Datasheet TLE 6228 GP Smart Quad Channel Low-Side Switch Features Product Summary • Shorted Circuit Protection • Overtemperature Protection • Overvoltage Protection • Parallel Control of the Inputs (PWM Applications) • Seperate Diagnostic Pin for Each Channel • Power - SO 20 - Package with integrated cooling area • Standby mode with low current consumption • µC compatible Input • Electrostatic Discharge (ESD) Protection Supply voltage Drain source voltage On resistance Output current Application • All kinds of resistive and inductive loads (relays,electromagnetic valves) • µC compatible power switch for 12 and 24 V applications • Solenoid control switch in automotive and industrial control systems • Robotic Controls VS VDS(AZ)max RON 1,2 RON 3,4 ID 1,2 (max) ID 3,4 (max) 4.8 - 32 60 0.23 0.28 2x5 2x3 V V Ω Ω A A P-DSO-20-12 Ordering Code: Q67006-A9364 General description Quad channel Low-Side-Switch (2x5A/2x3A) in Smart Power Technology (SPT) with four separate inputs and four open drain DMOS output stages. The TLE 6228 GP is fully protected by embedded protection functions and designed for automotive and industrial applications. Each channel has its own status signal for diagnostic feedback. Therefore the TLE 6228 GP is particularly suitable for ABS or Powertrain Systems. Block Diagram STBY ENA VS GND normal function IN1 VBB SCB / overload IN2 as Ch. 1 IN3 as Ch. 1 IN4 as Ch. 1 ST1 LOGIC overtemperature open load/sh. to gnd Output Stage 1 OUT1 4 4 ST2 ST3 as ST 1 ST4 as ST 1 Gate Control OUT4 as ST 1 GND V3.1 Page 1 26. Aug. 2002 Datasheet TLE 6228 GP Detailed Block Diagram VS STBY ENA internal supply Overtemperature Channel 4 Overtemperature Channel 1 Open Load IN1 Overload LOGIC OUT1 ST1 Open Load IN4 IPD Overload LOGIC OUT ST4 Overtemperature Channel 3 Overtemperature Channel 2 IPD Open Load IN2 Overload LOGIC OUT ST2 Open Load IN3 IPD Overload LOGIC OUT ST3 IPD GND V3.1 Page 2 26. Aug. 2002 Datasheet TLE 6228 GP Pin Description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Symbol GND OUT1 ST1 IN4 VS STBY IN3 ST2 OUT2 GND GND OUT3 ST3 IN2 GND ENA IN1 ST4 OUT4 GND Pin Configuration (Top view) Function Ground Power Output channel 1 Status Output channel 1 Control Input channel 4 Supply Voltage Standby Control Input channel 3 Status Output channel 2 Power Output channel 2 Ground Ground Power Output channel 3 Status Output channel 3 Control Input channel 2 Ground Logic Enable Input for all four channels Control Input channel 1 Status Output channel 4 Power Output channel 4 Ground GND OUT1 ST1 IN4 VS STBY IN3 ST2 OUT2 GND 1• 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 P - DSO - 20 - 12 Heat slug internally connected to ground pins V3.1 Page 3 26. Aug. 2002 GND OUT4 ST4 IN1 ENA GNDL IN2 ST3 OUT3 GND Datasheet TLE 6228 GP Maximum Ratings for Tj = – 40°C to 150°C The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the IC will result. Parameter Supply voltage Symbol VS Continuous drain source voltage (OUT1...OUT4) VDS Input voltage IN1 to IN4, ENA VIN , VENA Input voltage STBY VSTBY Status output voltage VST Unit V 45 V - 0.3 ... + 6 V - 0.3 ... + 40 - 0.3 ... + 32 V 55 V - 40 ... + 150 - 55 ... + 150 °C ID(lim) min A - 5 ... + 5 mA 50 mJ 2) Load Dump Protection VLoad Dump = UP+US; UP=13.5 V RI1)=2 Ω; td=400ms; IN = low or high With RL= 5 Ω for Ch. 1,2; 10 Ω for Ch. 3,4 (ID = 2,7A respectively 1,35A) VLoad Dump Operating temperature range Storage temperature range Tj Tstg Output current per channel (see page 6) ID(lim) Status output current IST Inductive load switch off energy (single pulse) Values -0.3 ... + 40 Tj = 25°C Electrostatic Discharge Voltage (human body model) according to MIL STD 883D, method 3015.7 and EOS/ESD assn. standard S5.1 - 1993 EAS VESD 2000 DIN Humidity Category, DIN 40 040 E IEC Climatic Category, DIN IEC 68-1 40/150/56 K/W Thermal resistance junction – case (die soldered on the frame) junction - ambient @ min. footprint junction - ambient @ 6 cm2 cooling area RthJC RthJA 2) 2 50 38 PCB with heat pipes, 2 backside 6 cm cooling area Minimum footprint 1) RI=internal resistance of the load dump test pulse generator LD200 VLoadDump is setup without DUT connected to the generator per ISO 7637-1 and DIN 40 839. V3.1 V Page 4 26. Aug. 2002 Datasheet TLE 6228 GP Electrical Characteristics Parameter and Conditions VS = 4.8 to 18 V ; Tj = - 40 °C to + 150 °C (unless otherwise specified) Symbol Values min Unit typ max 1. Power Supply (VS) Supply current (Outputs ON) IS 8 mA Supply current (Outputs OFF) VENA = L, VSTBY = H IS 4 mA IS 10 Standby current VSTBY = L Operating voltage VS 4.8 µA 32 V 2. Power Outputs ON state resistance Channel 1,2 ID = 1A; VS ≥ 9.5 V Tj = 25 ° C Tj = 150°C RDS(ON) 0.23 0.26 0.5 Ω ON state resistance Channel 3,4 ID = 1A; VS ≥ 9.5 V Tj = 25 ° C Tj = 150°C RDS(ON) 0.28 0.4 0.75 Ω ID ≥ 100 mA VDS(AZ) 45 60 V VSTBY = H, VIN = L IPD 10 50 µA VSTBY = L, 0V ≤ VDS ≤ 20V IDlk 5 µA 50 60 30 30 100 3000 3000 3000 100 µs Z-Diode clamping voltage (OUT1...4) Pull down current Output leakage current 3 4 Output turn on time Output turn off time 4 Output on fall time 4 Output off rise time 4 Overload switch-off delay time 4 Output off status delay time 4 Failure extension Time for Status Report Input Suppression Time Open Load (off) filtering Time 5 ID = 1 A ID = 1 A ID = 1 A ID = 1 A ton toff tfall trise tDSO tD tD-failure tD-IN tfOL(off) 3 3 3 3 20 500 500 500 10 20 15 20 10 5 60 1200 1200 1200 30 3. Digital Inputs (IN1, IN2, IN3, IN4, ENA) Input low voltage Input high voltage Input voltage hysteresis 5 Input pull down current Enable pull down current VIN = 5 V; VS ≥ 6.5 V VENA = 5 V; VS ≥ 6.5 V VINL - 0.3 1.0 V VINH 2.0 6.0 V VINHys 50 200 IIN 10 30 60 µA IENA 10 20 40 µA VSTL 0.5 V ISTH 2 µA mV 4. Digital Status Outputs (ST1 - ST4) Open Drain Output voltage low IST = 2 mA Leakage current high 3 If the output voltage exceeds 35V, this current (zener current of a internal structure) can rise up to 1mA See timing diagram, resistive load condition; VS ≥ 9 V 5 This parameter will not be testet but assured by design 4 V3.1 Page 5 26. Aug. 2002 Datasheet TLE 6228 GP Electrical Characteristics Parameter and Conditions VS = 4.8 to 18 V ; Tj = – 40 °C to + 150 °C (unless otherwise specified) Symbol Values min Unit typ max 5. Standby Input (STBY) Input low voltage VSTBY 0 1 V Input high voltage VSTBY 3.5 VS V 300 µA 0.3*VS 0.33*VS 0.36*VS V Input current VSTBY = 18 V ISTBY 6. Diagnostic Functions Open load detection voltage VENA = X, VIN = L VS ≥ 6.5 V VDS(OL) Open load detection current channel 1,2 VENA = VIN = H VS ≥ 6.5 V ID(OL) 1,2 100 160 250 mA Open load detection current channel 3,4 VENA = VIN = H VS ≥ 6.5 V ID(OL) 3,4 100 160 250 mA Overload detection current channel 1,2 VS ≥ 6.5 V ID(lim) 1,2 5 7.5 A Overload detection current channel 3,4 VS ≥ 6.5 V ID(lim) 3,4 3 5.5 A Overtemperature shutdown threshold Hysteresis 5 Tth Thys Pulse Width for static diagnostic output 5 tIN 170 200 °C K 500 µs 10 This parameter will not be tested but assured by design V3.1 Page 6 26. Aug. 2002 Datasheet TLE 6228 GP Application Description This IC is especially designed to drive inductive loads (relays, electromagnetic valves). Integrated clamp-diodes limit the output voltage when inductive loads are discharged. Four open-drain logic outputs indicate the status of the integrated ciruit. The following conditions are monitored and signalled: - overloading of output (also shorted load to supply) in active mode - open and shorted load to ground in active and inactive mode - overtemperature Circuit Description Input Circuits The control and enable inputs, both active high, consist of schmitt triggers with hysteresis. All inputs are provided with pull-down current sources. Not connected inputs are interpreted as low and the respective output stages are switched off. In standby mode (STBY = LOW ) the current consumption is greatly reduced. The circuit is active when STBY = HIGH. If the standby function is not used, it is allowed to connect the standby pin directly to VS. Status Signals: The status signals are undefined for 2ms after a power up event or a STBY low to high transition. Output Stages The four power outputs consist of DMOS-power transistors with open drains. The output stages are short circuit protected throughout the operating range. Each output has it's own zenerclamp. This causes a voltage limitation at the power transistor when inductive loads are switched off. Parallel to the DMOS transistors there are internal pull down current sources. They are provided to detect an open load condition in the off state. They will be disconnected in the standby mode. Due to EMI measures there is an internal zenerclamp in parallel to the output stage. It gets active above 33V drain source voltage. This leads to an increasing leakage current up to 1 mA @ VDS = 40V. Protective Circuits 6) The outputs are protected against current overload and overtemperature. If the output current increases above the overload detection threshold IQO for a longer time then tDSO or the temperature increases above Tth, then the power transistor is immediately switched off. It remains off until the control signal at the input is switched off and on again. Fault Detection The status outputs indicate the switching state of the output stage. Under normal conditions is: ST = low Output off; ST = high Output on. If an error occurs, the logic level of the status output is inverted, as listed in the diagnostic table. 6) The integrated protection functions prevent an IC destruction under fault conditions and may not be used in normal operation or permanently. V3.1 Page 7 26. Aug. 2002 Datasheet TLE 6228 GP If current overload or overtemperature occurs for a longer time than tDSO, the fault condition is latched into an internal register and the output is shutdown. The reset is done by switching off the corresponding control input for a time longer than tD-IN. Open load is detected for all four channels in on and off mode. In the on mode the load current is monitored. If it drops below the specified threshold value IQU then an open load condition is detected. In the off mode, the output voltage is monitored. An open load condition is detected when the output voltage of a given channel is below the threshold VDS(OL), which is typ. 33 % of the supply voltage VS. To prevent an open load diagnosis in case of transient Voltages on the outputs the open load detection in off mode uses a filter of typ. 50µs. Status output at pulse width operation If the input is operated with a pulsed signal, the status does not follow each single pulse of the input signal. An internal delay tD of typ. 1.2ms ( min 500 µs) enables a continuous status output signal. See the timing diagrams on the following pages for further information. This internal status delay simplifies diagnostic software for pwm applications. Diagnostic Table In general the status follows the input signal in normal operating conditions. If any error is detected the status is inverted. Standby Input Enable Input Control Input Power Output Status Output STBY ENA IN Q ST Standby L X X off H Normal function H H H L H H X L H off off ON L L H Open load or short to ground H H H H L L H H L H L H off off off ON H H H L Overload or short to supply1) H H H off L H H H→L off L H L X off L H H H off L H H H→L off L H L X off L Operating Condition reset latch 2) Overtemperature reset latch 2) 1) Note 1) : overload/short-to-supply/overtemperature - events shorter than min. time t DSO specified in 2.10 will not be latched and not reported at the status pin. V3.1 Page 8 26. Aug. 2002 Datasheet TLE 6228 GP Note 2) : to reset latched status-output in case of overload/short-to-supply/overtemperature the control input has to go low and stay low for longer than max. input suppression time tD-IN specified in 2.13 of the characteristics Failure Situations and Status Report Logic Block Diagram Overtemperature 1.....overtemperature 0.....normal cond. Gate Driver 1... Output 0....Output ENA 1....enabled 0... disabled Input 1....On 0... Off IN tDSO Delay D Delay 60µs S R SET CLR Q Delay 60µs EN IN HI Filter 30µs Filter EN IN OUT 1,2ms typ. IN tD OUT 60µs typ. Q tD tD-IN when load Overload 0.....overload 1.....normal cond. Open load "off" 1.....open load 0.....normal cond. tD Delay D OUT Status 0....High 1....Low Delay D OUT tD-failure EN Open load "on" 0.....open load 1.... normal cond. IN Delay D OUT tD-failure V3.1 Page 9 26. Aug. 2002 Datasheet TLE 6228 GP Timing Diagrams Output Slope VIN VI NH V INL t VDS ton t off VS 85% 15% t tr tf VST tD t Fig. 1 Overload Switch OFF Delay ID t ID(lim) DSO ID(OL) t VST t D-failure t V3.1 Page 10 Fig. 2 26. Aug. 2002 V3.1 Page 11 ST2 ST3 ST4 10k IN1 IENA IIN4 IIN3 IIN2 IIN1 IST4 IST3 IST2 IST1 VSTBY VENA ISTBY ENA VIN4 IN4 10k VIN3 IN3 VIN2 IN2 10k VST1 VST2 VST3 VST4 VIN1 ST1 10k VD = 5V STBY ENA IN4 IN3 IN2 IN1 ST4 ST3 ST2 ST1 IVS TLE 6228 GP GND TLE 6227 VS VS OUT4 OUT3 OUT2 OUT1 ID4 ID3 ID2 ID1 R L4 OUT3 R L2 OUT2 R L1 OUT1 VDS(OUT4) VDS(OUT3) VDS(OUT2) VDS(OUT1) OUT4 R L3 Datasheet TLE 6228 GP Test Circuit 26. Aug. 2002 Datasheet TLE 6228 GP ENA GND IN1 6228 OUT3 IN2 OUT4 IN3 IN4 Enable Input Control Inputs Status Output 10k 10k 10k 10k VD = 5V C STBY VS ST1 OUT1 ST2 ST3 ST4 TLE OUT2 L1 L2 L3 L4 +12V Application Circuit The blocking capacitor C is recommended to avoid critical negative voltage spikes on VS in case of battery interruption during OFF-commutation. V3.1 Page 12 26. Aug. 2002 Datasheet TLE 6228 GP Timing Diagrams of Diagnostic with Pulsed Input Signal Normal condition, resistive load, pulsed input signal V IN t IN ID V ST tD tD Fig. 3 Current Overload F current overload condition tINoff V IN I D(lim) ID V ST tD-IN t DSO t DSO tINoff < tD-IN : Input suppression time avoids a restart after overtemperature V3.1 Page 13 26. Aug. 2002 Fig. 4 Datasheet TLE 6228 GP Diagnostic status output at different open load current conditions V IN I D(OL) ID t D-failure V ST tD Fig. 5 V IN tINoff I D(OL) ID tD-failure V ST tD tINOFF < tD leads to a static status signal V Fig. 6 IN tINoff I D(OL) ID V ST tD-failure tD-failure tD tD-failure tINoff > tD : Intermittend status signal V3.1 Fig. 7 Page 14 26. Aug. 2002 Datasheet TLE 6228 GP Normal operation, followed by open load condition ~ 55V Open load voltage condition VDS 12V 33% VIN I D(OL) ID tfOL(off)- tD-failure VST tD-failure tD Fig. 8 Overtemperature Overtemperature VIN tINoff > tD-IN Reset of overload Flip Flop I D(OL) ID VST V3.1 tD-failure tD-failure t DSO Page Fig. 9 15 26. Aug. 2002 Datasheet TLE 6228 GP Typical electrical Characteristics Drain-Source on-resistance RDS(ON) = f (Tj) ; Vs = 9,5V Channel 1, 2 Channel 3, 4 Typical Drain- Source ON-Resistance 0,45 RDS(ON) [Ohm] 0,4 0,35 0,3 0,25 0,2 0,15 -50 -25 0 25 50 75 100 125 150 175 Tj[°C] Typical ON Resistance versus Junction-Temperature Channel 1-4 Figure 6 : Output Clamping Voltage VDS(AZ) = f (Tj) ; ID = 100mA Channel 1-4 Typical Clamping Voltage 55 54 VDS (AZ) [V] 53 52 51 50 49 48 -50 -25 0 25 50 75 100 125 150 175 Tj[°C] Figure 7 : V3.1 Typical Clamp Voltage versus Junction-Temperature Channel 1-4 Page 16 26. Aug. 2002 Datasheet TLE 6228 GP Package and ordering code all dimensions in mm P - DSO - 20 - 12 Ordering code TLE 6228 GP Q67006-A9364 1 5 .7 4 + /- 0 .1 13.7 -0.2 9 x 1.27 = 11.43 1.27 + 0 .1 3 1.2 -0.3 0.25 M A 1 5.9 + /-0 .1 11 3.2 + /-0 .1 20 0.4 10 1 x 45° P IN 1 IN D E X M A R K IN G A 15.9 + /-0 .1 5 1.3 0.1 8° 2.8 8° 6.3 8° 8° 11 + /-0 .1 5 1 ) 14.2 + /-0 .3 V3.1 Page 17 26. Aug. 2002 Datasheet TLE 6228 GP Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 76, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. V3.1 Page 18 26. Aug. 2002