INFINEON TLE6217G_08

TLE6217G
Smart Quad Channel Low-Side Switch
Features
Product Summary
Supply voltage
VS
Shorted Circuit Protection
Drain source voltage
VDS(AZ)max
Overtemperature Protection
Overvoltage Protection
On resistance
RON 1,2
Parallel Control of the Inputs (PWM Applications)
RON 3,4
Separate Diagnostic Pin for Each Channel
Output current
ID 1,2
Power - SO 20 - Package with integrated
ID 3,4
cooling area
• Standby mode with low current consumption
• μC compatible Input
• Electrostatic Discharge (ESD) Protection •Green Product (RoHS Compliant)
•
•
•
•
•
•
4.8 - 32
60
0.2
0.35
2x5
2x3
V
V
Ω
Ω
A
A
•AEC Qualified
Application
•
•
•
•
All kinds of resistive and inductive loads (relays, electromagnetic valves)
μC compatible power switch for 12 and 24 V applications
Solenoid control switch in automotive and industrial control systems
Robotic Controls
PG-DSO-20-37
General description
Quad channel Low-Side-Switch (2x5A/2x3A) in Smart Power Technology (SPT) with four separate inputs and four open drain DMOS output stages. The TLE 6217 GP is fully protected by embedded protection functions and designed for automotive and industrial applications. Each channel has its own
status signal for diagnostic feedback. Therefore the TLE 6217 GP is particularly suitable for ABS or
Powertrain Systems.
Block Diagram
STBY
ENA
VS
GND
normal function
IN1
VBB
SCB / overload
IN2
as Ch. 1
IN3
as Ch. 1
IN4
as Ch. 1
overtemperature
LOGIC
open load/sh. to gnd
Output Stage
ST1
1
OUT1
4
4
ST2
ST3
as ST 1
ST4
as ST 1
Gate Control
as ST 1
OUT4
GND
Data Sheet
1
Rev. 6.1, 2008-04
TLE6217G
Pin Configuration (Top view)
PG - DSO - 20 - 37
Pin Description
Pin
Symbol
Function
1
GND
Ground
2
OUT1
Power Output channel 1
3
ST1
Status Output channel 1
4
IN4
Control Input channel 4
5
VS
Supply Voltage
6
STBY
Standby
7
IN3
Control Input channel 3
8
ST2
Status Output channel 2
9
OUT2
Power Output channel 2
10
GND
Ground
11
GND
Ground
12
OUT3
Power Output channel 3
13
ST3
Status Output channel 3
14
IN2
Control Input channel 2
15
GND
Ground Logic
16
ENA
Enable Input for all four channels
17
IN1
Control Input channel 1
18
ST4
Status Output channel 4
19
OUT4
Power Output channel 4
20
GND
Ground
Heat slug internally connected to ground pins
Data Sheet
2
Rev. 6.1, 2008-04
TLE6217G
Detailed Block Diagram
VS
STBY
ENA
internal supply
Overtemperature
Channel 4
Overtemperature
Channel 1
Open Load
IN1
Overload
LOGIC
OUT1
ST1
Open Load
IN4
IPD
Overload
LOGIC
OUT4
ST4
Overtemperature
Channel 3
Overtemperature
Channel 2
IPD
Open Load
IN2
Overload
LOGIC
OUT2
ST2
Open Load
IN3
IPD
Overload
LOGIC
OUT3
ST3
IPD
GND
Data Sheet
3
Rev. 6.1, 2008-04
TLE6217G
Maximum Ratings for Tj = – 40°C to 150°C
The maximum ratings may not be exceeded under any circumstances, not even momentarily and
individually, as permanent damage to the IC will result.
Parameter
Supply voltage
Symbol
VS
Continuous drain source voltage (OUT1...OUT4)
VDS
Input voltage IN1 to IN4, ENA
VIN , VENA
-
Input voltage STBY
VSTBY
- 0.3 ... + 40
Status output voltage
VST
- 0.3 ... + 32
V
Operating temperature range
during clamping; Σt = 30 min
during clamping; Σt = 15 min
Storage temperature range
Tj
Tj
Tj
Tstg
40 ... + 150
175
190
- 55 ... + 150
°C
Output current per channel
ID(lim)
Output current at reversal supply
ID 1,2
ID 3,4
Status output current
IST
Inductive load switch off energy (single pulse)
Tj = 25°C
Electrostatic Discharge Voltage (HBM) according to MIL
STD 883D, method 3015.7 and EOS/ESD assn. Standard
S5.1 – 1993
Output 1-4 Pins
All other Pins
Thermal resistance
junction – case (die soldered on the frame)
Values
-0.3 ... + 40
Unit
V
40
V
1.5... + 6
V
-
overload
shutdown
EAS
VESD
VESD
A
-4
-2
A
- 5 ... + 5
mA
50
mJ
4000
2000
V
V
K/W
RthJC
Maximum operating lifetime (according to "Ambient thermal
conditions")
tb
2
10000
h
Ambient thermal conditions
TAmbient temperature
range
operating periods
-40 °C
2%
-20 °C
10 %
25 °C
24 %
60 °C
34 %
80 °C
24 %
100 °C
5%
> 120 °C
1%
Data Sheet
4
Rev. 6.1, 2008-04
TLE6217G
Electrical Characteristics
Parameter and Conditions
VS = 4.8 to 18 V ; Tj = - 40 °C to + 150 °C
(unless otherwise specified)
Symbol Values
min
Unit
typ
max
1. Power Supply (VS)
Supply current (Outputs ON)
IS
8
mA
Supply current (Outputs OFF)
VENA = L, VSTBY = H
IS
4
mA
IS
10
Standby current
VSTBY = L
VS
Operating voltage
4.8
32
μA
V
2. Power Outputs
ON state resistance Channel 1,2
ID = 1A; VS ≥ 9.5 V
Tj = 25 ° C
Tj = 150°C
RDS(ON)
ON state resistance Channel 3,4
ID = 1A; VS ≥ 9.5 V
Tj = 25 ° C
Tj = 150°C
RDS(ON)
ID ≥ 100 mA
VDS(AZ)
45
IPD
10
Z-Diode clamping voltage (OUT1...4)
Pull down current
Output Leakage Current
1
VSTBY = H, VIN = L
VSTBY = L
Tj = -40°C...150°C
wafer test at 25°C
ID = 1 A
ID = 1 A
ID = 1 A
ID = 1 A
Output turn on delay time
Output turn off delay time 1
Output on fall time 1
Output off rise time 1
Overload switch-off delay time 1
2
Output off status delay time
Failure extension Time for Status Report
Input Suppression Time
Open Load (off) filtering Time 2
Ω
0.2
0.5
Ω
0.35
0.75
20
60
V
50
μA
IDlk
5
1
ton
toff
tfall
trise
tDSO
tD
tD-failure
tD-IN
tfOL(off)
0
0
3
3
20
500
500
500
10
5
10
10
10
1200
1200
1200
30
20
30
30
30
100
3000
3000
3000
100
μA
μA
μs
3. Digital Inputs (IN1, IN2, IN3, IN4, ENA)
Input low voltage
Input high voltage
Input voltage hysteresis
2
Input pull down current
Enable pull down current
VIN = 5 V; VS ≥ 6.5 V
VENA = 5 V; VS ≥ 6.5 V
VINL
- 0.3
1.0
V
VINH
2.0
6.0
V
VINHys
50
100
IIN
10
30
60
μA
IENA
10
20
40
μA
VSTL
0.5
V
ISTH
2
μA
mV
4. Digital Status Outputs (ST1 - ST4) Open Drain
Output voltage low
IST = 2 mA
Leakage current high
1
2
See timing diagram, resistive load condition; VS ≥ 9 V
This parameter will not be tested but assured by design
Data Sheet
5
Rev. 6.1, 2008-04
TLE6217G
Electrical Characteristics
Parameter and Conditions
VS = 4.8 to 18 V ; Tj = – 40 °C to + 150 °C
(unless otherwise specified)
Symbol
Values
min
Unit
typ
max
5. Standby Input (STBY)
Input low voltage
VSTBY
0
1
V
Input high voltage
VSTBY
3.5
VS
V
300
μA
0.3*VS 0.33*VS 0.36*VS
V
Input current
VSTBY = 18 V
ISTBY
6. Diagnostic Functions
Open load detection voltage
VENA = X, VIN = L
VS ≥ 6.5 V
VDS(OL)
Open load detection current channel 1,2
VENA = VIN = H
VS ≥ 6.5 V
ID(OL) 1,2
100
240
mA
Open load detection current channel 3,4
VENA = VIN = H
VS ≥ 6.5 V
ID(OL) 3,4
100
240
mA
Overload Current channel 1, 2
VS ≥ 6.5 V
ID(lim) 1,2
5
7.5
A
VS ≥ 6.5 V
ID(lim) 3,4
3
5
A
Tth
Thys
170
Overload Current channel 3 , 4
Overtemperature shutdown threshold
Hysteresis
2
tIN
Pulse Width for static diagnostic output
2
200
°C
K
500
μs
10
This parameter will not be tested but assured by design
Data Sheet
6
Rev. 6.1, 2008-04
TLE6217G
Application Description
This IC is especially designed to drive inductive loads (relays, electromagnetic valves).
Integrated clamp-diodes limit the output voltage when inductive loads are discharged.
Four open-drain logic outputs indicate the status of the integrated circuit. The following conditions are
monitored and signalled:
- Overloading of output (also shorted load to supply) in active mode
- Open and shorted load to ground in active and inactive mode
- Overtemperature
Circuit Description
Input Circuits
The control and enable inputs, both active high, consist of schmitt triggers with hysteresis. All inputs
are provided with pull-down current sources. Not connected inputs are interpreted as low and the respective output stages are switched off.
In standby mode (STBY = LOW) the current consumption is greatly reduced.
The circuit is active when STBY = HIGH.
If the standby function is not used, it is allowed to connect the standby pin directly to VS.
Status Signals: The status signals are undefined for 2ms after a power up event or a STBY low to high
transition.
Output Stages
The four power outputs consist of DMOS-power transistors with open drains. The output stages are
short circuit protected throughout the operating range. Each output has it's own zenerclamp. This
causes a voltage limitation at the power transistor when inductive loads are switched off.
Parallel to the DMOS transistors there are internal pull down current sources. They are provided to
detect an open load condition in the off state. They will be disconnected in the standby mode.
Due to EMI measures there is an internal zenerclamp in parallel to the output stage. It gets active
above 33V drain source voltage. This leads to an increasing leakage current up to 1 mA @ VDS = 40V.
Protective Circuits
The outputs are protected against current overload and overtemperature. If the output current increases above the overload detection threshold IQO for a longer time then tDSO or the temperature increases above Tth, then the power transistor is immediately switched off. It remains off until the control
signal at the input is switched off and on again.
Fault Detection
The status outputs indicate the switching state of the output stage. Under normal conditions is: ST =
low
Output off; ST = high
Output on. If an error occurs, the logic level of the status output is inverted, as listed in the diagnostic table.
If current overload or overtemperature occurs for a longer time than tDSO, the fault condition is latched
into an internal register and the output is shutdown. The reset is done by switching off the corresponding control input for a time longer than tD-IN.
Data Sheet
7
Rev. 6.1, 2008-04
TLE6217G
Open load is detected for all four channels in on and off mode.
In the on mode the load current is monitored. If it drops below the specified threshold value IQU then
an open load condition is detected.
In the off mode, the output voltage is monitored. An open load condition is detected when the output
voltage of a given channel is below the threshold VDS(OL), which is typ. 33 % of the supply voltage VS.
To prevent an open load diagnosis in case of transient Voltages on the outputs the open load detection
in off mode uses a filter of typ. 30μs.
Status output at pulse width operation
If the input is operated with a pulsed signal, the status does not follow each single pulse of the input
signal. An internal delay tD of typ. 1.2ms (min 500 μs) enables a continuous status output signal. See
the timing diagrams on the following pages for further information.
This internal status delay simplifies diagnostic software for pwm applications.
Diagnostic Table
In general the status follows the input signal in normal operating conditions.
If any error is detected the status is inverted.
Standby
Input
Enable
Input
Control
Input
Power
Output
Status
Output
STBY
ENA
IN
Q
ST
Standby
L
X
X
off
H
Normal function
H
H
H
L
H
H
X
L
H
off
off
ON
L
L
H
Open load or short to ground
H
H
H
H
L
L
H
H
L
H
L
H
off
off
off
ON
H
H
H
L
Overload or short to supply1)
H
H
H
off
L
H
H
H→L
off
L
H
L
X
off
L
H
H
H
off
L
H
H
H→L
off
L
H
L
X
off
L
Operating Condition
reset latch 2)
Overtemperature
reset latch
2)
1)
Note 1) : overload/short-to-supply/overtemperature - events shorter than min. time t DSO specified in
2.10 will not be latched and not reported at the status pin.
Data Sheet
8
Rev. 6.1, 2008-04
TLE6217G
Note 2): to reset latched status-output in case of overload/short-to-supply/overtemperature the control
input has to go low and stay low for longer than max. Input suppression time tD-IN specified in 2.13 of
the characteristics
Failure Situations and Status Report
Logic Block Diagram
Overtemperature
1.....overtemperature
0.....normal cond.
Gate Driver
1... Output
0....Output
O
Off
ENA
1....enabled
0... disabled
Input
1....On
0... Off
IN
tDSO
Delay
60μs
S
R
SET
CLR
Q
OUT
1,2ms typ.
IN
tD
OUT
60μs typ.
Q
Delay
60μs
tD
tD-IN when overload
d
EN
Overload
0.....overload
1.....normal cond.
Delay D
OUT
IN
tfOL(off)
HI
Open load "off"
1.....open load
0.....normal cond.
tD
Delay D
Filter
30μs
Filter
EN
Delay D OUT
IN
Status
0....High
1....Low
tD-failure
EN
Open load "on"
0.....open load
1.... normal cond.
Delay D
OUT
IN
tD-failure
Data Sheet
9
Rev. 6.1, 2008-04
TLE6217G
Timing Diagrams
Output Slope
VIN
VI NH
V INL
t
VDS
VS
85%
t off
t on
15%
t
tf
tr
VST
tD
t
Fig. 1
Overload Switch OFF Delay
ID
t
ID(lim)
DSO
ID(OL)
t
VST
t D-failure
t
Fig. 2
Data Sheet
10
Rev. 6.1, 2008-04
Data Sheet
11
ST2
ST3
ST4
10k
IN1
IENA
IIN4
IIN3
IIN2
IIN1
IST4
IST3
IST2
IST1
STBY
ENA
IN4
IN3
IN2
IN1
ST4
ST3
ST2
ST1
IVS
GND
TLE
6227
VS
VS
TLE 6217 GP
VSTBY
VENA
ISTBY
ENA
VIN4
IN4
10k
VIN3
IN3
VIN2
IN2
10k
VST1 VST2 VST3 VST4 VIN1
ST1
10k
VD = 5V
OUT4
OUT3
OUT2
OUT1
ID4
ID3
ID2
ID1
R L4
OUT3
R L2
OUT2
R L1
OUT1
VDS(OUT4) VDS(OUT3) VDS(OUT2) VDS(OUT1)
OUT4
R L3
TLE6217G
Test Circuit
Rev. 6.1, 2008-04
TLE6217G
+12V
Application Circuit
L4
L3
L2
ENA GND
6217 OUT3
OUT4
Enable
Input
Control
Inputs
Status
Output
10k 10k 10k 10k
VD = 5V
C
VS
IN1
IN2
IN3
IN4
STBY
ST1
OUT1
ST2
ST3
ST4 TLE OUT2
L1
The blocking capacitor C is recommended to avoid critical negative voltage spikes on VS in case of
battery interruption during OFF-commutation.
Data Sheet
12
Rev. 6.1, 2008-04
TLE6217G
Timing Diagrams of Diagnostic with Pulsed Input Signal
Normal condition, resistive load, pulsed input signal
V
IN
t IN
ID
V ST
tD
tD
Fig. 3
Current Overload
F
current overload condition
tINoff
V
IN
I D(lim)
ID
V ST
tD-IN
t DSO
t DSO
tINoff < tD-IN : Input suppression time avoids a restart after overtemperature
Fig. 4
Data Sheet
13
Rev. 6.1, 2008-04
TLE6217G
Diagnostic status output at different open load current conditions
V IN
I D(OL)
ID
t D-failure
V ST
tD
Fig. 5
V
IN
tINoff
I D(OL)
ID
tD-failure
V ST
tD
tINOFF < tD leads to a static status signal
Fig. 6
V
IN
tINoff
I D(OL)
ID
V ST
tD-failure
tD-failure
tD
tD-failure
tINoff > tD : Intermittend status signal
Data Sheet
Fig. 7
14
Rev. 6.1, 2008-04
TLE6217G
Normal operation, followed by open load condition
~ 55V
Open load voltage condition
VDS 12V
33%
VIN
I D(OL)
ID
tfOL(off)-
tD-failure
VST
tD-failure
tD
Fig. 8
Overtemperature
Overtemperature
VIN
tINoff > tD-IN
Reset of overload
Flip Flop
I D(OL)
ID
VST
tD-failure
tD-failure
t
DSO
Fig. 9
Data Sheet
15
Rev. 6.1, 2008-04
TLE6217G
Ordering code
Type
Ordering Code
Package
TLE6217 G
TLE6217 C
on request
on request
P - DSO - 20 – 12
Bare dice on wafer
Pad Assignment
Out
GTV
ST
IN
VR1 EN
GN
I
IN
T
P
Out
GTV
ST
y
P
G
N
P
G
N
x
center of
P
G
N
ST
GTV
IN
I
V
STB
Out
Data Sheet
P
G
N
IN
V
ST
GTV
Out
16
Rev. 6.1, 2008-04
TLE6217G
Package Outlines
+0.07
-0.02
3.5 MAX.
6.3
0.1
5˚ ±3˚
0.25
1.3
15.74 ±0.1
(Heatslug)
B
2.8
Heatslug
(Mold)
0.95 ±0.15
0.25 M A 20x
20
11
1
10
14.2 ±0.3
Bottom View
11
0.25 B
20
5.9 ±0.1
(Metal)
0.4 +0.13
3.2 ±0.1
(Metal)
1.27
3.25 ±0.1
0 +0.1
1.1 ±0.1
11 ±0.15 1)
Index Marking
1 x 45˚
15.9 ±0.15 1)
(Mold)
1)
Figure 1
10
A
13.7 -0.2
(Metal)
1
Heatslug
Does not include plastic or metal protrusion of 0.15 max. per side
PG-DSO-20-37 (Please Insert Package Long Name!)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Data Sheet
17
Dimensions in mm
Rev. 6.1, 2008-04
TLE6217G
Revision History
1
Revision History
Revision
Date
Changes
6.1
2008-04-04
Initial version of RoHS-compliant derivate of TLE6217G
Page 1: AEC certified statement added
Page 1 and 17: added RoHS compliance statement and Green product feature
Page 1 and 17: Package changed to RoHS compliant version
Page 18-19: added Revision History, updated Legal Disclaimer
Data Sheet
18
Rev. 6.1, 2008-04
Edition 2008-04
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2008 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
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