned for resonance
PMB 2401
Test Circuit 1.1
Test Circuit 1.2
Semiconductor Group
14
PMB 2401
Test Circuit 2a
Test Circuit 2b
Test Circuit 2c
Semiconductor Group
15
PMB 2401
The S-parameters are tested at the indicated frequency and the equivalent parallel or series circuit
is calculated on this base.
Test Point
Test Circuit Test Frequency / MHz
Pin x
Pin y
LO1-input impedance
2a
900
21
22
SI-input impedance
2a
900
18
19
IFI-input impedance
2a
45 … 90
11
12
LO2-input impedance
2b
180, 360
9
–
MO-output impedance
2c
45, 71
15
16
Semiconductor Group
16
PMB 2401
Test Circuit 3
f W = wanted input signal from received channel
fint = unwanted interfering signal within band : fint = fLO – fIF / 2
fLO = local oscillator signal
fIFW = wanted IF signal from received channel = fLO – fW
fIFi t = unwanted IF / 2 signal from interfering channel: fIFint = fLO – fint
fIF2in = unwanted harmonic signal of fIF2in : fIF2in = 2 × fIFint
Semiconductor Group
17
PMB 2401
Application Circuit
Semiconductor Group
18
PMB 2401
Diagram 1
First Mixer Gain versus LO-Level PLO1
PSI = – 40 dBm, fMO = 45 MHz
Diagram 2
Gain Control Characteristic Output Level
PSO versus input Level PIFI
Diagram 3
Gain Control Characteristic Voltage Gain
GSO versus GC-Voltage VGC
Diagram 4
Gain Control Characteristic
Max. Input Level PIFI versus GC-Voltage VGC:
(1 dB Compression at SO)
Semiconductor Group
19
PMB 2401
Diagram 5
Gain–Control Characteristic Input Intercept
Point PIPI versus GC-Voltage VGC
Semiconductor Group
Diagram 6
Frequency Transfer Characteristic of
Outputs SOI / SOQ
20
PMB 2401
Diagram 7
Worst-Case Signal Levels without Blocking Level
Semiconductor Group
21
PMB 2401
Diagram 8
Worst-Case Signal Levels with Blocking Level
Semiconductor Group
22
PMB 2401
Package Outlines
GPS05123
Plastic-Package, P-DSO-28 (SMD)
(Dual-Small-Outlines)
GPS05389
Plastic-Package, P-DSO-28-4 (Shrink) (SMD)
(Dual-Small-Outlines)
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”
SMD = Surface Mounted Device
Semiconductor Group
23
23
Dimensions in mm