PHILIPS BYQ28E-200

Philips Semiconductors
Product specification
Rectifier diodes
ultrafast, rugged
BYQ28E, BYQ28EB, BYQ28ED series
FEATURES
SYMBOL
• Low forward volt drop
• Fast switching
• Soft recovery characteristic
• Reverse surge capability
• High thermal cycling performance
• Low thermal resistance
QUICK REFERENCE DATA
VR = 150 V/ 200 V
VF ≤ 0.895 V
a2
3
a1
1
IO(AV) = 10 A
IRRM = 0.2 A
k 2
trr ≤ 25 ns
GENERAL DESCRIPTION
Dual, ultra-fast, epitaxial rectifier diodes intended for use as output rectifiers in high frequency switched mode power
supplies.
The BYQ28E series is supplied in the SOT78 conventional leaded package.
The BYQ28EB series is supplied in the SOT404 surface mounting package.
The BYQ28ED series is supplied in the SOT428 surface mounting package.
PINNING
PIN
SOT78 (TO220AB)
SOT404
SOT428
DESCRIPTION
1
anode 1
2
cathode 1
3
anode 2
tab
cathode
tab
tab
tab
2
1
1 23
2
3
1
3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
MIN.
BYQ28E/ BYQ28EB/ BYQ28ED
VRRM
VRWM
VR
IO(AV)
IFRM
IFSM
IRRM
IRSM
Tj
Tstg
Peak repetitive reverse
voltage
Working peak reverse
voltage
Continuous reverse voltage
Average rectified output
current (both diodes
conducting)
Repetitive peak forward
current per diode
Non-repetitive peak forward
current per diode
Peak repetitive reverse
surge current per diode
Peak non-repetitive reverse
surge current per diode
Operating junction
temperature
Storage temperature
MAX.
UNIT
-
-150
150
-200
200
V
-
150
200
V
-
150
200
V
square wave; δ = 0.5; Tmb ≤ 119 ˚C
-
10
A
square wave; δ = 0.5; Tmb ≤ 119 ˚C
-
10
A
t = 10 ms
t = 8.3 ms
sinusoidal; with reapplied VRRM(max)
tp = 2 µs; δ = 0.001
-
50
55
A
A
-
0.2
A
tp = 100 µs
-
0.2
A
-
150
˚C
- 40
150
˚C
1. It is not possible to make connection to pin 2 of the SOT428 or SOT404 packages.
October 1998
1
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes
ultrafast, rugged
BYQ28E, BYQ28EB, BYQ28ED series
ESD LIMITING VALUE
SYMBOL
PARAMETER
CONDITIONS
VC
Electrostatic discharge
capacitor voltage
Human body model;
C = 250 pF; R = 1.5 kΩ
MIN.
MAX.
UNIT
-
8
kV
THERMAL RESISTANCES
SYMBOL PARAMETER
CONDITIONS
Rth j-mb
per diode
both diodes
SOT78 package, in free air
SOT404 and SOT428 packages, pcb
mounted, minimum footprint, FR4 board
Rth j-a
Thermal resistance junction
to mounting base
Thermal resistance junction
to ambient
MIN.
-
TYP. MAX. UNIT
60
50
4.5
3
-
K/W
K/W
K/W
K/W
ELECTRICAL CHARACTERISTICS
All characteristics are per diode at Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
VF
Forward voltage
IR
Reverse current
Qrr
trr1
trr2
Irrm
Reverse recovered charge
Reverse recovery time
Reverse recovery time
Peak reverse recovery
current
Forward recovery voltage
IF = 5 A; Tj = 150˚C
IF = 5 A
IF = 10 A
VR = VRWM
VR = VRWM; Tj = 100˚C
IF = 2 A; VR ≥ 30 V; -dIF/dt = 20 A/µs
IF = 1 A; VR ≥ 30 V; -dIF/dt = 100 A/µs
IF = 0.5 A to IR = 1 A; Irec = 0.25 A
IF = 5 A; VR ≥ 30 V; -dIF/dt = 50 A/µs
-
IF = 1 A; dIF/dt = 10 A/µs
Vfr
October 1998
MIN.
2
TYP. MAX. UNIT
-
0.8
0.95
1.1
2
0.1
4
15
10
0.5
0.895
1.1
1.25
10
0.2
9
25
20
0.7
V
V
V
µA
mA
nC
ns
ns
A
-
1
-
V
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes
ultrafast, rugged
I
dI
F
BYQ28E, BYQ28EB, BYQ28ED series
R
F
dt
t
rr
D.U.T.
Voltage Pulse Source
time
Q
I
I
R
Current
shunt
100%
10%
s
rrm
Fig.4. Circuit schematic for trr2
Fig.1. Definition of trr1, Qs and Irrm
I
to ’scope
F
0.5A
IF
0A
time
I rec = 0.25A
VF
IR
V
fr
trr2
VF
I = 1A
R
time
Fig.2. Definition of Vfr
8
PF / W
Fig.5. Definition of trr2
Tmb(max) / C
BYQ28
Vo = 0.748 V
D = 1.0
Rs = 0.0293 Ohms
7
PF / W
0.5
5
Rs = 0.0293 Ohms
115
a = 1.57
5
3
2
1
t
T
0
1
2
3
4
IF(AV) / A
5
6
7
4
3
135
2
140
1
145
140
145
150
8
0
Fig.3. Maximum forward dissipation PF = f(IF(AV)) per
diode; square current waveform where
IF(AV) =IF(RMS) x √D.
October 1998
130
2.8
135
tp
D=
T
tp
I
125
2.2
4
130
0.1
120
1.9
125
0.2
4
Tmb(max) / C
BYQ28
Vo = 0.748 V
120
6
0
6
110
0
1
2
3
IF(AV) / A
4
5
150
6
Fig.6. Maximum forward dissipation PF = f(IF(AV)) per
diode; sinusoidal current waveform where a = form
factor = IF(RMS) / IF(AV).
3
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes
ultrafast, rugged
BYQ28E, BYQ28EB, BYQ28ED series
trr / ns
1000
Qs / nC
100
IF=5A
IF=2A
IF=1A
100
IF=5A
10
IF=1A
10
1
1.0
1
0.1
100
10
dIF/dt (A/us)
Fig.7. Maximum trr at Tj = 25 ˚C; per diode
10
-dIF/dt (A/us)
100
Fig.10. Maximum Qs at Tj = 25 ˚C; per diode
Irrm / A
10
1.0
10
Transient thermal impedance, Zth j-mb (K/W)
1
1
IF=5A
0.1
0.1
IF=1A
PD
0.01
0.01
10
-dIF/dt (A/us)
1
0.001
1us
100
Fig.8. Maximum Irrm at Tj = 25 ˚C; per diode
15
tp
D=
T
10us
tp
T
t
100us 1ms
10ms 100ms
1s
pulse width, tp (s)
BYQ28E
10s
Fig.11. Transient thermal impedance; per diode;
Zth j-mb = f(tp).
BYQ28
IF / A
Tj=150C
Tj=25C
10
5
max
typ
0
0
0.5
VF / V
1
1.5
Fig.9. Typical and maximum forward characteristic
IF = f(VF); parameter Tj
October 1998
4
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes
ultrafast, rugged
BYQ28E, BYQ28EB, BYQ28ED series
MECHANICAL DATA
Dimensions in mm
4,5
max
Net Mass: 2 g
10,3
max
1,3
3,7
2,8
5,9
min
15,8
max
3,0 max
not tinned
3,0
13,5
min
1,3
max 1 2 3
(2x)
0,9 max (3x)
2,54 2,54
0,6
2,4
Fig.12. SOT78 (TO220AB); pin 2 connected to mounting base.
Notes
1. Refer to mounting instructions for SOT78 (TO220) envelopes.
2. Epoxy meets UL94 V0 at 1/8".
October 1998
5
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes
ultrafast, rugged
BYQ28E, BYQ28EB, BYQ28ED series
MECHANICAL DATA
Dimensions in mm
4.5 max
1.4 max
10.3 max
Net Mass: 1.4 g
11 max
15.4
2.5
0.85 max
(x2)
0.5
2.54 (x2)
Fig.13. SOT404 : centre pin connected to mounting base.
MOUNTING INSTRUCTIONS
Dimensions in mm
11.5
9.0
17.5
2.0
3.8
5.08
Fig.14. SOT404 : soldering pattern for surface mounting.
Notes
1. Epoxy meets UL94 V0 at 1/8".
October 1998
6
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes
ultrafast, rugged
BYQ28E, BYQ28EB, BYQ28ED series
MECHANICAL DATA
Dimensions in mm
seating plane
Net Mass: 1.1 g
6.73 max
1.1
tab
2.38 max
0.93 max
5.4
4 min
6.22 max
10.4 max
4.6
2
1
0.5
0.5 min
3
0.3
0.5
0.8 max
(x2)
2.285 (x2)
Fig.15. SOT428 : centre pin connected to tab.
MOUNTING INSTRUCTIONS
Dimensions in mm
7.0
7.0
2.15
1.5
2.5
4.57
Fig.16. SOT428 : minimum pad sizes for surface mounting.
Notes
1. Plastic meets UL94 V0 at 1/8".
October 1998
7
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes
ultrafast, rugged
BYQ28E, BYQ28EB, BYQ28ED series
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
October 1998
8
Rev 1.300