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PRODUCT BULLETIN
Generic Copy
17 Dec 2007
SUBJECT: ON Semiconductor Product Bulletin # 16076
TITLE: Discontinuance of Dry Pack for NCP1606xDR2G Products
PROPOSED FIRST SHIP DATE: 01 Jan 2008
AFFECTED PRODUCT DIVISION: Automotive and Power Regulation Group (APRG)
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor sales office or Scott Brow <[email protected]>
NOTIFICATION TYPE:
ON Semiconductor considers this change approved unless specific conditions of acceptance are provided
in writing. To do so, contact your local ON Semiconductor sales office.
DESCRIPTION AND PURPOSE:
The NCP1606xDR2G has recently been qualified at MSL 1 @ 260C level. 1 Production lot has
passed MSL 1 @ 260C Preconditioning and reliability testing. Results are shown here:
Pre-Conditioned AutoClave – 121C/100%RH/15psig
Pre-Conditioned Temp Cycle - -65C to +150C
Pre-Conditioned UHAST – 130C/85%RH/18.8psig
High Temperature Storage – 150C
High Temp Operating Life – Ta = 125C, Vcc = 18V
0/80 at 96hrs
0/80 at 500cycles
0/80 at 96hrs
0/80 at 504hrs
0/80 at 504hrs
These devices were previously qualified to MSL 3 which required the use of Dry Packaging
Techniques. Effective Jan 1, 2008, dry packing will be discontinued for these devices and the
products will be shipped per MSL 1 packaging.
AFFECTED DEVICE LIST
NCP1606ADR2G
NCP1606BDR2G
Issue Date: 17 Dec 2007
Rev.07-02-06
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