FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16923 Generic Copy Issue Date: 25-Oct-2012 TITLE: Phase 1 Copper Wire for VHVIC Products in SOIC and TSSOP packages in Carmona, Philippines PROPOSED FIRST SHIP DATE: 25-Jan-2013 AFFECTED CHANGE CATEGORY(S): Assembly Process FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or <[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or <[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. implementation of the change. FPCNs are issued at least 90 days prior to ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: A General Announcement (GA#16200) was published on 1-29-09 regarding the ongoing Copper Wirebond conversion program at ON Semiconductor. This is a FPCN to notify customers of its plan to qualify Copper Wire (in place of Gold Wire) on SOIC and TSSOP packages assembled at the Carmona, Philippine assembly location for the VHVIC products listed in this announcement. Reliability Qualification and full electrical characterization over temperature has now been completed on the designated package qualification vehicles. Issue Date: 25-Oct-2012 Rev. 06-Jan-2010 Page 1 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16923 RELIABILITY DATA SUMMARY: Reliability Test Results: NCP1200D60R2G # Test Name Test Conditions End Point Req's Test (rej/ss) Results Read Point Lot A Initial Electrical Done (rej/ss) (rej/ss) (rej/ss) Lot B Lot C Control Done Done Done 1 Prep Sample preparation and initial part testing A1 PC MSL 1 Preconditioning MSL1 260C c=0, Room Post PC 0/240 0/240 0/240 0/240 A3 PC-TC Preconditioned Temperature Cycle -65C/+150C c=0, Room 500 cycles 1000 cycles 0/80 0/80 0/80 0/80 0/80 0/80 0/80 0/80 A2 PC-HAST Precond Highly Accelerated Stress Test TA = 130C/85%RH, 18.8psig, with bias c=0, Room 96 hours 0/80 0/80 0/80 0/80 A4 PC-UHAST Precond Highly Accelerated Stress Test TA = 130C/85%RH, 18.8psig, no bias c=0, Room 96 hours 0/80 0/80 0/80 0/80 A6 HTSL High Temperature Storage Life TA = 150C c=0, Room 504 hours 1008 hours 0/80 0/80 0/80 0/80 0/80 0/80 0/80 0/80 B1 HTOL High Temp Op Life TA = 150C for 1008hrs with bias c=0, Room 504 hours 1008 hours 0/80 0/80 0/80 0/80 0/80 0/80 0/80 0/80 C3 SD Solderability (> 95% coverage) 10 units per lot Pass 0/10 0/10 0/10 0/10 RSH Resistance to solder heat JESD22 - B106 260C Immersion c=0, Room Pass 0/10 0/10 0/10 0/10 C4 BPS Wire Bond Pull Test Cpk>1.33 5 parts minumum 30 bonds 0/30 0/30 0/30 0/30 C5 WBS Wire Bond Shear Test Cpk>1.33 5 parts minumum 30 bonds 0/30 0/30 0/30 0/30 Name Test Conditions (rej/ss) (rej/ss) (rej/ss) Lot B Lot C Control Done Done Done NCP1217D65R2G # Test Various -- End Point Req's (rej/ss) Test Results Read Point Lot A Initial Electrical Done 1 Prep Sample preparation and initial part testing A1 PC MSL 1 Preconditioning MSL1 260C c=0, Room Post PC 0/240 0/240 0/240 0/240 A3 PC-TC Preconditioned Temperature Cycle -65C/+150C c=0, Room 500 cycles 1000 cycles 0/80 0/80 0/80 0/80 0/80 0/80 0/80 0/80 A4 PC-AC Preconditioned Autoclave TA = 121C/100%RH, 15psig c=0, Room 96 hours 0/80 0/80 0/80 0/80 A5 PC-UHAST Precond Highly Accelerated Stress Test TA = 130C/85%RH, 18.8psig, no bias c=0, Room 96 hours 0/80 0/80 0/80 0/80 A6 HTSL High Temperature Storage Life TA = 150C c=0, Room 504 hours 1008 hours 0/80 0/80 0/80 0/80 0/80 0/80 0/80 0/80 C3 SD RSH Solderability (> 95% coverage) Resistance to solder heat JESD22 - B106 260C Immersion 10 units per lot c=0, Room Pass Pass 0/10 0/10 0/10 0/10 0/10 0/10 0/10 0/10 C4 BPS Wire Bond Pull Test Cpk>1.33 5 parts minumum 30 bonds 0/30 0/30 0/30 0/30 C5 WBS Wire Bond Shear Test Cpk>1.33 5 parts minumum 30 bonds 0/30 0/30 0/30 0/30 Issue Date: 25-Oct-2012 Various -- Rev. 06-Jan-2010 Page 2 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16923 ELECTRICAL CHARACTERISTIC SUMMARY: There is no electrical characterization difference in products assembled with copper wire. Electrical data is available upon request. CHANGED PART IDENTIFICATION: Products affected on this FPCN will have part number date codes greater than WW03 2013. List of affected General Parts: MC33363ADWG MC33363ADWR2G MC33363BDWG MC33363BDWR2G MC33364D1G MC33364D1R2G MC33364D2G MC33364D2R2G MC33364DG MC33364DR2G MC33368DG MC33368DR2G NCP1200D100R2G NCP1200D40R2G NCP1200D60R2G NCP1203D100R2G NCP1203D40R2G NCP1203D60R2G NCP1207ADR2G Issue Date: 25-Oct-2012 NCP1207BDR2G NCP1216AD100R2G NCP1216AD133R2G NCP1216AD65R2G NCP1216D100R2G NCP1216D133R2G NCP1216D65R2G NCP1217AD100R2G NCP1217AD133R2G NCP1217AD65R2G NCP1217D100R2G NCP1217D133R2G NCP1217D65R2G NCP1230D100R2G NCP1230D133R2G NCP1230D165R2G NCP1230D65R2G NCP1308DR2G NCP1337DR2G Rev. 06-Jan-2010 NCP1338DR2G NCP1351ADR2G NCP1351BDR2G NCP1351CDR2G NCP1351DDR2G NCP1377BD1R2G NCP1377BDR2G NCP1377D1R2G NCP1377DR2G NCP1395ADR2G NCP1395BDR2G NCP1605ADR2G NCP1605BDR2G NCP1605DR2G NCP1650DR2G NCP1651DR2G NCP1653ADR2G NCP1653DR2G NCP5181DR2G Page 3 of 3